MC10H186LD [MOTOROLA]

D Flip-Flop, 6-Func, Master-slave Triggered, ECL, CDIP16;
MC10H186LD
型号: MC10H186LD
厂家: MOTOROLA    MOTOROLA
描述:

D Flip-Flop, 6-Func, Master-slave Triggered, ECL, CDIP16

触发器 逻辑集成电路
文件: 总4页 (文件大小:104K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
The MC10H186 is a hex D type flip–flop with common reset and clock lines.  
This MECL 10H part is a functional/pinout duplication of the standard MECL  
10K family part, with 100% improvement in clock toggle frequency and  
propagation delay and no increase in power–supply current.  
Propagation Delay, 1.7 ns Typical  
Power Dissipation, 460 mW Typical  
Improved Noise Margin 150 mV (Over Operating Voltage and  
Temperature Range)  
L SUFFIX  
CERAMIC PACKAGE  
CASE 620–10  
Voltage Compensated  
MECL 10K–Compatible  
P SUFFIX  
PLASTIC PACKAGE  
CASE 648–08  
FN SUFFIX  
PLCC  
CASE 775–02  
MAXIMUM RATINGS  
Characteristic  
= 0)  
Symbol  
Rating  
Unit  
Vdc  
Vdc  
mA  
Power Supply (V  
Input Voltage (V  
V
–8.0 to 0  
CC  
= 0)  
EE  
V
I
0 to V  
EE  
CC  
Output Current — Continuous  
— Surge  
I
50  
100  
out  
CLOCKED TRUTH TABLE  
Operating Temperature Range  
T
A
0 to +75  
°C  
R
L
C
D
X
L
Qn+1  
Qn  
L
Storage Temperature Range — Plastic  
— Ceramic  
T
–55 to +150  
–55 to +165  
°C  
°C  
stg  
L
ELECTRICAL CHARACTERISTICS (V  
= –5.2 V ±5%) (See Note)  
L
H *  
H *  
L
EE  
L
H
X
H
0°  
25°  
75°  
H
L
Characteristic  
Symbol  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
Power Supply Current  
I
121  
110  
121  
mA  
E
* A clock H is a clock transition from  
a low to a high state.  
Input Current High  
Pins 5,6,7,10,11,12  
Pin 9  
I
µA  
inH  
430  
670  
1250  
265  
420  
765  
265  
420  
765  
Pin 1  
Input Current Low  
High Output Voltage  
Low Output Voltage  
High Input Voltage  
Low Input Voltage  
I
0.5  
0.5  
0.3  
µA  
inL  
V
–1.02 –0.84 –0.98 –0.81 –0.92  
–1.95 –1.63 –1.95 –1.63 –1.95  
–1.17 –0.84 –1.13 –0.81 –1.07  
–1.95 –1.48 –1.95 –1.48 –1.95  
–0.735  
–1.60  
Vdc  
Vdc  
Vdc  
Vdc  
OH  
DIP  
V
OL  
PIN ASSIGNMENT  
V
–0.735  
–1.45  
IH  
V
IL  
RESET  
Q0  
V
CC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
AC PARAMETERS  
Propagation Delay  
Set–up Time  
t
0.7  
1.5  
1.0  
0.7  
0.7  
250  
3.0  
3.0  
0.7  
1.5  
1.0  
0.7  
0.7  
250  
3.0  
3.0  
0.7  
1.5  
1.0  
0.7  
0.7  
250  
3.0  
3.0  
ns  
ns  
Q5  
Q4  
Q3  
D5  
pd  
t
set  
Q1  
Hold Time  
t
ns  
hold  
Q2  
Rise Time  
t
2.6  
2.6  
2.6  
2.6  
2.6  
2.6  
ns  
r
Fall Time  
t
f
ns  
D0  
Toggle Frequency  
f
MHz  
ns  
tog  
D4  
D1  
Reset Recovery Time  
t
rr  
(t  
)
1–9+  
D2  
D3  
NOTE:  
CLOCK  
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,  
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed  
circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated  
through a 50–ohm resistor to –2.0 volts.  
V
EE  
Pin assignment is for Dual–in–Line Package.  
For PLCC pin assignment, see the Pin Conversion  
Tables on page 6–11 of the Motorola MECL Data  
Book (DL122/D).  
3/93  
Motorola, Inc. 1996  
REV 5  
MC10H186  
APPLICATION INFORMATION  
The MC10H186 contains six high–speed, master slave  
type “D” flip–flops. Data is entered into the master when  
the clock is low. Master–to–slave data transfer takes  
place on the positive–going Clock transition. Thus  
outputs may change only on a positive–going Clock  
transition. A change in the information present at the data  
(D) input will not affect the output information any other  
time due to the master–slave construction of this device.  
A common Reset is included in this circuit. THE RESET  
ONLY FUNCTIONS WHEN THE CLOCK IS LOW.  
