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0015800603 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating; 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 60电路， 0.38μm （ 15μ ），金（Au ）选择性电镀

0015800603


元器件型号：	0015800603
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 60电路， 0.38μm （ 15μ ），金（Au ）选择性电镀连接器集管和边缘连接器
PDF文件：	总7页 (文件大小：1222K)
下载文档：	下载PDF数据表文档文件
型号参数：0015800603参数

0015800605

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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9 MOLEX

0015800621

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating

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5 MOLEX

0015800623

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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11 MOLEX

0015800625

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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6 MOLEX

0015800641

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, Tin (Sn) Plating

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3 MOLEX

0015800643

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits

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11 MOLEX

0015800645

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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7 MOLEX

0015800661

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, Tin (Sn) Plating

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5 MOLEX

0015800663

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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19 MOLEX

0015800665

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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14 MOLEX

0015800681

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating

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19 MOLEX

0015800683

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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5 MOLEX

0015800685

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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8 MOLEX

0015800701

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, Tin (Sn) Plating

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6 MOLEX

0015800703

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,

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8 MOLEX

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