M38510/31301BCA [MOTOROLA]

NAND Gate, LS Series, 2-Func, 4-Input, TTL, CDIP14, CERAMIC, DIP-14;


型号：	M38510/31301BCA
厂家：	MOTOROLA
描述：	NAND Gate, LS Series, 2-Func, 4-Input, TTL, CDIP14, CERAMIC, DIP-14 栅 CD
文件：	总18页 (文件大小：159K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

INCH-POUND

MIL-M-38510/313B

23 May 2003

SUPERSEDING

MIL-M-38510/313A

22 July 1983

MILITARY SPECIFICATION

MICROCIRCUITS, DIGITAL, BIPOLAR LOW-POWER SCHOTTKY TTL,

SCHMITT TRIGGER POSITIVE NAND GATES AND INVERTERS, MONOLITHIC SILICON

Inactive for new design after 18 April 1997.

This specification is approved for use by all Departments

and Agencies of the Department of Defense.

1. SCOPE

1.1 Scope. This specification covers the detail requirements for monolithic silicon, low-power Schottky TTL,

Schmitt trigger positive NAND gate and inverter microcircuits. Two product assurance classes and a choice of case

outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product,

the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.3).

1.2 Part number. The part number should be in accordance with MIL-PRF-38535, and as specified herein.

1.2.1 Device types. The device types should be as follows:

Device type

Circuit

Dual 4 input, Schmitt trigger positive NAND gate

Hex Schmitt trigger inverter

Quad 2 input Schmitt trigger positive NAND gate

1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535.

1.2.3 Case outlines. The case outlines should be as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

Terminals

Package style

GDFP5-F14 or CDFP6-F14

GDFP4-F14

GDIP1-T14 or CDIP2-T14

GDFP1-F14 or CDFP2-F14

CQCC2-N20

Flat pack

Dual-in-line

Flat pack

Square leadless chip carrier

CQCC1-N20

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in

improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN:

DSCC-VAS, P. O. Box 3990, Columbus, OH 43216-5000, by using the self addressed Standardization

Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

AMSC N/A

FSC 5962

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

MIL-M-38510/313B

1.3 Absolute maximum ratings.

Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc

Input voltage range ................................................................................ -1.5 V dc at -18 mA to +5.5 V dc

Storage temperature range .................................................................... -65° to +150°C

Maximum power dissipation, (P_D) 1/

Device type 01 ..................................................................................... 38.5 mW dc

Device type 02 ..................................................................................... 115.5 mW dc

Device type 03 ..................................................................................... 77 mW dc

Lead temperature (soldering, 10 seconds) ............................................. +300°C

Thermal resistance, junction to case (θ_JC):

Cases A, B, C, D, X, and 2 ................................................................... (See MIL-STD-1835)

Junction temperature (T_J) 2/ ................................................................... +175°C

1.4 Recommended operating conditions.

Supply voltage (V_CC) .............................................................................. +4.5 V dc minimum to +5.5 V dc

maximum

Minimum high level input voltage (V_IH) ................................................... +1.4 V dc

Maximum low level input voltage (V_IL) .................................................... +1.0 V dc

Normalized fanout (each output) 3/ ....................................................... 10 maximum

Case operating temperature range (T_C) ................................................. -55° to +125°C

2. APPLICABLE DOCUMENTS

2.1 Government documents.

2.1.1 Specifications and Standards. The following specifications and standards form a part of this specification to

the extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the

issue of the Departments of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited

in the solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535

STANDARDS

DEPARTMENT OF DEFENSE

Integrated Circuits (Microcircuits) Manufacturing, General Specification for.

MIL-STD-883

MIL-STD-1835

Test Method Standard for Microelectronics.

Interface Standard Electronic Component Case Outlines

(Unless otherwise indicated, copies of the above specifications and standards are available from the

Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited

herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws

and regulations unless a specific exemption has been obtained.

_______

1/ Must withstand the added P_Ddue to short-circuit test (e.g., I_OS).

2/ Maximum junction temperature shall not be exceeded except in accordance with allowable short

duration burn-in screening condition in accordance with MIL-PRF-38535.

