MC145583VF [MOTOROLA]
3.3 Volt Only Driver/Receiver with an Integrated Standby Mode; 3.3伏，只有驱动器/接收器，集成待机模式
| 型号： | MC145583VF |
| 厂家： | 
MOTOROLA |
| 描述： | 3.3 Volt Only Driver/Receiver with an Integrated Standby Mode |
| 文件： | 总8页 (文件大小：191K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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by MC145583/D
SEMICONDUCTOR TECHNICAL DATA
Product Preview
DW SUFFIX
SOG PACKAGE
CASE 751F
28
1
VF SUFFIX
SSOP
CASE 940J
EIA–232–E and CCITT V.28
28
1
The MC145583 is a CMOS transceiver composed of three drivers and five
receivers that fulfills the electrical specifications of EIA–232–E, EIA–562, and
CCITT V.28 while operating from a single + 3.3 or + 5.0 V power supply. This
transceiver is a high–performance, low–power consumption device that is
equipped with a standby function.
ORDERING INFORMATION
MC145583DW
MC145583VF
SOG Package
SSOP
A voltage tripler and inverter converts the + 3.3 V to ± 8.8 V, or a voltage
doubler and inverter converts the + 5.0 V to ± 8.8 V. This is accomplished
through an on–chip 40 kHz oscillator and five inexpensive external capacitors.
PIN ASSIGNMENT
Drivers:
•
•
•
•
± 5 V Minimum Output Swing at 3.3 or 5.0 V Power Supply
300 Ω Power–Off Impedance
Output Current Limiting
C5+
1
2
28
27
26
C2+
GND
C5–
V
CC
Three–State Outputs During Standby Mode
3
4
C2–
C1+
C1–
Receivers:
•
•
•
•
± 25 V Input Range
3 to 7 kΩ Input Impedance
0.8 V Hysteresis for Enhanced Noise Immunity
Three–State Outputs During Standby Mode
RING
MONITOR
CIRCUIT
RIMON
25
24
5
V
(INVERTING)
SS
Ring Monitor Circuit:
6
23
22
STB
Rx1
Rx2
Rx3
Tx1
Rx4
Tx2
Rx5
Tx3
V
DD
•
Invert the Input Level on Rx1 to Logic Output Level on RIMON at Standby
Mode
7
DO1
DO2
DO3
DI1
8
21
20
19
18
17
16
15
9
10
11
12
13
14
DO4
DI2
DO5
DI3
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
REV 3
1/96
Motorola, Inc. 1996
FUNCTION DIAGRAM
CHARGE PUMPS
OSC
V
GND
CC
VOLTAGE
TRIPLER
VOLTAGE
INVERTER
+
C4
C3
+
C1
C2
C5
+
V
V
SS
DD
C5+
C5–
C1–
C1+
C2–
+
C2+
**
RECEIVER
V
DD
*
V
STB
CC
15 kΩ
+
–
DO
5.4 kΩ
1.0 V
TURN OFF
1.8 V
*Protection Circuit.
**Capacitors C1 and C2 are replaced by a 1 µF capacitor at
= 5.0 V supply.
TURN ON
V
CC
DRIVER
V
DD
STB
V
CC
300
Ω
LEVEL
SHIFTER
+
–
DI
Tx
1.4 V
V
SS
MC145583
MOTOROLA
2
MAXIMUM RATINGS (Voltage polarities referenced to GND)
This device contains protection circuitry to
guard against damage due to high static
voltages or electric fields. However, precau-
tions must be taken to avoid applications of
any voltage higher than maximum rated volt-
agestothishigh–impedancecircuit.Forproper
operation, it is recommended that the voltage
at the DI and DO pins be constrained to the
Rating
DC Supply Voltage
Symbol
Value
Unit
V
V
CC
– 0.5 to + 6.0
Input Voltage
Rx1 – Rx5 Inputs
DI1 – DI3 Inputs
V
IR
V
– 15 to V
+ 15
+ 0.5
V
SS
– 0.5 to V
DD
CC
DC Current per Pin
Power Dissipation
I
± 100
mA
W
P
D
1
range GND ≤ V ≤ V
and GND ≤ V
DI
CC
DO
≤ V . Also, the voltage at the Rx pin should
Operating Temperature Range
Storage Temperature Range
T
A
– 40 to + 85
°C
°C
CC
be constrained to (V
– 15 V) ≤ V
Rx1 – Rx5
SS
+ 15 V), and Tx should be constrained
T
stg
– 85 to + 150
≤ (V
DD
SS
to V
≤ V
≤ V .
Tx1 – Tx3
DD
Unused inputs must always be tied to an
appropriate logic voltage level (e.g., GND or
V
CC
for DI, and GND for Rx).
