MC74HCXXXD [MOTOROLA]
HighâPerformance SiliconâGate CMOS;
| 型号： | MC74HCXXXD |
| 厂家： | 
MOTOROLA |
| 描述： | HighâPerformance SiliconâGate CMOS 栅 |
| 文件： | 总7页 (文件大小：203K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
High–Performance Silicon–Gate CMOS
J SUFFIX
CERAMIC PACKAGE
CASE 620–10
The MC54/74HC175 is identical in pinout to the LS175. The device inputs
are compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LSTTL outputs.
16
1
This device consists of four D flip–flops with common Reset and Clock
inputs, and separate D inputs. Reset (active–low) is asynchronous and
occurs when a low level is applied to the Reset input. Information at a D input
is transferred to the corresponding Q output on the next positive going edge
of the Clock input.
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
16
1
•
•
•
•
•
•
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
D SUFFIX
SOIC PACKAGE
CASE 751B–05
16
Low Input Current: 1 µA
1
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
ORDERING INFORMATION
MC54HCXXXJ
MC74HCXXXN
MC74HCXXXD
Ceramic
Plastic
SOIC
•
Chip Complexity 166 FETs or 41.5 Equivalent Gates
LOGIC DIAGRAM
9
2
3
CLOCK
Q0
Q0
PIN ASSIGNMENT
7
6
10
Q1
Q1
Q2
RESET
1
2
16
15
V
CC
INVERTING
AND
NONINVERTING
OUTPUTS
4
5
D0
D1
Q0
Q3
DATA
INPUTS
11
15
14
Q0
D0
3
4
5
6
7
8
14
13
12
11
10
9
Q3
Q2
Q3
Q3
12
13
D2
D3
D3
D1
D2
1
RESET
Q1
Q2
Q1
Q2
PIN 16 = V
CC
PIN 8 = GND
GND
CLOCK
FUNCTION TABLE
Inputs
Reset Clock
Outputs
D
Q
Q
L
H
H
H
X
X
H
L
L
H
L
H
L
H
L
X
No Change
10/95
Motorola, Inc. 1995
REV 6
MC54/74HC175
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
– 0.5 to + 7.0
V
CC
V
– 1.5 to V
+ 1.5
V
in
CC
V
out
– 0.5 to V
+ 0.5
V
CC
I
± 20
mA
mA
mA
mW
in
cuit. For proper operation, V and
in
I
DC Output Current, per Pin
± 25
± 50
out
CC
V
should be constrained to the
out
I
DC Supply Current, V and GND Pins
CC
range GND (V or V
)
V
CC
.
in out
Unused inputs must always be
tied to an appropriate logic voltage
P
D
Power Dissipation in Still Air, Plastic or Ceramic DIP†
SOIC Package†
750
500
level (e.g., either GND or V ).
Unused outputs must be left open.
CC
T
Storage Temperature
– 65 to + 150
C
C
stg
T
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
(Ceramic DIP)
L
260
300
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/ C from 65 to 125 C
Ceramic DIP: – 10 mW/ C from 100 to 125 C
SOIC Package: – 7 mW/ C from 65 to 125 C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
0
Max
Unit
V
V
CC
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
6.0
V , V
in out
V
CC
V
T
A
– 55 + 125
C
t , t
r f
Input Rise and Fall Time
(Figure 1)
V
CC
V
CC
V
CC
= 2.0 V
= 4.5 V
= 6.0 V
0
0
0
1000
500
400
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
– 55 to
V
CC
V
Symbol
Parameter
Test Conditions
25 C
Unit
85 C
125 C
V
IH
Minimum High–Level Input
Voltage
V
= 0.1 V or V
– 0.1 V
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4 2
V
out
CC
|I
|
20 µA
out
V
Maximum Low–Level Input
Voltage
V
= 0.1 V or V
– 0.1 V
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
V
IL
out
CC
|I
|
20 µA
out
V
OH
Minimum High–Level Output
Voltage
V
= V or V
IH IL
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
in
|I
|
20 µA
out
V
in
= V or V
|I
|I
|
|
4.0 mA
5.2 mA
4.5
6.0
3.98
5.48
3.84
5.34
3.70
5.20
IH
IL out
out
V
OL
Maximum Low–Level Output
