MC74HCT174ANDS [MOTOROLA]

D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, PDIP16;
MC74HCT174ANDS
型号: MC74HCT174ANDS
厂家: MOTOROLA    MOTOROLA
描述:

D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, PDIP16

触发器 时钟
文件: 总5页 (文件大小:181K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
N SUFFIX  
PLASTIC PACKAGE  
CASE 648–08  
16  
High–Performance Silicon–Gate CMOS  
1
The MC74HCT174A is identical in pinout to the LS174. This device may  
be used as a level converter for interfacing TTL or NMOS outputs to High  
Speed CMOS inputs.  
D SUFFIX  
This device consists of six D flip–flops with common Clock and Reset  
inputs. Each flip–flop is loaded with a low–to–high transition of the Clock  
input. Reset is asynchronous and active–low.  
16  
SOIC PACKAGE  
CASE 751B–05  
1
Output Drive Capability: 10 LSTTL Loads  
TTL NMOS Compatible Input Levels  
Outputs Directly Interface to CMOS, NMOS and TTL  
Operating Voltage Range: 4.5 to 5.5 V  
Low Input Current: 1.0 µA  
ORDERING INFORMATION  
MC74HCXXXAN  
MC74HCXXXAD  
Plastic  
SOIC  
In Compliance with the Requirements Defined by JEDEC Standard  
No. 7A  
PIN ASSIGNMENT  
Chip Complexity: 178 FETs or 44.5 Equivalent Gates  
RESET  
Q0  
1
2
16  
15  
V
CC  
Q5  
LOGIC DIAGRAM  
D0  
D1  
3
4
5
6
7
8
14  
13  
12  
11  
10  
9
D5  
D4  
3
4
2
5
Q0  
D0  
D1  
D2  
D3  
D4  
D5  
Q1  
Q4  
Q1  
Q2  
Q3  
Q4  
Q5  
D2  
D3  
6
7
DATA  
INPUTS  
NONINVERTING  
OUTPUTS  
Q2  
Q3  
11  
13  
14  
10  
12  
15  
GND  
CLOCK  
FUNCTION TABLE  
9
1
CLOCK  
RESET  
Inputs  
Reset Clock  
Output  
D
Q
PIN 16 = V  
PIN 8 = GND  
CC  
L
X
X
H
L
L
H
L
H
H
H
H
L
X
X
No Change  
No Change  
Design Criteria  
Internal Gate Count*  
Value  
Units  
ea.  
ns  
44.5  
1.5  
Internal Gate Propagation Delay  
Internal Gate Power Dissipation  
Speed Power Product  
0.005  
0.0075  
µW  
pJ  
* Equivalent to a two–input NAND gate.  
10/95  
REV 6  
Motorola, Inc. 1995  
MC74HCT174A  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
Unit  
V
This device contains protection  
circuitry to guard against damage  
due to high static voltages or electric  
fields. However, precautions must  
be taken to avoid applications of any  
voltage higher than maximum rated  
voltages to this high–impedance cir-  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
– 0.5 to + 7.0  
CC  
V
– 1.5 to V  
+ 1.5  
V
in  
CC  
V
out  
– 0.5 to V  
+ 0.5  
V
CC  
I
± 20  
mA  
mA  
mA  
mW  
in  
cuit. For proper operation, V and  
in  
I
I
DC Output Current, per Pin  
± 25  
± 50  
out  
V
should be constrained to the  
out  
range GND (V or V  
)
V
CC  
.
DC Supply Current, V  
CC  
and GND Pins  
in out  
CC  
Unused inputs must always be  
tied to an appropriate logic voltage  
P
D
Power Dissipation in Still Air  
Plastic DIP†  
SOIC Package†  
750  
500  
level (e.g., either GND or V ).  
CC  
Unused outputs must be left open.  