RECOMMENDED OPERATING LIMITS
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply
V
3.0
4.5
3.3
5.0
3.6
5.5
V
CC
V
CC
*
Operating Temperature Range
T
A
– 40
—
85
°C
* Capacitors C1 and C2 are replaced by a 1 µF capacitor at V
CC
= 5 V.
DC ELECTRICAL CHARACTERISTICS (Voltage polarities referenced to GND = 0 V; C1 – C5 = 1 µF; T = 25°C)
A
Parameter
Symbol
Min
3.0
—
Typ
3.3
2.8
< 5
Max
3.6
6.0
10
Unit
V
DC Power Supply
V
CC
Quiescent Supply Current (Output Unloaded, Input Low)
Quiescent Supply Current (Standby Mode; STB = 1, Output Unloaded)
Control Signal Input Voltage (STB)
I
mA
µA
V
CC
I
—
CC(STB)
V
—
—
—
0.5
—
IL
V
IH
V
– 0.5
CC
Control Signal Input Current (STB)
I
—
—
—
—
10
10
µA
IL
I
IH
Charge Pumps Output Voltage (V
CC
= 3 V; C1, C2, C3, C4, C5 = 1 µF)
V
DD
V
Output Voltage (V
)
I
I
= 0 mA
= 6 mA
8.5
7.5
8.8
7.9
—
—
DD
load
load
Output Voltage (V
)
I
I
= 0 mA
= 6 mA
V
SS
—
—
– 8.8
– 7.8
– 8.5
– 7.0
SS
load
load
RECEIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; V
= + 3.3 V ± 10%; C1 – C5 = 1 µF; T = 25°C)
CC
A
Parameter
Symbol
Min
Typ
Max
Unit
Input Turn–On Threshold (V
Input Turn–Off Threshold (V
Input Resistance
= V ; Rx1 – Rx5)
OL
3.3 V
5.0 V
V
1.35
2.00
1.8
2.5
2.35
3.10
V
DO1 – DO5
on
= V ; Rx1 – Rx5)
OH
3.3 V
5.0 V
V
off
0.75
1.20
1.0
1.5
1.25
1.80
V
DO1 – DO5
R
3
5.4
7
kΩ
in
High–Level Output Voltage (DO1 – DO5)
= – 3 to – 25 V
I
= – 20 µA
V
V
V
– 0.1
– 0.6
—
2.7
—
—
V
out
OH
CC
CC
V
I
= – 1 mA
Rx1 – Rx5
Low–Level Output Voltage (DO1 – DO5)
= + 3 to + 25 V
out
I
= + 20 µA
= + 1.6 mA
V
—
—
0.01
0.5
0.1
0.7
V
out
OL
V
I
I
Rx1 – Rx5
out
Ring Monitor Circuit (Input Threshold)
High–Level Output Voltage (RIMON)
V
—
1.1
—
V
V
TH
I
= – 20 µA
V
OH
V
CC
V
CC
– 0.1
– 0.6
—
2.7
—
—
out
I
= – 1 mA
out
Low–Level Output Voltage (RIMON)
I
= + 20 µA
= + 1.6 mA
V
—
—
0.01
0.5
0.1
0.7
V
out
OL
out
MOTOROLA
MC145583
3
DRIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; V
= + 3.3 V or + 5.0 V ± 10%; C1 – C5 = 1 µF; T = 25°C)
A
CC
Parameter
Symbol
Min
Typ
Max
Unit
Digital Input Voltage
Logic Low
Logic High
DI1 – DI3
DI1 – DI3
V
V
—
1.8
—
—
0.7
—
IL
V
IH
Digital Input Current
µA
V
V
DI
V
DI
= GND
I
—
—
7
—
—
± 1.0
IL
= V
I
IH
CC
Output High Voltage
Load on All Tx1 – Tx3, R = 3 kΩ; C = 2500 pF, V
No Load
V
OH
= Logic Low
= Logic High
5.0
8.5
7.0
8.8
—
—
L
P
DI1 – DI3
Output Low Voltage
Load on All Tx1 – Tx3, R = 3 kΩ; C = 2500 pF, V
No Load
V
V
OL
RF
—
—
– 7.0
– 8.8
– 5.0
– 8.5
L
P
DI1 – DI3
Ripple (Refer to V
– V
Value) ***
V
—
—
—
± 5%
DD
SS
Off Source Impedance
Tx1 – Tx3
Z
off
300
—
Ω
Output Short Circuit Current (V
Tx1 – Tx3 Shorted to GND*
Tx1 – Tx3 Shorted to ± 15 V**
= 3.3 V or 5.5 V)
I
mA
CC
SC
—
—
—
—
± 60
± 100
*Specification is for one Tx output to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation
limits could be exceeded.
