2010215074 [MOLEX]
Board Connector;
| 型号： | 2010215074 |
| 厂家： | 
Molex |
| 描述： | Board Connector 连接器 |
| 文件： | 总12页 (文件大小：542K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRODUCT SPECIFICATION
®
1.27mm PITCH SLIM-GRID SHROUDED HEADERS (BOARD TO BOARD)
1.0 SCOPE
This Product Specification covers the 1.27mm centerline (pitch) printed circuit board (PCB)
connector series
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAME AND SERIES NUMBER(S)
Product Name
Series Number
200989
®
1.27mm Pitch SLIM-GRID Vertical SMT Header
®
201022
1.27mm Pitch SLIM-GRID Vertical Thru-hole Header
®
201173
1.27mm Pitch SLIM-GRID Right Angle SMT Header
®
201021
1.27mm Pitch SLIM-GRID Right Angle Thru-hole Header
200989
201021
201022
201173
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
See Sales Drawing 2009890024, 2010210024, 2010220024 and 2011730024 for information
on dimensions, materials, platings and markings.
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
SHROUDED HEADERS
ECM: 118480
1 of 12
A2
DATE: 2017/06/22
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
2.3 SAFETY AGENCY APPROVALS
UL File Number :
CSA File Number :
File E29179, Vol 10
152514 (LR 19980)
CSA approval meets following standards/test procedures:
a) CSA std. C22.2 No. 182.3-M1987
b) UL-1977
* “C” and “US” mark adjacent to CSA signifies that the product has been evaluated to the applicable
CSA and ANSI/UL standards, for use in Canada and US respectively.
Series 78120, 87933, 200989, 201021, 201022, 201173, rated 4.3A, 125Vac
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
The following documents form a part of this specification to the extended specified herewith. In the
event of conflict between the requirements of this specification and the product drawing, the
product drawing shall take precedence
Reference Product Specifications
®
781200001
1.27mm Pitch SLIM-GRID Receptacle
4.0 RATINGS
4.1 MAXIMUM VOLTAGE
125 Volts Vac
4.2 MAXIMUM CURRENT
4.3 Amps per pole (with 1 contact powered up)
Current rating is application dependent and each application should be evaluated by the end user for compliance to
specific safety agency requirements. The ratings listed in the chart below are per Molex test method based on a 30° C
maximum temperature rise over ambient temperature and are provided as a guideline. Appropriate de-rating is
required based on circuit size, ambient temperature, copper trace size on the PCB, gross heating from adjacent
modules/components and other factors that influence connector performance.
CIRCUIT SIZE (NUMBER OF CONTACTS POWERED UP)
2*
4
6*
8*
10*
12*
14
16*
18*
20*
22*
24
Current
Rating
per
3.60
3.00
2.70
2.50
2.40
2.30
2.20
2.10
2.10
2.00
2.00
1.90
Pole
(Amps,
Max)
*Extrapolated from test data. Refer to sheet 3 of 12 for more information.
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
2 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
CGOH
KHLIM
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
4.3 TEMPERATURE
Operating: - 55°C to + 105°C
Non-operating: - 55°C to + 105°C
5.1 ELECTRICAL REQUIREMENTS
ITEM
DESCRIPTION
TEST CONDITION
REQUIREMENT
Mate connectors: apply a maximum
voltage of 20 mV and a current of
100 mA.
Contact
Resistance
(LLCR)
30 milliohms
[MAXIMUM]
[initial]
1
(EIA-364-23)
Note: Wire resistance and traces shall be
removed from the measured value.
Mated & unmount connectors: apply a
voltage of 500 VDC between adjacent
terminals and between terminals to
ground.
Insulation
Resistance
1000 Megohms
2
[MINIMUM]
(EIA-364-21)
Mated & unmount connectors: apply a
voltage of 1000VAC for 1 minute between
adjacent terminals and between terminals
to ground.
Dielectric
Withstanding
Voltage
No breakdown;
Current leakage < 5 mA
3
4
(EIA-364-20)
Mate connectors: measure the
temperature rise of the contact when the
maximum DC rated current is passed.
Temperature
Rise
Temperature rise:
+30°C [MAXIMUM]
(EIA-364-70, Method 1)
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
3 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
5.2 MECHANICAL REQUIREMENTS
ITEM
DESCRIPTION
TEST CONDITION
REQUIREMENT
Mate Force
15N (24ckt)
10N (4ckt)
Mate and unmate connectors at a rate of
Connector Mate & 25.4 mm/min..
