0737801264 [MOLEX]
2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551"), Pin Length 4.00mm (.157"),; 2.00毫米（ .079 “ ）间距HDM®板对板子卡插座，垂直， SignalModule ， 144电路，安装高度14.00毫米（ .551 ” ） ，引脚长度4.00毫米（ .157 “ ） ，
| 型号： | 0737801264 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551"), Pin Length 4.00mm (.157"), |
| 文件： | 总3页 (文件大小：205K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0737800123
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal
Module, 72 Circuits, Mounted Height 13.00mm (.512"), Pin Length 2.50mm (.098"),
Solder Tail
Documents:
3D Model
Drawing (PDF)
Test Summary (PDF)
Product Specification PS-73780-999 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
EU RoHS
ELV and RoHS
Compliant
China RoHS
General
Product Family
Series
Backplane Connectors
73780
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Halogen-Free
Need more information on product
environmental compliance?
Application
Comments
Component Type
Overview
Product Name
Style
Daughtercard, Mezzanine
Solder Tail
PCB Receptacle
hdm
HDM®
N/A
Physical
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Circuits (Loaded)
72
72
Black
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Guide to Mating Part
Keying to Mating Part
Material - Metal
250
No
No
None
Please visit the Contact Us section for any
non-product compliance questions.
Copper-Nickel-Tin
Material - Plating Mating
Material - Plating Termination
Material - Resin
Gold
Tin
Search Parts in this Series
73780Series
High Temperature Thermoplastic
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length (in)
12
Mates With
Open Pin Field
6
Vertical
0.079 In
2.00 mm
No
HDM® Board-to-Board Backplane Header
73642 , 73643 , 73644 , 73942 , 73943 ,
73944 , 74349 , 74428. HDM® Board-to-
Board Stacking Header 73769 , 73770 ,
73782 , 73783 , 73771
PC Tail Length (mm)
PCB Locator
PCB Retention
None
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.063 In
1.60 mm
Tube
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.079 In
2.00 mm
0.079 In
2.00 mm
30
0.75
100
2.5
No
Stackable
Yes
Surface Mount Compatible (SMC)
Yes
Temperature Range - Operating
Termination Interface: Style
-55°C to +105°C
Through Hole
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
15A, 1A
1.0 Gbps
75
No
Voltage - Maximum
250V AC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
5
Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
260
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
PS-73780-999
SD-73780-004
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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