0015800329_17 [MOLEX1]

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical;
0015800329_17
元器件型号: 0015800329_17
生产厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用:

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

PDF文件: 总2页 (文件大小:33K)
下载文档:  下载PDF数据表文档文件
型号参数:0015800329_17参数

0015800341

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating

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12 MOLEX

0015800341_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800343

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

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11 MOLEX

0015800343_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800345

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

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13 MOLEX

0015800345_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800361

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating

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12 MOLEX

0015800361_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800363

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits

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20 MOLEX

0015800365

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits

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7 MOLEX

0015800369

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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11 MOLEX

0015800381

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating

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18 MOLEX

0015800383

2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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16 MOLEX

0015800385

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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11 MOLEX

0015800401

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

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10 MOLEX