[MAXIMUM]
5
Unmate Force
Unmate Force
3.0N (24ckt)
0.5N (4ckt)
(EIA-364-13D, Method A)
[MINIMUM]
Appearance: No Damage
Mate connectors up to 50 cycles at a
maximum rate of 500 ±50 cycles/hr.
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
Durability
Reseating
6
(EIA-364-09)
Manually mate and unmate the connector
with mating half for 3 cycles with rate of 5
cycles/min maximum.
Appearance: No Damage
7
8
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
(EIA-364-09)
Axial pullout force on the terminal in the
housing at a rate of 25 ± 6 mm (1 ± ¼
inch) per minute.
Terminal
Retention Force
(Header)
16.0 N
[MINIMUN]
(EIA-364-29, Method C)
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
4 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
5.3 ENVIRONMENTAL REQUIREMENTS
Mate connectors and subject to the
following vibration conditions, for a period
of 2 hours in each 3 mutually
perpendicular axis.
Appearance: No Damage
15milliohms
[MAXIMUM]
(change from initial)
Amplitude: 1.52mm (.060 inch) peak to
peak
Test pulse: half sine
9
Vibration
Sweep: 10->55->10 Hz in 1 minute
Duration: 2 hours in each x-y-z axis.
Discontinuity: 1.0 µs
[maximum]
(EIA-364-28, Test Condition I)
Mate connectors and subject to the
following shock conditions, 3 shocks shall
be applied along 3 mutually perpendicular
axis. (total of 18 shocks)
Appearance: No Damage
Contact Resistance:
15milliΩ
Mechanical shock
10
[MAXIMUM]
[CHANGE FROM INITIAL]
Peak value: 490 m/s sq. (50G)
Test pulse : half sine
Duration : 11 ms in each x-y-z axis
Discontinuity: 1.0 µs
[maximum]
(EIA-364-27B Condition A)
Mate connectors, expose to 5 cycles of:-
Temperature °c
Duration
(minutes)
30
Appearance: No Damage
-55+0/-5
Transfer time from
cold to hot
5 maximum
30
Contact Resistance:
15milliΩ
Thermal shock
11
+105+3/-0
[MAXIMUM]
[CHANGE FROM INITIAL]
Transfer time from
hot to cold
5 maximum
(EIA-364-32G Method A, Condition VII)
Appearance: No Damage
Mate connectors, expose to:-
Contact Resistance:
15milliΩ
Temperature: 105 ± 2 °c
Duration: 96 hours.
Temperature life
12
[MAXIMUM]
[CHANGE FROM INITIAL]
(EIA-364-17, Method A, Condition 4)
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
5 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
Appearance: No Damage
ate connector and expose to:-
Temperature: 25 ± 3 °C @
Humidity: 80% ± 3%
Contact Resistance:
15milliΩ
And
[MAXIMUM]
[CHANGE FROM INITIAL]
Temperature: 65 ± 3 °C @
Humidity: 50% ± 3%
Cyclic temperature
and humidity
13
Ramp times should be 0.5 hour
and dwell times should be 1.0 hour.
Dwell times start when the
temperature and humidity have
stabilized within the specified levels.
Duration: 24 cycles (72 hours)
Dielectric withstanding
Voltage:
No breakdown
Insulation resistance:
1000 megaΩ minimum
Appearance: No Damage
Mate connectors and expose to:
Low temperature
test
Temperature: -40 ± 3°C
Duration: 96 +5/-0 hours
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
14
15
(EIA-364-59A)
Appearance: No Damage
Mate connectors and expose to:
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
SO2 gas density: 50 ±5 ppm
Temperature: 40 ±2 °C
Duration: 24 hours
SO2 gas
Humidity: 60-75%.
Expose the mated connectors to the
following salt mist condition:
Concentration : 5 ±1%
Temperature : 35 +1/-2°C
Test time : 48 hours
Appearance: No Damage
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
Salt spray
(Note: immediately after exposure, the
test specimens shall be dipped in running
tap (≤38°C) for 5 mins max and dried for
16 hour max in a circulating air oven at 38
± 3°C. Sample examination done in room
temperature.
16
(EIA-364-26C, Condition B)
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
6 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
Unmate connector.
Steam age for 8 hour ± 15 min.
(precondition: Condition C)
SMT
Surface mount process simulation test
Solder paste is deposited onto screen
(e.g.ceramic plate) via stencil.
The connectors are placed onto the
solder paste print.
Subject the substrate and component to
the reflow process through a convection
oven.
95% of the immersed area
must show no voids, pin holes
Solderability
17
Refer to section10.0 for temperature
profile.
Flux type: ROL0
THRU-HOLES
Dip and look test
Dip solder tails into solder pot at a
temperature of 245 ± 5°c for 5 ± 0.5 sec.
