MC74HCT240AN [MOTOROLA]
Octal 3-State Inverting Buffer/Line Driver/Line Receiver with LSTTL-Compatible Inputs; 八路三态缓冲器/线路驱动器/线接收器与LSTTL兼容输入
| 型号： | MC74HCT240AN |
| 厂家： | 
MOTOROLA |
| 描述： | Octal 3-State Inverting Buffer/Line Driver/Line Receiver with LSTTL-Compatible Inputs |
| 文件： | 总7页 (文件大小：175K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
20
High–Performance Silicon–Gate CMOS
1
The MC74HCT240A is identical in pinout to the LS240. This device may
be used as a level converter for interfacing TTL or NMOS outputs to
High–Speed CMOS inputs. The HCT240A is an octal inverting buffer line
driver line receiver designed to be used with 3–state memory address
drivers, clock drivers, and other bus–oriented systems. The device has
inverting outputs and two active–low output enables.
DW SUFFIX
SOIC PACKAGE
CASE 751D–04
20
1
SD SUFFIX
SSOP PACKAGE
CASE 940C–03
20
20
The HCT240A is the inverting version of the HCT244. See also HCT241.
1
•
•
•
•
•
•
Output Drive Capability: 15 LSTTL Loads
TTL NMOS–Compatible Input Levels
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 4.5 to 5.5 V
Low Input Current: 1 µA
DT SUFFIX
TSSOP PACKAGE
CASE 948E–02
1
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
ORDERING INFORMATION
MC74HCTXXXAN
Plastic
SOIC
SSOP
TSSOP
•
Chip Complexity: 110 FETs or 27.5 Equivalent Gates
MC74HCTXXXADW
MC74HCTXXXASD
MC74HCTXXXADT
LOGIC DIAGRAM
PIN ASSIGNMENT
2
4
6
8
18
16
14
12
A1
YA1
ENABLE A
1
20
V
CC
A2
A3
A4
YA2
YA3
YA4
A1
YB4
A2
2
3
4
19
18
17
ENABLE B
YA1
B4
YB3
A3
5
16
15
14
13
12
11
YA2
B3
INVERTING
OUTPUTS
6
DATA INPUTS
11
13
9
7
B1
B2
YB1
YB2
YB2
A4
7
YA3
B2
8
YB1
GND
9
YA4
B1
15
17
5
3
10
B3
B4
YB3
YB4
FUNCTION TABLE
PIN 20 = V
CC
PIN 10 = GND
Inputs
Enable A,
Enable B A, B
Outputs
1
ENABLE A
ENABLE B
OUTPUT
ENABLES
19
YA, YB
L
L
H
L
H
X
H
L
Z
Z = High Impedance
X = Don’t Care
2/97
Motorola, Inc. 1997
REV 7
MC74HCT240A
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
– 0.5 to + 7.0
CC
V
– 0.5 to V
+ 0.5
V
in
CC
V
out
– 0.5 to V
+ 0.5
V
CC
I
± 20
mA
mA
mA
mW
in
cuit. For proper operation, V and
in
I
I
DC Output Current, per Pin
± 35
± 75
out
V
should be constrained to the
out
range GND (V or V
)
V
.
DC Supply Current, V
and GND Pins
in out
CC
CC
CC
Unused inputs must always be
tied to an appropriate logic voltage
P
D
Power Dissipation in Still Air
Plastic DIP†
SOIC Package†
750
500
450
level (e.g., either GND or V ).
CC
TSSOP or SSOP Package†
Unused outputs must be left open.
