MC13122DWR3_技术文档

The MC13027 and MC13122 have been specifically designed for AM

radio which can meet the EIA/NAB AMAX requirements. They are

essentially the same as the MC13022A and MC13025 with the addition of

noise blanking circuitry. The noise blanker consists of a wide band amplifier

with an RF switch for blanking ahead the IF amplifier and a stereo audio

blanker with adjustable delay and blanking times.

AMAX STEREO

IC CHIPSET

• Operating Voltage Range of 6.0 V to 10 V

• RF Blanker with Built–In Wide Band AGC Amplifier

• Audio Noise Blanker with Audio Track and Hold

• Mixer Third Order Intercept of 8.0 dBm (115 dBµV)

• Wide Band AGC Detector for RF Amplifier

• Local Oscillator VCO Divide–by–4 for Better Phase Noise

• Buffered Local Oscillator Output at the Fundamental Frequency

• Fast Stereo Decoder Lock

MC13027

20

1

P SUFFIX

DW SUFFIX

PLASTIC PACKAGE

CASE 751D

PLASTIC PACKAGE

CASE 738

(SO–20L)

• Soft Stereo Blend

• Signal Quality Detector to Control Variable Q–Notch Filters for Adaptive

MC13122

Audio Bandwidth and Whistle Reduction

• Signal Quality Detector for AM Stereo

• Very Low Distortion Envelope and Synchronous Detectors

• Variable Bandwidth IF

P SUFFIX

PLASTIC PACKAGE

CASE 710

ORDERING INFORMATION

Operating

28

1

Temperature Range

Device

MC13027DW

MC13027P

Package

SO–20L

DW SUFFIX

PLASTIC PACKAGE

CASE 751F

Plastic DIP

SO–28L

28

T

= –40 ° to +85°C

A

MC13122DW

MC13122P

(SO–28L)

1

Plastic DIP

Functional Block Diagram

RF Input

Mixer

Oscillator

Buffer

To Synthesizer

Voltage

Controlled

Oscillator

450 kHz IF

IF Amplifier

Osc

Tank

÷4

Left Audio

L

IF Amplifier

AGC

Post Detector

Decoder

Track & Hold

Filter

RF

AGC

Input

Wide Band

AGC

R

AGC

Output

Right Audio

Blanking

Fast

Q

450 kHz Blend cosθ

Fast Lock

Shunt

Switch

AGC

Control

Pulse Length

Timer

Pilot

Detector

Control

AM

Detector

Pulse

Detector

Stereo Indicator Lamp

Fast/

Slow

Audio

Blanking

Automatic

Gain Controlled

RF Amplifier

RF

Input

Pulse Delay

Timer

Pulse Length

Timer

I

Yes/No

Signal Quality

Detector

Signal Level

Stop–Sense

RF AGC Meter Drive

MC13027

This device contains 428 active transistors.

MC13122

This device contains 670 active transistors.

9–94

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13027

MAXIMUM RATINGS

Rating

Symbol

Value

12

Unit

Vdc

°C

Power Supply Input Voltage

V

CC

Ambient Operating Temperature

Storage Temperature Range

T

A

–40 to +85

–60 to +150

150

T

stg

°C

Operating Junction Temperature

NOTE: ESD data available upon request.

T

J

°C

MC13027

ELECTRICAL CHARACTERISTICS (T = 25°C, 8.0 V

Test Circuit as shown in Figure 1.)

A

CC

Characteristic

Supply Voltage Range (Pin 8)

Wideband (WB) AGC Threshold

IF Output DC Current

Min

Typ

6.0 to 10

1.0

Max

–

Unit

V

–

mVrms

mAdc

mVpp

mAdc

dBm

mS

1.0

–

Mixer DC Current Output

0.83

600

1.0

–

Local Oscillator Output

–

Wideband AGC Pull–Down Current (Pin 20)

Power Supply Current

–

16

–

Mixer 3rd Order Intercept Point (Pin 6)

Mixer Conversion Gain

8.0

–

2.9

–

IF Amplifier Input Impedance (Pin 14)

IF Amplifier Transconductance

IF Amplifier Load Resistance (Pin 16)

IF Amplifier Collector Current (Pin 16)

2.2

–

kΩ

2.8

–

mS

5.7

–

kΩ

990

–

µA

9–95

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 1. MC13027 Test Circuit

AGC

Feedback

On

V

CC

V

CC

+

V

CC

C14

47 µF

R20

47 k

C10

0.01

MC13027

1

20

19

WB AGC

Out

WB AGC Out

R19

R10

56 k

C90

0.1

In

RT1

39 k

RL1

51

500 k

+

R4

47

2

C5

Blanker

AGC

Audio

Blank Time

22 µF

R3b

RF

WB AGC

Q4

10 k

+

RF Module

C16

10 µF

Audio Blank

RF In

MMBT3904L

1

2

3

4

5

3

4

5

6

7

8

Audio 18

Blank Pulse

Mixer In

Blanker In

Q3

(Note 1)

Feedback

4.0 V Reg

RF Gnd

RF In

R200

560 k

+

R18

C26

1.0 µF

RM1

16.7

R11

47

2.35 k

Q2

CM1

0.01

RM5

16.7

17

16

15

14

(Note 1)

Audio Blank

Delay Time

V

CC

R17

500 k

Q1

R2b

10 k

+

C9

47 µF

V

MMBFJ309L

CC

R21

510

R16

RM2

16.7

RL2

51

R1

100 k

Gnd

Mixer In

IF Out

3.3 k

R2

82

C87

0.1

L2 1.0 mH

IF Out

R1b

10 k

Pulse On

C16 120

Mixer In

Blanker RF In

RF Blank

Time

Pulse In

R15

500 k

V

C103

0.1

CC

C293

10 µF

Murata

SFG450E

5

R299

51

R12

Mixer 4.0 V

4.0 Filter

IF In

Gnd2

1.8 k

+

C11

0.1

4 3 2

1

6

7

8

13

12

11

Tuning V

VCLO

V

CC

C6

0.1

9

VCO

RF Blank

Mixer Out

RF Blank

Q1b

(Note 1)

R201

120

10

VCLO 4.0 V

LO Out

R5b

390 k

100

C37

0.01

LO Out

Tuning Voltage

4.0 V Reg

NOTE: 1. General purpose NPN transistor 2N3904 or equivalent.

9–96

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13122

MAXIMUM RATINGS

Rating

Symbol

Value

12

Unit

Vdc

mAdc

°C

Power Supply Input Voltage

V

CC

Stereo (Pilot) Indicator Lamp Current (Pin 21)

Operating Ambient Temperature

Storage Temperature Range

–

30

T

A

–40 to +85

–65 to +150

150

T

stg

°C

Operating Junction Temperature

Power Dissipation Derated above 25°C

T

°C

J(max)

P

D

1.25

10

Ω

mW/C

NOTE: ESD data available upon request.

MC13122

ELECTRICAL CHARACTERISTICS (V

= 8.0 V, T = 25°C, Test Circuit of Figure 2.)

A

CC

Characteristic

Min

6.0

10

Typ

8.0

20

Max

10

Unit

V

Power Supply Operating Range

Supply Current Drain (Pin 25)

25

mA

Minimum Input Signal Level, Unmodulated, for AGC Start

Audio Output Level, 50% Modulation, L Only or R Only

Audio Output Level, 50% Mono

–

5.0

400

200

–

mV

290

140

530

265

mVrms

%

Output THD, 50% Modulation (Monaural Stereo)

–

0.3

0.5

0.8

1.6

Channel Separation, L Only or R Only, 50% Modulation

IF Input Voltage Range

22

–

35

1.0–1000

10 to 50

9.6

–

dB

mV

kΩ

mS

kΩ

IF Input Resistance Range

–

IF Amplifier Transconductance

IF Detector Circuit Impedance

–

8.3

–

Input AGC Threshold

5.0

–

mV

V

Stop–Sense Output Range

2.2 to 4.0

300

–

Audio Output Impedance at 1.0 kHz (Pins 7 and 14)

Stereo Indicator Lamp Leakage

Stereo Indicator Saturation Voltage @ 3.0 mA

Oscillator Capture Range

–

Ω

–

1.0

200

–

µA

–

mVdc

kHz

±3.0

9–97

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 2. MC13122 Test Circuit

Envelope Det Out

I Detector Out

Q Detector Out

8.0 V

C28

1000

C27

1000

C1

1000

C22

220 µF

MC13122

IC2

R10

13 k

C2

120

L1

1.0 mH

1

28

27

26

25

24

23

E Det

I Det

2

3

4

5

6

Det In

3.0 V Reg

AGC

L–R Det

Q Det

2.2 k

R26

C3 47 µF

C4

10 µF

V

CC

10 k

R5

450 kHz IF In

IF In

Loop Filt

Blend

Gnd

.01

C24

47 µF

100 k

R6

SS

C23

22 µF

Stereo

7

8

22

21

20

19

L Out

D1

1.0 k

U2

6

Ch2 Out

L Filt In

Pilot Ind

Osc Out

Osc In

3.6 MHz

X1

C

A

5

4

9

R20

C6

1.0 µF

Ch2 Cont

Ch2 In

L Filt Ctr

L Mat Out

51 C29

3.9 k

R12

C18

10

1000 C30

3

2

1

11

12

13

14

18

17

16

15

Ch1 In

Ch1 Cont

Ch1 Out

R Mat Out

R Filt Ctr

R Filt In

R Out

Pilot Det I

Pilot I

22 µF

Pilot Q

C31

1.0 µF

Audio Blank

THB122

C16

0.47 µF

C17

10 µF

1000

AF Blank

C

SS Out

Left

Audio Out

Right

Audio Out

33 k

R11

Blend Disable

B

E

MPS6515

Q3

9–98

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

AMAX STEREO CHIPSET

What is AMAX?

ignitions, using multiple spark coils, along with increased use

of plastic in the auto body, have increased the noise energy

at the radio. Also, the consumer has learned to expect higher

quality audio due to advances in many other media. For the

AM band to sustain interest to the consumer, a truly effective

noise blanker is required.

In 1993, a joint proposal by the EIA (Electronic Industries

Association) and the NAB (National Association of

Broadcasters) was issued. It included a unified standard for

pre–emphasis and distortion for broadcasters as well as a set

of criteria for the certification of receivers. The purpose of this

proposal was to restore quality and uniformity to the AM band

and to make it possible for the consumer to receive high

quality signals using the AM band. The FCC has been

supportive of this initiative and has required all new

broadcast licensees to meet AMAX standards. The NAB and

EIA have continued to encourage receiver manufacturers by

offering the AMAX certification logo to be displayed on all

qualifying radios. This logo is shown below.

The block diagram below shows the Motorola AMAX

stereo chipset. It offers a two–pronged approach to noise

blanking which is believed to be the most effective yet offered

in the consumer market. The initial blanking takes place in

the output of the mixer, using a shunt circuit triggered by a

carefully defined wideband receiver. For most noises, some

residual audible disturbance is almost always still present

after this process. The disturbance becomes stretched and

delayed as it passes through the rest of the selectivity in the

receiver. The stretching and delay are predictable, so the

MC13027 can provide a noise blanking pulse with the correct

delay and stretch to the output stages of the MC13122

decoder. The MC13122 has a Track and Hold circuit which

receives the blanking signal from the Front End and uses it to

gently hold the audio wherever it is as the pulse arrives, and

hold that value until the noise has passed. The combined

effect is dramatic. A wide range of types of noise is

successfully suppressed and the resulting audio seems

almost clean until the noise is so intense that the blanking

approaches full–time.

or

The Receiver Criteria

An AMAX receiver must have wide bandwidth: 7.5kHz for

home and auto, 6.5 kHz for portables. It must have some

form of bandwidth control, either manual or automatic,

including at least two bandwidth provisions, such as “narrow”

and “wide”. It must meet NRSC receiver standards for

distortion and deemphasis. It must have provisions for an

external antenna. It must be capable of tuning the expanded

AM band (up to 1700 kHz). And finally, home and auto

receivers must have effective noise blanking. All of these

requirements, except the noise blanking, have been met by

Motorola’s previous AM radio products, such as MC13025

Front End and the MC13022A C–QUAM stereo decoder. It is

the Noise Blanker requirement which is met by the two

devices on this data sheet, the MC13027 and MC13122.

Noise blanking, especially in AM auto radios, has become

extremely important. The combination of higher energy

The amount of extra circuitry to accomplish noise blanking

is relatively small. The external components for this added

capability are shown in Figure 3. In the MC13027 Front end,

the noise receiver/detector requires two capacitors. The

presettings for blanking timing and blanking delay require

three external fixed resistors. Finally the decoder requires

two track and hold capacitors to store the “audio” voltage

during the track and hold function.

Figure 3. AMAX Stereo Receiver with Noise Blanker

MC13027

MC13122

Left

AM

Stereo

Decoder

Track

and

Hold

RF In

RF

Amplifier

IF

AGC’d IF

Amplifier

Variable

Notch Filter

Mixer

Amplifier

Right

RF Attenuate

Divide

by 4

450 kHz

Filter

Audio Blank

Wideband

AGC

Diode

RF

Attenuator

Switch

RF Blank

Timer

VCO

Reset

4.0 V

Regulator

Audio

Reject

Filter

AGC’d RF

Amplifier

AM

Detector

Pulse

Detector

Audio

Blank

Switch

Delay

Timer

Audio Blank

Timer

AGC

9–99

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 4. MC13027 Internal Block Diagram

WB AGC

Out

Audio

Blank Time

Audio

Blank Pulse

Audio Blank

Delay Time

RF Blank

Time

IF Out

16

IF In

14

Gnd2

13

RF Blank

12

Mixer Out

11

20

19

18

17

15

IF Amp

V

CC

Mixer

AF Time

MV

AF Del

MV

RF Time

MV

X1

NB Amp

÷4

WB AGC Amp

Reg

X1

1

2

3

4

5

6

7

8

9

10

WB AGC

In

Blanker

AGC

Feedback

4.0 V Reg

RF Gnd

Mixer In

Blanker RF In

4.0 Filter

V

CC

VCO

LO Out

MC13027 FUNCTIONAL DESCRIPTION

The MC13027 contains the mixer, wide band AGC

system, local oscillator, IF pre–amplifier and noise blanker for

an AM radio receiver. It is designed to be used with the

MC13122 to produce a complete AM stereo receiver. The

Pin 12 is “on”. The audio blanking pulse delay is set by the

resistor on Pin 17 and the width by the resistor on Pin 19.

This is necessary because the IF filtering delays and

stretches the noise as it arrives at the detector. The transistor

on Pin 18 goes “on” to cause noise blanking in the track and

hold circuit in the MC13122 (Pin 15).

Wideband AGC is used in auto receivers to prevent

overload – it drives the base of a cascode transistor RF

amplifier and also a pin diode at the antenna (See Figures 6

and 7).

A low gain IF amplifier between Pins 14 and 16 is used as

a buffer amplifier between the mixer output filter and IF filter.

The input resistance of the IF amplifier is designed to match

a ceramic IF filter. The gain of the IF amplifier is determined

by the impedance of the load on Pin 16.

VCO runs at 4 (F +F ) and is divided internally by 4 for the

in IF

mixer input and local oscillator buffered output. Dividing the

VCO reduces the phase noise for AM stereo applications.

The noise blanker input is connected in parallel with the

mixer input at Pin 6. The noise blanker circuitry contains a

high gain amplifier with its own AGC so it remains linear

throughout the mixer’s linear range. It can detect noise

pulses as low as 120 µV and generates three pulses when

the noise threshold is exceeded. The width and timing of the

blanking pulses is set by the resistors connected to Pins 15,

17 and 19. The resistor on Pin 15 sets the length of the RF

blanking pulse and determines the time the transistor on

9–100

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 5. MC13122 Internal Block Diagram

Loop

Filt

Audio

Blank

I Det

L–R Det Q Det

V

CC

25

Blend

23

Gnd

22

Pilot Ind Osc Out Osc In Pilot Det I Pilot I

Pilot Q

16

28

I

27

26

Q

24

21

20

19

18

17

15

L–R

330

V

CC

VCO

Pilot I

Det

Pilot Q

Det

450 <90°

450 <0°

÷8

Loop

Driver

Pilot

Level

Det

25.6 Hz

Clamp

24.4 Hz

Blend

Fast Lock

Count

Control

Disable

C–QUAM

Comparator

÷32

÷137/144

÷4

Signal

Quality

Detector

cosθ

L–R

Fast AGC

L+R

Level

AGC

Matrix

IF Amp

3.0 V

L

R

1.0 V

VGA

±0.9

1

2

3

4

5

6

7

8

9

10

11

12

13

R Filt In

14

E Det

Det In

3.0 V

Reg

AGC

IF In

SS

L Out

L Filt In L Filt Ctr

L Mat

Out

R Mat

Out

R Filt

Ctr

R Out

MC13122 FUNCTIONAL DESCRIPTION

The MC13122 is designed to accept a 450 kHz C–QUAM

input signal from approximately 1.0 mV to 1.0 V and produce

L and R audio output signals. It has additional features: stop

signal, variable bandwidth IF and audio response, stereo

indicator driver and track and hold noise blanking.

