90136-1318 [MOLEX]

2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating; 2.54毫米（ .100 ）间距C-电网III ™头，单列，立式，带罩， 18电路， 0.76μm （ 30μ ），金（Au ）选择性电镀


型号：	90136-1318
厂家：	Molex
描述：	2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54毫米（ .100 ）间距C-电网III ™头，单列，立式，带罩， 18电路， 0.76μm （ 30μ ），金（Au ）选择性电镀
文件：	总4页 (文件大小：163K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

This document was generated on 05/26/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0901361102

Active

cgrid_iii

Overview:

Description:

2.54mm (.100") Pitch C-Grid III™ Header, Single Row, Vertical, Shrouded, 2 Circuits,

4µm (160µ") Tin/Lead (Sn) over Nickel (Ni)

Documents:

3D Model

RoHS Certificate of Compliance (PDF)

Drawing (PDF)

Series

image - Reference only

General

Product Family

Series

PCB Headers

90136

EU RoHS

China RoHS

ELV and RoHS

Compliant

Application

Overview

Wire-to-Board

cgrid_iii

REACH SVHC

Contains SVHC: No

Halogen-Free

Status

Product Name

C-Grid III™

Physical

Breakaway

Not Halogen-Free

Circuits (Loaded)

Circuits (maximum)

Color - Resin

Need more information on product

environmental compliance?

Black

None

Yes

Brass

Tin

Polyester

Vertical

0.114 In

2.90 mm

First Mate / Last Break

Glow-Wire Compliant

Guide to Mating Part

Keying to Mating Part

Lock to Mating Part

Material - Metal

Material - Plating Mating

Material - Plating Termination

Material - Resin

Number of Rows

Orientation

PC Tail Length (in)

PC Tail Length (mm)

PCB Locator

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Please visit the Contact Us section for any

non-product compliance questions.

Search Parts in this Series

90136Series

Mates With

90123 C-Grid III™ Modular Crimp Housing.

90156 C-Grid III™ Crimp Housing

PCB Retention

None

0.062 In

1.60 mm

Tray

PCB Thickness Recommended (in)

PCB Thickness Recommended (mm)

Packaging Type

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Plating min: Termination (µin)

Plating min: Termination (µm)

Polarized to PCB

0.100 In

2.54 mm

120

Shrouded

Fully

Stackable

Temperature Range - Operating

Termination Interface: Style

-55°C to +125°C

Through Hole

Electrical

Current - Maximum per Contact

Voltage - Maximum

350V

Solder Process Data

Lead-free Process Capability

Wave Capable (TH only)

Material Info

Reference - Drawing Numbers

Packaging Specification

Sales Drawing

PK-90136-001

SDA-90136

This document was generated on 05/26/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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