MC145408 [MOTOROLA]

DRIVER / RECEIVERS; 驱动器/接收机
MC145408
型号: MC145408
厂家: MOTOROLA    MOTOROLA
描述:

DRIVER / RECEIVERS
驱动器/接收机

驱动器 接收机
文件: 总9页 (文件大小:186K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Order this document  
by MC145403/D  
SEMICONDUCTOR TECHNICAL DATA  
EIA–232–E and CCITT V.28  
These devices are silicon gate CMOS ICs that combine both the transmitter  
and receiver to fulfill the electrical specifications of EIA Standard 232–E and  
CCITT V.28. The drivers feature true TTL input compatibility, slew rate limiting  
outputs, 300 power–off source impedance, and output typically switching to  
within 25% of the supply rails. The receivers can handle up to ± 25 V while  
presenting 3 to 7 kimpedance. Hysteresis in the receivers aid in the reception  
of noisy signals. By combining both drivers and receivers in a single CMOS  
chip, these devices provide efficient, low–power solutions for both EIA–232–E  
and V.28 applications.  
P SUFFIX  
PLASTIC DIP  
CASE 738  
20  
1
These devices offer the following performance features:  
P SUFFIX  
PLASTIC DIP  
CASE 724  
Drivers  
± 5 to ± 12 V Supply Range  
300 Power–Off Source Impedance  
Output Current Limiting  
TTL and CMOS Compatible Inputs  
Driver Slew Rate Range Limited to 30 V/µs Maximum  
24  
1
DW SUFFIX  
SOG PACKAGE  
CASE 751D  
20  
Receivers  
1
± 25 V Input Range  
3 to 7 kInput Impedance  
0.8 V of Hysteresis for Enhanced Noise Immunity  
TTL and CMOS Compatible Outputs  
DW SUFFIX  
SOG PACKAGE  
CASE 751E  
24  
Available Driver/Receiver Combinations  
1
Device  
Drivers  
Receivers  
Figure  
No. of Pins  
MC145403  
MC145404  
MC145405  
MC145408  
3
4
5
5
5
4
3
5
1
2
3
4
20  
20  
20  
24  
SD SUFFIX  
SSOP  
CASE 940B  
20  
1
ORDERING INFORMATION  
Alternative EIA–232 devices to consider are:  
MC145403P  
MC145404P  
MC145405P  
MC145408P  
Plastic DIP  
Plastic DIP  
Plastic DIP  
Plastic DIP  
Three Supply  
Single Supply  
MC145406 (3 x 3)  
MC145407 (3 x 3)  
MC145705 (2 x 3) with Power Down  
MC145706 (3 x 2) with Power Down  
MC145707 (3 x 3) with Power Down  
MC145403DW  
MC145404DW  
MC145405DW  
MC145408DW  
SOG Package  
SOG Package  
SOG Package  
SOG Package  
MC145405SD  
SSOP  
REV 2  
1/97  
TN97010600  
Motorola, Inc. 1997  
PIN ASSIGNMENTS  
(DIP, SOG, AND SSOP)  
MC145403  
3 DRIVERS/5 RECEIVERS  
MC145404  
4 DRIVERS/4 RECEIVERS  
MC145405  
5 DRIVERS/3 RECEIVERS  
MC145408  
5 DRIVERS/5 RECEIVERS  
1
2
20  