3/ The device shall fanout in both high and low levels to the specified number of inputs of the same device

type as that being tested.

MIL-M-38510/313B

3. REQUIREMENTS

3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before

contract award (see 4.3 and 6.4).

3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as

specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the

QM plan shall not affect the form, fit, or function as described herein.

3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be

as specified in MIL-PRF-38535 and herein.

3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as

specified on figure 1.

3.3.2 Truth tables. The truth tables shall be as specified on figure 2.

3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to

the qualifying activity and the preparing activity upon request.

3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.

3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).

3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,

and apply over the full recommended case operating temperature range, unless otherwise specified.

3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups

specified in table II. The electrical tests for each subgroup are described in table III.

3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.

3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group

number 8 (see MIL-PRF-38535, appendix A).

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535

or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall

not effect the form, fit, or function as described herein.

4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior

to qualification and quality conformance inspection. The following additional criteria shall apply:

a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as

specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test

circuit shall be maintained under document control by the device manufacturer's Technology Review

Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or

preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power

dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical

parameters test prior to burn-in is optional at the discretion of the manufacturer.

c. Additional screening for space level product shall be as specified in MIL-PRF-38535.

MIL-M-38510/313B

TABLE I. Electrical performance characteristics.

Test

Symbol

Conditions

Device

types

Limits

Unit

Min

1.4

Max

1.9

-55°C ≤ T_C≤ +125°C

unless otherwise specified

Positive going threshold V_T+

voltage

V_CC= +5.0 V

All

Negative going threshold V_T-

voltage

V_CC= +5.0 V

0.5

0.4

2.5

1.0

1.4

Hysteresis

High level output voltage V_OH1

Low level output voltage V_OL1

High level output voltage V_OH2

Low level output voltage V_OL2

V_CC= +4.5 V, I_OH= -.4 mA,

V_IN= +0.5 V

V_CC= +4.5 V, I_OL= +4 mA,

V_IN= +1.9 V

0.4

V_CC= +5.0 V, I_OH= -.4 mA,

V_IN= +0.5 V, then +1.4 V

V_CC= +5.0 V, I_OL= +4 mA,

V_IN= +1.9 V, then +1.0 V

V_CC= +4.5 V, I_IN= -18 mA,

T_C= +25°C

2.5

0.4

-1.5

Input clamp voltage

V_IC

I_IH1

I_IH2

High level input current

V_CC= +5.5 V, V_IN= +2.7 V

µA

V_CC= +5.5 V, V_IH= +5.5 V

All

100

µA

Low level input current

I_IL

V_CC= +5.5 V, V_IN= +0.4 V

V_CC= +5.5 V, V_IN= GND 2/

V_CC= +5.5 V, V_IN= GND

All

-.12

-.36

-100

Short circuit output

current

I_OS

I_CCH

-15

High level supply

current (total)

All

6.0

16.0

11.0

7.0

Low level supply

current (total)

I_CCL

V_CC= +5.5 V, V_IN= 5.5 V

21.0

14.0

Propagation delay time

high to low level

t_PHL

t_PLH

V_CC= +5.0 V,

R_L= 2 kΩ ±10%

C_L= 50 pF ±10%,

Propagation delay time

low to high level

All

1/ For CKT E, device type 03, I_ILlimits are -.17 mA min and -.41 mA max.

2/ Not more than one output should be shorted at a time.

MIL-M-38510/313B

TABLE II. Electrical test requirements.

Subgroups (see table III)

MIL-PRF-38535

test requirements

Class S

devices

Class B

devices

Interim electrical parameters

Final electrical test parameters

Group A test requirements

1*, 2, 3, 9

1, 2, 3,

1, 2, 3, 9,

10, 11

N/A

9, 10, 11

1, 2, 3,

Group B electrical test parameters

when using the method 5005 QCI option

Group C end-point electrical parameters

9, 10, 11

1, 2, 3,

1, 2, 3

9, 10, 11

1, 2, 3

Group D end-point electrical parameters

*PDA applies to subgroup 1.

4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.

