MSN138-SOT23 [MORESEMI]
50V(D-S) N-Channel Enhancement Mode Power MOS FET;![MSN138-SOT23](http://pdffile.icpdf.com/pdf2/p00339/img/icpdf/MSN138-SOT23_2088880_icpdf.jpg)
型号: | MSN138-SOT23 |
厂家: | ![]() |
描述: | 50V(D-S) N-Channel Enhancement Mode Power MOS FET |
文件: | 总6页 (文件大小:528K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
MSN138
50V(D-S) N-Channel Enhancement Mode Power MOS FET
General Features
● VDS = 50V,ID = 0.22A
RDS(ON) < 3Ω @ VGS=5V
RDS(ON) < 2Ω @ VGS=10V
Lead Free
● Lead free product is acquired
● Surface mount package
Application
●Direct logic-level interface: TTL/CMOS
●Drivers: relays, solenoids, lamps, hammers , display,
memories, transistors, etc.
●Battery operated systems
●Solid-state relays
Marking and pin assignment
PIN Configuration
Schematic diagram
SOT-23 top view
Package Marking and Ordering Information
Device Marking
Device
Device Package
Reel Size
Ø180mm
Tape width
Quantity
MSN138
SOT-23
8 mm
3000 units
Absolute Maximum Ratings (TA=25℃unless otherwise noted)
Parameter
Symbol
Limit
50
Unit
Drain-Source Voltage
V
V
VDS
Gate-Source Voltage
±20
VGS
Drain Current-Continuous
Drain Current-Pulsed (Note 1)
0.22
0.88
0.35
A
ID
A
IDM
Maximum Power Dissipation
W
℃
PD
Operating Junction and Storage Temperature Range
-55 To 150
TJ,TSTG
Thermal Characteristic
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
350
℃/W
MORE Semiconductor Company Limited
http://www.moresemi.com
1/6
MSN138
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min Typ
Max
Unit
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics (Note 3)
BVDSS
IDSS
VGS=0V ID=250μA
VDS=50V,VGS=0V
VGS=±20V,VDS=0V
50
-
65
-
-
V
0.5
μA
nA
IGSS
-
-
±100
Gate Threshold Voltage
VGS(th)
RDS(ON)
gFS
VDS=VGS,ID=250μA
VGS=5V, ID=0.05A
VGS=10V, ID=0.5A
VDS=10V,ID=0.2A
0.8
1.2
1.2
1
1.6
3
V
Ω
Ω
S
-
-
Drain-Source On-State Resistance
2
Forward Transconductance
Dynamic Characteristics (Note4)
Input Capacitance
0.12
-
-
Clss
Coss
Crss
-
-
-
27
12
6
-
-
-
PF
PF
PF
VDS=25V,VGS=0V,
F=1.0MHz
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics (Note 4)
Turn-on Delay Time
td(on)
tr
td(off)
tf
-
-
-
-
2.5
6
-
-
-
-
nS
nS
nS
nS
Turn-on Rise Time
VDD=30V,ID=0.22A
VGS=10V,RGEN=6Ω
Turn-Off Delay Time
20
7
Turn-Off Fall Time
V
DS=25V,ID=0.3A,
Total Gate Charge
Qg
-
1.7
2.4
nC
VGS=10V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
Diode Forward Current (Note 2)
VSD
IS
VGS=0V,IS=0.22A
-
-
-
-
-
1.3
V
A
0.22
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
MORE Semiconductor Company Limited
http://www.moresemi.com
2/6
MSN138
Typical Electrical and Thermal Characteristics
Vdd
ton
tr
toff
tf
td(on)
VOUT
VIN
td(off)
Rl
Vin
90%
90%
D
Vout
Vgs
INVERTED
Rgen
10%
90%
G
10%
50%
S
50%
10%
PULSE WIDTH
Figure 1:Switching Test Circuit
Figure 2:Switching Waveforms
Vds Drain-Source Voltage (V)
Vgs Gate-Source Voltage (V)
Figure 3 Output Characteristics
Figure 4 Transfer Characteristics
ID- Drain Current (A)
Vgs Gate-Source Voltage (V)
Figure 5 Drain-Source On-Resistance
Figure 6 Rdson vs Vgs
MORE Semiconductor Company Limited
http://www.moresemi.com
3/6
MSN138
Qg Gate Charge (nC)
Vds Source-Drain Voltage (V)
Figure 7 Gate Charge
Figure 8 Source-DrainDiode Forward
TJ-Junction Temperature(℃)
Vds Drain-Source Voltage (V)
Figure 9 Drain-Source On-Resistance
Figure 10 Safe Operation Area
Vds Drain-Source Voltage (V)
Figure 11 Capacitance vs Vds
MORE Semiconductor Company Limited
http://www.moresemi.com
4/6
MSN138
Square Wave Pluse Duration(sec)
Figure 12 Normalized Maximum Transient Thermal Impedance
MORE Semiconductor Company Limited
http://www.moresemi.com
5/6
MSN138
SOT-23 Package Information
Dimensions in Millimeters
Symbol
MIN.
MAX.
1.150
A
A1
A2
b
0.900
0.000
0.900
0.300
0.080
2.800
1.200
2.250
0.100
1.050
0.500
c
0.150
D
3.000
E
1.400
E1
e
2.550
0.950TYP
2.000
e1
L
1.800
0.550REF
0.500
L1
θ
0.300
0°
8°
Notes
1. All dimensions are in millimeters.
2. Tolerance ±0.10mm (4 mil) unless otherwise specified
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
MORE Semiconductor Company Limited
http://www.moresemi.com
6/6
相关型号:
![](http://pdffile.icpdf.com/pdf2/p00299/img/page/MSO50MRM1E1_1805726_files/MSO50MRM1E1_1805726_1.jpg)
![](http://pdffile.icpdf.com/pdf2/p00299/img/page/MSO50MRM1E1_1805726_files/MSO50MRM1E1_1805726_2.jpg)
MSO104MRC02E1
Telecom and Datacom Connector, 104 Contact(s), Female, Wire Wrap Terminal, Receptacle
AMPHENOL
![](http://pdffile.icpdf.com/pdf2/p00299/img/page/MSO50MRM1E1_1805726_files/MSO50MRM1E1_1805726_1.jpg)
![](http://pdffile.icpdf.com/pdf2/p00299/img/page/MSO50MRM1E1_1805726_files/MSO50MRM1E1_1805726_2.jpg)
MSO104MRC89E1
Telecom and Datacom Connector, 104 Contact(s), Female, Wire Wrap Terminal, Receptacle
AMPHENOL
©2020 ICPDF网 联系我们和版权申明