87832-2221 [MOLEX]

2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.76μm (30μ) Gold (Au) Plating; 2.00毫米（ 0.079 ）间距的Milli-电网™接头，表面贴装，立式，带罩， 22无铅电路， 0.76μm （ 30μ ），金（Au ）镀层


型号：	87832-2221
厂家：	Molex
描述：	2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.76μm (30μ) Gold (Au) Plating 2.00毫米（ 0.079 ）间距的Milli-电网™接头，表面贴装，立式，带罩， 22无铅电路， 0.76μm （ 30μ ），金（Au ）镀层
文件：	总6页 (文件大小：390K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

This document was generated on 05/25/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0878321421

Active

milligrid

Overview:

Description:

2.00mm (.079") Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Lead-

free, 14 Circuits, 0.76µm (30µ") Gold (Au) Plating, with Locking Windows and Center

Polarization Slot, PCB Locator, Tube

Documents:

3D Model

Drawing (PDF)

Product Specification PS-87831-027 (PDF)

RoHS Certificate of Compliance (PDF)

Series

image - Reference only

Agency Certification

CSA

EU RoHS

ELV and RoHS

Compliant

China RoHS

LR19980

E29179

General

Product Family

Series

Application

Comments

REACH SVHC

Contains SVHC: No

Halogen-Free

Status

PCB Headers

87832

Wire-to-Board

Without Cap; Contact Molex for application in

Not Halogen-Free

automotive industry

milligrid

Need more information on product

environmental compliance?

Overview

Product Name

Milli-Grid™

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Physical

Breakaway

Circuits (Loaded)

Circuits (maximum)

Color - Resin

First Mate / Last Break

Flammability

Glow-Wire Compliant

Guide to Mating Part

Keying to Mating Part

Lock to Mating Part

Material - Metal

Material - Plating Mating

Material - Plating Termination

Material - Resin

Black

94V-0

Yes

Phosphor Bronze

Gold

Tin

Nylon

Please visit the Contact Us section for any

non-product compliance questions.

Search Parts in this Series

87832Series

Mates With

50394 Wire-to-Board Terminals. 51110

Wire-to-Board Crimp Housing. 87568 Wire-

to-Board IDT Housings. 79107 Board-to-

Board Top Entry Through Hole Receptacle.

79108 Board-to-Board FFC/FPC Top Entry

Through Hole Receptacle. L

Number of Rows

Orientation

PCB Locator

Vertical

Yes

PCB Retention

Packaging Type

None

Tube

0.079 In

2.00 mm

0.079 In

2.00 mm

0.76

1.88

Side Slots (2)

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Pitch - Term. Interface (in)

Pitch - Term. Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Plating min: Termination (µin)

Plating min: Termination (µm)

Polarized to Mating Part

Polarized to PCB

Shrouded

Stackable

Fully

Temperature Range - Operating

Termination Interface: Style

-55°C to +105°C

Surface Mount

Electrical

Current - Maximum per Contact

Voltage - Maximum

125V

Solder Process Data

Duration at Max. Process Temperature (seconds)

Lead-free Process Capability

Reflow Capable (SMT only)

Max. Cycles at Max. Process Temperature

Process Temperature max. C

260

Material Info

Reference - Drawing Numbers

Product Specification

Sales Drawing

PS-87831-027

SD-87832-007

This document was generated on 05/25/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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