T
Storage Temperature
– 65 to + 150
C
C
stg
T
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC, TSSOP or SSOP Package)
L
260
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/ C from 65 to 125 C
SOIC Package: – 7 mW/ C from 65 to 125 C
TSSOP or SSOP Package: – 6.1 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
4.5
0
Max
Unit
V
V
CC
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 1)
5.5
V , V
in out
V
CC
V
T
A
– 55 + 125
500
C
t , t
r f
0
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Test Conditions
Unit
85 C
125 C
V
IH
Minimum High–Level Input
Voltage
V
= 0.1 V or V
– 0.1 V
4.5
5.5
2
2
2
2
2
2
V
out
CC
|I
|
20 µA
out
V
Maximum Low–Level Input
Voltage
V
= 0.1 V or V
– 0.1 V
4.5
5.5
0.8
0.8
0.8
0.8
0.8
0.8
V
V
IL
out
CC
|I
|
20 µA
out
V
OH
Minimum High–Level Output
Voltage
V
= V or V
IH
4.5
5.5
4.4
5.4
4.4
5.4
4 4
5.4
in
IL
IL
IL
IL
|I
|
20 µA
out
V
= V or V
IH
in
|I
|
6 mA
4.5
3.98
3.84
3.7
out
V
OL
Maximum Low–Level Output
Voltage
V
V
= V or V
IH
4.5
5.5
0.1
0.1
0.1
0.1
0.1
0.1
in
|I
|
20 µA
out
V
= V or V
in
IH
6 mA
|I
|
4.5
5.5
5.5
0.26
± 0.1
± 0.5
0.33
± 1.0
± 5.0
0.4
± 1.0
± 10
out
I
in
Maximum Input Leakage Current
V
in
= V or GND
CC
µA
µA
I
Maximum Three State
Leakage Current
Output in High–Impedance State
OZ
V
= V or V
in
IL
= V
IH
or GND
V
out
CC
MOTOROLA
2
MC74HCT240A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Test Conditions
or GND
Unit
85 C
125 C
I
Maximum Quiescent Supply
Current (per Package)
V
= V
5.5
4
40
160
µA
CC
in
CC
= 0 µA
I
out
∆I
CC
Additional Quiescent Supply
Current
V
= 2.4 V, Any One Input
≥ –55 C
2.9
25 C to 125 C
in
V
in
l
= V
or GND, Other Inputs
CC
= 0 µA
2.4
out
5.5
mA
NOTES:
1. Informationon typical parametric values along with frequency or heavy load considerations can be found in Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
2. Total Supply Current = I
CC
+ Σ∆I .
CC
AC ELECTRICAL CHARACTERISTICS (V
CC
= 5.0 V ± 10%, C = 50 pF, Input t = t = 6 ns)
L r f
Guaranteed Limit
– 55 to
25 C
Symbol
Parameter
Unit
85 C
125 C
t
t
,
Maximum Propagation Delay, A to YA or B to YB
(Figures 1 and 3)
20
28
25
12
25
30
ns
PLH
PHL
t
t
,
Maximum Propagation Delay, Output Enable to YA or YB
(Figures 2 and 4)
35
31
15
42
38
18
ns
ns
ns
PLZ
PHZ
t
t
,
Maximum Propagation Delay, Output Enable to YA or YB
(Figures 2 and 4)
PZL
PZH
t
t
,
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
TLH
THL
C
Maximum Input Capacitance
10
15
10
15
10
15
pF
pF
in
C
Maximum Three–State Output Capacitance (Output in High–Impedance
State)
out
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
Typical @ 25°C, V
= 5.0 V
CC
C
Power Dissipation Capacitance (Per Enabled Output)*
pF
55
PD
2
* Used to determine the no–load dynamic power consumption: P = C
D
Motorola High–Speed CMOS Data Book (DL129/D).
V
f + I
V
. For load considerations, see Chapter 2 of the
PD CC
CC CC
3
MOTOROLA
MC74HCT240A
SWITCHING WAVEFORMS
3 V
ENABLE
A OR B
1.3 V
t
t
f
r
GND
3 V
INPUT
A OR B
2.7 V
1.3 V
0.3 V
t
t
PLZ
PZL
HIGH
IMPEDANCE
GND
1.3 V
t
t
PLH
PHL
OUTPUT Y
OUTPUT Y
10%
90%
V
V
OL
90%
1.3 V
10%
t
t
PHZ
PZH
OUTPUT
YA OR YB
OH
1.3 V
HIGH
IMPEDANCE
t
t
TLH
THL
Figure 1.
Figure 2.
TEST POINT
TEST POINT
1 k
OUTPUT
CONNECT TO V
WHEN
.
PZL
CC
AND t
Ω
OUTPUT
TESTING t
PLZ
CONNECT TO GND WHEN
TESTING t AND t
DEVICE
DEVICE
UNDER
TEST
UNDER
TEST
.