**This condition could exceed package limitations.
***Ripple V
would not exceed ± 5% of (V
– V ).
RF
DD
SS
SWITCHING CHARACTERISTICS (V
CC
= + 3.3 V or + 5 V, ± 10%; C1 – C5 = 1 µF; T = 25°C)
A
Parameter
Symbol
Min
Typ
Max
Unit
Drivers
Propagation Delay Time
Low–to–High
Tx1 – Tx3
Tx1 – Tx3
t
µs
DPLH
(R = 3 kΩ, C = 50 pF or 2500 pF)
—
0.5
1
L
L
High–to–Low
t
DPHL
SR
(R = 3 kΩ, C = 50 pF or 2500 pF)
—
0.5
—
1
L
L
Output Slew Rate (Source R = 300 Ω)
± 4
± 30
V/µs
Loading: R = 3 – 7 kΩ; C = 2500 pF
L
L
Output Disable Time*
t
t
—
—
4
10
50
µs
DAZ
Output Enable Time*
25
ms
DZA
Receivers
Propagation Delay Time
Low–to–High
DO1 – DO5
µs
t
t
—
—
—
—
—
—
—
—
1
1
RPLH
High–to–Low
RPHL
Output Rise Time
Output Fall Time
DO1 – DO5
DO1 – DO5
t
r
120
40
4
200
100
10
50
ns
ns
t
f
Output Disable Time*
Output Enable Time*
t
t
µs
ms
RAZ
RZA
25
* Including the charge pump setup time.
TRUTH TABLES
Drivers
Receivers
DI
X
STB
H
Tx
Rx
X
STB
H
DO
Z*
L
Z*
H
L
L
L
H
H
L
L
L
L
H
* V
SS
≤ V ≤ V
Tx DD
X = Don’t Care
* GND ≤ V
DO
≤ V
X = Don’t Care
CC
MC145583
4
MOTOROLA
driver and receiver output pins become high–impedance
PIN DESCRIPTIONS
state. In this condition, supply current I
is below 5 µA (typ).
CC
V
CC
Digital Power Supply (Pin 27)
C5+, C5–, C2+, C2–, C1+, C1–
This digital supply pin is connected to the logic power sup-
ply. This pin should have a not less than 0.33 µF capacitor
GND.
Voltage Tripler and Inverter (Pins 1, 3, 28, 26, 25, 24)
These are the connections to the internal voltage tripler
and inverter, which generate the V
and V voltages.
DD
SS
GND
Ground (Pin 2)
Rx1, Rx2, Rx3, Rx4, Rx5
Receive Data Inputs (Pins 7, 8, 9, 11, 13)
Ground return pin is typically connected to the signal
ground pin of the EIA–232–E connector (Pin 7) as well as to
the logic power supply ground.
These are the EIA–232–E receive signal inputs. A voltage
between + 3 and + 25 V is decoded as a space, and causes
the corresponding DO pin to swing to GND (0 V). A voltage
between – 3 and – 25 V is decoded as a mark, and causes
V
DD
Positive Power Supply (Pin 23)
the DO pin to swing up to V
.
CC
This is the positive output of the on–chip voltage tripler and
the positive power supply input of the driver/receiver sections
of the device. This pin requires an external storage capacitor
to filter the 50% duty cycle voltage generated by the charge
pump.
DO1, DO2, DO3, DO4, DO5
Data Outputs (Pins 22, 21, 20, 18, 16)
These are the receiver digital output pins, which swing
from V
to GND. Output level of these pins is high imped-
CC
V
ance while in standby mode.
SS
Negative Power Supply (Pin 5)
This is the negative output of the on–chip voltage tripler/in-
verter and the negative power supply input of the driver/ re-
ceiver sections of the device. This pin requires an external
storage capacitor to filter the 50% duty cycle voltage gener-
ated by the charge pump.
DI1, DI2, DI3
Data Inputs (Pins 19, 17, 15)
These are the high impedance digital input pins to the
drivers. Input voltage levels on these pins must be between
V
and GND.
CC
RIMON
Tx1, Tx2, Tx3
Ring Monitor Circuit (Pin 4)
Transmit Data Output (Pins 10, 12, 14)
The Ring Monitor Circuit will convert the input level on Rx1
pin at standby mode and output on the RIMON pin.
These are the EIA–232–E transmit signal output pins,
which swing toward V
and V . A logic 1 at a DI input
DD
causes the corresponding Tx output to swing toward V
SS
STB
.
SS
The actual levels and slew rate achieved will depend on the
output loading (R /C ).
