73644-1003 [MOLEX]

2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position B, 144 Circuits; 2.00毫米（ .079 “ ）间距HDM®板对板背板头，垂直， SMC ，压接，导柱位置A，电极标记位置B ， 144电路


型号：	73644-1003
厂家：	Molex
描述：	2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position B, 144 Circuits 2.00毫米（ .079 “ ）间距HDM®板对板背板头，垂直， SMC ，压接，导柱位置A，电极标记位置B ， 144电路连接器集管和边缘连接器 PC
文件：	总4页 (文件大小：171K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

This document was generated on 05/14/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0736441006

Active

hdm

Overview:

Description:

2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-

Fit, Guide Post Location B, Polarizing Key Position D, 144 Circuits

Documents:

Drawing (PDF)

RoHS Certificate of Compliance (PDF)

Series

Agency Certification

CSA

image - Reference only

China RoHS

LR19980

E29179

EU RoHS

General

Product Family

Series

Application

Comments

Component Type

Overview

ELV and RoHS

Compliant

REACH SVHC

Not Reviewed

Halogen-Free

Status

Backplane Connectors

73644

Backplane

Standard Press-Fit

PCB Header

hdm

Not Reviewed

Product Name

Style

HDM®

N/A

Need more information on product

environmental compliance?

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Physical

Circuits (Loaded)

144

Circuits (maximum)

Color - Resin

Black, Natural

250

94V-0

Please visit the Contact Us section for any

non-product compliance questions.

Durability (mating cycles max)

First Mate / Last Break

Flammability

Guide to Mating Part

Keying to Mating Part

Material - Metal

Material - Plating Mating

Material - Plating Termination

Material - Resin

Yes

Search Parts in this Series

73644Series

Phosphor Bronze, Stainless Steel

Gold

High Temperature Thermoplastic

Mates With

Number of Columns

Number of Pairs

Number of Rows

73632 HDM PLUS® Board-to-Board

Daughtercard Receptacle. 73780 HDM®

Board-to-Board Daughtercard Receptacle

Open Pin Field

Orientation

PC Tail Length (in)

PC Tail Length (mm)

PCB Locator

Vertical

0.138 In

3.50 mm

Application Tooling | FAQ

Tooling specifications and manuals are

found by selecting the products below.

Crimp Height Specifications are then

contained in the Application Tooling

Specification document.

PCB Retention

Yes

PCB Thickness Recommended (in)

PCB Thickness Recommended (mm)

Packaging Type

0.098 In

2.50 mm

Tube

Global

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Pitch - Term. Interface (in)

Pitch - Term. Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Plating min: Termination (µin)

Plating min: Termination (µm)

Polarized to PCB

0.079 In

2.00 mm

0.079 In

2.00 mm

0.75

0.05

Description

Flat Rock Tooling for 0622013700

Pneumatic Press

HDM® Backplane

Insertion Signal

Contact Tool

HDM® Backplane

Insertion Head for

144 Positions

Product #

0621001400

0622005703

Stackable

Extraction Tool

0621001000

Surface Mount Compatible (SMC)

Temperature Range - Operating

Termination Interface: Style

Yes

-55°C to +105°C

Through Hole - Compliant Pin

Electrical

Current - Maximum per Contact

Data Rate

Real Signals (per 25mm)

Shielded

1.0 Gbps

Voltage - Maximum

250V AC

Material Info

Reference - Drawing Numbers

Packaging Specification

Sales Drawing

PK-70873-0818

SDA-73644-****

HDM and High Density Metric are trademarks of Amphenol Corporation

This document was generated on 05/14/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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