19  
1
20  
1
2
20  
19  
1
2
24  
23  
V
V
V
V
V
V
V
V
CC  
DD  
CC  
DD  
CC  
DD  
CC  
DD  
2
19  
R
R
R
R
R
R
R
R
R
Rx1  
DO1  
Rx1  
DO1  
Rx1  
Tx1  
DO1  
DI1  
Rx1  
Tx1  
Rx2  
Tx2  
Rx3  
Tx3  
Rx4  
DO1  
DI1  
3
18  
3
4
5
6
7
8
22  
21  
20  
19  
18  
17  
3
4
18  
17  
3
4
18  
17  
D
D
D
D
D
D
D
Tx1  
Rx2  
DI1  
Tx1  
Rx2  
DI1  
4
5
6
17  
16  
15  
R
R
DO2  
DO2  
DO2  
DI2  
DI2  
Tx2  
Rx2  
Tx3  
5
6
7
16  
15  
14  
5
6
7
16  
15  
14  
R
Tx2  
Rx3  
Tx3  
Rx4  
Tx4  
DI3  
DO2  
DI3  
D
D
D
D
Rx3  
Tx2  
Rx4  
DO3  
DI2  
D
D
DO3  
DI3  
DO3  
DI3  
7
14  
13  
12  
11  
R
R
DO4  
D
D
Tx4  
Rx3  
Tx5  
DI4  
8
13  
12  
11  
8
13  
12  
11  
8
R
R
Rx5  
Tx3  
DO5  
DI3  
DO4  
DI4  
R
DO3  
DI5  
DO4  
9
16  
15  
9
9
9
D
D
Tx4  
Rx5  
DI4  
10  
10  
10  
10  
DO5  
V
GND  
V
GND  
V
SS  
GND  
SS  
SS  
11  
12  
14  
13  
Tx5  
DI5  
V
GND  
SS  
FUNCTIONAL DIAGRAM  
RECEIVER  
DRIVER  
V
V
CC  
DD  
ESD  
PROTECTION  
V
V
DD  
CC  
15 k  
V
CC  
+
Rx  
+
DO  
300  
DI  
LEVEL  
SHIFT  
Tx  
5.4 kΩ  
1.4 V  
V
SS  
V
SS  
1.0 V  
1.8 V  
MC145403MC145404MC145405MC145408  
MOTOROLA  
2
ABSOLUTE MAXIMUM RATINGS  
(Voltages referenced to GND, except where noted)  
This device contains circuitry to protect the  
inputsand outputs against damage due to high  
static voltages or electric fields; however, it is  
advised that normal precautions be taken to  
avoid applications of any voltage higher than  
maximum rated voltages to this high imped-  
ance circuit.  
Rating  
Symbol  
Value  
Unit  
DC Supply Voltage (V  
V  
)
V
V
– 0.5 to + 13.5  
+ 0.5 to – 13.5  
– 0.5 to + 6.0  
V
DD  
CC  
DD  
SS  
V
CC  
Input Voltage Range  
V
IR  
V
Rx1 – Rxn  
DI1 – DIn  
V
– 15 to V  
+ 15  
SS  
0.5 to V  
DD  
+ 15  
For proper operation it is recommended that  
CC  
V
and V be constrained to the ranges  
out  
in  
described as follows:  
DC Current Drain per Pin  
Power Dissipation  
I
± 00  
mA  
W
Digital I/O: Driver Inputs (DI):  
P
D
1
(GND V V ).  
DI CC  
Receiver Outputs (DO):  
(GND V V ).  
Operating Temperature Range  
Storage Temperature Range  
T
– 40 to + 85  
°C  
°C  
A
DO CC  
T
stg  
– 85 to + 150  
EIA–232 I/O: Driver Outputs (Tx):  
(V V  
V ).  
SS Tx1 – Txn  
DD  
Receiver Inputs (Rx):  
– 15 V V  
V
V  
Rx1 – Rxn DD  
SS  
+ 15 V).  
Reliabilityofoperationisenhancedifunused  
outputs are tied off to an appropriate logic  
voltage level (e.g., either GND or V  
and GND for Rx).  