T
stg  
Storage Temperature  
– 65 to + 150  
C
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds  
(Plastic DIP or SOIC Package)  
260  
* Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
†Derating — Plastic DIP: – 10 mW/ C from 65 to 125 C  
SOIC Package: – 7 mW/ C from 65 to 125 C  
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
4.5  
0
Max  
Unit  
V
V
CC  
DC Supply Voltage (Referenced to GND)  
5.5  
V , V  
in out  
DC Input Voltage, Output Voltage  
(Referenced to GND)  
V
CC  
V
T
Operating Temperature, All Package Types  
Input Rise and Fall Time (Figure 1)  
– 55 + 125  
500  
C
A
t , t  
r f  
0
ns  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Test Conditions  
85 C  
125 C  
Unit  
V
IH  
Minimum High–Level Input  
Voltage  
V
= 0.1 or V  
– 0.1 V  
4.5  
5.5  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
V
out  
CC  
|I  
|
20 µA  
out  
V
Maximum Low–Level Input  
Voltage  
V
= 0.1 or V  
– 0.1 V  
4.5  
5.5  
0.8  
0.8  
0.8  
0.8  
0.8  
0.8  
V
V
IL  
out  
CC  
|I  
|
20 µA  
out  
V
OH  
Minimum High–Level Output  
Voltage  
V
= V or V  
IH IL  
4.5  
5.5  
4.4  
5.4  
4.4  
5.4  
4.4  
5.4  
in  
|I  
|
20 µA  
out  
V
= V or V  
IH  
in  
IL  
IL  
IL  
|I  
|
4.0 mA  
4.5  
3.98  
3.84  
3.70  
out  
V
OL  
Maximum Low–Level Output  
Voltage  
V
= V or V  
IH  
4.5  
5.5  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
in  
|I  
|
20 µA  
out  
V
= V or V  
in  
IH  
4.0 mA  
|I  
|
4.5  
5.5  
5.5  
0.26  
± 0.1  
4.0  
0.33  
± 1.0  
40  
0.4  
± 1.0  
160  
out  
I
Maximum Input Leakage Current  
V
= V  
or GND  
or GND  
µA  
µA  
in  
in  
CC  
CC  
I
Maximum Quiescent Supply  
Current (per Package)  
V
I
= V  
= 0 µA  
CC  
in  
out  
I  
CC  
Additional Quiescent Supply  
Current  
V
V
l
= 2.4 V, Any One Input  
– 55 C  
25 C to 125 C  
in  
in  
out  
= V  
or GND, Other Inputs  
CC  
= 0 µA  
5.5  
2.9  
2.4  
mA  
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
MOTOROLA  
2
MC74HCT174A  
AC ELECTRICAL CHARACTERISTICS (V  
CC  
= 5.0 V ± 10%, C = 50 pF, Input t = t = 6.0 ns)  
L r f  
Guaranteed Limit  
– 55 to  
25 C  
Symbol  
Parameter  
Unit  
MHz  
ns  
85 C  
24  
125 C  
20  
f
Maximum Clock Frequency (50% Duty Cycle)  
30  
24  
MAX  
t
t
,
Maximum Propagation Delay, Clock to Q  
(Figures 1 and 4)  
30  
36  
PLH  
PHL  
t
Maximum Propagation Delay, Reset to Q  
(Figures 2 and 4)  
23  
15  
10  
28  
19  
10  
35  
22  
10  
ns  
ns  
pF  
PHL  
t
,
Maximum Output Transition Time, Any Output  
(Figures 1 and 4)  
TLH  
t
THL  
C
Maximum Input Capacitance  
in  
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–  
Speed CMOS Data Book (DL129/D).  
Typical @ 25°C, V  
= 5.0 V  
CC  
C
Power Dissipation Capacitance (Per Enabled Output)*  
pF  
79  
PD  
2
* Used to determine the no–load dynamic power consumption: P = C  
D
Motorola High–Speed CMOS Data Book (DL129/D).  
V
f + I  
V . For load considerations, see Chapter 2 of the  
CC CC  
PD CC  
TIMING REQUIREMENTS (V  
= 5.0 V ± 10%, C = 50 pF, Input t = t = 6.0 ns)  
CC  
L
r
f
Guaranteed Limit  
– 55 to 25 C  
85 C  
Max  
125 C  
Max  
Symbol  
Parameter  
Fig.  