The IF amplifier on Pin 5 has its own AGC system. It

operates by varying the input resistance on Pin 5. With weak

signals below approximate 5.0 mV, the input resistance is

very high and the amplifier is at maximum gain. For this AGC

to be effective, it is necessary to feed the IF input signal from

a relatively high impedance. The input resistance variation

also reduces the Q of the coil (T1 in the application) so the

receiver bandwidth is narrow for weak signals and wide for

strong signals. The value of the input resistor (R5) is selected

for the desired loading of the IF coil. The impedance of the IF

coil on Pin 2 determines the IF gain. Pin 2 is also the input to

the C–QUAM decoder.

The IF signal drives the envelope (E), in–phase (I),

quadrature (Q) and (L–R) detectors. The E detector is a

quasi–synchronous true envelope detector. The others are

true synchronous detectors. The E detector output provides

the L+R portion of the C–QUAM signal directly to the matrix.

The AGC signal of the IF amplifier drives the signal strength

output at Pin 6. An external resistor on Pin 6 (sets the gain of

the AGC). The Pin 6 voltage is used to control the Q of the

audio notch filter, causing the audio bandwidth and depth of

the 10 kHz notch to change with signal strength. It is also

used as one of the inputs to the signal quality detector which

generates the stop–sense and blend signal on Pins 6 and 23

respectively and tells the signal quality detector that the RF

input is below the AGC threshold.

VCO

The 3.6 MHz ceramic resonator on Pins 19 and 20 is part

of a phase locked loop which locks to the 450 kHz IF signal.

The 3.6 MHz is divided by 8 to produce in–phase and

quadrature signals for the I, Q and L–R detectors. It is also

divided by 32, and 137/144 to provide signals for the pilot I

and Q detectors. The pilot detector is a unique circuit which

does not need filtering to detect the 25 Hz pilot.

Blend Circuit

The purpose of the blend circuit is to provide an AM stereo

radio with the capability of very fast lock times, protection

against stereo falsing when there is no pilot present and

control of the L–R signal so as to provide as much stereo

information as possible, while still sounding good in the

presence of noise or interference. The circuit also provides

an optional stop–sense usable by a radio with seek and/or

scan. The stop–sense signal provides a “stop” signal only

when the radio is locked on station, signal strength is above

minimum level, and the level of interference is less than a

predetermined amount. The last feature prevents stopping

on frequencies where there is is a multiplicity of strong

co–channel stations. It is common for AM radios without this

capability to stop on many frequencies with unlistenable

stations, especially at night.

The blend circuit controls the PLL fast lock, pilot detector,

IF amplifier AGC rate, decoder L–R gain, cosθ compensation

and stop–sense as a function of the voltage on a signal

external blend capacitor. Timing is determined by the rate of

change of voltage on the blend cap. Timing is changed by

varying charge and discharge current and pulled down by a

current source, switch, and optionally an external switch. The

current sources and switches are controlled by various

measures of signal quality, signal strength, and presence or

absence of pilot tone.

9–101

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Detectors

In AM stereo operation, the Q detector delivers pilot signal

Sequence For Seek Scan

• Change Station – Pull–Down Blend

• Wait Approximately 50 ms for Synthesizer and Decoder

PLL to Lock

via an external low–pass filter to the pilot detector input (Pin

18). The E and I detectors drive the C–QUAM comparator.

The L–R signal and the output of the envelope detector are

combined in the matrix to produce the L and R signals. The

C–QUAM system modifies the in–phase and quadrature

components of the transmitted signal by the cosine of the

phase angle of the resultant carrier, for proper stereo

decoding. An uncompensated L–R would be distorted,

primarily by second harmonics. Where there is noise or

interference in the L–R, it has been subjectively determined

that reducing the cosθ compensation at the expense of

increased distortion sounds better than full decoding. The

blend line operates over a small voltage range to eliminate

cosine compensation.

• Observe Pin 6 Voltage

• If it is Above 2.0 V and Stays Above 2.0 V for

Approximately 800 ms, Stay on the Station

• No IF Count Now Needed

• No AGC Level Detector Needed

Table 1. Normal Sequence When Changing Stations

External Pull–Down of

Blend Capacitor to Under

0.47 V

– Increased Current Supplied to

Loop Driver for Fast Lock

– Fast AGC Activated

– Extra Current Pull–Up Activated

on Blend Capacitor

– Pilot Detector Disabled

– Loop Locks

Signal Quality Detector – Blend Voltage Control

The signal quality detector output is dependent on signal

strength, over–modulation, and whether or not the blend pin

has been pulled low prior to searching. Over–modulation

usually occurs when a radio is tuned one channel away from

a desired strong signal, so this prevents stopping one

channel away from a strong signal.

In a radio tuned to a strong, interference free C–QUAM

station, the blend voltage will be approximately 3.6 V. In the

presence of noise or interference, when the modulation

envelope is at a minimum, it is possible for the I detector to

produce a negative, or below zero carrier signal. The Signal

Quality Detector produces an output each time the negative

I exceeds 4%. The output of the detector sets a latch. The

output of the latch turns on current source which pulls down

the voltage of the blend cap at a predetermined rate. The

latch is then reset by a low frequency signal from the pilot

detector logic. This produces about a 200 mV change each

time 4% negative I is detected. Tables 1 and 2 describe the

blend behavior under various conditions.

– Stop–Sense Activated

Blend Released

Pilot Detected

– Blend Capacitor Pulled Up to

0.7 V – Stops

– Fast Lock Current Removed

– Fast AGC Turned Off

– Pilot Detector Enabled

– Stereo Indicator Pin Pulled Low

– Blend Voltage Pulled Positive

Rapidly

Blend Voltage Reaches

1.4 V

– Audio Starts Into Stereo

– 10% Negative I Detector

Enabled

Blend Voltage Reaches

2.2 V

– Stereo Separator Reaches 20

to 25 dB

– Rapid Current Pull–Up Turned

Off

– 4% Negative I Detector Enabled

Blend Voltage Reaches

3.0 V

– cosθ Enabled – Full C–QUAM

Decoding

When the blend voltage reaches 2.2 V a blend control

circuit starts to reduce the amplitude of the L–R signal fed to

the decoder matrix. By 1.5 V the L–R has been reduced by

about 40 dB. At lower voltages it is entirely off and the

decoder output is monaural. This reduction of L–R signal, or

blend as it is commonly called when done in FM stereo

radios, reduces undesirable interference effects as a function

of the amount of interference present.

– Blend Voltage Continues to Rise

to 3.6 V and Stops

Table 2. Operation In Adverse Conditions

4% Negative I Detected

– Blend Pulls Down

Approximately 200 mV for Each

Event – Acts Like One–Shot

Stop–Sense

– Stops at 2.2 V – cosθ Has Been

Defeated, Almost Full Stereo

Remains

Stop–sense is enabled when the blend voltage is

externally pulled below 0.45 V. An input from the AGC

indicating minimum signal, or detection of 10% negative I will

cause the stop–sense pin to be pulled low. With signals

greater than the AGC corner and less than 10% interference

the stop–sense will be a minimum of 1.0 V below the 3.0 V

line. Very rapid scanning is possible because the radio can

scan to the next frequency as soon as the stop–sense goes

low. The maximum wait time, set by the radio, is only reached

on good stations.

10% Negative I Detected

– Blend Pulls Down 200 mV for

Each Event

– Stops at 1.4 V – Stereo Has

Blended to Mono

– Resets Fast Pull–Up if Blend

Has Not Been Above 2.2 V

50% Negative I Detected

(Out of Lock)

– Blend Pulls Down Fast During

Event

The decoder will not lock on an adjacent channel because

it is out of the lock range of the PLL. The beat note produced

in the I detector by the out of lock condition will trigger the

10% negative I detector.

– Stops at 0.47 V

– Resets Fast Pull–Up

– Pilot Indicator Turned Off

Minimum Signal Level

Detected

– Resets Fast Pull–Up

– Pulls Down to 0.7 V

9–102

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13027 PIN FUNCTION DESCRIPTION

Internal Equivalent Circuit

Name

Description

Wideband AGC Input

1

WB AGC In

The input impedance to the WB AGC detector is

15 k and is internally biased so it must be coupled

through a capacitor. The threshold can be

increased by adding a resistor in series with the

input. The WB AGC begins at about 1.0 mV. In car

radios, this input should be connected to the

collector of the RF amplifier cascode stage through

a resistor and capacitor. A 68 pF to ground will

prevent undesired high frequency signals from

activating the WB AGC and make the sensitivity

more uniform across the band.

V

3.3 V

R2

CC

WB AGC In

1

15 k

20 k

2

Blanker AGC

The capacitor to ground is the bypass for the noise

blanker AGC circuit. The noise blanker can be

disabled by grounding this pin. 10 µF is used in the

application, but it can be changed to match the

time constant of the main IF AGC in the MC13122,

Pin 4.

NB AGC

2

D1

D2

3

Feedback

Blanker Feedback

This pin is the dc feedback to the input stage of the

wide band amplifier.

NB Feedback

3

11 k

4

7

4.0 V Reg

4.0 V Regulator

4.0 V Reg

4

The 4.0 V regulator supplies low impedance bias to

many of the circuits in the IC. It should be

bypassed to a ground near Pin 5.

Buffer

4.7 k

4.0 V Filter

7

4.0 V Filt

4.0 V Filter

The external capacitor works with internal 4.7 k to

filter noise from the bandgap regulator.

Reg

V

CC

5

6

Gnd

RF Ground

RF Gnd

5

This pin is the ground for the RF section, blanker

RF, filters and all radio circuits except the IF. In the

PCB layout, the ground pin should be used as the

internal return ground in the RF circuits.

Blk /Mix

RF

Mixer Input/Blanker RF Input

In

4.0 V

V

CC

Mixer Out

11

Mixer/

Blanker In

6

The blanker RF input must be biased from the

4.0 V on Pin 4. The mixer input is to two bases of

the upper mixer transistors. A low impedance dc

path to the 4.0 V on Pin 4 is required. Normally,

this would be a coil secondary connected between

Pins 6 and 4.

50 Ω

V

CC

50 Ω

LO +

LO–

11

Mixer Out

Mixer Output

A single ended output of a double balanced mixer.

A load resistor to supply is chosen to match the

ceramic filter, typically 1.5 k to 1.8 k. Output

current is 830 µA.

750

9–103

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13027 PIN FUNCTION DESCRIPTION (continued)

Internal Equivalent Circuit

Name

Description

8

V

CC

Supply Voltage

The normal operating voltage range is 6.0 to 10 V.

V

CC

8

V

CC

9

VCLO

Voltage Control Local Oscillator

V

CC

The oscillator is a cross coupled negative

resistance type and this pin must be connected

through a low dc resistance to Pin 4, the 4.0 V

regulator. Normally, this would be the secondary of

the oscillator coil.

4.0 V

VCLO

1.5 k

9

The impedance of the secondary winding should

be around 2.8 kΩ to guarantee that the oscillator

will run. It operates at 4 times the LO frequency:

f

= 4(F +F ).

osc

in IF

10

LO Out

Local Oscillator Output

V

CC

This is an emitter follower for LO output to drive a

synthesizer. It is a square wave output, the internal

series resistance and allows a small bypass to

reduce high frequency harmonics.

LO Out

10

390

12

RF Blank

RF Blanker

RF Blk

An unbiased NPN acts as a SHUNT impedance

when turned on. The 100 k resistor provides a dc

path for the capacitor.

12

100 k

13

14

Gnd2

IF In

IF Ground

Gnd

Pin 13 is the ground for the IF section and the

timing and switching circuits in the blanker.

13

In the application circuit this should be common to

the MC13122 ground.

IF Input

4.0 V

A degenerated differential amplifier internally

biased to 4.0 V. The IF input impedance is

approximately 1.8 k to match a ceramic filter. The

IF amplifier is used as a buffer between the

ceramic filter and the detector coil and has a fixed

gain determined by the impedance of the output

coil.

IF Out

V

CC

2.2 k

16

220 Ω

16

15

IF Out

3.4 k

IF Output

An open collector provides high–impedance drive

to the MC13122; the IF gain is set by the ac

impedance on this pin.

IF In

14

RF Time

RF Blank Time

4.0 V

A resistor to ground sets the RF blanking time. The

time is set to the minimum required to attenuate

the pulse received. This is normally longest at the

low end of the band. The value is best approved by

ear. A fixed value can be chosen for production.

(50 µs is typical.)

RF Blk Time

10 k

15

9–104

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13027 PIN FUNCTION DESCRIPTION (continued)

Internal Equivalent Circuit

Name

Description

17

Delay Time

Audio Blank Delay Time

A resistor to ground sets the delay time from the

beginning of the RF blanking pulse to the

4.0 k

beginning of the audio blanking pulse. This

normally is about 50 µs for a wide AMAX filter. The

ear is the most sensitive measure of the correct

delay; start low, say 20 µs, and vary delay until

noise is heard, and then reduce somewhat.

Audio

Delay Time

17

10 k

18

Audio Blank

Cntl

Audio Blank Pulse

V

CC

When the blanker is operating, a positive pulse

from this pin is fed to Pin 15 of the MC13122 to

blank the audio signal.

Audio Blank

18

4.7 k

19

Audio Time

Audio Blank Time

V

CC

A resistor to ground sets the width of the blanking

pulse on Pin 18. This is usually selected by

applying a pulse to the antenna of the receiver and

adjusting a variable resistor. The blanking signal

should be just long enough to suppress the audio

pulse. Again the ear is the most sensitive tool.

Start long, approximately 250 µs and reduce until

noise is audible then increase.

Audio

Blk Time

19

10 k

20

WB AGC Out

Wideband AGC Output

A push–pull current output. The resistor to voltage

V

CC

source (normally V ) determines the gain. Used

CC

440 Ω

to bias a cascode transistor in series with the input

FET and can also be used to drive a PNP

transistor which drives a pin diode attenuator (refer

to Application Circuit Figure 6.)

WB AGC Out

20

330 Ω

9–105

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13122 PIN FUNCTION DESCRIPTION

Internal Equivalent Circuit

Name

Description

Envelope Detector

1

E Detector

This is the output of the envelope detector and is

used for one input to the comparator that

V

CC

generates cosθ signal and the L+R input to the

matrix. It is a quasi–synchronous full wave detector

with very low distortion (<1% at 100% modulation).

The output impedance is 6.2 k, and it is bypassed

6.2 k

Envelope Det

1

to V

with 1.0 nF to eliminate 900 kHz

CC

components. The bypass capacitor must be the

same as the one on Pin 27 and 28 for lowest

stereo distortion and best separation.

2

Detector In

IF Out/Decoder Input

Det In

2

The IF coil is connected from Pin 2 to Pin 3, the

3.0 V regulator. The IF amplifier output is a current

source. The gain is determined by the impedance

between Pins 2 and 3. Bandwidth and gain is set

by the resistance across the coil.

V

CC

120

3

4

3.0 V Reg

3.0 V Regulator

This bandgap regulator supplies bias to many of

the circuits in the IC.

3.0 V Reg

3

3.0 V

AGC Byp

IF AGC Bypass

2.3 V

The AGC has a fast and slow time constant. The

fast AGC is 18X the slow one and is active when

the 450 kHz loop is not locked. This allows for fast

scanning in car radios. This capacitor should be

selected for distortion for low frequencies at 80%

modulation.