for DI,  
CC  
DC ELECTRICAL CHARACTERISTICS (All polarities referenced to GND = 0 V, T = – 40 to + 85°C)  
A
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
DC Supply Voltage  
V
4.5  
– 4.5  
4.5  
5 to 12  
– 5 to – 12  
5
13.2  
– 13.2  
5.5  
V
DD  
V
SS  
CC  
V
Quiescent Supply Current (Outputs Unloaded, Inputs Low)  
V
V
V
= + 12 V  
= – 12 V  
I
425  
– 400  
110  
635  
– 600  
200  
µA  
DD  
SS  
DD  
I
SS  
CC  
= + 5 V  
I
CC  
RECEIVER ELECTRICAL SPECIFICATIONS  
(Voltage polarities referenced to GND = 0 V, V  
= + 12 V, V  
= – 12 V, T = – 40 to + 85°C, V  
= + 5 V, ± 10%)  
CC  
DD  
Characteristic  
SS  
A
Symbol  
Min  
Typ  
Max  
Unit  
Input Turn–On Threshold  
= V  
Rx1 – Rxn  
Rx1 – Rxn  
V
1.35  
1.8  
2.35  
V
on  
V
DO  
Input Turn–Off Threshold  
= V  
OL  
V
off  
0.75  
0.6  
3
1
1.25  
V
V
V
DO  
OH  
Input Threshold Hysteresis  
V
hys  
0.8  
5.4  
= V – V  
on  
off  
Input Resistance  
R
7
kΩ  
V
in  
(V  
SS  
– 15 V) V Rx1 – Rxn (V  
+ 15 V)  
DD  
High Level Output Voltage  
= – 3 to – 25 V* (DO1 – DOn)  
I
= – 20 µA  
out  
= – 1.0 mA  
V
OH  
4.9  
3.8  
4.9  
4.3  
V
I
out  
Rx  
Low Level Output Voltage  
= + 3 to + 25 V* (DO1 – DOn)  
I
I
= + 2 mA  
= + 4 mA  
V
OL  
0.02  
0.5  
0.5  
0.7  
V
out  
out  
V
Rx  
* This is the range of input voltages as specified by EIA–232–E to cause a receiver to be in the high or low.  
MOTOROLA  
MC145403MC145404MC145405MC145408  
3
DRIVER ELECTRICAL SPECIFICATIONS  
(Voltage Polarities Referenced to GND = 0 V, V  
= + 12 V, V  
= – 12 V, T = – 40 to + 85°C, V = + 5 V, ± 10%)  
CC  
DD  
SS  
A
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Digital Input Voltage  
Logic 0  
Logic 1  
DI1 – DIn  
DI1 – DIn  
Tx1 – Txn  
V
V
2
0.8  
IL  
V
IH  
Input Current  
µA  
V
DI  
V
DI  
= GND  
I
7
± 1.0  
IL  
= V  
I
IH  
CC  
Output High Voltage  
V
OH  
V
V
= Logic 0, R = 3 kΩ  
L
DI  
V
V
V
= + 5.0 V, V  
= + 6.0 V, V  
= – 5.0 V  
= – 6.0 V  
3.5  
4.3  
9.2  
3.9  
4.7  
9.5  
DD  
DD  
DD  
SS  
SS  
= + 12.0 V, V  
= – 12.0 V  
SS  
Output Low Voltage*  
Tx1 – Txn  
V
OL  
V
V
DI  
V
= Logic 1, R = 3 kΩ  
L
= + 5.0 V, V  
= + 6.0 V, V  
= – 5.0 V  
= – 6.0 V  
– 4  
– 4.5  
– 10  
– 4.3  
– 5.2  
– 10.3  
DD  
DD  
DD  
SS  
SS  
V
V
= + 12.0 V, V  
= – 12.0 V  
SS  
Input Current  
(Figure 5)  
Tx1 – Txn  
Tx1 – Txn  
Z
300  
off  
Output Short Circuit Current  
= + 12 V, V = – 12 V  
I
SC  
mA  
V
DD  
SS  
Tx Shorted to GND**  
Tx Shorted to ± 15 V***  
± 22  
± 60  
± 60  
± 100  
*Voltage specifications are in terms of absolute values.  
**Specificationis for one Tx output pin to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation  
limits will be exceeded.  
