0440670401 [MOLEX]

3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB; 3.00毫米（ 0.118 “ ）间距微飞度3.0线对板头，双排，垂直长达3.56毫米（ 0.140 ” ）厚的PCB


型号：	0440670401
厂家：	Molex
描述：	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB 3.00毫米（ 0.118 “ ）间距微飞度3.0线对板头，双排，垂直长达3.56毫米（ 0.140 ” ）厚的PCB PC
文件：	总3页 (文件大小：208K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

This document was generated on 05/24/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0440670401

Active

microfit_30

Overview:

Description:

3.00mm (.118") Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up

to 3.56mm (.140") Thick PCB, 4 Circuits, Tin (Sn) Plating

Documents:

3D Model

Drawing (PDF)

Product Specification PS-43045 (PDF)

RoHS Certificate of Compliance (PDF)

Series

image - Reference only

China RoHS

General

Product Family

Series

PCB Headers

44067

EU RoHS

ELV and RoHS

Compliant

REACH SVHC

Contains SVHC: No

Halogen-Free

Status

Application

Comments

Overview

Wire-to-Board

High Temperature, Polarization Key to PCB

microfit_30

Product Name

Micro-Fit 3.0™

Physical

Breakaway

Not Reviewed

Circuits (Loaded)

Circuits (maximum)

Need more information on product

environmental compliance?

Color - Resin

Black

None

Yes

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Durability (mating cycles max)

First Mate / Last Break

Glow-Wire Compliant

Guide to Mating Part

Keying to Mating Part

Lock to Mating Part

Please visit the Contact Us section for any

non-product compliance questions.

Material - Plating Mating

Material - Plating Termination

Material - Resin

Number of Rows

Orientation

Tin

High Temperature Thermoplastic

Vertical

Search Parts in this Series

44067Series

PC Tail Length (in)

PC Tail Length (mm)

PCB Locator

0.158 In

4.01 mm

Yes

Mates With

43025 Micro-Fit™ Header

PCB Retention

Yes

PCB Thickness Recommended (in)

PCB Thickness Recommended (mm)

Packaging Type

0.140 In

3.60 mm

Tray

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Pitch - Term. Interface (in)

Pitch - Term. Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Plating min: Termination (µin)

Plating min: Termination (µm)

Polarized to PCB

0.118 In

3.00 mm

0.118 In

3.00 mm

100

2.5

100

2.5

Yes

Shrouded

Fully

Stackable

Surface Mount Compatible (SMC)

Temperature Range - Operating

Termination Interface: Style

Yes

-40°C to +105°C

Through Hole - Kinked Pin

Electrical

Current - Maximum per Contact

Voltage - Maximum

250V

Solder Process Data

Duration at Max. Process Temperature (seconds)

Lead-free Process Capability

SMC & Wave Capable (TH only)

Max. Cycles at Max. Process Temperature

Process Temperature max. C

260

Material Info

Reference - Drawing Numbers

Packaging Specification

Product Specification

PK-70873-0314

PS-43045

Sales Drawing

SD-44067-001

This document was generated on 05/24/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

相关型号：