Emersion rate: 25.4 +/-6.4 mm /sec
Flux type: rol1
(JESD22-B-102E; Method 1 and 2)
SMT
Convection reflow
Sample to be passed through reflow over
according to temperature profiles (shown
in section10.0)
Resistance to solder
Heats
18
Appearance: no damage
Appearance: no bridging
(EIA-364-56C, Procedure 6)
THRU-HOLES
WAVE solder terminations
Resistance to Wave Sample to be mounted on pcb and
19
20
Soldering
passed through oven according to
temperature profiles (shown in section
10.0)
Insertion Force:
20 N
Mount connectors onto the board at a rate
of 25.4 mm/min.
Optional Crushed
Pegs Insertion Force
(For 201021 Only)
[MAXIMUM]
(EIA-364-13D, Method A)
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
7 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
6.0 APPLICATION
6.1 PLACEMENT FORCE - CONNECTOR 201021 SERIES
For series 201021 with peg option, it is recommended to apply a minimum force of 20N onto a
mounting gauge to ensure crushed pegs are properly inserted into PCB holes
6.2 MOUNTING WEIGHT - CONNECTOR 201021 SERIES
For series 201021 without peg option, it is recommended to place a weight (>2g) on connector to
minimize the lifting of light weight connector by surface tension of solder paste
6.3 PCBA ORIENTATION TO OVEN - CONNECTOR 201021/201022 THROUGH-HOLE SERIES
It is recommended to place the connector on board in the following orientation before send the PCBA
assembly to wave soldering oven.
To Oven
201022
To Oven
201021
7.0 PACKAGING
Parts shall be packaged to protect against damage during handling, transit and storage.
Parts are packaged in bulk, tape and reel or tube, refer to Appropriate Sales Drawing and Packaging
Specification for specific information.
8.0 OTHERS
8.1 Although some discolouration could be seen on the soldertail after reflow, it does not impact on the
product’s performance.
8.2 Mating should be performed as close as possible to the mating axis for the delicate ckt sizes.
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
8 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
9.0 TEST SEQUENCE
12 13
Sequential Tests Group
Test or Examination
Sample size
1
2
3
4
5
6
7
8
9.1 9.2 10 11
5
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
1
5
5
1
5
5
Resistance to Solder Heat
Resistance to Wave Soldering
2, 5, 2, 5, 2, 5,
Low Level Contact Resistance
(LLCR)
2, 4 2, 4 2, 4 3, 6
7
7, 9 7, 9
Insulation Resistance
Dielectric Withstanding Voltage
Connector Mate
2, 6
3, 7
2, 7
4, 8
5
Connector Unmate
Durability
3(a) 3(a) 3(a)
1
Crushed Pegs Insertion Force
Reseating
6
8
Vibration
6
8
Mechanical Shock
Thermal Shock
4
6
4
5
Temperature Life
Cyclic Temperature & Humidity
Low Temperature Test
SO2 gas (Gold plated)
Salt Spray
4
4(a)
3
3
3
Pin Retention (in housing)
Solderability
1
2
1
Temperature Rise
Notes:
1
(a) Preconditioning
-
-
Durability: 20cycles for gold plated
Temperature life: duration is 48 hours.
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
9 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
CGOH
KHLIM
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
10.0 REFLOW PROFILE
Lead-free reflow profile requirement for soldering heat resistance testing
Description
Average Ramp Rate
Preheat Temperature
Preheat Time
Requirement
3°C/sec Max
150°C Min to 200°C Max
60 to 180 sec
3°C/sec Max
Ramp to Peak
Time over Liquidus (217°C)
Peak Temperature
Time within 5°C of Peak
Ramp - Cool Down
Time 25 °C to Peak
60 to 150 sec Max
260 0/-5°C
20 to 40 sec
6°C/sec Max
8 Min Max
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
10 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
Lead-free reflow profile requirement for solderability test
Description
Preheat Temperature
Preheat Time
Requirement
160°C Min to 180°C Max
50 to 70 sec
Peak Temperature
Time within 5°C of Peak
230 ~ 245°C
50 to 70 sec
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
ECM: 118480
11 of 12
A2
DATE: 2017/06/22
SHROUDED HEADERS
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
PRODUCT SPECIFICATION
Lead-free wave soldering profile requirement
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID®
SHROUDED HEADERS
ECM: 118480
12 of 12
A2
DATE: 2017/06/22
DOCUMENT NUMBER:
CREATED / REVISED BY:
SCHEONG
CHECKED BY:
APPROVED BY:
KHLIM
CGOH
2009890001
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
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