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0879140009 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 6 Circuits, Gold (Au) Flash Overall Plating, Tray Packaging, Lead-free; 2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直， 6电路，金（Au ）的Flash整体电镀，纸盒包装，无铅

0879140009


元器件型号：	0879140009
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 6 Circuits, Gold (Au) Flash Overall Plating, Tray Packaging, Lead-free 2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直， 6电路，金（Au ）的Flash整体电镀，纸盒包装，无铅连接器集管和边缘连接器
PDF文件：	总48页 (文件大小：3773K)
下载文档：	下载PDF数据表文档文件
型号参数：0879140009参数

0879140216

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 2 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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8 MOLEX

0879140416

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 4 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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9 MOLEX

0879140616

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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10 MOLEX

0879140806

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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5 MOLEX

0879140807

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging

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5 MOLEX

0879140816

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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8 MOLEX

0879141001

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free

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7 MOLEX

0879141016

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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6 MOLEX

0879141216

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 12 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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12 MOLEX

0879141405

Board Connector,

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0 MOLEX

0879141416

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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8 MOLEX

0879141616

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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4 MOLEX

0879141816

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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18 MOLEX

0879142016

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 20 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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10 MOLEX

0879142216

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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16 MOLEX

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