select brandShort,logo,brand from pdf_brand where id=752 limit 1 73644-00209_技术文档

73644-00209 [MOLEX]

2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits; 2.00毫米( .079 “ )间距HDM®板对板背板头,垂直, SMC ,压入,导柱位置A,电极标记位置E , 72电路
73644-00209
型号: 73644-00209
厂家: Molex    Molex
描述:

2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
2.00毫米( .079 “ )间距HDM®板对板背板头,垂直, SMC ,压入,导柱位置A,电极标记位置E , 72电路

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