IF AGC

4

5

IF In

IF Input

AGC Current

The IF AGC varies the current through attenuator

diodes. The diodes vary the input impedance

shunting the IF signal. The varying impedance also

varies the Q and therefore the bandwidth. The IF

AGC is accomplished by turning on the diodes and

lowering the IF input impedance.

IF In

5

10 k

9–106

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13122 PIN FUNCTION DESCRIPTION (continued)

Internal Equivalent Circuit

Name

Description

6

SS

Signal Strength/Stop–Sense

V

CC

The signal strength is a push–pull circuit. The

voltage is 2.2 V at minimum signal and 3.5 to 5.0 V

at strong signal. This dc voltage is also used to

control the audio output notch filters. If the Blend

pin is low the stop–sense is activated and this pin

can go low. This can be used to control the

seek–scan in the radio.

3.0 V

20 k

Stop–Sense

6

Signal

Strength

1.0 k

Stop–Sense

Pull–Down

7

14

Left Out

Right Out

Filtered Left and Filtered Right Output

This can drive a de–emphasis filter to bring audio

contour to AMAX specifications. Since the output is

an emitter follower, the output impedance is low,

and a series R should be used with the

de–emphasis network as shown on the application

circuit.

V

CC

L Out

7

8

13

L Filt In

R Filt In

Input to Notch Filter

DC bias is supplied through the external filter

components.

L Filter In

8

9

12

L Filt Ctr

R Filt Ctr

Left Filter and Right Filter Center

Drives the center leg of a twin–T filter, varying the

Q. At strong signal, positive feedback narrows the

notch, and there is little HF roll–off. At weak signal,

negative feedback produces a broad notch and HF

roll–off.

Op Amp

20 k

L Filter Ctr

9

20 k

10

11

L Matrix Out

R Matrix Out

Track and Hold Output

This is a unity gain operational amplifier output.

The current is turned off by the blanking pulse. The

capacitor holds output voltage constant until

unblanked. Internal feedback causes the output

impedance to be low.

L Matix Out

10

15

AF Blank In

Audio Blank Control

The current to the output drivers is turned off.

L

4.7 k

R

Audio Blank

15

4.7 k

9–107

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13122 PIN FUNCTION DESCRIPTION (continued)

Name

Pilot Q

Internal Equivalent Circuit

Description

16

Pilot Q

This is the output of a quadrature detector of a

narrowband phase locked loop system.

3.0 V

It is used to control the pilot detector circuitry. The

pilot Q is clamped to the 3.0 V reference when the

blend voltage is pulled low. This results in faster

pilot detection when a stereo station is tuned in. If

the blend is not pulled low, the pilot Q will drift up

approximately 0.5 V when there is no pilot, and it

will take longer to detect the pilot. The capacitor to

ground is the loop filter. It sets the pilot loop

bandwidth: if it is too large, the loop bandwidth

maybe too small, and the pilot may not be

re–acquired if it is lost unless the blend pin is

externally pulled low again.

Pilot Q

16

17

Pilot I

3.0 V

When the loop is locked to a 25 Hz AM stereo pilot,

this is the output of a an in–phase synchronous

detector. The capacitor filters the output, which is

used to drive the pilot indicator driver on Pin 21.

The time constant for the pilot indicator output is

determined by this capacitor and the internal 47 k

resistor. If the capacitor is too small, it can lead to

pilot falsing due to noise. If the capacitor is too

large, the acquisition time increases. The cap is

charged to 3.0 V when the blend voltage is low to

shorten lock time.

47 k

Pilot I

17

18

Pilot Det In

Pilot Detector Input

V

CC

3.0 V

The pilot detector will detect a pilot tone between

24.4 and 25.6 Hz. The pilot signal is fed from Q

detector through a low pass filter on Pin 26. The

audio signals from the Q detector must be filtered

out, so a low–pass filter is used. The capacitor in

series with Pin 18 blocks dc and prevents large low

frequency transients from knocking the decoder

out of stereo mode.

47 k Pilot Det In

18

39 k

19

Osc In

Oscillator Input

V

CC

3.0 V

The input impedance is 10 k, but the

recommended circuit adds 3.9 k in parallel with this

to control the capture range of the VCO to be

around ±3.0 kHz. using the recommended ceramic

resonator.

10 k Osc Input

19

22 k

20

Osc Out

Oscillator Output

V

CC

The internal phase shift of the VCO is 90 degrees,

and the output impedance is low. It is designed to

drive a resonant circuit with a 90 degree phase

shift at the center frequency.

100

Osc Feedback

20

9–108

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13122 PIN FUNCTION DESCRIPTION (continued)

Internal Equivalent Circuit

Name

Pilot

Description

21

Pilot Indicator

Indicator

The maximum current is internally limited to protect

the IC, but it should be operated with a current

limiting resistor.

Pilot Indicator

21

27 k

10

22

23

Gnd

Ground

Gnd

22

Use good practices to keep oscillator returns and

RF bypasses to good copper near this point

Blend Cont

Blend Control

3.0 V

There are pull–up and pull–down currents provided

to this pin. The external capacitor controls the rate

of change of this voltage and 22 µF is

recommended. This is an important voltage

affecting many functions in the IC.

Blend

23

330

24

Loop Filt

Loop Filter

The phase detector is a current source, so only a

single RC loop filter is needed for a second order

loop. The internal 330 Ω resistor together with a

47 µF gives the correct corner frequency and

damping for the proper operation on the decoder

loop. The cap should be low leakage to avoid static

phase error.

Loop Filter

3.0 V

330

24

25

26

V

CC

V

CC

25

The operating voltage is normally 8.0 to 10 V in car

radios. The MC13122 will work from 6.0 to 10 V.

V

CC

Q Detector

Q Detector Output

This is a synchronous detector in quadrature with

the 450 kHz IF signal. The output impedance is

11 k. This signal is normally used for input to the

pilot detector and internally for the fast lock.

3.0 V

Q Det Out

11 k

26

9–109

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

MC13122 PIN FUNCTION DESCRIPTION (continued)

Internal Equivalent Circuit

Name

Description

27

L–R Detector

This is similar to the Q detector output but its level

is controlled by the blend circuit. When the blend is

active, the L–R output is reduced in level by

reducing the dc current until mono operation is

reached. It operates in the same way as the blend

circuit in FM stereo decoders. The bypass

capacitor should be 1.0 nF as on Pin 1 for optimum

channel separation.

V

CC

L–R Det

6.2 k

27

28

I Detector

This is a synchronous detector in phase with the

450 kHz IF signal. It is used internally to generate

the cosθ signal and as an input to the signal quality

detector. The bypass capacitor should be the same

as the one on Pin 1 for best separation and lowest

stereo distortion.

V

CC

I Det

6.2 k

28

9–110

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

CAR RADIO APPLICATION

Figure 6 shows a car radio circuit using a TOKO pre–tuned

The SS (stop–sense) output can be used for station

searching and scanning. The best way to use it is to connect

the SS signal to a comparator or A–D converter in the control

microprocessor. If Pin 23 is grounded during searching by

turning on Q3, the SS voltage changes from less than 0.5 V

to around 2.2 V when an RF threshold is exceeded, as is

shown in the graph in Figure 15. This system results in very

reliable stopping on usable signals and fast detection of AM

stereo signals. After a station is detected, Q3 should be

turned off.

This receiver is very easy to set up because the TOKO

module is pre–aligned. The only adjustments are to tune T1

and T2 for maximum voltage of the SS out line or maximum

audio with a weak signal. If desired, they can be changed

slightly to maximize stereo separation.

RF module. The RF module includes a 4 diode tracking circuit

to eliminate mistracking between the oscillator and RF circuits

over the 530 to 1700 kHz AM band. This is important for stereo

performance because mistracking will cause mono distortion

and will significantly reduce the stereo separation. The

THB122 module contains the variable 10 kHz notch filter. This

module can be replaced with discrete components as shown

in Figure 8, using 1% resistors and 5% capacitors.

Some manufacturers add a PIN diode attenuator at the

antenna input. An example is shown in Figure 7.

The WB AGC sensitivity can be adjusted by changing R4

in series with the WB AGC input, Pin 1. The internal input

resistance is 15 k.

R15, R17 and R19 are the blanker timing resistors. They

were setup for this circuit and can be changed if desired.

FL1 is a linear phase IF filter . We recommend a Gaussian

(rounded) filter, such as SFG or SFH for lower distortion and

better separation than one with a flatter amplitude response.

The SFG types of filters have poorer selectivity than the ones

with flat GDT (group delay time) so some compromise has

been made on adjacent channel selectivity.

The blanker can be disabled for testing by grounding the

blanker AGC on Pin 2 in the MC13027.

The blanker and mixer inputs must be biased from the

4.0 V regulator through a low dc resistance like the

secondary winding of the RF coil.

If different components are used, the blanker resistors can

be setup as follows:

Ground Pin 2 of the MC13027. Apply a 1.0 µs pulse or 50

Hz square wave of about 10 mV through a dummy antenna

and synchronize an oscilloscope to the pulse generator.

Observe the signal at the mixer collector (Pin 11). It should be

a sine wave burst. Remove the ground on Pin 2 and adjust

R15 so the burst is just suppressed. Check the performance

at the ends and middle of the band because the width might

change due to RF circuit bandwidth.

Mix the pulse signal with a CW signal of about 300 µV with

a power combiner and connect the oscilloscope to Pin 7 or

Pin 14 of the MC13122. Adjust R17 so the blanking starts at

the beginning of the audio pulse and R19 so the audio

blanking is just long enough to suppress the audio pulse. The

audio blanking time should not be made longer than

necessary because it will be more noticeable in the normal

program. The effectiveness of the blanker can be determined

in field testing by connecting a switch from Pin 2 of the

MC13027 to ground and bringing it outside the radio.

Figures 10 to 19 refer to the performance of the

Application Circuit of Figure 6.

The receiver VCO operates at 4 times the local oscillator

frequency and is divided internally in the MC13027 so that

both the mixer input and the LO out is the same as in other

receivers. This receiver can be connected to an existing

synthesizer. For AM stereo, the synthesizer must have low

phase noise. The Motorola MC145173 is recommended. For

bench testing of this receiver, the Motorola MC145151

parallel input synthesizer may be useful. It will operate on

9.0 V and the phase detector can provide tuning voltage

without a buffer amplifier.

9–111

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 6.

T H B 1 2 2

T M G 5 2 2 E

9–112

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 7. RF Pin Diode

C18

0.1

R51

820

R6

27 k

Q25

MMBT3906L

R5

2.7 k

R7

3.3 k

R8

220

Q2

MMBT3904L

C6

0.47

C5

68 µF

+

C7

0.01

C57

0.01

Q1

RF In

AGC

1

3

MMBFJ309L

D1

L1

126ANS

7594HM

R3

100 k

MC13027

R13

13 k

BA585

1

20

WB AGC In

AGC

WB AGC Out

R4

82

C8

0.047

C56

0.047

R52

390

C14

0.01

2

Figure 8. MC13027/MC13122

Discrete RF and Notch Filters

Figure 9. Overall Selectivity of a Typical Receiver

versus Filter Control Voltage

IF/Audio Response at

Filter Input

0

MC13122 Pins

Filt In

–10

8 (13)

V at Pin 6 = 3.5 Vdc

–20

–30

–40

–50

–60

–70

–80

2.5 Vdc

1.5 Vdc

360

44.2 k

22.1 k

720

Filt Ctr

Filt Out

9 (12)

– – Response at

– – Pins 10 and 11 Due

– – to IF Selectivity

– – Total Response at

– – Output Pins 7 and 14

360

10 (11)

1.5 2.0

3.0 4.0 5.0 6.0 8.0 10

AUDIO FREQUENCY (kHz)

15 20

30

9–113

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 10. Blend Voltage versus RF Input Level

Figure 11. Separation versus RF Input Level

4.0

3.0

2.0

1.0

0

40

32

24

16

8.0

0

20

30

40

50

60

70

80

20

30

40

50

60

70

80

ANTENNA INPUT (dBµV)

NOTE: The graphs on this page were made using the 15/60 pF

NOTE: The radio stays in mono until the stereo signal is

dummy antenna and the Application Circuit of Figure 6.

sufficiently large and then makes a smooth transition to

stereo. This is similar to FM receivers with variable

blend.

Figure 13. 5.0 kHz Attentuation

versus RF Input Level

Figure 12. Signal to Noise versus RF Input Level

0

–5.0

–10

–15

–20

–25

50

42

34

26

18

10

20

30

40

50

60

70

80

20

30

40

50

60

70

80

ANTENNA INPUT (dBµV)

NOTE: The slightly abrupt change at around 25 dBµV is due

NOTE: This curve shows the effect of the variable audio

to the decoder switching into stereo.

bandwidth control of the MC13122. It is due to the

variable loading of the IF coil and the variable 10 kHz

notch filter in the output.

Figure 14. Audio Output Level

versus RF Input Level

Figure 15. Stop–Sense Voltage

versus RF Input Level

500

400

300

200

100

0

4.0

3.0

2.0

1.0

0

Pin 23 = Open

Pin 23 = Grounded

20

30

40

50

60

70

80

60

70

80

90

100

110

ANTENNA INPUT (dBµV)

RF INPUT LEVEL (dBµV)

NOTE: All the curves of performance versus RF input level

NOTE: This measurement was made on the MC13122 alone

with a 10 k series input resistor. It will enable the

designer to determine the stop–sense level if the gain

of receiver RF section is known. Note that if Pin 23 is

held low, the SS voltage on Pin 6 rises from about 0.3

to 2.2 V over a small change in RF level. This can be

used to generate a very reliable stop signal. If Pin 23 is

not held low, the SS voltage starts out at 2.2 V and

rises slowly to a maximum of around 4.0 V.

were generated using the car radio receiver circuit

shown in Figure 6. Using a 15/60 pF dummy antenna

input and a 50% L only stereo signal.

9–114

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 16. Audio Blanking Delay versus R17

Figure 17. RF Blanking Time versus R15

1000

100

10

1000

100

10

1.0

10

33

100

330

1000

10

33

100

330

1000

R17 (kΩ)

R15 (kΩ)

Figure 19. WB AGC Output Voltage (Pin 20)

versus RF Input Level

Figure 18. Audio Blanking Time versus R19

1000

100

10

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0

1.0

10

33

100

330

1000

0

1.0

2.0

3.0

4.0

5.0

6.0

R19 (kΩ)

RF LEVEL INTO PIN 1 (mV)

NOTE: This was measured by applying an RF signal through

a capacitor directly to Pin 1. The input resistance is

15 k, so the desired threshold can be increased by

adding a resistor in series with the input.

9–115

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

AMAX STEREO CHIPSET

The RF Module

power supply connections. This modification is described

below. Motorola will work with TOKO to develop a new part

number incorporating this change. In the meantime, it is

necessary that the user perform these simple changes,

because the radio circuits throughout this data sheet assume

this modified design.

In the early development phase of this AMAX Stereo

Chipset, Motorola worked with TOKO America Inc. to

develop an RF tuning module. Part number TMG522E was

assigned and is available from TOKO now. This module

provides the “tracked” tuning elements for the RF (T1 and T2

and associated capacitors and varicaps) and the VCO (T3 et

al). Some radio designers may prefer to develop their own

tuning system using discrete coils and components, but the

TOKO approach offers good performance, compactness and

ease of application. Motorola recommends that every

designer use this approach at least for initial system

development and evaluation.

Modifying the TMG522E

Referring to Figures 20 and 21, there are three simple

steps to the modification:

1. Cut the thin copper trace from Pin 2 to Pin 5 as shown.

2. Cut the thin copper trace from Pin 8 to the bottom of the

120 Ω resistor. Removal of the resistor is optional.

As refinement of the application progressed, it was found

that a modification of the TMG522E was needed which would

reduce the amount of VCO leakage into the Mixer through the

3. Connect a wire from Pin 5 to the top of the 120 Ω resistor

(or the upper pad for the resistor).