LOGIC DIAGRAM  
D0  
D1  
5
2
3
Q0  
Q1  
6
7
D2  
D3  
D4  
4
Q2  
10  
11  
12  
13 Q3  
14 Q4  
15 Q5  
D5  
9
CLOCK  
RESET  
1
V
V
=
=
PIN 16  
PIN 8  
CC  
EE  
2–281  
MOTOROLA  
MC10H186  
OUTLINE DIMENSIONS  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 775–02  
ISSUE C  
M
S
S
0.007 (0.180)  
T
L–M  
N
B
Y BRK  
–M–  
–N–  
M
S
S
0.007 (0.180)  
T
L–M  
N
U
D
D
–L–  
Z
W
20  
1
S
S
S
0.010 (0.250)  
T
L–M  
N
G1  
X
V
VIEW D–D  
M
M
S
S
S
S
A
R
0.007 (0.180)  
0.007 (0.180)  
T
L–M  
L–M  
N
N
Z
T
M
S
S
0.007 (0.180)  
T
L–M  
N
H
C
K1  
E
K
0.004 (0.100)  
–T– SEATING  
G
J
PLANE  
M
S
S
0.007 (0.180)  
T
L–M  
N
F
VIEW S  
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T
L–M  
N
NOTES:  
1. DATUMS –L–, –M–, AND –N– DETERMINED  
INCHES  
MILLIMETERS  
DIM  
MIN  
MAX  
0.395  
0.395  
0.180  
0.110  
0.019  
MIN  
9.78  
9.78  
4.20  
2.29  
0.33  
MAX  
10.03  
10.03  
4.57  
2.79  
0.48  
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC  
BODY AT MOLD PARTING LINE.  
A
B
C
E
0.385  
0.385  
0.165  
0.090  
0.013  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM –T–, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN THE  
PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE TOP  
AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037 (0.940).  
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE  
THE H DIMENSION TO BE SMALLER THAN 0.025  
(0.635).  
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC  
1.27 BSC  
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
–––  
0.032  
–––  
–––  
0.356  
0.356  
0.048  
0.048  
0.056  
0.020  
10  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
–––  
2
0.81  
–––  
–––  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
Z
G1  
K1  
2
0.310  
0.040  
0.330  
–––  
7.88  
1.02  
8.38  
–––  
MOTOROLA  
2–282  
MC10H186  
OUTLINE DIMENSIONS  
L SUFFIX  
CERAMIC DIP PACKAGE  
CASE 620–10  
–A–  
NOTES:  
ISSUE V  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSION F MAY NARROW TO 0.76 (0.030)  
WHERE THE LEAD ENTERS THE CERAMIC  
BODY.  
16  
1
9
8
–B–  
C
L
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
MIN  
MAX  
0.785  
0.295  
0.200  
0.020  
MIN  
19.05  
6.10  
–––  
MAX  
19.93  
7.49  
5.08  
0.50  
0.750  
0.240  
–––  
–T–  
SEATING  
PLANE  
0.015  
0.39  
K
N
E
0.050 BSC  
1.27 BSC  
F
0.055  
0.065  
1.40  
1.65  
G
H
K
L
M
N
0.100 BSC  
2.54 BSC  
M
E
0.008  
0.125  
0.015  
0.170  
0.21  
3.18  
0.38  
4.31  
F
J 16 PL  
G
0.300 BSC  
7.62 BSC  
M
S
0.25 (0.010)  
T B  
0
15  
0
15  
D 16 PL  
0.25 (0.010)  
0.020  
0.040  
0.51  
1.01  
M
S
T
A
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 648–08  
ISSUE R  
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
16  
1
9
8
B
S
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
F
MIN  
MAX  
0.770  
0.270  
0.175  
0.021  
0.70  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
0.740  
0.250  
0.145  
0.015  
0.040  
C
L
SEATING  
–T–  
G
H
J
K
L
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
PLANE  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
0.25 (0.010)  
M
S
0.020  
0.040  
0.51  
1.01  
M
M
T
A
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;  
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,  
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454  
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315  
MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609  
INTERNET: http://Design–NET.com  
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,  
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298  
MC10H186/D  

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