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0015800383 [MOLEX]

2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating; 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 38电路， 0.38μm （ 15μ ），金（Au ）选择性电镀

0015800383


元器件型号：	0015800383
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 38电路， 0.38μm （ 15μ ），金（Au ）选择性电镀连接器集管和边缘连接器
PDF文件：	总7页 (文件大小：1221K)
下载文档：	下载PDF数据表文档文件
型号参数：0015800383参数

0015800385

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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11 MOLEX

0015800401

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

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10 MOLEX

0015800401_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800403

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits

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6 MOLEX

0015800403_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800405

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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8 MOLEX

0015800407

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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3 MOLEX

0015-80-0407

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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5 MOLEX

001580-0407

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

0015800407-ND

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

0015800409

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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6 MOLEX

0015800409_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800421

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating

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9 MOLEX

0015800423

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits

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10 MOLEX

0015800425

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

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