Figure 20. TMG522E Schematic

Add

Wire (3)

Cut

Trace (2)

5

4

8

7

RF Out

3.0 V Osc

Low

Osc

High

3.9 k

120

X

T2

T3

RF In

T1

1

2

10 k

X

5

47 k

Cut Trace (1)

+B

Gnd

VT

3

6

Figure 21. TMG522E Physical Modifications

TMG522E

Cut (2)

TMG522E

Cut (2)

Add Wire (3)

Cut (1)

8

7 6 5 4 3 2 1

8

7

6

5

4

3

2

1

9–116

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 22. AMAX Chipset Printed Circuit Board

(Top View)

Gnd

WH10

VT

Osc

WH3

R

SS

+

C16

C17

+ C20

L

WH11

+

C31

FL1

WH6 WH5

+

C14

WH12

WH4

C18

+

FL3

FL2

T1

C5

X1

+

C2

+

C4

WH13

Q2

+

C23

T2

Gnd

WH9

WH8

+

L1

Q3

WH7

C24

C22

+

C35

+

D1

+

WH1 WH2

Gnd Ant

Q1

C11

V

CC

Search

Figure 23. AMAX Chipset Printed Circuit Board

(Bottom View)

9–117

MOTOROLA ANALOG IC DEVICE DATA

MC13027 MC13122

Figure 24. AMAX Chipset Printed Circuit Board

(Copper View)

9–118

MOTOROLA ANALOG IC DEVICE DATA

Tape and Reel Options

In Brief . . .

Motorola offers the convenience of Tape and Reel

packaging for our growing family of standard integrated circuit

products. Reels are available to support the requirements of

both first and second generation pick–and–place equipment.

The packaging fully conforms to the latest EIA–481A

specification. The antistatic embossed tape provides a

secure cavity, sealed with a peel–back cover tape.

Page

Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2

Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4

Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5

12–1

MOTOROLA ANALOG IC DEVICE DATA

Tape and Reel Configurations

Mechanical Polarization

SOIC and Micro–8

DEVICES

PLCC DEVICES

Typical

PIN 1

User Direction of Feed

2

DPAK and D PAK

DEVICES

Typical

User Direction of Feed

SOT–23 (5 Pin)

DEVICES

Typical

SOT–89 (3 Pin)

DEVICES

Typical

SOT–89 (5 Pin)

DEVICES

Typical

User Direction of Feed

12–2

MOTOROLA ANALOG IC DEVICE DATA

Tape and Reel Configurations (continued)

TO–92 Reel Styles

STYLE A

(Preferred)

STYLE E

Carrier Strip

Rounded

Side

Flat Side

Adhesive Tape

Feed

Rounded side of transistor and adhesive tape visible.

Flat side of transistor and adhesive tape visible.

TO–92 Ammo Pack Styles

STYLE P

(Preferred)

STYLE M

Adhesive Tape On

Top Side

Adhesive Tape On

Top Side

Feed

Rounded Side

Flat Side

Carrier

Strip

Carrier

Strip

Flat side of transistor and

adhesive tape visible.

Rounded side of transistor and

adhesive tape visible.

Label

Style P ammo pack is equivalent to Styles A and B of reel pack

dependent on feed orientation from box.

Style M ammo pack is equivalent to Style E of reel

pack dependent on feed orientation from box.

TO–92 EIA Radial Tape in Fan Fold Box or On Reel

H2A

H2B

H

W2

H4

H5

T1

L1

H1

W1

W

L

T

T2

F1

F2

D

P2

P1

P2

P

12–3

MOTOROLA ANALOG IC DEVICE DATA

Tape and Reel Information Table

(1)

Devices

per Reel

Tape Width

(mm)

Reel Size

(inch)

Device

Suffix

Package

SO–8, SOP–8

SO–14

SO–16

12

16

2,500

13

R2

SO–16L, SO–8+8L WIDE

SO–20L WIDE

SO–24L WIDE

SO–28L WIDE

16

24

32

1,000

13

R2

R3

Micro–8

12

2,500

13

R2

PLCC–20

PLCC–28

PLCC–44

16

24

32

1,000

500

13

R2

PLCC–52

PLCC–68

PLCC–84

32

44

500

250

13

R2

(2)

TO–226AA (TO–92)

18

2,000

13

RA, RE, RP, or RM

(Ammo Pack) only

DPAK

16

24

8

2,500

800

13

7

RK

R4

TR

T1

2

D PAK

SOT–23 (5 Pin)

3,000

1,000

SOT–89 (3/5 Pin)

(1)

12

7

Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.

Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations

are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.

(2)

12–4

MOTOROLA ANALOG IC DEVICE DATA

Analog MPQ Table

Tape/Reel and Ammo Pack

Package Type

Package Code

MPQ

PLCC

Case 775

Case 776

Case 777

0802

0804

0801

1000/reel

500/reel

SOIC

Case 751

Case 751A

Case 751B

Case 751G

Case 751D

Case 751E

Case 751F

0095

0096

0097

2003

2005

2008

2009

2500/reel

1000/reel

Micro–8

Case 846A

–

2500/reel

TO–92

Case 29

0031

2000/reel

2000/Ammo Pack

DPAK

Case 369A

–

2500/reel

800/reel

2

D PAK

Case 936

SOT–23 (5 Pin)

Case 1212

3000/reel

1000/reel

SOT–89 (3 Pin)

Case 1213

SOT–89 (5 Pin)

Case 1214

12–5

MOTOROLA ANALOG IC DEVICE DATA

12–6

MOTOROLA ANALOG IC DEVICE DATA

Packaging Information

In Brief . . .

The packaging availability for each device type is indicated

on the individual data sheets and the Selector Guide. All of the

outline dimensions for the packages are given in this section.

The maximum power consumption an integrated circuit

can tolerate at a given operating ambient temperature can be

found from the equation:

T

– T

A

J(max)

P

=

D(TA)

R

θJA(Typ)

where:

P

= Power Dissipation allowable at a given

operating ambient temperature. This must

be greater than the sum of the products of

the supply voltages and supply currents at

the worst case operating condition.

D(TA)

T

= Maximum operating Junction Temperature

as listed in the Maximum Ratings Section.

J(max)

See individual data sheets for T

information.

J(max)

T

A

= Maximum desired operating Ambient

Temperature

R

= Typical Thermal Resistance Junction-to-

Ambient

θJA(Typ)

13–1

MOTOROLA ANALOG IC DEVICE DATA

Case Outline Dimensions

LP, P, Z SUFFIX

CASE 29-04

NOTES:

Plastic Package

(TO-226AA/TO-92)

ISSUE AD

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R

IS UNCONTROLLED.

4. DIMENSION F APPLIES BETWEEN P AND L.

DIMENSION D AND J APPLY BETWEEN L AND K

MINIMUM. LEAD DIMENSION IS UNCONTROLLED

IN P AND BEYOND DIMENSION K MINIMUM.

A

B

R

P

INCHES

DIM MIN MAX

MILLIMETERS

L

MIN

4.45

4.32

3.18

0.41

1.15

2.42

0.39

MAX

5.20

5.33

4.19

0.55

0.48

1.39

2.66

0.50

–––

F

SEATING

PLANE

A

B

C

D

F

G

H

J

0.175 0.205

0.170 0.210

0.125 0.165

0.016 0.022

0.016 0.019

0.045 0.055

0.095 0.105

0.015 0.020

K

1

2

3

D

X X

G

K

L

N

P

0.500

0.250

0.080 0.105

––– 0.100

––– 12.70

–––

J

H

V

6.35

2.04

–––

2.93

3.43

–––

2.66

2.54

–––

C

SECTION X–X

R

V

0.115

0.135

–––

1

–––

N

KC, T SUFFIX

CASE 221A-06

Plastic Package

ISSUE Y

SEATING

PLANE

–T–

C

NOTES:

T

F

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

–B–

S

2. CONTROLLING DIMENSION: INCH.

INCHES

DIM MIN MAX

0.560 0.625 14.23 15.87

MILLIMETERS

MIN MAX

4

Q

A

B

C

D

F

U

0.380 0.420

0.140 0.190

0.020 0.045

0.139 0.155

0.100 BSC

9.66 10.66

1

2

3

3.56

0.51

3.53

4.82

1.14

3.93

H

L

–Y–

G

H

J

2.54 BSC

K

––– 0.280

0.012 0.045

–––

0.31

7.11

1.14

1

2

3

K

L

N

Q

R

S

0.500 0.580 12.70 14.73

R

0.045 0.070

0.200 BSC

1.15

5.08 BSC

1.77

J

0.100 0.135

2.54

2.04

0.51

5.97

0.00

3.42

2.92

1.39

6.47

1.27

G

0.080

0.115

D 3 PL

0.020 0.055

0.235 0.255

0.000 0.050

T

U

M

0.25 (0.010)

B

Y

N

13–2

MOTOROLA ANALOG IC DEVICE DATA

TH SUFFIX

CASE 314A-03

Plastic Package

ISSUE D

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

–T–

Y14.5M, 1982.

B

–P–

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION D DOES NOT INCLUDE

INTERCONNECT BAR (DAMBAR) PROTRUSION.

DIMENSION D INCLUDING PROTRUSION SHALL

NOT EXCEED 0.043 (1.092) MAXIMUM.

C

E

Q

OPTIONAL

CHAMFER

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

A

U

F

A

B

C

D

E

F

0.572 0.613 14.529 15.570

0.390 0.415 9.906 10.541

0.170 0.180 4.318 4.572

0.025 0.038 0.635 0.965

0.048 0.055 1.219 1.397

0.570 0.585 14.478 14.859

L

K

1

5

G

J

K

L

Q

S

0.067 BSC

1.702 BSC

G

0.015 0.025 0.381 0.635

0.730 0.745 18.542 18.923

0.320 0.365 8.128 9.271

0.140 0.153 3.556 3.886

0.210 0.260 5.334 6.604

0.468 0.505 11.888 12.827

5X J

S

5X D

M

0.014 (0.356)

T P

U

NOTES:

T, TV SUFFIX

CASE 314B-05

Plastic Package

ISSUE J

C

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

B

–P–

OPTIONAL

CHAMFER

Q

F

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION D DOES NOT INCLUDE

INTERCONNECT BAR (DAMBAR) PROTRUSION.

DIMENSION D INCLUDING PROTRUSION SHALL

NOT EXCEED 0.043 (1.092) MAXIMUM.

E

A

INCHES

DIM MIN MAX

A

B

C

D

E

MILLIMETERS

MIN MAX

0.613 14.529 15.570

0.415 9.906 10.541

U

L

S

V

0.572

0.390

0.170

0.025

0.048

0.850

0.067 BSC

0.166 BSC

0.015

0.900

0.320

0.320 BSC

0.140

–––

0.468

–––

0.090

W

K

0.180 4.318

0.038 0.635

0.055 1.219

4.572

0.965

1.397

F

0.935 21.590 23.749

1

G

H

J

K

L

N

Q

S

1.702 BSC

4.216 BSC

5

0.025 0.381

1.100 22.860 27.940

0.635

5X J

0.365 8.128

9.271

G

M

0.24 (0.610)

T

H

N

8.128 BSC

5X D

0.153 3.556

0.620

0.505 11.888 12.827

0.735 ––– 18.669

0.110 2.286 2.794

3.886

––– 15.748

M

0.10 (0.254)

T P

U

V

W

SEATING

PLANE

–T–

B

–Q–

SEATING

PLANE

T SUFFIX

–T–

CASE 314C–01

Plastic Package

ISSUE A

C

E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

A

K

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION D DOES NOT INCLUDE

INTERCONNECT BAR (DAMBAR) PROTRUSION.

DIMENSION D INCLUDING PROTRUSION SHALL

NOT EXCEED 10.92 (0.043) MAXIMUM.

1

2 3 4 5

INCHES

DIM MIN MAX

0.625 15.59

MILLIMETERS

L

MIN

MAX

15.88

10.67

4.83

1

A

B

C

D

E

G

J

0.610

0.380

0.160

0.020

0.035

5

0.420

0.190

0.040

0.055

9.65

4.06

0.51

0.89

1.02

1.40

0.067 BSC

1.702 BSC

0.015

0.500

0.355

0.139

0.025

––– 12.70

0.370

0.147

0.38

0.64

–––

9.40

3.73

K

L

Q

9.02

3.53

G

D 5 PL

M

0.356 (0.014)

T Q

J

13–3

MOTOROLA ANALOG IC DEVICE DATA

T, T1 SUFFIX

CASE 314D-03

Plastic Package

ISSUE D

SEATING

PLANE

–T–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

C

–Q–

B

Y14.5M, 1982.

E

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION D DOES NOT INCLUDE

INTERCONNECT BAR (DAMBAR) PROTRUSION.

DIMENSION D INCLUDING PROTRUSION SHALL

NOT EXCEED 10.92 (0.043) MAXIMUM.

U

A

S

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

L

A

B

C

D

E

G

H

J

0.572

0.390

0.170

0.025

0.048

0.613 14.529 15.570

0.415 9.906 10.541

0.180 4.318

0.038 0.635

0.055 1.219

1

2

3

4 5

K

4.572

0.965

1.397

0.067 BSC

1.702 BSC

0.087

0.015

1.020

0.320

0.140

0.105

0.543

0.112 2.210

0.025 0.381

2.845

0.635

1

2

3

4

K

L

Q

U

S

1.065 25.908 27.051

5

0.365 8.128

0.153 3.556

0.117 2.667

9.271

3.886

2.972

J

G

H

0.582 13.792 14.783

D 5 PL

M

0.356 (0.014)

T Q

DT-1 SUFFIX

CASE 369-07

Plastic Package

(DPAK)

C

B

R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

V

ISSUE K

E

INCHES

DIM MIN MAX

MILLIMETERS

4

MIN

5.97

6.35

2.19

0.69

0.84

0.94

MAX

6.35

6.73

2.38

0.88

1.01

1.19

4

A

B

C

D

E

F

G

H

J

0.235 0.250

0.250 0.265

0.086 0.094

0.027 0.035

0.033 0.040

0.037 0.047

0.090 BSC

0.034 0.040

0.018 0.023

0.350 0.380

0.175 0.215

0.050 0.090

0.030 0.050

A

1

2

3

S

–T–

SEATING

PLANE

2.29 BSC

1

2

3

K

0.87

0.46

8.89

4.45

1.27

0.77

1.01

0.58

9.65

5.46

2.28

1.27

K

R

S

J

F

V

H

D 3 PL

G

M

0.13 (0.005)

T

DT SUFFIX

CASE 369A-13

Plastic Package

(DPAK)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

SEATING

PLANE

–T–

C

B

ISSUE Y

INCHES

DIM MIN MAX

MILLIMETERS

E

V

R

MIN

5.97

6.35

2.19

0.69

0.84

0.94

MAX

6.35

6.73

2.38

0.88

1.01

1.19

A

B

C

D

E

F

G

H

J

K

L

R

S

U

V

Z

0.235 0.250

0.250 0.265

0.086 0.094

0.027 0.035

0.033 0.040

0.037 0.047

0.180 BSC

4

Z

1

A

K

S

1

2

3

4.58 BSC

U

0.034 0.040

0.018 0.023

0.87

0.46

2.60

1.01

0.58

2.89

0.102

0.114

0.090 BSC

0.175 0.215

0.020 0.050

2.29 BSC

F

J

4.45

0.51

0.77

3.51

5.46

1.27

–––

1.27

–––

L

H

0.020

0.030 0.050

0.138 –––

–––

D 2 PL

M

G

0.13 (0.005)

T

13–4

MOTOROLA ANALOG IC DEVICE DATA

DP1, N, P, P1 SUFFIX

CASE 626-05

Plastic Package

ISSUE K

8

5

NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR

SQUARE CORNERS).