Standby Mode (Pin 6)
The device enters the standby mode while this pin is con-
nected to the logic high level. During the standby mode,
L
L
The minimum output impedance is 300 Ω when turned off.
SWITCHING CHARACTERISTICS
DRIVER
DI1 – DI3
DRIVER
+ 3.3 V
0 V
+ 3 V
0 V
STB (INPUT)
+ 1.5 V
+ 1.5 V
50%
(INPUT)
t
t
V
f
r
OH
+ 5 V
– 5 V
+ 5 V
– 5 V
V
Tx1 – Tx3
(OUTPUT)
HIGH Z
OH
Tx1 – Tx3
(OUTPUT)
90%
10%
V
OL
V
OL
t
DAZ
t
DZA
t
t
DPLH
DPHL
RECEIVER
RECEIVER
+ 3 V
0 V
+ 3.3 V
0 V
Rx1 – Rx5
(INPUT)
STB (INPUT)
+ 1.5 V
+ 1.5 V
50%
t
t
RPLH
RPHL
90%
10%
V
OH
90%
10%
V
90%
10%
OH
DO1 – DO5
(OUTPUT)
HIGH Z
DO1 – DO5
(OUTPUT)
V
V
OL
OL
t
t
t
RAZ
t
RZA
f
r
MOTOROLA
MC145583
5
ESD PROTECTION
will usually occur through the internal ESD protection diodes
which are designed to do just that. The key to protecting the
IC is to shunt as much of the energy to ground as possible
before it enters the IC. Figure 1 shows a technique which will
clamp the ESD voltage at approximately ± 15 V using the
MMBZ15VDLT1. Any residual voltage which appears on the
supply pins is shunted to ground through the capacitors C1
and C2.
ESD protection on IC devices that have their pins acces-
sible to the outside world is essential. High static voltages
applied to the pins when someone touches them either
directly or indirectly can cause damage to gate oxides and
transistor junctions by coupling a portion of the energy from
the I/O pin to the power supply buses of the IC. This coupling
C5+
C2+
GND
C5–
V
CC
0.1
0.1
µ
F
F
C2–
MMBZ15VDLT1 x 8
C1
C2
RIMON
C1+
C1–
V
µ
SS
V
STB
Rx1
DD
DO1
Rx2
Rx3
Tx1
Rx4
Tx2
Rx5
Tx3
DO2
DO3
DI1
DO4
DI2
DO5
DI3
Figure 1. ESD Protection Scheme
MC145583
6
MOTOROLA
PACKAGE DIMENSIONS
DW SUFFIX
SOG PACKAGE
CASE 751F–04
-A-
NOTES:
28
1
15
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
14X P
M
M
-B-
0.010 (0.25)
B
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
14
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
28X D
M
M
S
S
0.010 (0.25)
T
A
B
R X 45°
MILLIMETERS
INCHES
C
DIM
A
B
C
D
F
G
J
K
M
P
MIN
17.80
7.40
2.35
0.35
0.41
1.27 BSC
0.23
0.13
MAX
18.05
7.60
2.65
0.49
0.90
MIN
MAX
0.711
0.299
0.104
0.019
0.035
-T-
0.701
0.292
0.093
0.014
0.016
0.050 BSC
0.009
0.005
-T-
SEATING
PLANE
26X G
K
F
0.32
0.29
0.013
0.011
8°
0.415
0.029
J
0°
8°
0°
10.05
0.25
10.55
0.75
0.395
0.010
R
VF SUFFIX
SSOP
CASE 940J–01
28
15
B
–R–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROSTRUSION. MOLD PROTRUSION IS
0.15 (0.006) MAX PER SIDE.
1
14
MILLIMETERS
INCHES
A
DIM
A
B
C
D
E
MIN
10.10
5.20
–––
MAX
10.20
5.30
2.00
0.40
1.85
0.75
MIN
MAX
0.402
0.209
0.079
0.016
0.073
0.030
0.398
0.205
–––
–P–
L
M
S
0.25 (0.010)
T
R
0.20
1.75
0.45
0.008
0.069
0.018
F
G
H
J
K
L
0.65 BSC
0.0256 BSC
0.00
0.10
0.15
0.20
0.000
0.004
0.006
0.008
–T–
0.325 BSC
0.0128 BSC
7.50
1
7.90
7
0.295
1
0.311
7
M
J
K
D
G
M
S
0.12 (0.005)
T P
0.10 (0.004)
T
C
E
SEATING
PLANE
–T–
H
F
M
MOTOROLA
MC145583
7
Motorolareserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representationorguaranteeregarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
andspecifically disclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
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MC145583/D
◊
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