0736446216 [MOLEX]
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits; 2.00毫米（ .079 “ ）间距HDM®板对板背板头，垂直， SMC ，踩飞度，导柱位置B，偏光键位置N / A ， 144电路
| 型号： | 0736446216 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits |
| 文件： | 总4页 (文件大小：186K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 06/07/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0736446216
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-
Fit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits
Documents:
Drawing (PDF)
RoHS Certificate of Compliance (PDF)
Series
Agency Certification
CSA
UL
image - Reference only
China RoHS
LR19980
E29179
EU RoHS
General
Product Family
Series
Application
Component Type
Overview
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Backplane Connectors
73644
Backplane
PCB Header
hdm
Not Reviewed
Need more information on product
environmental compliance?
Product Name
Style
HDM®
N/A
Physical
Circuits (Loaded)
Email productcompliance@molex.com
144
For a multiple part number RoHS Certificate of
Compliance, click here
Circuits (maximum)
Color - Resin
144
Black
Durability (mating cycles max)
First Mate / Last Break
Flammability
250
No
94V-0
Please visit the Contact Us section for any
non-product compliance questions.
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Yes
None
Phosphor Bronze, Stainless Steel
Gold
Tin
Search Parts in this Series
73644Series
High Temperature Thermoplastic
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
24
Mates With
Open Pin Field
6
Vertical
0.138 In
3.50 mm
No
73632 HDM PLUS® Board-to-Board
Daughtercard Receptacle. 73780 HDM®
Board-to-Board Daughtercard Receptacle
Application Tooling | FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Yes
0.098 In
2.50 mm
Tube
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.079 In
2.00 mm
0.079 In
2.00 mm
30
0.75
15
0.375
No
No
Global
Description
Product #
0621001400
HDM® Backplane
Insertion Signal
Contact Tool
HDM® Backplane
Insertion Head for
144 Positions
0622005703
0621001000
Extraction Tool
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Yes
-55°C to +105°C
Through Hole - Compliant Pin
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
1A
1.0 Gbps
75
No
Voltage - Maximum
250V AC
Material Info
Reference - Drawing Numbers
Sales Drawing
SD-73644-003
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 06/07/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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