3
Unit  
ns  
Min  
10  
Max  
Min  
13  
Min  
15  
t
su  
Minimum Setup Time, Data to Clock  
Minimum Hold Time, Clock to Data  
t
h
3
5.0  
5.0  
15  
6.0  
6.0  
19  
8.0  
8.0  
22  
ns  
t
Minimum Recovery Time, Reset Inactive to Clock  
Minimum Pulse Width, Clock  
2
ns  
rec  
t
t
1
ns  
w
Minimum Pulse Width, Reset  
2
15  
19  
22  
ns  
w
t , t  
r f  
Maximum Input Rise and Fall Times  
1
500  
500  
500  
ns  
3
MOTOROLA  
MC74HCT174A  
SWITCHING WAVEFORMS  
t
t
r
f
V
t
CC  
w
2.7 V  
3.0 V  
GND  
CLOCK  
1.3 V  
1.3 V  
RESET  
0.3 V  
GND  
t
w
t
PHL  
1/f  
max  
1.3 V  
t
t
PHL  
Q
PLH  
90%  
1.3 V  
10%  
t
rec  
3.0 V  
GND  
Q
CLOCK  
1.3 V  
t
t
THL  
TLH  
Figure 1.  
Figure 2.  
TEST POINT  
VALID  
OUTPUT  
3.0 V  
DEVICE  
UNDER  
TEST  
1.3 V  
DATA  
C *  
L
GND  
3.0 V  
t
t
h
su  
CLOCK  
1.3 V  
* Includes all probe and jig capacitance  
GND  
Figure 3.  
Figure 4. Test Circuit  
EXPANDED LOGIC DIAGRAM  
9
3
CLOCK  
D0  
C
2
5
Q
Q0  
Q1  
D
R
1
RESET  
C
Q
4
D1  
D
R
C
7
Q
Q2  
Q3  
Q4  
Q5  
6
D2  
D3  
D4  
D5  
D
R
C
Q
10  
12  
15  
11  
13  
14  
D
R
C
Q
D
R
C
Q
D
R
MOTOROLA  
4
MC74HCT174A  
OUTLINE DIMENSIONS  
N SUFFIX  
PLASTIC PACKAGE  
CASE 648–08  
ISSUE R  
NOTES:  
–A  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
16  
1
9
8
B
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
F
G
H
J
K
L
MIN  
MAX  
0.770  
0.270  
0.175  
0.021  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
F
C
L
0.740  
0.250  
0.145  
0.015  
0.040  
S
0.070  
1.77  
SEATING  
–T  
PLANE  
0.100 BSC  
0.050 BSC  
0.015  
0.130  
0.305  
2.54 BSC  
1.27 BSC  
0.38  
3.30  
7.74  
M
K
0.008  
0.110  
0.295  
0.21  
2.80  
7.50  
H
J
G
D 16 PL  
M
S
0°  
10°  
0°  
10°  
M
M
0.25 (0.010)  
T
A
0.020  
0.040  
0.51  
1.01  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751B–05  
ISSUE J  
–A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
16  
1
9
8
–B  
P 8 PL  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
M
0.25 (0.010)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
G
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
F
G
J
MIN  
9.80  
3.80  
1.35  
0.35  
0.40  
MAX  
10.00  
4.00  
1.75  
0.49  
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
0.386  
0.150  
0.054  
0.014  
0.016  
F
K
R X 45°  
C
1.25  
1.27 BSC  
0.050 BSC  
–T  
0.19  
0.10  
0.25  
0.25  
0.008  
0.004  
0.009  
0.009  
J
SEAT  
ING  
M
K
PLANE  
D 16 PL  
M
P
R
0
5.80  
0.25  
°
7
6.20  
0.50  
°
0
°
7°  
0.244  
0.019  
0.229  
0.010  
M
S
S
0.25 (0.010)  
T
B
A
Motorolareserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representationorguaranteeregarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,  
andspecifically disclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters can and do vary in different  
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does  
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CODELINE  
MC74HCT174A/D  

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