MC12034BP [MOTOROLA]
MECL PLL COMPONENTS ±32/33, ±64/65 DUAL MODULUS PRESCALER; MECL PLL元件÷ 32/33 ， ÷六十五分之六十四双模预分频器
| 型号： | MC12034BP |
| 厂家： | 
MOTOROLA |
| 描述： | MECL PLL COMPONENTS ±32/33, ±64/65 DUAL MODULUS PRESCALER |
| 文件： | 总4页 (文件大小：84K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Order this document by MC12034A/D
The MC12034A can be used with CMOS synthesizers requiring positive
edges to trigger internal counters such as Motorola’s MC145xxx series in a
PLL to provide tuning signals up to 2.0 GHz in programmable frequency
steps.
The MC12034B can be used with CMOS synthesizers requiring negative
edges to trigger internal counters such as Fujitsu’s MB87001.
A Divide Ratio Control (SW) permits selection of a 32/33 or 64/65 divide
ratio as desired.
MECL PLL COMPONENTS
÷32/33, ÷64/65
DUAL MODULUS PRESCALER
The Modulus Control (MC) selects the proper divide number after SW has
been biased to select the desired divide ratio.
SEMICONDUCTOR
TECHNICAL DATA
• 2.0 GHz Toggle Frequency
• Supply Voltage 4.5 to 5.5 V
• MC12034A for Positive Edge Triggered Synthesizers
8
• 12mA Maximum, –40 to 85°C, V
= 5.5 Vdc
CC
1
• Modulus Control Input is Compatible with Standard CMOS and TTL
• Low–Power 8.5 mA Typical
D SUFFIX
PLASTIC PACKAGE
CASE 751
FUNCTIONAL TABLE
(SO–8)
SW
H
MC
H
Divide Ratio
32
33
64
65
H
L
L
H
L
L
NOTES: 1. SW: H = V , L = Open. A logic L can also be applied by grounding this pin,
CC
8
but this is not recommended due to increased power consumption.
1
2. MC: H = 2.0 V to V , L = GND to 0.8 V.
CC
Design Criteria
Internal Gate Count *
Value
67
Unit
ea
P SUFFIX
PLASTIC PACKAGE
CASE 626
Internal Gate Propagation Delay
Internal Gate Power Dissipation
200
ps
0.75
0.15
mW
pJ
Speed Power Product
NOTE: *Equivalent to a two–input NAND gate.
PIN CONNECTIONS
MAXIMUM RATINGS
Characteristic
Symbol
Range
Unit
Vdc
°C
1
2
3
4
8
7
6
5
IN
IN
V
NC
MC
Power Supply Voltage, Pin 2
Operating Temperature Range
Storage Temperature Range
Modulus Control Input, Pin 6
NOTES: 1. ESD data available upon request.
V
CC
–0.5 to +7.0
–40 to +85
–65 to +150
–0.5 to +6.5
CC
SW
T
A
Gnd
OUT
T
stg
°C
(Top View)
MC
Vdc
2. This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this high
impedance circuit. For proper operation, V and V
should be constrained
in out
ORDERING INFORMATION
Operating
to the range GND ≤ (V or V ) ≤ V
in out
.
CC
Temp Range
Device
Package
MC12034AD
MC12034AP
MC12034BD
MC120348BP
SO–8
Plastic
SO–8
Plastic
T
A
= –40° to +85°C
Motorola, Inc. 1997
Rev 3
MC12034A MC12034B
ELECTRICAL CHARACTERISTICS (V
= 4.5 to 5.5 Vdc, T = –40 to 85°C, unless otherwise noted.)
