73644-0201 [MOLEX]

2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A; 2.00毫米( .079 “ )间距HDM板对板背板头,垂直, SMC ,踩飞度,导柱位置一
73644-0201
型号: 73644-0201
厂家: Molex    Molex
描述:

2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
2.00毫米( .079 “ )间距HDM板对板背板头,垂直, SMC ,踩飞度,导柱位置一

连接器 集管和边缘连接器 PC
文件: 总4页 (文件大小:171K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This document was generated on 05/26/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0736440000  
Active  
hdm  
Overview:  
Description:  
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-  
Fit, Guide Post Location B, Polarizing Key Position A, 72 Circuits  
Documents:  
3D Model  
Drawing (PDF)  
Test Summary (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
Agency Certification  
CSA  
UL  
LR19980  
E29179  
EU RoHS  
ELV and RoHS  
Compliant  
REACH SVHC  
Contains SVHC: No  
Halogen-Free  
Status  
Not Reviewed  
Need more information on product  
environmental compliance?  
General  
Product Family  
Series  
Application  
Comments  
Component Type  
Overview  
Backplane Connectors  
73644  
Backplane  
Standard Press-Fit  
PCB Header  
hdm  
Product Name  
Style  
HDM®  
N/A  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Physical  
Circuits (Loaded)  
72  
Circuits (maximum)  
Color - Resin  
Durability (mating cycles max)  
First Mate / Last Break  
Flammability  
72  
Please visit the Contact Us section for any  
non-product compliance questions.  
Black, Natural  
250  
No  
94V-0  
Guide to Mating Part  
Keying to Mating Part  
Material - Metal  
Yes  
Yes  
Search Parts in this Series  
73644Series  
Phosphor Bronze, Stainless Steel  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Number of Columns  
Number of Pairs  
Gold  
Gold  
Mates With  
High Temperature Thermoplastic  
12  
Open Pin Field  
6
73632 HDM PLUS® Board-to-Board  
Daughtercard Receptacle. 73780 HDM®  
Board-to-Board Daughtercard Receptacle  
Number of Rows  
Orientation  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
PCB Retention  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
Vertical  
0.138 In  
3.50 mm  
No  
Application Tooling | FAQ  
Tooling specifications and manuals are  
found by selecting the products below.  
Crimp Height Specifications are then  
contained in the Application Tooling  
Specification document.  
Yes  
0.098 In  
2.50 mm  
Tube  
Global  
Description  
Product #  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Pitch - Term. Interface (in)  
Pitch - Term. Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
0.079 In  
2.00 mm  
0.079 In  
2.00 mm  
30  
0.75  
2
0.05  
Flat Rock Tooling for 0622013700  
Pneumatic Press  
HDM® Backplane  
Insertion Signal  
Contact Tool  
0621001400  
Extraction Tool  
0621001000  
Polarized to PCB  
No  
Stackable  
No  
Surface Mount Compatible (SMC)  
Temperature Range - Operating  
Termination Interface: Style  
Yes  
-55°C to +105°C  
Through Hole - Compliant Pin  
Electrical  
Current - Maximum per Contact  
Data Rate  
Real Signals (per 25mm)  
Shielded  
1A  
1.0 Gbps  
75  
No  
Voltage - Maximum  
250V AC  
Material Info  
Reference - Drawing Numbers  
Packaging Specification  
Sales Drawing  
PK-70873-0818  
SDA-73644-****  
HDM and High Density Metric are trademarks of Amphenol Corporation  
This document was generated on 05/26/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  

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