–B–

1

4

3. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

MILLIMETERS

DIM MIN MAX

9.40 10.16 0.370 0.400

INCHES

MIN MAX

F

A

B

C

D

F

–A–

NOTE 2

6.10

3.94

0.38

1.02

6.60 0.240 0.260

4.45 0.155 0.175

0.51 0.015 0.020

1.78 0.040 0.070

L

G

H

J

K

L

2.54 BSC

0.100 BSC

1.27 0.030 0.050

0.30 0.008 0.012

8

C

0.76

0.20

2.92

1

J

3.43

0.115

0.135

–T–

SEATING

PLANE

7.62 BSC

0.300 BSC

N

M

N

–––

10

–––

10

0.76

1.01 0.030 0.040

M

D

K

G

H

M

0.13 (0.005)

T A

B

N, P, N-14, P2 SUFFIX

CASE 646-06

Plastic Package

ISSUE L

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUM

MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

4. ROUNDED CORNERS OPTIONAL.

14

1

8

B

7

INCHES

DIM MIN MAX

0.770 18.16

MILLIMETERS

A

F

MIN

MAX

19.56

6.60

4.69

0.53

1.78

A

B

C

D

F

0.715

0.240

0.145

0.015

0.040

0.260

0.185

0.021

0.070

6.10

3.69

0.38

1.02

L

14

1

C

G

H

J

K

L

0.100 BSC

2.54 BSC

0.052

0.008

0.115

0.095

0.015

0.135

1.32

0.20

2.92

2.41

0.38

3.43

J

N

0.300 BSC

7.62 BSC

SEATING

PLANE

K

M

N

0

10

0.039

0

0.39

10

1.01

0.015

H

G

D

M

DP2, N, P, PC SUFFIX

CASE 648-08

Plastic Package

ISSUE R

NOTES:

–A–

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

16

1

9

8

B

S

INCHES

DIM MIN MAX

0.770 18.80

MILLIMETERS

MIN

MAX

19.55

6.85

4.44

0.53

1.77

F

A

B

C

D

F

0.740

0.250

0.145

0.015

0.040

C

L

0.270

0.175

0.021

0.70

6.35

3.69

0.39

1.02

16

1

SEATING

PLANE

–T–

G

H

J

K

L

M

S

0.100 BSC

0.050 BSC

2.54 BSC

1.27 BSC

K

M

0.008

0.015

0.130

0.305

10

0.21

0.38

3.30

7.74

10

H

J

0.110

0.295

0

2.80

7.50

0

G

D 16 PL

0.020

0.040

0.51

1.01

M

0.25 (0.010)

T A

13–5

MOTOROLA ANALOG IC DEVICE DATA

B, P, P2, V SUFFIX

CASE 648C-03

Plastic Package

(DIP–16)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. INTERNAL LEAD CONNECTION BETWEEN 4 AND

5, 12 AND 13.

–A–

ISSUE C

16

1

9

8

–B–

INCHES

DIM MIN MAX

0.840 18.80

MILLIMETERS

L

MIN

MAX

21.34

6.60

4.69

0.53

A

B

C

D

E

F

0.740

0.240

0.145

0.015

0.050 BSC

0.040

0.100 BSC

0.008

0.115

0.300 BSC

0

0.260

0.185

0.021

6.10

3.69

0.38

NOTE 5

16

1

1.27 BSC

C

0.70

1.02

1.78

G

J

K

L

M

N

2.54 BSC

0.015

0.135

0.20

2.92

0.38

3.43

–T–

SEATING

PLANE

M

N

7.62 BSC

K

10

0.040

0

10

E

0.015

0.39

1.01

J 16 PL

F

G

D 16 PL

M

S

0.13 (0.005)

T B

M

S

0.13 (0.005)

T A

–A–

P SUFFIX

NOTES:

CASE 648E–01

Plastic Package

(DIP–16)

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION A AND B DOES NOT INCLUDE MOLD

PROTRUSION.

5. MOLD FLASH OR PROTRUSIONS SHALL NOT

EXCEED 0.25 (0.010).

R

16

1

9

8

ISSUE O

–B–

6. ROUNDED CORNER OPTIONAL.

M

P

L

INCHES

DIM MIN MAX

0.760 18.80

MILLIMETERS

F

MIN

MAX

19.30

6.60

4.44

0.53

1.77

A

B

C

D

F

0.740

0.245

0.145

0.015

0.050

0.260

0.175

0.021

0.070

6.23

3.69

0.39

1.27

16

J

1

C

G

H

J

K

L

M

P

0.100 BSC

0.050 BSC

2.54 BSC

1.27 BSC

0.21

3.05

7.50

0

5.08 BSC

7.62 BSC

0.39 0.88

–T–

SEATING

PLANE

0.008

0.015

0.140

0.305

10

0.38

3.55

7.74

10

S

0.120

0.295

0

K

H

G

0.200 BSC

0.300 BSC

0.015 0.035

R

S

D 13 PL

M

S

0.25 (0.010)

T B

A

P SUFFIX

CASE 649-03

Plastic Package

ISSUE D

P

A

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUM

MATERIAL CONDITION.

13

24

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

L

Q

B

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

1.265

0.540

0.205

0.020

0.060

1

A

B

C

D

F

31.50

13.21

4.70

0.38

1.02

32.13 1.240

13.72 0.520

5.21 0.185

0.51 0.015

1.52 0.040

12

M

J

H

F

C

G

H

J

K

L

M

N

P

2.54 BSC

0.100 BSC

1.65

0.20

2.92

14.99

–––

2.16 0.065

0.30 0.008

3.43

15.49 0.590

10 –––

0.085

0.012

0.135

0.610

10

24

N

0.115

1

K

0.51

0.13

0.51

1.02 0.020

0.38 0.005

0.76 0.020

0.040

0.015

0.030

D

G

SEATING

PLANE

Q

13–6

MOTOROLA ANALOG IC DEVICE DATA

A, B, N, P SUFFIX

CASE 707-02

Plastic Package

ISSUE C

NOTES:

1. POSITIONAL TOLERANCE OF LEADS (D),

SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM

MATERIAL CONDITION, IN RELATION TO

SEATING PLANE AND EACH OTHER.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

18

10

9

B

1

3. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

A

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.915

0.260

0.180

0.022

0.070

L

A

B

C

D

F

22.22

6.10

3.56

0.36

1.27

23.24 0.875

6.60 0.240

4.57 0.140

0.56 0.014

1.78 0.050

C

18

1

G

H

J

K

L

2.54 BSC

0.100 BSC

K

N

1.02

0.20

2.92

1.52 0.040

0.30 0.008

3.43

0.060

0.012

0.135

J

M

F

D

SEATING

PLANE

0.115

H

G

7.62 BSC

0.300 BSC

M

N

0

0.51

15

0

15

0.040

1.02 0.020

P SUFFIX

CASE 710-02

Plastic Package

ISSUE B

NOTES:

1. POSITIONAL TOLERANCE OF LEADS (D), SHALL

BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL

CONDITION, IN RELATION TO SEATING PLANE

AND EACH OTHER.

28

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

1

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

28

1

15

A

B

C

D

F

36.45 37.21 1.435 1.465

13.72 14.22 0.540 0.560

B

3.94

0.36

1.02

5.08 0.155 0.200

0.56 0.014 0.022

1.52 0.040 0.060

14

G

H

J

K

L

2.54 BSC

0.100 BSC

2.16 0.065 0.085

0.38 0.008 0.015

1.65

0.20

2.92

L

C

A

3.43

0.115

0.135

15.24 BSC

0.600 BSC

N

M

N

0

0.51

15

0

15

1.02 0.020 0.040

J

M

G

H

F

K

SEATING

PLANE

D

P SUFFIX

CASE 711-03

Plastic Package

ISSUE C

NOTES:

1. POSITIONAL TOLERANCE OF LEADS (D), SHALL

BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL

CONDITION, IN RELATION TO SEATING PLANE

AND EACH OTHER.

40

1

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

40

21

20

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

B

A

B

C

D

F

51.69 52.45 2.035 2.065

13.72 14.22 0.540 0.560

3.94

0.36

1.02

5.08 0.155 0.200

0.56 0.014 0.022

1.52 0.040 0.060

1

G

H

J

K

L

2.54 BSC

0.100 BSC

2.16 0.065 0.085

0.38 0.008 0.015

L

A

1.65

0.20

2.92

C

3.43

0.115

0.135

N

15.24 BSC

0.600 BSC

M

N

0

0.51

15

0

15

J

1.02 0.020 0.040

K

SEATING

PLANE

M

H

G

F

D

13–7

MOTOROLA ANALOG IC DEVICE DATA

F, P, P-3 SUFFIX

CASE 724-03

Plastic Package

(NDIP–24)

NOTES:

1. CHAMFERED CONTOUR OPTIONAL.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

24

ISSUE D

1

4. CONTROLLING DIMENSION: INCH.

–A–

INCHES

DIM MIN MAX

1.265 31.25

MILLIMETERS

MIN

MAX

32.13

6.85

4.44

0.51

24

1

13

12

A

B

C

D

E

F

1.230

0.250

0.145

0.015

0.050 BSC

0.040

–B–

0.270

0.175

0.020

6.35

3.69

0.38

1.27 BSC

1.02

L

C

0.060

1.52

G

J

K

L

M

N

0.100 BSC

2.54 BSC

0.007

0.110

0.012

0.140

0.18

2.80

0.30

3.55

NOTE 1

–T–

SEATING

PLANE

K

0.300 BSC

7.62 BSC

N

M

0

15

0

15

E

0.020

0.040

0.51

1.01

G

J 24 PL

F

M

0.25 (0.010)

T B

D 24 PL

M

0.25 (0.010)

T A

H, P, DP SUFFIX

CASE 738-03

Plastic Package

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

–A–

4. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

20

1

11

B

INCHES

DIM MIN MAX

1.010 1.070 25.66

MILLIMETERS

10

MIN

MAX

27.17

6.60

A

B

C

D

E

F

0.240 0.260

0.150 0.180

0.015 0.022

0.050 BSC

6.10

3.81

0.39

L

4.57

0.55

C

1.27 BSC

0.050 0.070

0.100 BSC

1.27

1.77

20

G

2.54 BSC

1

J

0.008 0.015

0.21

2.80

7.62 BSC

0

0.51

0.38

3.55

K

L

M

N

0.110

0.140

–T–

SEATING

PLANE

K

M

0.300 BSC

0

15

1.01

0.020 0.040

N

E

J 20 PL

G

F

M

0.25 (0.010)

T B

D 20 PL

M

0.25 (0.010)

T A

D, D1, D2 SUFFIX

CASE 751-05

Plastic Package

(SO-8, SOP-8)

ISSUE R

NOTES:

D

A

E

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. DIMENSIONS ARE IN MILLIMETERS.

3. DIMENSION D AND E DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS

OF THE B DIMENSION AT MAXIMUM MATERIAL

CONDITION.

C

8

1

5

4

M

0.25

B

H

MILLIMETERS

8

h X 45

B

C

DIM MIN

MAX

1.75

0.25

0.49

0.25

5.00

4.00

e

1

A

A1

B

C

D

E

1.35

0.10

0.35

0.18

4.80

3.80

A

SEATING

PLANE

e

H

h

1.27 BSC

0.10

L

5.80

0.25

0.40

0

6.20

0.50

1.25

7

A1

B

L

M

S

0.25

C B

A

13–8

MOTOROLA ANALOG IC DEVICE DATA

D SUFFIX

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

CASE 751A-03

Plastic Package

(SO-14)

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

–A–

ISSUE F

14

1

8

7

–B–

P 7 PL

M

0.25 (0.010)

B

MILLIMETERS

DIM MIN MAX

INCHES

14

1

MIN

MAX

0.344

0.157

0.068

0.019

0.049

F

A

B

C

D

F

8.55

3.80

1.35

0.35

0.40

8.75 0.337

4.00 0.150

1.75 0.054

0.49 0.014

1.25 0.016

R X 45

G

C

G

J

K

M

P

1.27 BSC

0.050 BSC

–T–

SEATING

PLANE

J

M

0.19

0.10

0

0.25 0.008

0.25 0.004

0.009

7

K

D 14 PL

7

0

M

S

0.25 (0.010)

T B

A

5.80

0.25

6.20 0.228

0.50 0.010

0.244

0.019

R

–A–

D SUFFIX

NOTES:

CASE 751B-05

Plastic Package

(SO-16)

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

16

9

ISSUE J

–B–

P 8 PL

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

M

S

0.25 (0.010)

B

1

8

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

G

MILLIMETERS

DIM MIN MAX

9.80 10.00 0.386 0.393

INCHES

MIN MAX

16

1

A

B

C

D

F

K

3.80

1.35

0.35

0.40

4.00 0.150 0.157

1.75 0.054 0.068

0.49 0.014 0.019

1.25 0.016 0.049

R X 45

C

G

J

K

M

P

1.27 BSC

0.050 BSC

0.25 0.008 0.009

0.25 0.004 0.009

–T–

SEATING

PLANE

0.19

0.10

0

J

M

D

16 PL

7

0

7

5.80

0.25

6.20 0.229 0.244

0.50 0.010 0.019

M

S

0.25 (0.010)

T B

A

R

DW, FP SUFFIX

–A–

NOTES:

CASE 751D-04

Plastic Package

(SO-20L, SO–20)

ISSUE E

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

20

11

4. MAXIMUM MOLD PROTRUSION 0.150

(0.006) PER SIDE.

10X P

–B–

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.13

(0.005) TOTAL IN EXCESS OF D DIMENSION

AT MAXIMUM MATERIAL CONDITION.

M

0.010 (0.25)

B

1

10

J

F

20X D

MILLIMETERS

DIM MIN MAX

12.65 12.95 0.499 0.510

INCHES

MIN MAX

M

S

0.010 (0.25) T A

B

A

B

C

D

F

20

7.40

2.35

0.35

0.50

7.60 0.292 0.299

2.65 0.093 0.104

0.49 0.014 0.019

0.90 0.020 0.035

1

R X 45

G

J

K

M

P

1.27 BSC

0.050 BSC

0.32 0.010 0.012

0.25 0.004 0.009

C

0.25

0.10

0

SEATING

PLANE

7

0

7

–T–

10.05 10.55 0.395 0.415

18X G

R

0.25

0.75 0.010 0.029

K

M

13–9

MOTOROLA ANALOG IC DEVICE DATA

DW SUFFIX

CASE 751E-04

Plastic Package

(SO-24L,

SOP (16+4+4)L)

ISSUE E

–A–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

24

13

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

–B– 12X P

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

M

0.010 (0.25)

B

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

1

12

24X D

24

J

MILLIMETERS

DIM MIN MAX

INCHES

M

S

0.010 (0.25)

T A

B

1

MIN

MAX

0.612

0.299

0.104

0.019

0.035

A

B

C

D

F

15.25

7.40

2.35

0.35

0.41

15.54 0.601

7.60 0.292

2.65 0.093

0.49 0.014

0.90 0.016

F

R X 45

G

J

K

M

P

1.27 BSC

0.050 BSC

0.23

0.13

0

0.32 0.009

0.29 0.005

0.013

0.011

8

C

K

–T–

SEATING

8

0

M

10.05

0.25

10.55 0.395

0.75 0.010

0.415

0.029

PLANE

R

22X G

DW SUFFIX

CASE 751F-04

NOTES:

Plastic Package

(SO-28L, SOIC–28)

ISSUE E

28

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE

1

–A–

15

28

14X P

DAMBAR PROTRUSION SHALL BE 0.13

(0.005) TOTAL IN EXCESS OF D DIMENSION

AT MAXIMUM MATERIAL CONDITION.

M

0.010 (0.25)

B

–B–

1

MILLIMETERS

DIM MIN MAX

INCHES

14

MIN

MAX

0.711

0.299

0.104

0.019

0.035

M

A

B

C

D

F

17.80

7.40

2.35

0.35

0.41

18.05 0.701

7.60 0.292

2.65 0.093

0.49 0.014

0.90 0.016

28X D

R

X 45

M

S

0.010 (0.25)

T A

B

G

J

K

M

P

1.27 BSC

0.050 BSC

0.23

0.13

0

0.32 0.009

0.29 0.005

0.013

0.011

8

C

8

0

–T–

SEATING

PLANE

10.01

0.25

10.55 0.395

0.75 0.010

0.415

0.029

26X G

F

R

K

J

DW SUFFIX

CASE 751G-02

Plastic Package

(SO-16L, SOP–16L,

SOP-8+8L)

ISSUE A

–A–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

16

9

–B–

8X P

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

M

0.010 (0.25)

B

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

1

8

J

16X D

16

MILLIMETERS

DIM MIN MAX

10.15 10.45 0.400

INCHES

M

S

0.010 (0.25)

T A

B

MIN

MAX

1

A

B

C

D

F

0.411

F

7.40

2.35

0.35

0.50

7.60 0.292 0.299

2.65 0.093 0.104

0.49 0.014 0.019

0.90 0.020 0.035

R X 45

G

J

K

M

P

1.27 BSC

0.050 BSC

0.32 0.010 0.012

0.25 0.004 0.009

0.25

0.10

0

C

7

0

7

–T–

M

10.05 10.55 0.395 0.415

0.25 0.75 0.010 0.029

SEATING

14X G

K

PLANE

R

13–10

MOTOROLA ANALOG IC DEVICE DATA

D SUFFIX

16

CASE 751K–01

Plastic Package

(SO–16)

NOTES:

1

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2

3

CONTROLLING DIMENSION: MILLIMETER.

DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

–A–

ISSUE O

4

5

MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

16

9

DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN

EXCESS OF THE D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

M

–B–

P

MILLIMETERS

DIM MIN MAX

INCHES

F

MIN

MAX

0.393

0.157

0.068

0.019

0.049

A

B

C

D

F

9.80

3.80

1.35

0.35

0.40

10.00 0.368

4.00 0.150

1.75 0.054

0.49 0.014

1.25 0.016

1

8

G

R ^{X 45}

G

J

K

M

P

1.27 BSC

0.050 BSC

0.19

0.10

0

0.25 0.008

0.25 0.004

7

0.009

7

C

SEATING

PLANE

–T–

0

5.80

0.25

6.20 0.229

0.50 0.010

0.244

0.019

14 X D

J

K

R

M

S

0.25 (0.010)

T A

B

–A–

DW SUFFIX

CASE 751N–01

Plastic Package

(SOP–16L)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

T

16

9

ISSUE O

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

M

–B–

P

0.010 (0.25)

B

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

1

8

16

J

F

MILLIMETERS

DIM MIN MAX

10.15 10.45 0.400

INCHES

13X D

1

MIN

MAX

A

B

C

D

F

0.411

M

S

0.010 (0.25)

T A

B

7.40

2.35

0.35

0.50

7.60 0.292 0.299

2.65 0.093 0.104

0.49 0.014 0.019

0.90 0.020 0.035

G

J

K

M

P

R

S

T

1.27 BSC

0.050 BSC

0.32 0.010 0.012

0.25 0.004 0.009

R X 45

0.25

0.10

0

7

0

7

C

10.05 10.55 0.395 0.415

0.25 0.75 0.010 0.029

2.54 BSC

3.81 BSC

–T–

SEATING

PLANE

M

S

0.100 BSC

0.150 BSC

K

9X G

13–11

MOTOROLA ANALOG IC DEVICE DATA

CASE 762-01

Plastic Medium Power Package

(SIP-9)

ISSUE C

9

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

Q

1

M

0.25 (0.010)

T A

–A–

MILLIMETERS

DIM MIN MAX

22.40 23.00 0.873 0.897

INCHES

MIN MAX

–C–

U

V

A

B

C

D

E

M

X

6.40

3.45

0.40

9.35

1.40

6.60 0.252 0.260

3.65 0.135 1.143

0.55 0.015 0.021

9.60 0.368 0.377

1.60 0.055 0.062

S

W

E

F

Y

G

H

J

2.54 BSC

0.100 BSC

1.51

1.71 0.059 0.067

0.360 0.400 0.014 0.015

R

B

N

K

M

N

Q

R

S

U

V

W

X

Y

3.95

30 BSC

2.50

3.15

13.60 13.90 0.535 0.547

1.65 1.95 0.064 0.076

22.00 22.20 0.866 0.874

0.55

2.89 BSC

4.20 0.155 0.165

30 BSC

2.70 0.099 0.106

3.45 0.124 0.135

9

1

SEATING

PLANE

–T–

K

M

0.25 (0.010)

T C

J

H

G

F

0.75 0.021 0.029

0.113 BSC

0.75 0.025 0.029

D 9 PL

0.65

2.70

M

0.25 (0.010)

T A

2.80 0.106

0.110

FN SUFFIX

CASE 775-02

Plastic Package

(PLCC-20)

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED

WHERE TOP OF LEAD SHOULDER EXITS PLASTIC

BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE

MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD

FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)

PER SIDE.

1

ISSUE C

M

S

0.007 (0.180) T L–M

N

B

4. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

M

S

N

0.007 (0.180) T L–M

Y BRK

–N–

U

6. THE PACKAGE TOP MAY BE SMALLER THAN THE

PACKAGE BOTTOM BY UP TO 0.012 (0.300).

DIMENSIONS R AND U ARE DETERMINED AT THE

OUTERMOST EXTREMES OF THE PLASTIC BODY

EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,

GATE BURRS AND INTERLEAD FLASH, BUT

INCLUDING ANY MISMATCH BETWEEN THE TOP

AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR

PROTRUSION OR INTRUSION. THE DAMBAR

PROTRUSION(S) SHALL NOT CAUSE THE H

DIMENSION TO BE GREATER THAN 0.037 (0.940).

THE DAMBAR INTRUSION(S) SHALL NOT CAUSE

THE H DIMENSION TO BE SMALLER THAN 0.025

(0.635).

D

–L–

Z

–M–

W

D

20

1

S

0.010 (0.250) T L–M

N

G1

X

V

VIEW D–D

INCHES

DIM MIN MAX

MILLIMETERS

MIN

9.78

4.20

2.29

0.33

MAX

10.03

4.57

2.79

0.48

M

S

A

R

0.007 (0.180) T L–M

N

A

B

C

E

0.385

0.165

0.090

0.013

0.395

0.180

0.110

0.019

Z

M

S

0.007 (0.180) T L–M

N

F

M

S

H

0.007 (0.180) T L–M

N

G

H

J

0.050 BSC

1.27 BSC

C

0.026

0.020

0.025

0.350

0.042

–––

0.032

–––

0.356

0.048

0.056

0.020

10

0.66

0.51

0.64

8.89

1.07

–––

2

0.81

–––

9.04

1.21

1.42

0.50

10

E

0.004 (0.100)

K1

K

R

U

V

W

X

Y

Z

G

–T– ^SEATING

J

PLANE

VIEW S

M

S

0.007 (0.180) T L–M

N

G1

F

S

0.010 (0.250) T L–M

N

VIEW S

2

G1 0.310

K1 0.040

0.330

–––

7.88

1.02

8.38

–––

13–12

MOTOROLA ANALOG IC DEVICE DATA

FN SUFFIX

CASE 776-02

Plastic Package

(PLCC–28)

ISSUE D

1

M

S

0.007 (0.180)

T L–M

N

B

Z

Y BRK

D

–N–

M

S

0.007 (0.180)

T L–M

N

U

–M–

–L–

W

D

S

0.010 (0.250)

T L–M

N

X

G1

V

28

1

VIEW D–D

M

S

A

0.007 (0.180)

T L–M

N

M

S

H

0.007 (0.180)

T L–M

N

Z

M

S

T L–M

N

R

K1

C

E

0.004 (0.100)

SEATING

PLANE

G

K

–T–

VIEW S

J

M

S

0.007 (0.180)

T L–M

N

F

G1

S

0.010 (0.250)

T L–M

N

VIEW S

NOTES:

INCHES

DIM MIN MAX

MILLIMETERS

1. DATUMS –L–, –M–, AND –N– DETERMINED

WHERE TOP OF LEAD SHOULDER EXITS

PLASTIC BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE

MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE

MOLD FLASH. ALLOWABLE MOLD FLASH IS

0.010 (0.250) PER SIDE.

MIN

MAX

12.57

4.57

2.79

0.48

A

B

C

E

0.485

0.165

0.090

0.013

0.495 12.32

0.180

0.110

0.019

4.20

2.29

0.33

F

G

H

J

0.050 BSC

1.27 BSC

4. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

0.026

0.020

0.025

0.450

0.042

–––

0.032

–––

0.456

0.048

0.056

0.020

10

0.66

0.51

0.64

11.43

1.07

–––

0.81

–––

11.58

1.21

1.42

0.50

10

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN

THE PACKAGE BOTTOM BY UP TO 0.012

(0.300). DIMENSIONS R AND U ARE

DETERMINED AT THE OUTERMOST

EXTREMES OF THE PLASTIC BODY

EXCLUSIVE OF MOLD FLASH, TIE BAR

BURRS, GATE BURRS AND INTERLEAD

FLASH, BUT INCLUDING ANY MISMATCH

BETWEEN THE TOP AND BOTTOM OF THE

PLASTIC BODY.

K

R

U

V

W

X

Y

Z

2

G1 0.410

K1 0.040

0.430 10.42

––– 1.02

10.92

–––

7. DIMENSION H DOES NOT INCLUDE DAMBAR

PROTRUSION OR INTRUSION. THE DAMBAR

PROTRUSION(S) SHALL NOT CAUSE THE H

DIMENSION TO BE GREATER THAN 0.037

(0.940). THE DAMBAR INTRUSION(S) SHALL

NOT CAUSE THE H DIMENSION TO BE

SMALLER THAN 0.025 (0.635).

13–13

MOTOROLA ANALOG IC DEVICE DATA

FN SUFFIX

CASE 777-02

Plastic Package

(PLCC)

M

S

0.007(0.180)

T

L–M

N

B

M

S

0.007(0.180)

T

L–M

N

U

1

ISSUE C

D

–N–

Z

Y BRK

–M–

–L–

X

G1

S

0.010 (0.25)

T

L–M

N

VIEW D–D

H

V

W

D

M

S

0.007(0.180)

T

L–M

N

44

1

M

S

A

R

0.007(0.180)

T

L–M

N

K1

Z

K

J

C

F

E

M

S

0.007(0.180)

VIEW S

T

L–M

N

0.004 (0.10)

G

SEATING

PLANE

–T–

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

G1

VIEW S

A

B

C

E

0.685 0.695 17.40 17.65

S

0.010 (0.25)

T

L–M

N

0.165 0.180

0.090 0.110

0.013 0.019

0.050 BSC

4.20

2.29

0.33

4.57

2.79

0.48

NOTES:

6. THE PACKAGE TOP MAY BE SMALLER THAN

THE PACKAGE BOTTOM BY UP TO 0.012

(0.300). DIMENSIONS R AND U ARE

DETERMINED AT THE OUTERMOST

EXTREMES OF THE PLASTIC BODY

EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,

GATE BURRS AND INTERLEAD FLASH, BUT

INCLUDING ANY MISMATCH BETWEEN THE

TOP AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR

PROTRUSION OR INTRUSION. THE DAMBAR

PROTRUSION(S) SHALL NOT CAUSE THE H

DIMENSION TO BE GREATER THAN 0.037

(0.940). THE DAMBAR INTRUSION(S) SHALL

NOT CAUSE THE H DIMENSION TO BE

SMALLER THAN 0.025 (0.635).

F

1. DATUMS –L–, –M–, AND –N– ARE DETERMINED

WHERE TOP OF LEAD SHOULDER EXITS

PLASTIC BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE

MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD

FLASH. ALLOWABLE MOLD FLASH IS 0.010

(0.25) PER SIDE.

G

H

J

1.27 BSC

0.026 0.032

0.66

0.51

0.64

0.81

–––

0.020

0.025

–––

K

R

U

V

W

X

Y

Z

0.650 0.656 16.51 16.66

0.042 0.048

0.042 0.056

––– 0.020

1.07

–––

2

1.21

1.42

0.50

10

4. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

2

10

G1 0.610 0.630 15.50 16.00

K1 0.040 ––– 1.02 –––

NOTES:

M SUFFIX

CASE 803C

PRELIMINARY

Plastic Package

6

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

–A–

7

8

CONTROLLING DIMENSION: MILLIMETER.

DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

–F–

9

MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER

SIDE.

20

1

11

10

10 DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN

EXCESS OF THE D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

K

–B–

1

J

20

G

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.504

0.215

0.081

0.020

0.032

S 10 PL

A

B

C

D

E

F

12.35

5.10

1.95

0.35

–––

12.80 0.486

5.45 0.201

2.05 0.077

0.50 0.014

M

0.13 (0.005)

B

N

0.81

12.40*

–––

0.488*

G

H

J

K

L

M

N

S

1.15

0.59

0.18

1.10

0.05

0

1.39 0.045

0.81 0.023

0.27 0.007

1.50 0.043

0.20 0.001

0.055

0.032

0.011

0.059

0.008

10

C

0.10 (0.004)

E

L

M

10

0

D 20 PL

–T–

SEATING

PLANE

0.50

7.40

0.85 0.020

8.20 0.291

0.033

0.323

M

S

0.13 (0.005)

T B

A

*APPROXIMATE

13–14

MOTOROLA ANALOG IC DEVICE DATA

TV SUFFIX

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

CASE 821C-04

Plastic Package

(15-Pin ZIP)

ISSUE D

1

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION R DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

15

5. MOLD FLASH OR PROTRUSIONS SHALL NOT

EXCEED 0.010 (0.250).

6. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION SHALL

BE 0.003 (0.076) TOTAL IN EXCESS OF THE D

DIMENSION. AT MAXIMUM MATERIAL CONDITION.

SEATING

PLANE

–T–

C

E

M

B

–Q–

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

–P–

U

A

B

C

D

E

0.684 0.694 17.374 17.627

0.784 0.792 19.914 20.116

0.173 0.181 4.395 4.597

0.024 0.031 0.610 0.787

0.058 0.062 1.473 1.574

Y

K

V

A

R

G

H

J

K

L

0.050 BSC

0.169 BSC

0.018 0.024 0.458 0.609

0.700 0.710 17.780 18.034

1.270 BSC

4.293 BSC

S

0.200 BSC

5.080 BSC

PIN 15

M

R

S

U

V

Y

0.148 0.151 3.760 3.835

0.416 0.426 10.567 10.820

0.157 0.167 3.988 4.242

PIN 1

H

L

G

0.105

0.868 REF

0.625 0.639 15.875 16.231

0.115 2.667 2.921

15X D

15X J

22.047 REF

S

M

Q

0.010 (0.254)

T P

0.024 (0.610)

T

T SUFFIX

CASE 821D-03

Plastic Package

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION R DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

1

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

15

5. MOLD FLASH OR PROTRUSIONS SHALL NOT

EXCEED 0.010 (0.250).

6. DELETED

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION SHALL

BE 0.003 (0.076) TOTAL IN EXCESS OF THE D

DIMENSION. AT MAXIMUM MATERIAL CONDITION.

SEATING

PLANE

Q

–L–

–T–

C

B

E

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

–P–

U

A

B

C

D

E

F

0.681 0.694 17.298 17.627

0.784 0.792 19.914 20.116

0.173 0.181 4.395 4.597

0.024 0.031 0.610 0.787

0.058 0.062 1.473 1.574

0.016 0.023 0.407 0.584

A

R

K

G

H

J

K

Q

R

U

Y

0.050 BSC

0.110 BSC

0.018 0.024 0.458 0.609

1.078 1.086 27.382 27.584

0.148 0.151 3.760 3.835

0.416 0.426 10.567 10.820

1.270 BSC

2.794 BSC

Y

PIN 1

PIN 15

H

G

0.110 BSC

0.503 REF

2.794 BSC

12.776 REF

7X F

15X D

15X J

S

M

L

0.010 (0.254)

T P

M

0.024 (0.610)

T

13–15

MOTOROLA ANALOG IC DEVICE DATA

FTB SUFFIX

CASE 824D–01

Plastic Package

(TQFP–44)

1

ISSUE O

L

–T–, –U–, –Z–

–Z–

44

34

33

1

AE

G

AE

DETAIL AA

–T–

L

–U–

F

PLATING

BASE METAL

DETAIL AA

J

11

23

N

12

22

D

M

S

0.20 (0.008)

AC T–U

Z

A

SECTION AE–AE

M

S

0.20 (0.008)

AB T–U

Z

0.05 (0.002) T–U

S

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

M

S

0.20 (0.008)

AC T–U

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD WHERE

THE LEAD EXITS THE PLASTIC BODY AT THE

BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT

DATUM PLANE –AB–.

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –AC–.

M

DETAIL AD

–AB–

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25

(0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE DETERMINED

AT DATUM PLANE –AB–.

E

C

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL NOT

CAUSE THE D DIMENSION TO EXCEED 0.530

(0.021).

