MC1658PD [MOTOROLA]
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MOTOROLA 
SEMICONDUCTOR TECHNICAL DATA
The MC1658 is a voltage–controlled multivibrator which provides
appropriate level shifting to produce an output compatible with MECL III
and MECL 10,000 logic levels. Frequency control is accomplished
through the use of voltage–variable current sources which control the
slew rate of a single external capacitor.
VOLTAGE
CONTROLLED
MULTIVIBRATOR
The bias filter may be used to help eliminate ripple on the output
voltage levels at high frequencies and the input filter may be used to
decouple noise from the analog input signal.
Pinout: 16–Lead Package (Top View)
NC
16
NC
15
CX2
14
INF
13
BIAS CX1
NC
10
NC
9
L SUFFIX
16–LEAD CERAMIC PACKAGE
CASE 620–10
12
11
Not Recommended for New Designs
1
2
3
4
5
6
7
8
V
V
NC
Q
V
Q
NC
V
EE
CC1
CX
CC2
P SUFFIX
16–LEAD PLASTIC PACKAGE
CASE 648–08
LOGIC DIAGRAM
CX1 11
CX2 14
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
V
CX
2
6
4
Q
Q
Bias Filter
Input Filter
FN SUFFIX
20–LEAD PLCC PACKAGE
CASE 775–02
V
V
V
= Pin 1
= Pin 5
= Pin 8
CC1
CC2
EE
Pin Conversion Table
16 PIN DIP
1
2
2
3
3
4
4
5
5
7
6
8
7
9
8
9
10 11 12 13 14 15 16
20 PIN PLCC
10 12 13 14 15 17 18 19 20
1/97
REV 1
Motorola, Inc. 1997
MC1658
V
V
CC2
5
CC1
1
100
100
Q 4
6 Q
1k
1000
V
2
CX
12 Bias Filter
14 CX2
1k
CX1 11
80
80
1k
1k
250
Input Filter 13
125
125
500
500
62
500
250
8
V
EE
Figure 1. Circuit Schematic
TEST VOLTAGE VALUES
Vdc ±1%
@ Test
Temperature
V
IH
V
IL
V
3
I
IHA
–30°C
+25°C
+85°C
0
–2.0
–2.0
–2.0
–1.0
–1.0
–1.0
+2.0
+2.0
+2.0
0
0
Note: SOIC “D” package guaranteed –30°C to +70°C only
MOTOROLA
2
HIPERCOMM
BR1334 — Rev 4
MC1658
ELECTRICAL CHARACTERISTICS (V
= –5.2V, V
= 0V [GND] )
CC
EE
–30°C
+25°C
+85°C
Symbol
Characteristic
Min
Max
Min
Max
Min
Max
Unit
Condition
I
E
Power Supply Drain Current
–
–
–
32
–
–
mAdc
V
to V
Limit Applies for
IH
1 or 2
CX
1
I
Input Current
–
–
–
350
–
–
µAdc
Vdc
V
to V
inH
IH
CX
V
Output Voltage “Q” HIGH
Output Voltage “Q” LOW
–1.045 –0.875 –0.96
–0.81
–1.62
–0.89
–1.83
–0.7
V
3
to V . Limits Apply for 1
CX
OH
OL
or 2
V
–1.89
–1.65
–1.85
–1.575
Vdc
AC CHARACTERISTICS (V
= –3.2V, V
= +2.0V )
CC
EE
–30°C
Min
+25°C
+85°C
Min
Condition
Symbol
Characteristic
Max
2.7
2.7
–
Min
–
Typ
1.6
Max
2.7
Max
3.0
3.0
–
Unit
ns
(See Figure 2)
+
t
4
Rise Time (10% to 90%)
Fall Time (10% to 90%)
Oscillator Frequency
–
–
–
–
V
to V , CX1 from Pin
11 to Pin 14
IHA
CX
–
t
f
f
–
1.4
2.7
ns
130
–
130
78
155
100
175
120
110
–
MHz
osc1
osc2
5
–
–
V
to V , CX2 from
CX
IHA
Pin 11 to Pin 14
3
TR
5
Tuning Ratio Test
–
–
3.1
4.5
–
–
–
–
CX2 from Pin 11 to Pin 14
1 Germanium diode (0.4 drop) forward biased from 11 to 14 (11
2 Germanium diode (0.4 drop) forward biased from 14 to 11 (11
14).
14).
Output frequency at V
Output frequency at V
GND
2.0V
CX
3 TR =
CX
4 CX1 = 5.0pF connected from pin 11 to pin 14.
5 CX2 = 10pF connected from pin 11 to pin 14.
V
CC
+2.0Vdc
V
1
5
V
CC2
0.1µF
CC1
90%
0.01µF
12
Q
50%
50%
10%
Bias Filter
Input Filter
6
Coax
Channel “A”
Input 2
–
+
t
Q
t
0.001µF
13
2
90%
10%
50%
50%
Q
Coaxial Cables
(Equal lengths, 50
To Scope
Ω)
V
CX
–
+
t
t
11
14
0.1µF
CX
CX
4
Coax
Channel “B”
Input 2
50 ohm termination to ground located in each scope channel input.
All input and output cables to the scope are equal lengths of 50 ohm
coaxial cable. Wire length should be < 1/4 inch from TP to input pin
C
Q
X
in
and TP
to output pin.
out
Note: All power supply and logic levels are shown shifted 2.0V positive.
