MC54HC563J [MOTOROLA]

Octal 3-State Inverting Transparent Latch; 八路三态反相透明锁存器
MC54HC563J
型号: MC54HC563J
厂家: MOTOROLA    MOTOROLA
描述:

Octal 3-State Inverting Transparent Latch
八路三态反相透明锁存器

总线驱动器 总线收发器 锁存器 逻辑集成电路 CD
文件: 总8页 (文件大小:110K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
High–Performance Silicon–Gate CMOS  
J SUFFIX  
CERAMIC PACKAGE  
CASE 732–03  
20  
20  
The MC54/74HC563 is identical in pinout to the LS563. The device inputs  
are compatible with standard CMOS outputs; with pullup resistors, they are  
compatible with LSTTL outputs.  
This device is identical in function to the HC533 but has the Data Inputs on  
the opposite side of the package from the outputs to facilitate PC board  
layout.  
These latches appear transparent to data (i.e., the outputs change  
asynchronously) when Latch Enable is high. The data appears at the outputs  
in inverted form. When Latch Enable goes low, data meeting the setup and  
hold time becomes latched.  
The Output Enable input does not affect the state of the latches, but when  
Output Enable is high, all device outputs are forced to the high–impedance  
state. Thus, data may be latched even when the outputs are not enabled.  
The HC573 is the noninverting version of this function.  
1
N SUFFIX  
PLASTIC PACKAGE  
CASE 738–03  
1
DW SUFFIX  
SOIC PACKAGE  
CASE 751D–04  
20  
1
ORDERING INFORMATION  
MC54HCXXXJ  
MC74HCXXXN  
MC74HCXXXDW SOIC  
Ceramic  
Plastic  
Output Drive Capability: 15 LSTTL Loads  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 2 to 6 V  
Low Input Current: 1 µA  
High Noise Immunity Characteristic of CMOS Devices  
In Compliance with the Requirements Defined by JEDEC Standard  
No. 7A  
PIN ASSIGNMENT  
OUTPUT  
ENABLE  
1
20  
V
CC  
Chip Complexity: 202 FETs or 50.5 Equivalent Gates  
D0  
2
3
4
19  
18  
17  
Q0  
Q1  
Q2  
D1  
D2  
LOGIC DIAGRAM  
D3  
D4  
5
16  
15  
14  
13  
12  
11  
Q3  
Q4  
Q5  
Q6  
Q7  
19  
2
3
4
5
6
7
8
9
6
D0  
D1  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
18  
17  
16  
15  
14  
13  
12  
D5  
7
D6  
8
D2  
DATA  
INPUTS  
D3  
INVERTING  
OUTPUTS  
D7  
9
LATCH  
ENABLE  
D4  
GND  
10  
D5  
D6  
D7  
FUNCTION TABLE  
LATCH  
ENABLE  
11  
1
Inputs  
Output  
PIN 20 = V  
CC  
PIN 10 = GND  
OUTPUT  
ENABLE  
Output Latch  
Enable Enable  
D
Q
L
L
L
H
H
L
H
L
X
X
L
H
No Change  
Z
H
X
X = don’t care  
Z = high impedance  
10/95  
REV 6  
Motorola, Inc. 1995  
MC54/74HC563  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
Unit  
V
This device contains protection  
circuitry to guard against damage  
due to high static voltages or electric  
fields. However, precautions must  
be taken to avoid applications of any  
voltage higher than maximum rated  
voltages to this high–impedance cir-  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
– 0.5 to + 7.0  
CC  
V
– 1.5 to V  
+ 1.5  
V
in  
CC  
V
out  
– 0.5 to V  
+ 0.5  
V
CC  
I
± 20  
mA  
mA  
mA  
mW  
in  
cuit. For proper operation, V and  
in  
I
I
DC Output Current, per Pin  
± 35  
± 75  
out  
V
should be constrained to the  
out  
range GND (V or V  
)
V
CC  
.
DC Supply Current, V  
CC  
and GND Pins  
in out  
CC  
Unused inputs must always be  
tied to an appropriate logic voltage  
P
D
Power Dissipation in Still Air, Plastic or Ceramic DIP†  