PZH
PHZ
C *
C *
L
L
* Includes all probe and jig capacitance
* Includes all probe and jig capacitance
Figure 3. Test Circuit
Figure 4. Test Circuit
LOGIC DETAIL
TO THREE OTHER
A OR B INVERTERS
ONE OF 8
INVERTERS
V
CC
INPUT
A OR B
YA
OR
YB
OUTPUT ENABLES
ENABLE A OR ENABLE B
MOTOROLA
4
MC74HCT240A
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
ISSUE E
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
20
1
11
10
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
L
C
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
1.070
0.260
0.180
0.022
MIN
25.66
6.10
3.81
0.39
MAX
27.17
6.60
4.57
0.55
1.010
0.240
0.150
0.015
–T–
SEATING
PLANE
K
E
0.050 BSC
1.27 BSC
M
0.050
0.070
1.27
1.77
F
G
J
K
L
N
E
0.100 BSC
2.54 BSC
0.008
0.110
0.015
0.140
0.21
2.80
0.38
3.55
G
F
J 20 PL
0.300 BSC
7.62 BSC
D 20 PL
0.25 (0.010)
M
M
0.25 (0.010)
T B
M
N
0
15
0
15
0.020
0.040
0.51
1.01
M
M
T
A
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
10X P
–B–
M
M
0.010 (0.25)
B
1
10
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
20X D
DIM
A
B
C
D
MIN
12.65
7.40
2.35
0.35
0.50
MAX
12.95
7.60
2.65
0.49
0.90
MIN
MAX
0.510
0.299
0.104
0.019
0.035
J
0.499
0.292
0.093
0.014
0.020
M
S
S
0.010 (0.25)
T
A
B
F
F
G
J
K
M
P
R
1.27 BSC
0.050 BSC
0.25
0.10
0
0.32
0.25
7
0.010
0.004
0
0.012
0.009
7
R X 45
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
C
SEATING
PLANE
–T–
M
18X G
K
5
MOTOROLA
MC74HCT240A
OUTLINE DIMENSIONS
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940C–03
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
ISSUE B
Y14.5M, 1982.
20X K REF
0.12 (0.005)
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
0.25 (0.010)
M
S
S
T
U
V
N
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR INTRUSION SHALL NOT
REDUCE DIMENSION K BY MORE THAN 0.07 (0.002)
AT LEAST MATERIAL CONDITION.
M
20
11
10
L/2
N
B
F
L
DETAIL E
K
PIN 1
1
IDENT
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE
ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE –W–.
–U–
A
–V–
J
J1
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
H
J
J1
K
MIN
7.07
5.20
1.73
0.05
0.63
MAX
7.33
5.38
1.99
0.21
0.95
MIN
MAX
0.288
0.212
0.078
0.008
0.037
K1
M
S
0.20 (0.008)
T U
0.278
0.205
0.068
0.002
0.024
SECTION N–N
–W–
0.65 BSC
0.026 BSC
C
0.59
0.09
0.09
0.25
0.25
7.65
0
0.75
0.20
0.16
0.38
0.33
7.90
8
0.023
0.003
0.003
0.010
0.010
0.301
0
0.030
0.008
0.006
0.015
0.013
0.311
8
0.076 (0.003)
SEATING
PLANE
–T–
D
G
DETAIL E
K1
L
M
H
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
20X K REF
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
T
U
V
S
0.15 (0.006)
T
U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
K
K1
20
11
2X L/2
J J1
B
L
–U–
PIN 1
IDENT
SECTION N–N
1
10
0.25 (0.010)
N
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
0.15 (0.006)
T U
M
A
MILLIMETERS
INCHES
DIM
A
B
C
D
MIN
6.40
4.30
–––
0.05
0.50
MAX
6.60
4.50
1.20
0.15
0.75
MIN
MAX
0.260
0.177
0.047
0.006
0.030
–V–
0.252
0.169
–––
0.002
0.020
N
F
F
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
DETAIL E
0.27
0.09
0.09
0.19
0.19
0.37
0.20
0.16
0.30
0.25
0.011
0.004
0.004
0.007
0.007
0.015
0.008
0.006
0.012
0.010
–W–
C
6.40 BSC
0.252 BSC
G
D
M
0
8
0
8
H
DETAIL E
0.100 (0.004)
–T– SEATING
PLANE
MOTOROLA
6
MC74HCT240A
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
Opportunity/Affirmative Action Employer.
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Mfax is a trademark of Motorola, Inc.
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;
P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315
Mfax : RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
INTERNET: http://www.mot.com/SPS/
MC74HCT240A/D
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