A
CC
Characteristic
Toggle Frequency (Sine Wave)
Symbol
Min
0.5
–
Typ
2.4
8.5
–
Max
2.0
12
Unit
GHz
mA
V
f
t
Supply Current Output Unloaded (Pin 2)
Modulus Control Input High (MC)
Modulus Control Input Low (MC)
Divide Ratio Control Input High (SW)
Divide Ratio Control Input Low (SW)
I
CC
V
2.0
–
V
CC
0.8
IH1
V
–
V
IL1
V
IH2
V
CC
V
V
Vdc
–
CC
CC
V
IL2
OPEN
OPEN
OPEN
Output Voltage Swing (C = 12 pF, R = 1.1 kΩ)
V
1.0
–
1.6
8.0
–
–
V
L
L
out
pp
ns
Modulus Setup Time MC to Out
t
10.0
1500
3.5
SET
Input Voltage Sensitivity 500–2000 MHz
V
100
–
mVpp
mA
in
Output Current (C = 12 pF, R = 1.1 kΩ)
I
–
L
L
O
Figure 1. Logic Diagram (MC12034A)
Figure 2. Modulus Setup Time
D
C
Q
D
C
Q
D
C
Q
PROP. DELAY
A
B
C
QB
IN
QB
QB
M
In
In
OUT
MC
MC
MC SETUP
MC RELEASE
D
C
Q
D
C
QB
Q
D
C
Q
D
C
QB
Q
D
C
QB
Q
D
E
F
G
H
S
Modulus setup time MC to out is the MC
setup or MC release plus the prop. delay.
QB
QB
Out
SW
Figure 3. Typical Output Waveform
≈
500 m
20 ns
2
MOTOROLA RF/IF DEVICE DATA
MC12034A MC12034B
Figure 4. AC Test Circuit
V
= 4.5 Vdc to 5.5 Vdc
CC
C3
SINE WAVE GENERATOR
V
SW
CC
C1
IN
IN
50
Ω
OUT
C
L
C2
R
L
EXTERNAL COMPONENTS
C1 = C2 = 1000 pF
C3 = 0.1 µF
MC
GND
C
C
= 12 pF (INCLUDING SCOPE
= AND JIG CAPACITANCE)
L
L
MC INPUT
R
= 1.1 kΩ
L
Figure 5. Input Signal Amplitude versus Input Frequency
15
10
5
1250.0
710.0
400.0
0
225.0
125.0
71.0
40.0
22.5
12.8
–5
–10
–15
–20
–25
7.10
–30
–35
–40
–45
–50
4.00
2.25
1.25
0.71
0
260
520
780
1040
1300
1560
1820
2080
2340
2600
FREQUENCY (MHz)
Divide Ratio = 65
Figure 6. Output Amplitude versus Input Frequency
2000
1600
1200
800
400
0
0
260
520
780
1040
1300
1560
1820
2080
2340
2600
FREQUENCY (MHz)
3
MOTOROLA RF/IF DEVICE DATA
MC12034A MC12034B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
8
5
–B–
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
1
4
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
F
–A–
NOTE 2
MILLIMETERS
INCHES
DIM
A
B
C
D
F
MIN
9.40
6.10
3.94
0.38
1.02
MAX
10.16
6.60
4.45
0.51
1.78
MIN
MAX
0.400
0.260
0.175
0.020
0.070
L
0.370
0.240
0.155
0.015
0.040
C
G
H
J
K
L
2.54 BSC
0.100 BSC
J
0.76
0.20
2.92
1.27
0.30
3.43
0.030
0.008
0.115
0.050
0.012
0.135
–T–
SEATING
PLANE
N
7.62 BSC
0.300 BSC
M
D
K
M
N
–––
10
–––
10
0.76
1.01
0.030
0.040
G
H
M
M
M
0.13 (0.005)
T
A
B
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SO–8)
NOTES:
ISSUE T
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
D
A
C
8
1
5
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
M
M
0.25
B
H
E
4
MILLIMETERS
h X 45
DIM
A
A1
B
C
D
MIN
1.35
0.10
0.35
0.19
4.80
3.80
MAX
1.75
0.25
0.49
0.25
5.00
4.00
B
e
A
C
SEATING
PLANE
E
e
H
h
L
1.27 BSC
L
5.80
0.25
0.40
0
6.20
0.50
1.25
7
0.10
A1
B
M
S
S
0.25
C
B
A
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