0878345095 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating; 2.54毫米( .100 )间距C- Grid®头,双排,低调,垂直,罩,无PCB定位器,无尾窗, 0.05微米( 2μ ),金(Au )镀层
0878345095
型号: 0878345095
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating
2.54毫米( .100 )间距C- Grid®头,双排,低调,垂直,罩,无PCB定位器,无尾窗, 0.05微米( 2μ ),金(Au )镀层

PC
文件: 总3页 (文件大小:119K)
下载:  下载PDF数据表文档文件

0878346011

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 60 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

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7 MOLEX

0878346021

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

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6 MOLEX

0878346041

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

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11 MOLEX

0878350842

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

0878351042

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

0878351043

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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5 MOLEX

0878351242

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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6 MOLEX

0878351442

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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9 MOLEX

0878351642

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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12 MOLEX

0878351643

2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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8 MOLEX

0878352042

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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10 MOLEX

0878352043

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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9 MOLEX

0878352442

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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11 MOLEX

0878352642

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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8 MOLEX

0878353442

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

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11 MOLEX