4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with

MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).

4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as

follows:

a. Tests shall be as specified in table II herein.

b. Subgroups 4, 5, 6, 7, and 8 shall be omitted.

4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.

4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as

follows:

a. End-point electrical parameters shall be as specified in table II herein.

b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be

as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test

circuit shall be maintained under document control by the device manufacturer's Technology Review

Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or

preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power

dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.

4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point

electrical parameters shall be as specified in table II herein.

4.5 Methods of inspection. Methods of inspection shall be specified and as follows.

4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given

are conventional and positive when flowing into the referenced terminal.

MIL-M-38510/313B

FIGURE 1. Terminal connections and logic diagrams.

MIL-M-38510/313B

FIGURE 1. Terminal connections and logic diagrams - Continued.

MIL-M-38510/313B

Device type 01

Truth table

Input

Output

Positive logic Y = ABCD

Device type 02

Truth table each gate

Input

Output

Positive logic Y = A

Device type 03

Truth table each gate

Input

Output

Positive logic Y = AB

FIGURE 2. Truth tables and logic equations.

MIL-M-38510/313B

NOTES:

1. Pulse generator characteristics: PRR ≤ 1 MHz, t_I≤ 15 ns, t_O≤ 6 ns, and Z_OUT≈ 50Ω.

2. C_L= 50 pF ±10% including probe and jig capacitance. All diodes are 1N3064 or equivalent.

FIGURE 3. Switching time test circuit and waveforms.

TABLE III. Group A inspection for device type 01. 1/

Cases

A,B,C,D

Cases

X, 2 2/

Test no.

MIL-STD-

883

method

Subgroup Symbol

Measured

terminal

Limits

Unit

0.5 V

1.9 V

-.4 mA

GND

V_CC

4.5 V

Min

Max

V_OH1

3006

3007

3006

1.9 V

0.5 V

1.9 V

0.5 V

1.9 V

2.5

µA

“

Tc = 25°C

0.5 V

-.4 mA

0.5 V

1.9 V

0.5 V

1.9 V

0.5 V

1.9 V

0.5 V

V_OL1

V_OH2

1.9 V

4 mA

0.4

4 mA

1.9 V

-.4 mA

5.0 V

2.5

1.9 V

-.4 mA

1.9 V

V_OL2

V_IC

3007

4 mA

0.4

-1.5

4 mA

-18 mA

4.5 V

-18 mA

I_IH1

3010

2.7 V

GND

2.7 V

GND

2.7 V

GND

5.5 V

2.7 V

GND

2.7 V

GND

2.7 V

GND

2.7 V

I_IH2

5.5 V

GND

5.5 V

GND

5.5 V

GND

100

5.5 V

GND

5.5 V

GND

5.5 V

GND

5.5 V

See footnotes at end of table.

TABLE III. Group A inspection for device type 01 – Continued. 1/

Cases

A,B,C,D

MIL-STD-

883

method

Cases

X, 2 2/

Subgroup Symbol

Measured

terminal

Limits

Unit

Test no.

0.4 V

5.5 V

GND

V_CC

5.5 V

Min

Max

I _{I L}

3009

5.5 V

0.4 V

5.5 V

0.4 V

5.5 V

V_CC

-.12

-.36

-100

6.0

7.0

“

Tc = 25°C

0.4 V

5.5 V

0.4 V

5.5 V

0.4 V

5.5 V

0.4 V

I_OS

3011

3005

GND

-15

GND

5.5 V

GND

5.5 V

GND

5.5 V

GND

5.5 V

I_CCH

I_CCL

GND

5.5 V

GND

5.5 V

GND

5.5 V

GND

5.5 V

Same tests, terminal conditions and limits as for subgroup 1, except T_C= +125°C and V_{I C}tests are omitted.

Same tests, terminal conditions and limits as for subgroup 1, except T_C= -55°C and V_{I C}tests are omitted.

t_PHL

t_PLH

t_PHL

t_PLH

3003

Fig. 3

5.0 V

OUT

GND

5.0 V

1A to 1Y

2A to 2Y

1A to1Y

2A to 2Y

1A to 1Y

2A to 2Y

1A to1Y

2A to 2Y

“

OUT

5.0 V

Tc = 25°C

“

Tc = 125°C

Same tests, terminal conditions, and limits as for subgroup 10, except T_C= -55°C.