SOIC Package†  
750  
500  
level (e.g., either GND or V ).  
CC  
Unused outputs must be left open.  
T
stg  
Storage Temperature  
– 65 to + 150  
C
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds  
(Plastic DIP or SOIC Package)  
(Ceramic DIP)  
260  
300  
* Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
†Derating — Plastic DIP: – 10 mW/ C from 65 to 125 C  
Ceramic DIP: – 10 mW/ C from 100 to 125 C  
SOIC Package: – 7 mW/ C from 65 to 125 C  
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
0
Max  
Unit  
V
V
CC  
DC Supply Voltage (Referenced to GND)  
DC Input Voltage, Output Voltage (Referenced to GND)  
Operating Temperature, All Package Types  
6.0  
V , V  
in out  
V
CC  
V
T
A
– 55 + 125  
C
t , t  
r f  
Input Rise and Fall Time  
(Figure 1)  
V
CC  
V
CC  
V
CC  
= 2.0 V  
= 4.5 V  
= 6.0 V  
0
0
0
1000  
500  
400  
ns  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Test Conditions  
Unit  
85 C  
125 C  
V
IH  
Minimum High–Level Input  
Voltage  
V
= 0.1 V or V  
– 0.1 V  
2.0  
4.5  
6.0  
1.5  
3.15  
4.2  
1.5  
3.15  
4.2  
1.5  
3.15  
4.2  
V
out  
CC  
|I  
|
20 µA  
out  
V
Maximum Low–Level Input  
Voltage  
V
= 0.1 V or V  
– 0.1 V  
2.0  
4.5  
6.0  
0.3  
0.9  
1.2  
0.3  
0.9  
1.2  
0.3  
0.9  
1.2  
V
V
IL  
out  
CC  
|I  
|
20 µA  
out  
V
OH  
Minimum High–Level Output  
Voltage  
V
= V or V  
IH IL  
2.0  
4.5  
6.0  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
in  
|I  
|
20 µA  
out  
V
in  
= V or V  
|I  
|I  
|
|
6.0 mA  
7.8 mA  
4.5  
6.0  
3.98  
5.48  
3.84  
5.34  
3.70  
5.20  
IH IL out  
out  
V
OL  
Maximum Low–Level Output  
Voltage  
V
= V or V  
IH IL  
2.0  
4.5  
6.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
in  
|I  
|
20 µA  
out  
V
= V or V  
|I  
|I  
|
|
6.0 mA  
7.8 mA  
4.5  
6.0  
0.26  
0.26  
0.33  
0.33  
0.40  
0.40  
in  
in  
IH IL out  
out  
I
in  
Maximum Input Leakage Current  
V
= V  
CC  
or GND  
6.0  
± 0.1  
± 1.0  
± 1.0  
µA  
MOTOROLA  
2
MC54/74HC563  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Test Conditions  
85 C  
125 C  
Unit  
I
Maximum Three–State Leakage Output in High–Impedance State  
6.0  
± 0.5  
± 5.0  
± 10  
µA  
OZ  
Current  
V
V
= V or V  
IL IH  
= V or GND  
in  
out  
CC  
I
Maximum Quiescent Supply  
Current (per Package)  
V
= V  
CC  
= 0 µA  
or GND  
6.0  
8
80  
160  
µA  
CC  
in  
I
out  
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, Input t = t = 6 ns)  
L
r
f
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Unit  
85 C  
125 C  
t
t
t
,
Maximum Propagation Delay, Input D to Q  
(Figures 1 and 5)  
2.0  
4.5  
6.0  
175  
35  
30  
220  
44  
37  
265  
53  
45  
ns  
PLH  
t
PHL  
,
Maximum Propagation Delay, Latch Enable to Q  
(Figures 2 and 5)  
2.0  
4.5  
6.0  
175  
35  
30  
220  
44  
37  
265  
53  
45  
ns  
ns  
ns  
ns  
PLH  
t
PHL  
,
Maximum Propagation Delay, Output Enable to Q  
(Figures 3 and 6)  
2.0  
4.5  
6.0  
150  
30  
26  
190  
38  
33  
225  
45  
38  
PLZ  
t
PHZ  
t
t
,
Maximum Propagation Delay, Output Enable to Q  
(Figures 3 and 6)  
2.0  
4.5  
6.0  
150  
30  
26  
190  
38  
33  
225  
45  
38  
PZL  
PZH  
t
t
,
Maximum Output Transition Time, Any Output  
(Figures 1 and 5)  
2.0  
4.5  
6.0  
60  
12  
10  
75  
15  
13  
90  
18  
