171400-1020 [MOLEX]

Board Connector, 120 Contact(s), Right Angle, 0.074 inch Pitch, Press Fit Terminal, Locking;


型号：	171400-1020
厂家：	Molex
描述：	Board Connector, 120 Contact(s), Right Angle, 0.074 inch Pitch, Press Fit Terminal, Locking PC 连接器
文件：	总3页 (文件大小：117K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Impel™ Backplane

Connector System

Delivering industry-leading signal integrity and density

while providing a scalable price and performance path for

future data-rate enhancements, the Impel™ Backplane

Connector System offers OEMs the option for systems to

operate at today’s data rates and costs

171335 3-Pair 1.90mm

Backplane Header

171340 3-Pair 1.90mm

Daughtercard

Receptacle

Leading the datacom computing marketing with a high data-rate and high

density solutions, the Impel™ Backplane Connector System provides a

scalable price-for-performance solution enabling customers to secure a high-

speed 25 and 40 Gbps footprint.

171325 4-Pair 3.00mm

Backplane Header

Quad-Route

171330 4-Pair 3.00mm

Daughtercard

Molex continues to lead development in the backplane market through

innovative connector products. Customers are currently designing new high-

end system architectures that will require data-rate improvements. The

Impel™ Connector System provides the footprint and interface that will enable

customers to migrate to faster data rates (40 Gbps), without completely

re-designing their architecture or replacing hardware already placed in the

data-center while meeting the mechanical density requirements being driven

by the industry.

Receptacle

Quad-Route

171395 6-Pair 1.90mm

Backplane Header

171400 6-Pair 1.90mm

Daughtercard

Receptacle

Applications

Impel™ Backplane Connector System

A. 3-Pair Daughtercard Receptacle

(Series 171340)

B. 4-Pair Daughterard Receptacle

(Series 171330)

C. 3-Pair Backplane Headers

(Series 171335)

D. 4-Pair Backplane Headers

(Series 171325)

High-End Servers

Telecommunication Applications

– Hubs, switches, routers

– Central ofﬁce, cellular infrastructure and multi-platform service,

(DSL, Cable Data)

Data Networking Equipment

– Servers

– Storage systems

Industrial Equipment

Military/Aerospace Equipment

Impel™ Backplane

Connector System

Features and Beneﬁts

Molex patent-pending Impel™

connector technology

Tightly coupled differential-pair

structure providing optimal signal

integrity and mechanical

isolation through the connector

Compact, compliant-pin backplane

and daughtercard connectors with

data rates scalable

Enable backward and forward

compatibility with various high-end

system architectures

from 25 to 40 Gbps

Broad-edge-coupled 1.90mm pitch

solution

Superior density and electrical

performance, low cross-talk, low

insertion loss and minimal

performance variations across all

channels and frequencies to 20 GHz

92 Ohms nominal impedance

Optimized wafer structure

Enables customers to minimize

impedance discontinuities

Enables connector packaging

ﬂexibility. Provides 1.90 and

3.00mm column-to-column pitch

conﬁgurations allowing for PCB

layer-count maximization

Enhanced 0.36mm plated-through-

hole diameter

Meets manufacturing aspect ratio

while providing improved electrical

performance

Skew-less design

Eliminates the need for

compensating connector skew on

PCB routing

Staggered header-pin interface

Provides robust mechanical

isolation from the signal pins.

Mitigates the concern for bent pins

in the ﬁeld. Provides ﬁrst-mate-last-

break capabilities

Constructed with copper alloy and

LCP

Enables repeatable and reliable

part-to-part performance parity

versus competitors’ housings

with additives, which can result in

performance inconsistencies

IEEE 10GBASE-KR and Optical

Internetworking Forum (OIF) Stat

Eye Compliant Channel

Performance

Demonstrates end-to-end channel

performance compliance

Impel™ Backplane

Connector System

Speciﬁcations

Reference Information

Packaging: Tray

UL File No.: E28179

Mates with:

Numerous options, See Ordering

Information Charts

Designed In: Millimeters

RoHS: Yes

Mechanical

Insertion Force to PCB:

Backplane Header — 26.69N

Daughtercard Receptacle — 17.80N

Mating Force:

60g per signal; 80g per shield

Unmating Force (min.): 15g

Durability (min.): 200 cycles

Physical

Halogen Free: Yes

Housing: LCP

Electrical

Voltage —

Contact: Copper Alloy

Plating:

Daughtercard Receptacle (max.):

150VAC RMS

Current (max.): 0.75A

Contact Resistance (max.):

100mA; 20mV

Contact Area — 30μ

Compliant Pin Area —

select Matte Tin

Underplating — Nickel

PCB Thickness (min.): 1.00mm

Operating Temperature:

-40 to +105°C

Dielectric Withstanding Voltage:

500V AC

Insulation Resistance —

Daughtercard Receptacle: 500V

Ordering Information

Backplane Header

Plated Through-

Hole Diameter

(mm)

Pin Length

Number of

Columns

Number of

Guide

Order No.

Pitch (mm)

(mm)

Pairs

171335-1805

171335-1807

171335-1808

171325-1605

171395-1105

171395-1107

171395-1108

171395-1605

171395-1607

171395-5605

5.50

4.90

0.46

0.36

1.90

3.00

5.50

0.46

0.36

4.90

5.50

1.90

0.46

0.36

0.46

4.90

5.50

Right

Daughtercard Receptacle

Order No.

Pitch (mm)

Number of Columns

Number of Pairs

Guide

171340-1038

1.90

3.00

171330-1036

171400-1020

171400-1026

171400-3020

1.90

Left

171400-3026

171400-5020

Right

171400-5026

www.molex.com/link/impel.html

Order No. 987650-8371

Printed in USA/KC/2013.01

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