MSN0650D-TO252 [MORESEMI]

60V(D-S) N-Channel Enhancement Mode Power MOS FET;
MSN0650D-TO252
型号: MSN0650D-TO252
厂家: MORE Semiconductor    MORE Semiconductor
描述:

60V(D-S) N-Channel Enhancement Mode Power MOS FET

文件: 总6页 (文件大小:536K)
中文:  中文翻译
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MSN0650D  
60V(D-S) N-Channel Enhancement Mode Power MOS FET  
General Features  
VDS =60V,ID =50A  
RDS(ON) <20m@ VGS=10V  
High density cell design for ultra low Rdson  
Fully characterized avalanche voltage and current  
Good stability and uniformity with high EAS  
Excellent package for good heat dissipation  
Special process technology for high ESD capability  
Lead Free  
Application  
Power switching application  
Hard switched and high frequency circuits  
Uninterruptible Power Supply  
Marking and pin assignment  
PIN Configuration  
Schematic diagram  
TO-252-2L top view  
Package Marking and Ordering Information  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
Quantity  
MSN0650D  
MSN0650D  
TO-252-2L  
-
-
2500PCS  
Absolute Maximum Ratings (TC=25unless otherwise noted)  
Parameter  
Symbol  
Limit  
60  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Drain Current-Continuous  
VDS  
±20  
V
VGS  
50  
35  
A
A
ID  
Drain Current-Continuous(TC=100)  
Pulsed Drain Current  
ID (100)  
IDM  
220  
80  
A
Maximum Power Dissipation  
W
PD  
Derating factor  
Single pulse avalanche energy (Note 5)  
0.53  
115  
W/℃  
mJ  
EAS  
Operating Junction and Storage Temperature Range  
-55 To 175  
TJ,TSTG  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
1/6  
MSN0650D  
Thermal Characteristic  
Thermal Resistance,Junction-to-Case(Note 2)  
RθJC  
1.88  
/W  
Electrical Characteristics (TC=25unless otherwise noted)  
Parameter  
Symbol  
Condition  
Min Typ  
Max  
Unit  
Off Characteristics  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
On Characteristics (Note 3)  
Gate Threshold Voltage  
Drain-Source On-State Resistance  
Forward Transconductance  
Dynamic Characteristics (Note4)  
Input Capacitance  
BVDSS  
IDSS  
VGS=0V ID=250μA  
VDS=60V,VGS=0V  
VGS=±20V,VDS=0V  
60  
-
70  
-
-
1
V
μA  
nA  
IGSS  
-
-
±100  
VGS(th)  
RDS(ON)  
gFS  
VDS=VGS,ID=250μA  
VGS=10V, ID=20A  
VDS=25V,ID=20A  
1.5  
-
2.0  
17  
-
2.5  
20  
-
V
mΩ  
S
24  
Clss  
Coss  
Crss  
-
-
-
900  
104  
33  
-
-
-
PF  
PF  
PF  
VDS=25V,VGS=0V,  
Output Capacitance  
F=1.0MHz  
Reverse Transfer Capacitance  
Switching Characteristics (Note 4)  
Turn-on Delay Time  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
25  
5
-
-
-
-
nS  
nS  
nS  
nS  
nC  
nC  
nC  
Turn-on Rise Time  
VDD=30V,ID=2A,RL=15Ω  
GS=10V,RG=2.5Ω  
V
Turn-Off Delay Time  
50  
6
Turn-Off Fall Time  
Total Gate Charge  
Qg  
Qgs  
Qgd  
30  
10  
5
VDS=30V,ID=50A,  
GS=10V  
Gate-Source Charge  
V
Gate-Drain Charge  
Drain-Source Diode Characteristics  
Diode Forward Voltage (Note 3)  
Diode Forward Current (Note 2)  
Reverse Recovery Time  
VSD  
IS  
VGS=0V,IS=40A  
-
-
-
-
1.2  
50  
-
V
A
-
trr  
TJ = 25°C, IF = 40A  
di/dt = 100A/μs(Note3)  
50  
nS  
nC  
Reverse Recovery Charge  
Forward Turn-On Time  
Qrr  
ton  
100  
-
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
Notes:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature.  
2. Surface Mounted on FR4 Board, t 10 sec.  
3. Pulse Test: Pulse Width 300μs, Duty Cycle 2%.  
4. Guaranteed by design, not subject to production  
5. EAS condition:Tj=25,VDD=30V,VG=10V,L=0.5mH,Rg=25Ω  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
2/6  
MSN0650D  
Test Circuit  
1) EAS Test Circuit  
2) Gate Charge Test Circuit  
3) Switch Time Test Circuit  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
3/6  
MSN0650D  
Typical Electrical and Thermal Characteristics (Curves)  
Vds Drain-Source Voltage (V)  
TJ-Junction Temperature()  
Figure 1 Output Characteristics  
Figure 4 Rdson-Junction Temperature  
Vgs Gate-Source Voltage (V)  
Qg Gate Charge (nC)  
Figure 2 Transfer Characteristics  
Figure 5 Gate Charge  
ID- Drain Current (A)  
Vsd Source-Drain Voltage (V)  
Figure 3 Rdson- Drain Current  
Figure 6 Source- Drain Diode Forward  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
4/6  
MSN0650D  
Vds Drain-Source Voltage (V)  
TJ-Junction Temperature()  
Figure 7 Capacitance vs Vds  
Figure 9 BVDSS vs Junction Temperature  
Vds Drain-Source Voltage (V)  
TJ-Junction Temperature()  
Figure 8 Safe Operation Area  
Figure 10 VGS(th) vs Junction Temperature  
Square Wave Pluse Duration(sec)  
Figure 11 Normalized Maximum Transient Thermal Impedance  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
5/6  
MSN0650D  
TO-252 Package Information  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min.  
2.200  
0.000  
0.660  
0.460  
6.500  
5.100  
Max.  
2.400  
0.127  
0.860  
0.580  
6.700  
5.460  
Min.  
0.087  
0.000  
0.026  
0.018  
0.256  
0.201  
Max.  
0.094  
0.005  
0.034  
0.023  
0.264  
0.215  
A
A1  
b
c
D
D1  
D2  
E
0.483 TYP.  
0.190 TYP.  
6.000  
2.186  
9.800  
6.200  
2.386  
0.236  
0.086  
0.386  
0.244  
0.094  
0.409  
e
L
10.400  
L1  
L2  
L3  
L4  
Φ
θ
2.900 TYP.  
1.600 TYP.  
0.114 TYP.  
0.063 TYP.  
1.400  
1.700  
0.055  
0.067  
0.600  
1.100  
0°  
1.000  
1.300  
8°  
0.024  
0.043  
0°  
0.039  
0.051  
8°  
h
0.000  
0.300  
0.000  
0.012  
V
5.350 TYP.  
0.211 TYP.  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
6/6  

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