1/ Terminal conditions (pins not designated may be H ≥ 1.4 V; L ≤ 1.0 V; or open).

2/ Case X and 2 pins not referenced are NC.

3/ Momentary 0.5 V, then 1.4 V without overshoot during test.

4/ Momentary 1.9 V, then 1.0 V without undershoot during test.

TABLE III. Group A inspection for device type 02. 1/

Cases

A,B,C,D

Cases

X, 2 2/

Test no.

MIL-STD-

883

method

Subgroup Symbol

Measured

terminal

Limits

Unit

0.5 V

-.4 mA

GND

V_CC

4.5 V

Min

Max

V_OH1

V_OL1

V_OH2

V_OL2

V_{I C}

3006

3007

3006

2.5

“

µA

“

0.5 V

-.4 mA

“

Tc = 25°C

0.5 V

-.4 mA

4 mA

0.5 V

1.9 V

-.4 mA

4 mA

0.5 V

1.9 V

-.4 mA

4 mA

0.5 V

1.9 V

0.4 V

1.9 V

4 mA

“

1.9 V

4 mA

1.9 V

4 mA

-.4 mA

5.0 V

“

4.5 V

“

2.5

-.4 mA

4 mA

-.4 mA

4 mA

-.4 mA

4 mA

3007

0.4 V

-1.5

“

4 mA

-18 mA

4 mA

-18 mA

2.7 V

-18 mA

2.7 V

-18 mA

2.7 V

I_{I H 1}

I_{I H 2}

I_{I L}

3010

5.5 V

“

2.7 V

5.5 V

2.7 V

5.5 V

2.7 V

5.5 V

“

100

“

5.5 V

0.4 V

5.5 V

0.4 V

5.5 V

0.4 V

3009

-.12

-.36

“

0.4 V

“

See footnotes at end of table.

TABLE III. Group A inspection for device type 02. 1/

Cases

A,B,C,D

Cases

X, 2 2/

Test no.

MIL-STD-

883

method

Subgroup Symbol

Measured

terminal

Limits

Unit

GND

V_CC

5.5 V

Min

Max

I_OS

3011

V_{C C}

-15

-100

GND

Tc = 25°C

GND

5.5 V

I_{C CH}

I_{C CL}

3005

GND

5.5 V

GND

5.5 V

GND

5.5 V

GND

5.5 V

GND

5.5 V

Same tests, terminal conditions and limits as for subgroup 1, except T_C= +125° C, and V _{I C}tests are omitted.

Same tests, terminal conditions and limits as for subgroup 1, except T_C= -55° C, and V _{I C}tests are omitted.

t_PHL

t_PLH

t_PHL

t_PLH

3003

OUT

GND

5.0 V

1A to 1Y

2A to 2Y

3A to 3Y

4A to 4Y

5A to 5Y

6A to 6Y

1A to 1Y

2A to 2Y

3A to 3Y

4A to 4Y

5A to 5Y

6A to 6Y

1A to 1Y

2A to 2Y

3A to 3Y

4A to 4Y

5A to 5Y

6A to 6Y

1A to 1Y

2A to 2Y

3A to 3Y

4A to 4Y

5A to 5Y

6A to 6Y

“

Fig. 3

OUT

“

Tc = 25°C

OUT

“

OUT

“

OUT

“

3003

“

Fig. 3

Tc = 125°C

“

Same tests, terminal conditions, and limits as for subgroup 10, except T_C= -55°C.

1/ Terminal conditions (pins not designated may be H ≥ 1.4 V; L ≤ 1.0 V; or open).

2/ Case X and 2 pins not referenced are NC.

3/ Momentary 0.5 V, then 1.4 V without overshoot during test.

4/ Momentary 1.9 V, then 1.0 V without undershoot during test.

TABLE III. Group A inspection for device type 03. 1/

Cases

A,B,C,D

Cases

X, 2 2/

Test no.