0.10 (0.004)

–AC–

H

Y

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

A

B

C

D

E

9.950 10.050 0.392 0.396

1.400 1.600 0.055 0.063

0.300 0.450 0.012 0.018

1.350 1.450 0.053 0.057

0.300 0.400 0.012 0.016

R

F

G

H

J

K

L

M

N

Q

R

S

V

W

X

Y

0.800 BSC

0.031 BSC

K

0.050 0.150 0.002 0.006

0.090 0.200 0.004 0.008

0.450 0.550 0.018 0.022

8.000 BSC

12 REF

Q

W

X

0.315 BSC

12 REF

VIEW AD

0.090 0.160 0.004 0.006

1

5

1

5

0.100 0.200 0.004 0.008

11.900 12.100 0.469 0.476

0.200 REF

1.000 REF

12 REF

0.008 REF

0.039 REF

12 REF

13–16

MOTOROLA ANALOG IC DEVICE DATA

FB SUFFIX

CASE 824E–02

Plastic Package

(QFP)

44

1

ISSUE A

S

–L–, –M–, –N–

M

S

0.20 (0.008)

T L–M

H L–M

N

A

M

0.05 (0.002) L–M

PIN 1

IDENT

J1

G

44

34

33

1

VIEW Y

3 PL

F

PLATING

BASE METAL

–L–

–M–

J

B1

D

M

VIEW Y

S

0.20 (0.008)

T L–M

N

SECTION J1–J1

11

23

G 40X

44 PL

12

22

–N–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –L–, –M– AND –N– TO BE DETERMINED

AT DATUM PLANE –H–.

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –T–.

M

VIEW P

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25

(0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –H–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.530 (0.021).

E

DATUM

C

–H–

PLANE

0.01 (0.004)

–T–

W

Y

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.398

0.087

A

B

C

D

E

9.90

2.00

0.30

2.00

0.30

10.10 0.390

2.21 0.079

0.45 0.0118 0.0177

2.10 0.079

0.40 0.012

1

0.083

0.016

F

R R1

R R2

G

J

K

M

S

V

W

Y

A1

0.80 BSC

0.031 BSC

0.13

0.65

5

0.23 0.005

0.95 0.026

10

0.009

0.037

10

DATUM

PLANE

–H–

5

12.95

0.000

5

13.45 0.510

0.210 0.000

0.530

0.008

10

K

10

5

2

A1

0.450 REF

0.170 0.005

1.600 REF

0.130

0.300

0.300 0.005

0.018 REF

0.007

0.063 REF

B1 0.130

C1

R1

R2 0.130

1

2

C1

VIEW P

0.005

0.012

10

5

0

10

7

5

0

7

13–17

MOTOROLA ANALOG IC DEVICE DATA

FB SUFFIX

CASE 840F–01

Plastic Package

ISSUE O

64

1

L

–Z–

64

49

1

48

–T–, –U–, –Z–

P

AE

L

B

V

G

–U–

–T–

DETAIL AA

16

33

32

17

BASE

METAL

A

N

M

S

0.20 (0.008)

AB T–U

Z

0.050 (0.002) T–U

S

D

F

M

0.20 (0.008)

AC T–U

M

J

C

E

SECTION AE–AE

–AB–

0.10 (0.004)

–AC–

Y

H

DETAIL AD

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.396

0.063

0.011

0.057

0.009

NOTES:

A

B

C

D

E

F

9.950 10.050 0.392

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

1.400

0.170

1.350

0.170

1.600 0.055

0.270 0.007

1.450 0.053

0.230 0.007

Q

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED

AT DATUM PLANE –AC–.

G

H

J

K

L

M

N

P

0.500 BSC

0.020 BSC

R

0.050

0.090

0.450

0.150 0.002

0.200 0.004

0.550 0.018

0.006

0.008

0.022

K

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –AC–.

7.500 BSC

12° REF

0.090 0.160 0.004

0.250 BSC 0.010 BSC

0.295 BSC

12° REF

0.006

W

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –AB–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.350 (0.014).

X

°

5

Q

R

S

V

W

X

Y

1°

0.100

5

1°

0.200 0.004

DETAIL AD

0.008

0.476

11.900 12.100 0.469

0.200 REF

1.000 REF

12 REF

0.008 REF

0.039 REF

°

12 REF

°

13–18

MOTOROLA ANALOG IC DEVICE DATA

DM SUFFIX

CASE 846A–02

Plastic Package

(Micro–8)

8

1

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

–A–

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH,

PROTRUSIONS OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

–B–

K

MILLIMETERS

INCHES

PIN 1 ID

G

DIM MIN

MAX

3.10

1.10

MIN

0.114

MAX

0.122

D 8 PL

A

B

C

D

G

H

J

2.90

–––

M

S

0.08 (0.003)

T B

A

––– 0.043

0.25

0.40 0.010 0.016

0.65 BSC

0.026 BSC

0.15 0.002 0.006

0.23 0.005 0.009

5.05 0.187 0.199

0.70 0.016 0.028

0.05

0.13

4.75

0.40

SEATING

PLANE

–T–

K

L

0.038 (0.0015)

C

L

J

H

13–19

MOTOROLA ANALOG IC DEVICE DATA

FB SUFFIX

CASE 848B-04

Plastic Package

(TQFP–52)

1

52

ISSUE C

L

39

27

26

40

B

DETAIL A

–B–

–A–

L

–A–, –B–, –D–

DETAIL A

14

52

1

13

–D–

F

B

M

S

0.20 (0.008)

H A–B

D

0.05 (0.002) A–B

J

N

V

M

S

0.20 (0.008)

C A–B

BASE METAL

D

DETAIL C

M

C

M

S

0.02 (0.008)

C A–B

D

E

SECTION B–B

DATUM

PLANE

–H–

0.10 (0.004)

H

SEATING

PLANE

–C–

G

MILLIMETERS

DIM MIN MAX

INCHES

NOTES:

MIN

MAX

0.398

0.096

0.015

0.083

0.013

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD WHERE

THE LEAD EXITS THE PLASTIC BODY AT THE

BOTTOM OF THE PARTING LINE.

4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT

DATUM PLANE –H–.

U

A

B

C

D

E

9.90

2.10

0.22

2.00

0.22

10.10 0.390

2.45 0.083

0.38 0.009

2.10 0.079

0.33 0.009

F

G

H

J

K

L

0.65 BSC

0.026 BSC

R

–––

0.13

0.65

0.25

0.23 0.005

0.95 0.026

–––

0.010

0.009

0.037

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –C–.

Q

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25

(0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE DETERMINED

AT DATUM PLANE –H–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT.

7.80 REF

0.307 REF

M

N

Q

R

S

5

0.13

0

0.13

12.95

0.13

0

12.95

0.35

1.6 REF

10

5

10

0.007

7

0.17 0.005

7

0.30 0.005

13.45 0.510

––– 0.005

K

T

0

W

X

0.012

0.530

–––

T

U

V

W

X

–––

0

–––

DETAIL C

13.45 0.510

0.45 0.014

0.530

0.018

0.063 REF

13–20

MOTOROLA ANALOG IC DEVICE DATA

FB SUFFIX

CASE 848D–03

Plastic Package

ISSUE C

1

52

4X

4X TIPS

0.20 (0.008) H L–M N

0.20 (0.008) T L–M N

–X–

X=L, M, N

52

1

40

C

L

39

AB

G

3X VIEW Y

–L–

–M–

B1

VIEW Y

B

V

V1

BASE METAL

F

PLATING

13

14

27

26

J

U

–N–

A1

S1

D

M

S

0.13 (0.005)

T L–M

N

A

S

SECTION AB–AB

ROTATED 90 CLOCKWISE

4X θ2

4X θ3

C

0.10 (0.004) T

–H–

–T–

SEATING

PLANE

VIEW AA

MILLIMETERS

INCHES

MIN MAX

0.394 BSC

0.197 BSC

0.394 BSC

0.197 BSC

DIM MIN

MAX

10.00 BSC

5.00 BSC

A

A1

B

B1

C

C1

C2

D

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

S

0.05 (0.002)

10.00 BSC

5.00 BSC

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –L–, –M– AND –N– TO BE DETERMINED

AT DATUM PLANE –H–.

W

–––

0.05

1.30

0.20

0.45

0.22

1.70

––– 0.067

2 X R R1

0.20 0.002 0.008

1.50 0.051 0.059

0.40 0.008 0.016

0.75 0.018 0.030

0.35 0.009 0.014

θ1

E

F

0.25 (0.010)

C2

θ

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –T–.

G

0.65 BSC

0.026 BSC

GAGE PLANE

J

K

R1

S

S1

U

0.07

0.08

12.00 BSC

6.00 BSC

0.09

12.00 BSC

6.00 BSC

0.20 REF

1.00 REF

0.20 0.003 0.008

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE -H-.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46

(0.018). MINIMUM SPACE BETWEEN

0.50 REF

0.020 REF

0.20 0.003 0.008

K

E

0.472 BSC

0.236 BSC

0.16 0.004 0.006

C1

V

0.472 BSC

0.236 BSC

0.008 REF

0.039 REF

Z

V1

W

Z

VIEW AA

PROTRUSION AND ADJACENT LEAD OR

PROTRUSION 0.07 (0.003).

θ

0

12

5

7

0

7

–––

θ1

θ2

θ3

0

12

5

REF

13

REF

13

13–21

MOTOROLA ANALOG IC DEVICE DATA

B SUFFIX

CASE 858–01

Plastic Package

ISSUE O

42

1

NOTES:

–A–

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).

42

1

22

21

–B–

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

L

A

B

C

D

F

G

H

J

1.435 1.465 36.45 37.21

0.540 0.560 13.72 14.22

0.155 0.200

0.014 0.022

0.032 0.046

0.070 BSC

3.94

0.36

0.81

1.778 BSC

7.62 BSC

5.08

0.56

1.17

H

C

K

0.300 BSC

0.008 0.015

0.20

2.92

0.38

3.43

–T–

K

L

0.115

0.135

SEATING

PLANE

0.600 BSC

15.24 BSC

N

G

M

N

0

15

0

0.51

15

1.02

M

F

0.020 0.040

J 42 PL

D 42 PL

M

S

0.25 (0.010)

T B

M

S

0.25 (0.010)

T A

B SUFFIX

CASE 859–01

Plastic Package

(SDIP)

ISSUE O

56

1

–A–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

56

29

28

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)

–B–

INCHES

DIM MIN MAX

MILLIMETERS

1

MIN

MAX

52.45

14.22

5.08

A

B

C

D

E

2.035

0.540

0.155

0.014

2.065 51.69

0.560 13.72

0.200

0.022

L

3.94

0.36

0.56

H

C

0.035 BSC

0.89 BSC

F

0.032

0.046

0.81

1.17

G

H

J

K

L

0.070 BSC

0.300 BSC

1.778 BSC

7.62 BSC

–T–

K

0.008

0.115

0.015

0.135

0.20

2.92

0.38

3.43

SEATING

PLANE

0.600 BSC

15.24 BSC

N

G

M

F

M

N

0

15

0

0.51

15

1.02

0.020

0.040

E

J 56 PL

D 56 PL

M

S

0.25 (0.010)

T A

M

S

0.25 (0.010)

T B

13–22

MOTOROLA ANALOG IC DEVICE DATA

FB, FTB SUFFIX

CASE 873-01

Plastic Package

(TQFP–32)

1

ISSUE A

L

17

24

25

16

B

P

–B–

–A–

L

V

B

–A–, –B–, –D–

DETAIL A

32

9

1

8

F

BASE

METAL

–D–

A

M

S

0.20 (0.008)

C

A–B

D

0.05 (0.002) A–B

N

J

S

M

S

0.20 (0.008)

H A–B

D

M

S

0.20 (0.008)

C

A–B

D

DETAIL C

M

SECTION B–B

VIEW ROTATED 90 CLOCKWISE

E

C

DATUM

PLANE

–H–

–C–

SEATING

PLANE

0.01 (0.004)

M

H

G

U

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

A

B

C

D

E

F

G

H

J

K

L

M

N

P

Q

R

S

6.95

1.40

7.10 0.274 0.280

1.60 0.055 0.063

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD WHERE

THE LEAD EXITS THE PLASTIC BODY AT THE

BOTTOM OF THE PARTING LINE.

4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT

DATUM PLANE –H–.

T

0.273 0.373 0.010 0.015

1.30

0.273

0.80 BSC

–––

0.119

0.33

5.6 REF

6

0.119

0.40 BSC

5

0.15

8.85

0.15

5

8.85

1.00 REF

1.50 0.051 0.059

R

––– 0.010

–––

–H–

0.031 BSC

DATUM

PLANE

0.20

––– 0.008

0.197 0.005 0.008

0.57 0.013 0.022

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –C–.

0.220 REF

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25

(0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE DETERMINED

AT DATUM PLANE –H–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT.

K

8

6

8

Q

0.135 0.005 0.005

0.016 BSC

10

X

10

5

DETAIL C

0.25 0.006 0.010

9.15 0.348 0.360

0.25 0.006 0.010

T

U

V

X

11

9.15 0.348 0.360

0.039 REF

5

11

13–23

MOTOROLA ANALOG IC DEVICE DATA

T SUFFIX

CASE 894-03

Plastic Package

(23-Pin SZIP)

ISSUE B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

1

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION R DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

5. MOLD FLASH OR PROTRUSIONS SHALL NOT

EXCEED 0.010 (0.250).

23

6. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF

THE D DIMENSION AT MAXIMUM MATERIAL

CONDITION.

C

E

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

B

L

K

Y

A

B

C

D

E

0.684

1.183

0.175

0.026

0.058

0.165

0.694 17.374 17.627

1.193 30.048 30.302

0.179

0.031

0.062

0.175

V

–N–

4.445

0.660

1.473

4.191

4.547

0.787

1.574

4.445

M

A

U

F

P

S

F

G

H

J

K

L

M

N

P

0.050 BSC

0.169 BSC

1.270 BSC

4.293 BSC

0.356 0.508

0.014

0.625

0.770

0.148

0.020

H

0.639 15.875 16.231

0.790 19.558 20.066

0.152

R

W

3.760

3.861

–T–

SEATING

PLANE

0.390 BSC

9.906 BSC

23X J

R

S

U

V

W

Y

0.416

0.157

0.105

0.868 REF

0.200 BSC

0.700

0.424 10.566 10.770

0.167

0.115

3.988

2.667

4.242

2.921

PIN 1

M

0.024 (0.610)

T

PIN 23

22.047 REF

5.080 BSC

G

0.710 17.780 18.034

23X D

M

S

0.010 (0.254)

T Q

N

13–24

MOTOROLA ANALOG IC DEVICE DATA

FTA SUFFIX

CASE 932–02

Plastic Package

(TQFP–48)

ISSUE D

1

48

P

4X

0.200 (0.008) AB T–U

Z

DETAIL Y

9

A

A1

48

37

AE

1

36

–T–

–U–

V1

B

V

B1

–T–, –U–, –Z–

12

25

DETAIL Y

13

24

–Z–

S1

M

TOP & BOTTOM

S

R

4X

GAUGE PLANE

0.200 (0.008) AC T–U

Z

0.250 (0.010)

E

C

H

0.080 (0.003) AC

G

–AB–

–AC–

W

Q

K

AD

DETAIL AD

X

BASE METAL

MILLIMETERS

DIM MIN MAX

7.000 BSC

INCHES

MIN

MAX

NOTES:

A

A1

B

0.276 BSC

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

3.500 BSC

7.000 BSC

3.500 BSC

1.400 1.600 0.055 0.063

0.170 0.270 0.007 0.011

0.138 BSC

0.276 BSC

0.138 BSC

N

J

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED

AT DATUM PLANE –AB–.

B1

C

D

E

1.350 1.450 0.053 0.057

0.170 0.230 0.007 0.009

F

D

F

G

H

J

K

M

N

P

0.500 BASIC

0.020 BASIC

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –AC–.

0.050 0.150 0.002 0.006

0.090 0.200 0.004 0.008

0.500 0.700 0.020 0.028

12 REF

0.090 0.160 0.004 0.006

0.250 BASIC 0.010 BASIC

M

S

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –AB–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.350 (0.014).

0.080 (0.003)

AC T–U

Z

12 REF

SECTION AE–AE

Q

R

1

5

1

5

0.150 0.250 0.006 0.010

S

9.000 BSC

4.500 BSC

9.000 BSC

4.500 BSC

0.200 REF

1.000 REF

0.354 BSC

0.177 BSC

0.354 BSC

0.177 BSC

0.008 REF

0.039 REF

S1

V

V1

W

X

8. MINIMUM SOLDER PLATE THICKNESS SHALL BE

0.0076 (0.0003).

9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

13–25

MOTOROLA ANALOG IC DEVICE DATA

D2T SUFFIX

CASE 936–03

Plastic Package

ISSUE B

1

2

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

3

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS

A AND K.