15  
TLH  
THL  
C
Maximum Input Capacitance  
10  
15  
10  
15  
10  
15  
pF  
pF  
in  
C
Maximum Three–State Output Capacitance  
(Output in High–Impedance State)  
out  
NOTES:  
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
Typical @ 25°C, V  
= 5.0 V  
CC  
C
Power Dissipation Capacitance (Per Latch)*  
pF  
37  
PD  
2
* Used to determine the no–load dynamic power consumption: P = C  
D
Motorola High–Speed CMOS Data Book (DL129/D).  
V
f + I  
V
. For load considerations, see Chapter 2 of the  
PD CC  
CC CC  
3
MOTOROLA  
MC54/74HC563  
TIMING REQUIREMENTS (Input t = t = 6 ns)  
r
f
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Unit  
85 C  
125 C  
t
su  
Minimum Setup Time, Input D to Latch Enable  
(Figure 4)  
2.0  
4.5  
6.0  
75  
15  
13  
95  
19  
16  
110  
22  
19  
ns  
t
Minimum Hold Time, Latch Enable to Input D  
(Figure 4)  
2.0  
4.5  
6.0  
5
5
5
5
5
5
5
5
5
ns  
ns  
ns  
h
t
w
Minimum Pulse Width, Latch Enable  
(Figure 2)  
2.0  
4.5  
6.0  
80  
16  
14  
100  
20  
17  
120  
24  
20  
t , If  
r
Maximum Input Rise and Fall Times  
(Figure 1)  
2.0  
4.5  
6.0  
1000  
500  
400  
1000  
500  
400  
1000  
500  
400  
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
SWITCHING WAVEFORMS  
t
t
t
f
w
r
V
CC  
V
90%  
50%  
10%  
CC  
LATCH  
ENABLE  
INPUT D  
Q
50%  
GND  
GND  
t
t
PLH  
PHL  
t
t
PHL  
PLH  
90%  
50%  
10%  
Q
50%  
t
t
TLH  
THL  
50%  
Figure 1.  
Figure 2.  
V
CC  
VALID  
OUTPUT ENABLE  
GND  
V
CC  
t
t
INPUT D  
50%  
t
PZL  
PLZ  
HIGH  
IMPEDANCE  
GND  
t
su  
h
50%  
Q
Q
V
10%  
90%  
V
CC  
OL  
t
t
LATCH  
ENABLE  
PZH  
PHZ  
50%  
V
OH  
GND  
50%  
HIGH  
IMPEDANCE  
Figure 3.  
Figure 4.  
TEST CIRCUITS  
TEST POINT  
TEST POINT  
1 k  
OUTPUT  
CONNECT TO V  
CC  
WHEN  
AND t .  
PZL  
OUTPUT  
TESTING t  
PLZ  
DEVICE  
UNDER  
TEST  
DEVICE  
UNDER  
TEST  
CONNECT TO GND WHEN  
TESTING t AND t  
.
PHZ PZH  
C *  
C *  
L
L
* Includes all probe and jig capacitance  
* Includes all probe and jig capacitance  
Figure 5.  
Figure 6.  
MOTOROLA  
4
MC54/74HC563  
EXPANDED LOGIC DIAGRAM  
2
3
4
5
6
7
8
9
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D
19  
18  
17  
16  
15  
14  
13  
12  
LE  
Q
Q
Q
Q
Q
Q
Q
Q
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
D
LE  
D
LE  
D
LE  
D
LE  
D
LE  
D
LE  
D
LE  
LATCH  
ENABLE  
11  
1
OUTPUT  
ENABLE  
5
MOTOROLA  
MC54/74HC563  
OUTLINE DIMENSIONS  
J SUFFIX  
CERAMIC PACKAGE  
CASE 732–03  
ISSUE E  
NOTES:  
1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE  
POSITION AT SEATING PLANE, AT MAXIMUM  
MATERIAL CONDITION.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
20  
1
11  
10  
3. DIMENSIONS A AND B INCLUDE MENISCUS.  
B
C
MILLIMETERS  
INCHES  
A
DIM  
A
B
C
D
F
MIN  
23.88  
6.60  
3.81  
0.38  
1.40  
MAX  
25.15  
7.49  
5.08  
0.56  
1.65  
MIN  
MAX  
0.990  
0.295  
0.200  
0.022  
0.065  
0.940  
0.260  
0.150  
0.015  
0.055  
L
F
G
H
J
K
L
2.54 BSC  
0.100 BSC  
0.51  
0.20  
3.18  
1.27  
0.30  
4.06  
0.020  
0.008  
0.125  
0.050  
0.012  
0.160  
N
J
7.62 BSC  
0.300 BSC  
H
K
M
G
M
N
0
15  
0
15  
D
0.25  
1.02  
0.010  
0.040  
SEATING  
PLANE  
N SUFFIX  
PLASTIC PACKAGE  
CASE 738–03  
ISSUE E  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD  
FLASH.  
20  
1
11  