8
0.1µF
–3.2Vdc
V
EE
Figure 2. AC Test Circuit and Waveforms
HIPERCOMM
BR1334 — Rev 4
3
MOTOROLA
MC1658
1000
10,000
1000
100
150 MHz @ 5 pF
V
V
= +5.2 Vdc
= 0 Vdc
CC
EE
75 MHz @ 5 pF
100
10
1
35 MHz @ 5 pF
V
= 0 Vdc
CX
V
= –1 Vdc
CX
DC CONTROL INPUT = 4 Vdc
10
V
= –2 Vdc
CX
0.1
10
1
10
100
(pF)
1000
10,000
0.1
1
100
c
f, OPERATING FREQUENCY (MHz)
x
Figure 3. Output Frequency versus Capacitance
for Various Values of Input Voltage
Figure 4. RMS Noise Deviation versus
Operating Frequency
1600
c
c
(pF) = FREQUENCY–CAPACITANCE PRODUCT AT
1500
1400
1300
1200
1100
1000
x
x
(pF) = DESIRED V
DESIRED FREQUENCY (MHz)
CX
900
800
700
600
500
400
300
200
–2
–1.8 –1.6 –1.4 –1.2 –1
–0.8 –0.6 –0.4 –0.2
0
V
, INPUT VOLTAGE (Vdc)
CX
V
= –5.2V, V
= 0V.
EE
= 0V, V
CC
= +5V (V
For Use at V
= +5V – V
)
CX
EE
CXP
CC
CXP
V
= Positive Input Voltage
Figure 5. Frequency Capacitance Product versus Control Voltage (V
)
CX
MOTOROLA
4
HIPERCOMM
BR1334 — Rev 4
MC1658
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
ISSUE V
NOTES:
-A-
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
-B-
L
C
INCHES
MILLIMETERS
DIM
A
B
C
D
E
F
G
J
K
L
M
N
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
—
0.39
1.27 BSC
1.40
2.54 BSC
0.21
3.18
MAX
19.93
7.49
5.08
0.50
0.750
0.240
—
0.015
0.050 BSC
0.055
0.100 BSC
0.008
0.125
-T-
SEATING
PLANE
N
K
0.065
1.65
0.015
0.170
0.38
4.31
E
M
0.300 BSC
15
0.040
7.62 BSC
15
1.01
0.51
J 16 PL
F
G
°
°
0
°
0°
M
0.020
S
B
D 16 PL
0.25 (0.010)
0.25 (0.010)
T
M
S
T
A
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
NOTES:
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
16
1
9
8
B
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
MIN
MAX
0.770
0.270
0.175
0.021
0.070
MIN
18.80
6.35
3.69
0.39
1.02
2.54 BSC
1.27 BSC
0.21
MAX
19.55
6.85
4.44
0.53
1.77
F
C
L
0.740
0.250
0.145
0.015
0.040
0.100 BSC
0.050 BSC
0.008
S
SEATING
PLANE
-T-
M
K
0.015
0.130
0.305
0.38
3.30
7.74
H
J
0.110
0.295
2.80
7.50
G
D 16 PL
0.25 (0.010)
M
S
0°
10°
0°
10°
M
M
T
A
0.020
0.040
0.51
1.01
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A
–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
9
–B
–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.25 (0.010)
B
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
MIN
9.80
3.80
1.35
0.35
0.40
MAX
10.00
4.00
1.75
0.49
MIN
MAX
0.393
0.157
0.068
0.019
0.049
0.386
0.150
0.054
0.014
0.016
0.050 BSC
0.008
0.004
F
K
R X 45°
C
1.25
1.27 BSC
–T
0.19
0.10
0.25
0.25
0.009
0.009
J
SEAT
–
ING
M
K
PLANE
D 16 PL
0.25 (0.010)
M
P
R
0
5.80
0.25
°
7
6.20
0.50
°
0
°
7°
0.244
0.019
0.229
0.010
M
S
S
T
B
A
HIPERCOMM
5
MOTOROLA
BR1334 — Rev 4
MC1658
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
S
B
0.007 (0.180)
T
L –M
N
Y BRK
-M-
-N-
D
D
M
S
U
0.007 (0.180)
T
L –M
N
-L-
Z
W
20
1
S
S
S
G1
V
0.010 (0.250)
T
L –M
N
X
VIEW D-D
A
M
M
S
S
S
S
0.007 (0.180)
0.007 (0.180)
T
T
L –M
L –M
N
N
Z
R
M
S
S
H
0.007 (0.180)
T L
–M
N
C
K1
E
K
0.004 (0.100)
SEATING
G
-T-
VIEW S
J
PLANE
M
S
S
F
0.007 (0.180)
T
L –M
N
G1
VIEW S
S
S
S
0.010 (0.250)
T
L –M
N
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE
TOP OF LEAD SHOULDER EXITS PLASTIC BODY
AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT
DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER
SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
INCHES
MILLIMETERS
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
0.385
0.385
0.165
0.090
0.013
0.050 BSC
1.27 BSC
5. CONTROLLING DIMENSION: INCH.
0.026
0.032
—
—
0.356
0.356
0.048
0.048
0.056
0.020
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
—
0.81
—
—
9.04
9.04
1.21
1.21
1.42
0.50
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
0.020
0.025
0.350
0.350
0.042
0.042
0.042
—
2°
10
°
2°
10°
0.310
0.040
0.330
—
7.88
1.02
8.38
—
MOTOROLA
6
HIPERCOMM
BR1334 — Rev 4
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