***This condition could exceed package limitations.  
SWITCHING CHARACTERISTICS (V  
CC  
= + 5 V, ± 10%, V  
= + 12 V, V  
= – 12 V, T = – 40 to + 85°C; See Figures 2 and 3)  
A
DD  
SS  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Drivers  
Propagation Delay Time Tx  
Low–to–High  
t
t
ns  
PLH  
R
= 3 k, C = 50 pF  
500  
700  
1000  
1000  
L
L
High–to–Low  
= 3 k, C = 50 pF  
PHL  
R
L
L
Output Slew Rate  
Minimum Load  
SR  
V/µs  
R
= 7 k, C = 0 pF (V  
= 6 to 12 V, V  
= – 6 to – 12 V)  
4
± 6  
± 30  
L
L
DD  
SS  
Maximum Load  
= 3 k, C = 2500 pF (V  
R
= 12 V, V  
= – 12 V, V = 5 V)  
CC  
L
L
DD  
SS  
Receivers (C = 50 pF)  
L
Propagation Delay Time  
Low–to–High  
t
t
ns  
PLH  
360  
130  
250  
40  
610  
610  
400  
100  
High–to–Low  
Output Rise Time  
Output Fall Time  
PHL  
t
r
ns  
ns  
t
f
MC145403MC145404MC145405MC145408  
MOTOROLA  
4
1
24  
V
V
DD CC  
Tx1  
22  
20  
18  
16  
14  
3
DI1  
DI2  
DI3  
5
Tx2  
Tx3  
V
= ± 2 V  
in  
7
9
DI4  
DI5  
Tx4  
Tx5  
11  
V
GND  
DD  
12  
Vin  
I
Rout  
13  
Figure 1. Power–Off Source Resistance  
Illustrated for MC145408  
DRIVERS  
+ 3 V  
0 V  
DI  
50%  
t
t
r
f
V
OH  
OL  
90%  
Tx  
10%  
V
t
t
PLH  
PHL  
RECEIVERS  
DRIVERS  
+ 3 V  
0 V  
Rx  
50%  
+ 3 V  
– 3 V  
+ 3 V  
– 3 V  
Tx  
t
t
PLH  
PHL  
90%  
t
t
SLH  
V
SHL  
OH  
DO  
10%  
6 V  
or t  
V
OL  
Slew Rate =  
t
t
f
t
SLH  
SHL  
r
Figure 2. Switching Characteristics  
Figure 3. Slew Rate Characteristics  
V
PIN DESCRIPTIONS  
SS  
Most Negative Device Pin  
V
CC  
Digital Power Supply  
The most negative power supply pin, which is typically – 5  
to – 12 V.  
The digital supply pin, which is connected to the logic  
power supply (+ 5.5 V maximum).  
Rx1 – Rxn  
Receive Data Input Pins  
These are the EIA–232–E receive signal inputs. A voltage  
between + 3 and + 25 V is decoded as a space, and causes  
the corresponding DO pin to swing to ground (0 V). A voltage  
between – 3 and – 25 V is decoded as a mark, and causes  
GND  
Ground  
Ground return pin is typically connected to the signal  
ground pin of the EIA–232–E connector (Pin 7) as well as to  
the logic power supply ground.  
the corresponding DO pin to swing to V  
.
CC  
DO1 – DOn  
Data Output Pins  
V
DD  
Most Positive Device Pin  
These are the receiver digital output pins which swing from  
V to GND. Each output pin is capable of driving one  
The most positive power supply pin, which is typically + 5  
to + 12 V.  
CC  
LSTTL input load.  
MOTOROLA  
MC145403MC145404MC145405MC145408  
5
DI1 – DIn  
Data Input Pins  
off while the + 5 V is on and the off supply is a low impedance  
to ground, the diode D1 will prevent current flow through the  
internal diode.  
These are the high impedance digital input pins to the driv-  
ers. Input voltage levels on these pins are LSTTL compatible  
and must be between V and GND. A weak pull–up on  
each input sets all unused DI pins to V , causing the corre-  
The diode D2 is used as a voltage clamp, to prevent V  
from drifting positive to V , in the event that power is re-  
CC  
SS  
CC  
moved from V  
SS  
SS  
approximately 3 k, this pin will be pulled to V  
circuitry causing excessive current in the V  
If by design, neither of the above conditions are allowed to  
exist, then the diodes D1 and D2 are not required.  
(Pin 12). If V  
impedance from the V  
power is removed, and the  
SS  
pin to ground is greater than  
CC  
sponding unused driver outputs to be at V  
.
SS  
by internal  
CC  
pin.  
