53229-0201 [MOLEX]

Board Euro Connector, 20 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Receptacle;
53229-0201
型号: 53229-0201
厂家: Molex    Molex
描述:

Board Euro Connector, 20 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Receptacle

文件: 总3页 (文件大小:204K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
      
2.54mm (.100") Pitch  
DIN 41612  
FEATURES AND SPECIFICATIONS  
Features and Benefits  
  Sizes 16 to 64 circuits  
  DIN 41612 and IEC 603-2 compatible  
  Two points of contact provide low insertion force and  
reliable connection  
Electrical  
Voltage: 300V  
Header  
Current: 2.0A  
Contact Resistance: 20mmax.  
Dielectric Withstanding Voltage: 1000V AC  
Insulation Resistance: 106 Mmin.  
53229/53315  
Vertical  
Reference Information  
Packaging: Tray  
UL File No.: E29179  
CSA File No.: LR19980  
Mates With: 52299 and 52479  
Designed In: Millimeters  
Physical  
Housing: Glass-filled PBT, UL 94V-O  
Contact: Brass  
Metal Peg: Phosphor Bronze  
Plating: See Table  
Operating Temperature: -55 to +105˚C  
CATALOG DRAWING (FOR REFERENCE ONLY)  
J
Note: 53315 shown  
ORDERING INFORMATION AND DIMENSIONS  
Order No.  
Dimension  
B
Circuits  
Without Metal Peg  
53229-016X  
53229-020X  
53229-032X  
53229-044X  
With Metal Peg  
53315-016X  
53315-020X  
53315-032X  
53315-044X  
53315-050X  
53315-064X  
A
C
16  
20  
32  
44  
50  
64  
33.84 (1.332)  
38.92 (1.532)  
54.16 (2.132)  
69.40 (2.732)  
77.02 (3.032)  
94.80 (3.732)  
17.78 (.700)  
22.86 (.900)  
38.10 (1.500)  
53.34 (2.100)  
60.96 (2.400)  
78.74 (3.100)  
29.04 (1.143)  
34.12 (1.343)  
49.36 (1.943)  
64.60 (2.543)  
72.22 (2.843)  
90.00 (3.543)  
53229-050X  
53229-064X  
Replace X with plating no., 0-3  
Plating No. 0: 0.1µm Gold with Nickel underplate overall and Tin/Lead in solder area  
Plating No. 1: 0.3µm Gold with Nickel underplate overall and Tin/Lead in solder area  
Plating No. 2: 0.5µm Gold with Nickel underplate overall and Tin/Lead in solder area  
Plating No. 3: 0.76µm Gold with Nickel underplate overall and Tin/Lead in solder area  
J-170  
MX01  

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