10  
B
L
C
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
MIN  
MAX  
1.070  
0.260  
0.180  
0.022  
MIN  
25.66  
6.10  
3.81  
0.39  
MAX  
27.17  
6.60  
4.57  
0.55  
1.010  
0.240  
0.150  
0.015  
–T–  
SEATING  
PLANE  
K
E
0.050 BSC  
1.27 BSC  
M
0.050  
0.070  
1.27  
1.77  
F
G
J
K
L
N
E
0.100 BSC  
2.54 BSC  
0.008  
0.110  
0.015  
0.140  
0.21  
2.80  
0.38  
3.55  
G
F
J 20 PL  
0.300 BSC  
7.62 BSC  
D 20 PL  
0.25 (0.010)  
M
M
0.25 (0.010)  
T B  
M
N
0
15  
0
15  
0.020  
0.040  
0.51  
1.01  
M
M
T
A
DW SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751D–04  
ISSUE E  
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
20  
11  
4. MAXIMUM MOLD PROTRUSION 0.150  
(0.006) PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.13  
10X P  
–B–  
M
M
0.010 (0.25)  
B
1
10  
(0.005) TOTAL IN EXCESS OF D DIMENSION  
AT MAXIMUM MATERIAL CONDITION.  
MILLIMETERS  
INCHES  
20X D  
DIM  
A
B
C
D
MIN  
12.65  
7.40  
2.35  
0.35  
0.50  
MAX  
12.95  
7.60  
2.65  
0.49  
0.90  
MIN  
MAX  
0.510  
0.299  
0.104  
0.019  
0.035  
J
0.499  
0.292  
0.093  
0.014  
0.020  
M
S
S
0.010 (0.25)  
T
A
B
F
F
G
J
K
M
P
R
1.27 BSC  
0.050 BSC  
0.25  
0.10  
0
0.32  
0.25  
7
0.010  
0.004  
0
0.012  
0.009  
7
R X 45  
10.05  
0.25  
10.55  
0.75  
0.395  
0.010  
0.415  
0.029  
C
SEATING  
PLANE  
–T–  
M
18X G  
K
MOTOROLA  
6
MC54/74HC563  
Motorolareserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representationorguaranteeregarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,  
andspecifically disclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters can and do vary in different  
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does  
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in  
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of  
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such  
unintendedor unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless  
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.  
Motorola and  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.  
How to reach us:  
USA/EUROPE: Motorola Literature Distribution;  
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki,  
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447  
6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315  
MFAX: RMFAX0@email.sps.mot.com –TOUCHTONE (602) 244–6609  
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HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,  
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298  
CODELINE  
MC54/74HC563/D  
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MOTOROLA

MC54HC564JDS

D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20
MOTOROLA

MC54HC564JS

D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20
MOTOROLA

MC54HC573A

Octal 3-State Noninverting Transparent Latch
MOTOROLA

MC54HC573AJ

Octal 3-State Inverting Transparent Latch
MOTOROLA

MC54HC574A

OCTAL 3-STARE NONINVERTING D FLIP-FLOP
MOTOROLA

MC54HC574AJ

Octal 3-State Noninverting D Flip-Flop
MOTOROLA

MC54HC574AJD

D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20
MOTOROLA

MC54HC574J

HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20
MOTOROLA

MC54HC574JD

D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20
MOTOROLA