CC  
Tx1 – TXn  
Transmit Data Output Pins  
These are the EIA–232–E transmit signal output pins,  
which swing from V to V . A logic 1 at the DI input causes  
DD  
SS  
ESD PROTECTION  
the corresponding Tx output to swing to V . A logic 0 at the  
SS  
DI input causes the corresponding Tx out to swing to V  
ESD protection on IC devices that have their pins accessi-  
ble to the outside world is essential. High static voltages ap-  
plied to the pins when someone touches them either directly  
or indirectly can cause damage to gate oxides and transistor  
junctions by coupling a portion of the energy from the I/O pin  
to the power supply buses of the IC. This coupling will usually  
occur through the internal ESD protection diodes. The key to  
protecting the IC is to shunt as much of the energy to ground  
as possible before it enters the IC. Figure 4 shows a tech-  
nique which will clamp the ESD voltage at approximately  
± 15 V using the MMBZ15VDLT1. Any residual voltage which  
appears on the supply pins is shunted to ground through the  
capacitors C1 – C3. This scheme has provided protection to  
the interface part up to ± 10 kV, using the human body model  
test.  
.
DD  
The actual levels and slew rate achieved will depend on the  
output loading (R C ).  
L
L
APPLICATION INFORMATION  
POWER SUPPLY CONSIDERATIONS  
Figure 4 shows a technique to guard against excessive de-  
vice current.  
The diode D1 prevents excessive current from flowing  
through an internal diode from the V  
pin to the V  
pin  
CC  
by approximately 0.6 V or greater. This high  
DD  
when V  
< V  
DD  
CC  
current condition can exist for a short period of time during  
power up/down. Additionally, if the + 12 V supply is switched  
+ 12 V  
D1  
MMBZ15VDLT1 x 10  
+ 5 V  
1N4001  
C1  
V
V
CC  
DD  
1
24  
C2  
1N4001  
Rx1  
Tx1  
2
3
23 DO1  
22 DI1  
R
D
Rx2  
Tx2  
4
5
21 DO2  
20 DI2  
R
R
R
R
D
D
Rx3  
Tx3  
Rx4  
Tx4  
6
7
8
9
19 DO3  
18 DI3  
17 DO4  
16 DI4  
15 DO5  
D
Rx5 10  
Tx5 11  
14 DI5  
D
V
12  
13 GND  
SS  
C3  
D2  
1N5818  
– 12 V  
Figure 4.  
MC145403MC145404MC145405MC145408  
MOTOROLA  
6
PACKAGE DIMENSIONS  
P SUFFIX  
PLASTIC DIP  
CASE 738–03  
-A-  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
20  
1
11  
10  
B
4. DIMENSION B DOES NOT INCLUDE MOLD  
FLASH.  
C
L
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
E
F
G
J
K
L
M
N
MIN  
MAX  
1.070  
0.260  
0.180  
0.022  
MIN  
25.66  
6.10  
3.81  
0.39  
1.27 BSC  
1.27  
2.54 BSC  
0.21  
MAX  
27.17  
6.60  
4.57  
0.55  
1.010  
0.240  
0.150  
0.015  
0.050 BSC  
0.050  
0.100 BSC  
0.008  
0.110  
-T-  
SEATING  
PLANE  
K
M
0.070  
1.77  
E
N
0.015  
0.140  
0.38  
3.55  
G
F
J 20 PL  
2.80  
0.300 BSC  
15  
0.040  
7.62 BSC  
15  
0.51 1.01  
D 20 PL  
0.25 (0.010)  
M
M
0.25 (0.010)  
T
B
0°  
°
0°  
°
0.020  
M
M
T
A
P SUFFIX  
PLASTIC DIP  
CASE 724–03  
–A–  
NOTES:  
1. CHAMFERED CONTOUR OPTIONAL.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
24  
13  
12  
–B–  
1
4. CONTROLLING DIMENSION: INCH.  
INCHES  
MILLIMETERS  
L
DIM  
A
B
C
D
E
MIN  
MAX  
1.265  
0.270  
0.175  
0.020  
MIN  
31.25  
6.35  
3.69  
0.38  
MAX  
32.13  
6.85  
4.44  
0.51  
C
1.230  
0.250  
0.145  
0.015  
NOTE 1  
–T–  
SEATING  
PLANE  
K
0.050 BSC  
1.27 BSC  
F
G
J
K
L
M
N
0.040  
0.100 BSC  
0.007  
0.110  
0.300 BSC  
0.060  
1.02  
2.54 BSC  
0.18  
2.80  
7.62 BSC  
1.52  
N
M
E
0.012  
0.140  
0.30  
3.55  
G
J 24 PL  
F
M
M
0.25 (0.010)  
T B  
D 24 PL  
0.25 (0.010)  
0
15  
0.040  
0
0.51  
15  
1.01  
0.020  
M
M
T
A
MOTOROLA  
MC145403MC145404MC145405MC145408  
7
DW SUFFIX  
SOG PACKAGE  
CASE 751D–04  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
–A–  
ANSI Y14.5M, 1982.  