MIL-STD-

883

method

Subgroup Symbol

Measured

terminal

Limits

Unit

0.5 V

1.9 V

0.5 V

-.4 mA

GND

V_CC

4.5 V

Min

Max

V_OH1

3006

3007

3006

2.5

µA

“

Tc = 25°C

0.5 V

1.9 V

0.5 V

-.4 mA

0.5 V

1.9 V

0.5 V

-.4 mA

4 mA

0.5 V

1.9 V

0.5 V

1.9 V

V_OL1

0.4

4 mA

1.9 V

4 mA

1.9 V

4 mA

-.4 mA

V_OH2

5.0 V

4.5 V

2.5

1.9 V

-.4 mA

1.9 V

-.4 mA

4 mA

1.9 V

V_OL2

3007

0.4

4 mA

-18 mA

4 mA

V_{I C}

-1.5

-18 mA

I_IH1

3010

2.7 V

GND

2.7 V

5.5 V

2.7 V

GND

2.7 V

GND

2.7 V

GND

2.7 V

I_IH2

5.5 V

GND

5.5 V

100

5.5 V

GND

5.5 V

GND

5.5 V

GND

5.5 V

See footnotes at end of table.

TABLE III. Group A inspection for device type 03 – Continued. 1/

Cases

A,B,C,D

MIL-STD-

883

method

Cases

X, 2 2/

Subgroup Symbol

Measured

terminal

Limits

Unit

Test no.

0.4 V

5.5 V

0.4 V

GND

V_CC

5.5 V

Min

Max

I _{I L}

3009

V_CC

-.12

-15

-.36

-100

“

Tc = 25°C

0.4 V

5.5 V

0.4 V

5.5 V

0.4 V

5.5 V

0.4 V

I_OS

3011

GND

5.5 V

GND

5.5 V

I_CCH

I_CCL

3005

GND

5.5 V

GND

5.5 V

GND

5.5 V

GND

5.5 V

GND

5.5 V

GND

5.5 V

11.0

14.0

Same tests, terminal conditions and limits as for subgroup 1, except T_C= +125°C and V_{I C}tests are omitted.

Same tests, terminal conditions and limits as for subgroup 1, except T_C= -55°C and V_{I C}tests are omitted.

t_PHL

t_PLH

t_PHL

t_PLH

3003

5.0 V

OUT

GND

5.0 V

1A to 1Y

2A to 2Y

3A to 3Y

4A to 4Y

1A to 1Y

2A to 2Y

3A to 3Y

4A to 4Y

1A to 1Y

2A to 2Y

3A to 3Y

4A to 4Y

1A to 1Y

2A to 2Y

3A to 3Y

4A to 4Y

“

Fig. 3

5.0 V

OUT

“

Tc = 25°C

OUT

5.0 V

OUT

5.0 V

“

Tc = 125°C

“

Same tests, terminal conditions, and limits as for subgroup 10, except T_C= -55°C.

1/ Terminal conditions (pins not designated may be H ≥ 1.4 V; L ≤ 1.0 V; or open).

2/ Case X and 2 pins not referenced are NC.

3/ Momentary 0.5 V, then 1.4 V without overshoot during test.

4/ Momentary 1.9 V, then 1.0 V without undershoot during test.

5/ For CKT E I_ILlimits are as follows, -0.17 to -0.41 mA.

MIL-M-38510/313B

5. PACKAGING

5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the

contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these

personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements.

Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military

Department of Defense Agency, or within the Military Department's System Command. Packaging data retrieval is

available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM

products, or by contacting the responsible packaging activity.

6. NOTES

(This section contains information of a general or explanatory nature which may be helpful, but is not

mandatory.)

6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design

applications and logistic support of existing equipment.