TERMINAL 4

4. DIMENSIONS U AND V ESTABLISH A MINIMUM

MOUNTING SURFACE FOR TERMINAL 4.

5. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH OR GATE PROTRUSIONS. MOLD FLASH

AND GATE PROTRUSIONS NOT TO EXCEED

0.025 (0.635) MAXIMUM.

K

U

A

S

V

B

H

F

1

2

3

INCHES

DIM MIN MAX

0.403 9.804 10.236

MILLIMETERS

MIN MAX

A

B

C

D

E

F

0.386

0.356

0.170

0.026

0.045

J

D

0.368 9.042

0.180 4.318

0.036 0.660

0.055 1.143

9.347

4.572

0.914

1.397

G

M

0.010 (0.254)

T

0.051 REF

0.100 BSC

0.539 0.579 13.691 14.707

0.125 MAX

0.050 REF

1.295 REF

2.540 BSC

–T–

E

G

H

J

K

L

M

N

P

R

S

U

V

OPTIONAL

CHAMFER

3.175 MAX

1.270 REF

0.000

0.088

0.018

0.058

5

0.010 0.000

0.254

2.591

0.660

1.981

0.102 2.235

0.026 0.457

0.078 1.473

REF

5 REF

C

0.116 REF

0.200 MIN

0.250 MIN

2.946 REF

5.080 MIN

6.350 MIN

M

L

P

N

R

D2T SUFFIX

CASE 936A–02

Plastic Package

(D PAK)

1

NOTES:

2

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS

A AND K.

5

ISSUE A

TERMINAL 6

4. DIMENSIONS U AND V ESTABLISH A MINIMUM

MOUNTING SURFACE FOR TERMINAL 6.

5. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH OR GATE PROTRUSIONS. MOLD FLASH

AND GATE PROTRUSIONS NOT TO EXCEED

0.025 (0.635) MAXIMUM.

U

A

V

S

K

B

H

1

2

3

4

5

INCHES

DIM MIN MAX

0.403 9.804 10.236

MILLIMETERS

MIN MAX

A

B

C

D

E

G

H

K

L

M

N

P

R

S

0.386

0.356

0.170

0.026

0.045

0.067 BSC

0.539

0.050 REF

0.000

0.088

0.018

0.058

5

0.116 REF

0.200 MIN

0.250 MIN

0.368 9.042

0.180 4.318

0.036 0.660

0.055 1.143

1.702 BSC

0.579 13.691 14.707

1.270 REF

9.347

4.572

0.914

1.397

D

M

0.010 (0.254)

T

G

–T–

E

OPTIONAL

CHAMFER

0.010 0.000

0.254

2.591

0.660

1.981

0.102 2.235

0.026 0.457

0.078 1.473

REF

5 REF

2.946 REF

5.080 MIN

6.350 MIN

U

V

C

M

L

P

N

R

13–26

MOTOROLA ANALOG IC DEVICE DATA

20

DT, DTB SUFFIX

CASE 948E–02

Plastic Package

(TSSOP–20)

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

1

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

20X K REF

K

M

S

0.10 (0.004)

T U

V

S

K1

0.15 (0.006) T U

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

J J1

20

11

^2XL/2

B

SECTION N–N

L

–U–

PIN 1

IDENT

0.25 (0.010)

N

10

1

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.260

0.177

0.047

0.006

0.030

M

A

B

C

6.40

4.30

–––

6.60 0.252

4.50 0.169

1.20

S

0.15 (0.006) T U

–––

A

D

F

0.05

0.50

0.15 0.002

0.75 0.020

N

–V–

G

H

J

J1

K

K1

L

0.65 BSC

0.026 BSC

F

0.27

0.09

0.19

0.37

0.011

0.015

0.008

0.006

0.012

0.010

0.20 0.004

0.16 0.004

0.30 0.007

0.25 0.007

DETAIL E

C

6.40 BSC

0.252 BSC

M

0

8

0

8

–W–

G

D

H

0.100 (0.004)

–T– ^SEATING

DETAIL E

PLANE

DTB SUFFIX

CASE 948F–01

16

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

Plastic Package

1

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

(TSSOP–16, TSSOP–16L)

ISSUE O

16X KREF

M

S

0.10 (0.004)

T U

V

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

S

0.15 (0.006) T U

K

K1

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

16

9

2X L/2

J1

SECTION N–N

B

–U–

L

J

PIN 1

IDENT.

8

1

N

MILLIMETERS

DIM MIN MAX

INCHES

0.25 (0.010)

MIN

MAX

0.200

0.177

0.047

0.006

0.030

A

B

C

4.90

4.30

–––

5.10 0.193

4.50 0.169

1.20

S

M

0.15 (0.006) T U

A

–––

D

F

0.05

0.50

0.15 0.002

0.75 0.020

–V–

N

G

H

J

J1

K

K1

L

0.65 BSC

0.026 BSC

0.18

0.09

0.19

0.28 0.007

0.20 0.004

0.16 0.004

0.30 0.007

0.25 0.007

0.011

0.008

0.006

0.012

0.010

F

DETAIL E

6.40 BSC

0.252 BSC

0

C

M

0

8

0.10 (0.004)

–W–

H

SEATING

PLANE

–T–

D

G

13–27

MOTOROLA ANALOG IC DEVICE DATA

DTB SUFFIX

CASE 948G–01

Plastic Package

(TSSOP–14)

ISSUE O

14

1

NOTES:

14X K REF

1

DIMENSIONING AND TOLERANCING PER ANSI

M

S

Y14.5M, 1982.

0.10 (0.004)

T U

V

2

3

CONTROLLING DIMENSION: MILLIMETER.

DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

S

0.15 (0.006) T U

N

0.25 (0.010)

14

4

5

8

2X L/2

M

B

L

N

–U–

PIN 1

IDENT.

F

7

1

6

7

TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

DETAIL E

S

K

0.15 (0.006) T U

A

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

K1

–V–

A

B

C

4.90

4.30

–––

5.10 0.193 0.200

4.50 0.169 0.177

1.20

J J1

––– 0.047

D

F

0.05

0.50

0.15 0.002 0.006

0.75 0.020 0.030

SECTION N–N

G

H

J

J1

K

K1

L

0.65 BSC

0.026 BSC

0.60 0.020 0.024

0.20 0.004 0.008

0.16 0.004 0.006

0.30 0.007 0.012

0.25 0.007 0.010

0.50

0.09

0.19

–W–

C

6.40 BSC

0.252 BSC

0.10 (0.004)

M

0

8

0

8

SEATING

PLANE

–T–

H

G

DETAIL E

D

13–28

MOTOROLA ANALOG IC DEVICE DATA

DTB SUFFIX

CASE 948H–01

Plastic Package

ISSUE O

24

1

24X KREF

M

S

0.10 (0.004)

T U

V

S

0.15 (0.006) T U

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

24

13

2X L/2

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

B

–U–

L

PIN 1

IDENT.

12

1

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

S

0.15 (0.006) T U

A

–V–

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

MILLIMETERS

DIM MIN MAX

7.90 0.303

INCHES

MIN

MAX

C

A

B

7.70

4.30

–––

0.311

4.50 0.169 0.177

1.20 ––– 0.047

C

0.10 (0.004)

D

F

G

H

J

J1

K

K1

L

0.05

0.50

0.65 BSC

0.27

0.09

0.19

0.15 0.002 0.006

0.75 0.020 0.030

SEATING

PLANE

–T–

G

H

D

0.026 BSC

0.011 0.015

0.37

0.20 0.004 0.008

0.16 0.004 0.006

0.30 0.007 0.012

0.25 0.007 0.010

6.40 BSC

0.252 BSC

M

0

8

0

8

–W–

DETAIL E

N

0.25 (0.010)

K

M

K1

N

J1

F

DETAIL E

SECTION N–N

J

13–29

MOTOROLA ANALOG IC DEVICE DATA

DTB SUFFIX

CASE 948J–01

Plastic Package

(TSSOP–8)

8

1

ISSUE O

NOTES:

8x KREF

1

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

M

S

0.10 (0.004)

T U

V

2

3

CONTROLLING DIMENSION: MILLIMETER.

DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

S

0.15 (0.006) T U

K

K1

8

5

2X L/2

4

5

DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

J J1

B

–U–

L

PIN 1

IDENT.

SECTION N–N

4

1

N

6

7

0.25 (0.010)

S

0.15 (0.006) T U

A

M

–V–

MILLIMETERS

INCHES

DIM MIN

MAX

3.10

4.50 0.169

1.20 –––

0.15 0.002

0.75 0.020

MIN

0.114

MAX

0.122

0.177

0.047

0.006

0.030

N

A

B

C

2.90

4.30

–––

F

D

F

0.05

0.50

DETAIL E

G

H

J

J1

K

K1

L

0.65 BSC

0.026 BSC

0.50

0.09

0.19

0.60 0.020

0.20 0.004

0.16 0.004

0.30 0.007

0.25 0.007

0.024

0.008

0.006

0.012

0.010

–W–

C

0.10 (0.004)

G

SEE DETAIL E

SEATING

PLANE

–T–

D

6.40 BSC

0.252 BSC

M

0

8

0

8

H

M SUFFIX

CASE 967–01

Plastic Package

(EIAJ–20)

20

1

ISSUE O

NOTES:

1

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2

3

CONTROLLING DIMENSION: MILLIMETER.

DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

L

E

20

11

Q

1

4

5

TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

H

E

M

THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

L

1

10

DETAIL P

Z

D

VIEW P

MILLIMETERS

INCHES

MIN MAX

––– 0.081

e

A

DIM MIN

MAX

c

A

–––

0.05

0.35

0.18

2.05

0.20 0.002 0.008

0.50 0.014 0.020

0.27 0.007

1

b

c

0.011

D

E

e

12.35 12.80 0.486 0.504

A

b

1

5.10

5.45 0.201 0.215

1.27 BSC

0.050 BSC

8.20 0.291 0.323

0.85 0.020 0.033

1.50 0.043 0.059

M

0.10 (0.004)

0.13 (0.005)

H

7.40

0.50

1.10

0

0.70

–––

E

L

E

M

Q

10

0.90 0.028 0.035

0.81 ––– 0.032

10

0

1

Z

13–30

MOTOROLA ANALOG IC DEVICE DATA

FTB SUFFIX

CASE 976–01

Plastic Package

(TQFP–20)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED

AT DATUM PLANE –AB–.

20

1

ISSUE O

4X

9

0.200 (0.008) AB T–U Z

5. DIMENSIONS S AND V TO BE DETERMINED AT

DATUM PLANE –AC–.

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.250 (0.010) PER SIDE. DIMENSIONS A AND B

DO INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –AB–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.350 (0.014).

A

A1

DETAIL Y

20

16

8. MINIMUM SOLDER PLATE THICKNESS SHALL BE

0.0076 (0.0003).

9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

15

1

–T–

–U–

MILLIMETERS

DIM MIN MAX

4.000 BSC

INCHES

MIN MAX

0.157 BSC

0.079 BSC

0.157 BSC

0.079 BSC

V

B

A

A1

B

2.000 BSC

4.000 BSC

2.000 BSC

1.400 1.600 0.055 0.063

0.170 0.270 0.007 0.011

B1

C

D

E

11

5

V1

1.350 1.450 0.053 0.057

0.170 0.230 0.007 0.009

F

G

H

J

K

M

N

P

0.650 BSC

0.026 BSC

0.050 0.150 0.002 0.006

0.090 0.200 0.004 0.008

0.500 0.700 0.020 0.028

12 REF

0.090 0.160 0.004 0.006

0.250 BSC 0.010 BSC

6

10

12 REF

–Z–

S1

Q

R

S

S1

V

V1

W

X

1

5

1

5

S

0.150 0.250 0.006 0.010

6.000 BSC

3.000 BSC

6.000 BSC

3.000 BSC

0.200 REF

1.000 REF

0.236 BSC

0.118 BSC

0.236 BSC

0.118 BSC

0.008 REF

0.039 REF

4X

0.200 (0.008) AB T–U Z

DETAIL AD

J

N

–AB–

–AC–

F

D

0.080 (0.003) AC

S

0.080 (0.003)

AC T–U

Z

M

SECTION AE–AE

TOP & BOTTOM

R

–T–, –U–, –Z–

C

H

E

AE

G

AE

W

K

X

GAUGE

PLANE

Q

0.250 (0.010)

DETAIL AD

DETAIL Y

13–31

MOTOROLA ANALOG IC DEVICE DATA

FTA SUFFIX

CASE 977–01

Plastic Package

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

24

1

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED

AT DATUM PLANE –AB–.

4X

5. DIMENSIONS S AND V TO BE DETERMINED AT

DATUM PLANE –AC–.

9

0.200 (0.008) AB T–U Z

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.250 (0.010) PER SIDE. DIMENSIONS A AND B

DO INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –AB–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.350 (0.014).

A

A1

24

DETAIL Y

19

8. MINIMUM SOLDER PLATE THICKNESS SHALL BE

0.0076 (0.0003).

9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

1

18

–T–

–U–

MILLIMETERS

DIM MIN MAX

4.000 BSC

INCHES

MIN MAX

0.157 BSC

0.079 BSC

0.157 BSC

0.079 BSC

A

A1

B

2.000 BSC

4.000 BSC

2.000 BSC

1.400 1.600 0.055 0.063

0.170 0.270 0.007 0.011

V

B

B1

C

D

E

B1

13

6

1.350 1.450 0.053 0.057

0.170 0.230 0.007 0.009

V1

F

G

H

J

K

M

N

P

0.500 BSC

0.020 BSC

0.050 0.150 0.002 0.006

0.090 0.200 0.004 0.008

0.500 0.700 0.020 0.028

12 REF

0.090 0.160 0.004 0.006

0.250 BSC 0.010 BSC

12 REF

7

12

Q

R

S

S1

V

V1

W

X

1

5

1

5

–Z–

S1

0.150 0.250 0.006 0.010

6.000 BSC

3.000 BSC

6.000 BSC

3.000 BSC

0.200 REF

1.000 REF

0.236 BSC

0.118 BSC

0.236 BSC

0.118 BSC

0.008 REF

0.039 REF

S

4X

0.200 (0.008) AB T–U Z

DETAIL AD

–T–, –U–, –Z–

–AB–

–AC–

AE

0.080 (0.003) AC

M

TOP & BOTTOM

P

R

G

DETAIL Y

C

E

J

N

F

W

GAUGE

Q

D

PLANE

H

K

0.250 (0.010)

X

S

0.080 (0.003)

AC T–U

Z

DETAIL AD

SECTION AE–AE

13–32

MOTOROLA ANALOG IC DEVICE DATA

N SUFFIX

CASE 1212–01

Plastic Package

(SOT–23)

1

ISSUE O

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

A2

B

A

E

D

S

0.05

3. DATUM C IS A SEATING PLANE.

A1

MILLIMETERS

5

1

4

3

DIM MIN

MAX

0.10

1.30

0.50

0.25

3.00

3.10

1.80

L

A1

A2

B

C

D

E

E1

e

e1

L

0.00

1.00

0.30

0.10

2.80

2.50

1.50

0.95 BSC

1.90 BSC

0.20

0.45

2

E1

C

L1

B

5X

C

M

S

0.10

C B

A

e

e1

–––

0.75

L1

H SUFFIX

1

CASE 1213–01

Plastic Package

(SOT–89)

ISSUE O

NOTES:

A

D

A2

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCING

PER ASME Y14.5M, 1994.

C

B

D1

3. DATUM C IS A SEATING PLANE.

MILLIMETERS

DIM MIN

MAX

1.60

0.57

0.52

0.50

4.60

1.70

4.25

2.60

E1

E

A2

B

B1

C

D

D1

E

1.40

0.37

0.32

0.30

4.40

1.50

–––

L1

B

C

M

S

0.10

C B

A

E1

e

e1

L1

2.40

1.50 BSC

3.00 BSC

0.80 –––

B1 2X

e

M

S

0.10

C B

A

e1

13–33

MOTOROLA ANALOG IC DEVICE DATA


型号：	MC13122DWR3
厂家：	MOTOROLA
描述：	AM, AUDIO DEMODULATOR, PDSO28, PLASTIC, SOIC-28 光电二极管商用集成电路
文件：	总64页 (文件大小：1176K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MC13122DWR3 [MOTOROLA]

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