20  
11  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.150  
(0.006) PER SIDE.  
10X P  
–B–  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.13  
(0.005) TOTAL IN EXCESS OF D DIMENSION  
AT MAXIMUM MATERIAL CONDITION.  
M
M
0.010 (0.25)  
B
1
10  
MILLIMETERS  
INCHES  
20X D  
DIM  
A
B
C
D
MIN  
12.65  
7.40  
2.35  
0.35  
0.50  
MAX  
12.95  
7.60  
2.65  
0.49  
0.90  
MIN  
MAX  
0.510  
0.299  
0.104  
0.019  
0.035  
J
0.499  
0.292  
0.093  
0.014  
0.020  
M
S
S
0.010 (0.25)  
T
A
B
F
F
G
J
K
M
P
R
1.27 BSC  
0.050 BSC  
0.25  
0.10  
0
0.32  
0.25  
7
0.010  
0.004  
0
0.012  
0.009  
7
R X 45  
10.05  
0.25  
10.55  
0.75  
0.395  
0.010  
0.415  
0.029  
C
SEATING  
PLANE  
–T–  
M
18X G  
K
DW SUFFIX  
SOG PACKAGE  
CASE 751E–04  
–A–  
NOTES:  
24  
13  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
–B– 12X P  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
M
0.010 (0.25)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
1
12  
24X D  
J
MILLIMETERS  
INCHES  
M
S
S
0.010 (0.25)  
T
A
B
DIM  
A
B
C
D
MIN  
15.25  
7.40  
2.35  
0.35  
0.41  
MAX  
15.54  
7.60  
2.65  
0.49  
0.90  
MIN  
MAX  
0.612  
0.299  
0.104  
0.019  
0.035  
0.601  
0.292  
0.093  
0.014  
0.016  
F
R X 45  
F
G
J
K
M
P
R
1.27 BSC  
0.050 BSC  
0.23  
0.13  
0
0.32  
0.29  
8
0.009  
0.005  
0
0.013  
0.011  
8
C
K
–T–  
SEATING  
M
10.05  
0.25  
10.55  
0.75  
0.395  
0.010  
0.415  
0.029  
PLANE  
22X G  
MC145403MC145404MC145405MC145408  
MOTOROLA  
8
SD SUFFIX  
SSOP  
CASE 940B–03  
16X K REF  
0.12 (0.005)  
NOTES:  
M
S
S
T
U
V
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
0.25 (0.010)  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF K DIMENSION AT MAXIMUM  
MATERIAL CONDITION. DAMBAR INTRUSION  
SHALL NOT REDUCE DIMENSION K BY MORE  
THAN 0.07 (0.002) AT LEAST MATERIAL  
CONDITION.  
N
N
16  
9
8
L/2  
M
B
L
F
PIN 1  
IDENT  
1
DETAIL E  
–U–  
A
–V–  
K
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
J
J1  
M
S
0.20 (0.008)  
T
U
K1  
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
MIN  
6.07  
5.20  
1.73  
0.05  
0.63  
MAX  
6.33  
5.38  
1.99  
0.21  
0.95  
MIN  
MAX  
0.249  
0.212  
0.078  
0.008  
0.037  
SECTION N–N  
0.238  
0.205  
0.068  
0.002  
0.024  
–W–  
F
C
0.076 (0.003)  
SEATING  
PLANE  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.73  
0.09  
0.09  
0.25  
0.25  
7.65  
0
0.90  
0.20  
0.16  
0.38  
0.33  
7.90  
8
0.028  
0.003  
0.003  
0.010  
0.010  
0.301  
0
0.035  
0.008  
0.006  
0.015  
0.013  
0.311  
8
–T–  
D
G
DETAIL E  
H
M
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
Mfax is a trademark of Motorola, Inc.  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;  
P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447  
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,  
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315  
Mfax : RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609  
INTERNET: http://Design–NET.com  
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,  
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298  
MC145403/D  

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