6.2 Acquisition requirements. Acquisition documents should specify the following:

a. Title, number, and date of the specification.

b. Complete part number (see 1.2).

c. Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device

inspection lot to be supplied with each shipment by the device manufacturer, if applicable.

d. Requirements for certificate of compliance, if applicable.

e. Requirements for notification of change of product or process to contracting activity in addition to

notification to the qualifying activity, if applicable.

f. Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883),

corrective action, and reporting of results, if applicable.

g. Requirements for product assurance options.

h. Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should

not affect the part number. Unless otherwise specified, these requirements will not apply to direct

purchase by or direct shipment to the Government.

j. Requirements for "JAN" marking.

6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the

available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-

38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements

now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have

been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists.

6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which

are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not

such products have actually been so listed by that date. The attention of the contractors is called to these

requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal

Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for

the products covered by this specification. Information pertaining to qualification of products may be obtained from

DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.

MIL-M-38510/313B

6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined

in MIL-PRF-38535, MIL-HDBK-1331, and as follows:

GND ........................................... Ground zero voltage potential

I_IN................................................ Current flowing into an input terminal

V_IN............................................... Voltage level at an input terminal

6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified,

microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material

and finish A (see 3.4). Longer length leads and lead forming should not affect the part number.

6.7 Substitutability. The cross-reference information below is presented for the convenience of users.

Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry

microcircuit types may not have equivalent operational performance characteristics across military temperature

ranges or reliability factors equivalent to MIL-M-38510 device types and may have slight physical variations in relation

to case size. The presence of this information should not be deemed as permitting substitution of generic-industry

types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.

Military device

Generic-industry

type

54LS13

54LS14

54LS132

6.8 Manufacturers' designation. Manufacturers' circuits which form a part of this specification are designated with

an "X" as shown in table IV herein.

TABLE IV. Manufacturers' designations.

Circuits

Device

type

National

Semiconductor

Corp.

Texas

Instruments

Signetics Motorola Inc.

Corp.

Raytheon

Co.

6.9 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the

previous issue due to the extensiveness of the changes.

Custodians:

Army - CR

Navy - EC

Air Force - 11

DLA - CC

Preparing activity:

DLA - CC

(Project 5962-1962)

Review activities:

Army - MI, SM

Navy - AS, CG, MC, SH, TD

Air Force - 03, 19, 99

STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL

INSTRUCTIONS

1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given.

2. The submitter of this form must complete blocks 4, 5, 6, and 7, and send to preparing activity.

3. The preparing activity must provide a reply within 30 days from receipt of the form.

NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts.

Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend

contractual requirements.

1. DOCUMENT NUMBER

MIL-M-38510/313B

2. DOCUMENT DATE (YYYYMMDD)

I RECOMMEND A CHANGE:

2003-05-23

3. DOCUMENT TITLE

MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY TTL, SCHMITT TRIGGER POSITIVE NAND GATE AND

INVERTER, MONOLITHIC SILICON

4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.)

5. REASON FOR RECOMMENDATION

6. SUBMITTER

a. NAME (Last, First Middle Initial)

b. ORGANIZATION

c. ADDRESS (Include Zip Code)

d. TELEPHONE (Include Area Code)

(1) Commercial

7. DATE SUBMITTED

(YYYYMMDD)

(2) DSN

(If applicable)

8. PREPARING ACTIVITY

a. NAME

b. TELEPHONE (Include Area Code

Defense Supply Center, Columbus

(1) Commercial 614-692-0536

(2) DSN 850-0536

c. ADDRESS (Include Zip Code)

DSCC-VA

IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT:

Defense Standardization Program Office (DLSC-LM)

8725 John J. Kingman Road, Suite 2533

P. O. Box 3990

Columbus, Ohio 43216-5000

Fort Belvoir, Virginia 22060-6221

Telephone (703)767-6888 DSN 427-6888

DD Form 1426, FEB 1999 (EG)

PREVIOUS EDITIONS ARE OBSOLETE.

WHS/DIOR, Feb 99

M38510/31301BCA [MOTOROLA]

相关型号：

M38510/31301BCX

M38510/31301BDA

M38510/31301BDX

M38510/31302B2C

M38510/31302B2X

M38510/31302BAX

M38510/31302BBA

M38510/31302BBC

M38510/31302BBX

M38510/31302BCA

M38510/31302BCX

M38510/31302BDX