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15-47-7708 [MOLEX]

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- GridÂ®头，通孔，双排，垂直，高温，罩，用PEG ， 6电路，锡（Sn ）镀层

15-47-7708


元器件型号：	15-47-7708
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating 2.54毫米（ .100 ）间距C- GridÂ®头，通孔，双排，垂直，高温，罩，用PEG ， 6电路，锡（Sn ）镀层连接器集管和边缘连接器 PC
PDF文件：	总4页 (文件大小：381K)
下载文档：	下载PDF数据表文档文件
型号参数：15-47-7708参数

15-47-7710

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7710

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

15-47-7712

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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1 MOLEX

15-47-7712

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7712

Board Connector, 12 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Receptacle,

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0 MOLEX

15-47-7714

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7714

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

15-47-7714

Board Connector, 14 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Receptacle,

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0 MOLEX

15-47-7716

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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6 MOLEX

15-47-7716

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7718

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7718

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

15-47-7720

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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6 MOLEX

15-47-7720

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7722

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

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