Voltage
V
V
= V or V
IH
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
in
IL
|I
|
20 µA
out
V
= V or V
|I
|I
|
|
4.0 mA
5.2 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.40
0.40
in
in
IH IL out
out
I
Maximum Input Leakage Current
V
V
= V
= V
or GND
6.0
6.0
± 0.1
± 1.0
± 1.0
µA
µA
in
CC
I
Maximum Quiescent Supply
Current (per Package)
or GND
8
80
160
CC
in
CC
I
= 0 µA
out
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MOTOROLA
2
MC54/74HC175
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, Input t = t = 6 ns)
L
r
f
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Unit
85 C
125 C
f
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4)
2.0
4.5
6.0
6.0
30
35
4.8
24
28
4.0
20
24
MHz
max
t
t
,
Maximum Propagation Delay, Clock to Q or Q
(Figures 1 and 4)
2.0
4.5
6.0
150
30
26
190
38
33
225
45
38
ns
ns
ns
pF
PLH
PHL
t
Maximum Propagation Delay, Reset to Q or Q
(Figures 2 and 4)
2.0
4.5
6.0
125
25
21
155
31
26
190
38
32
PHL
t
t
,
Maximum Output Transition Time, Any Output
(Figures 1 and 4)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
TLH
THL
C
Maximum Input Capacitance
—
10
10
10
in
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, V
= 5.0 V
CC
C
Power Dissipation Capacitance (Per Flip–Flop)*
pF
35
PD
2
* Used to determine the no–load dynamic power consumption: P = C
D
Motorola High–Speed CMOS Data Book (DL129/D).
V
f + I
V
. For load considerations, see Chapter 2 of the
PD CC
CC CC
TIMING REQUIREMENTS (Input t = t = 6 ns)
r
f
Guaranteed Limit
– 55 to
V
CC
V
25 C
Symbol
Parameter
Unit
85 C
125 C
t
su
Minimum Setup Time, Data to Clock
(Figure 3)
2.0
4.5
6.0
100
20
17
125
25
21
150
30
26
ns
t
Minimum Hold Time, Clock to Data
(Figure 3)
2.0
4.5
6.0
3
3
3
3
3
3
3
3
3
ns
ns
ns
ns
ns
h
t
Minimum Recovery Time, Reset Inactive to Clock
(Figure 2)
2.0
4.5
6.0
100
20
17
125
25
21
150
30
26
rec
t
Minimum Pulse Width, Clock
(Figure 1)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
w
w
t
Minimum Pulse Width, Reset
(Figure 2)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
t , t
r f
Maximum Input Rise and Fall Times
(Figure 1)
2.0
4.5
6.0
1000
500
400
1000
500
400
1000
500
400
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
3
MOTOROLA
MC54/74HC175
SWITCHING WAVEFORMS
t
w
t
t
r
f
V
CC
V
50%
CC
90%
50%
10%
RESET
CLOCK
Q or Q
GND
GND
t
PHL
t
w
50%
50%
1/f
max
Q
Q
t
t
PHL
PLH
t
PLH
90%
50%
10%
t
rec
t
t
THL
TLH
V
CC
CLOCK
Figure 1.
50%
GND
Figure 2.
VALID
V
CC
DATA
GND
t
t
su
h
V
CC
CLOCK
50%
GND
Figure 3.
TEST CIRCUIT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
C *
L
* Includes all probe and jig capacitance
Figure 4.
MOTOROLA
4
MC54/74HC175
EXPANDED LOGIC DIAGRAM
2
4
9
D0
D
D
D
D
Q
Q
Q
Q
Q0
C
C
3
Q0
CLOCK
R
R
R
R
5
7
D1
Q1
C
C
6
Q1
12
10
D2
Q2
C
C
11
Q2
13
1
15
D3
Q3
C
C
14
Q3
RESET
5
MOTOROLA
MC54/74HC175
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 620–10
ISSUE V
–A
–
NOTES:
16
1
9
8
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–B
–
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
L
C
INCHES
MILLIMETERS
DIM
A
B
C
D
E
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
—
0.39
1.27 BSC
MAX
19.93
7.49
5.08
0.50
0.750
0.240
—
0.015
0.050 BSC
–T
SEAT
–
ING
N
K
PLANE
F
G
J
K
L
M
N
0.055
0.100 BSC
0.008
0.125
0.065
1.40
2.54 BSC
0.21
3.18
1.65
E
M
0.015
0.170
0.38
4.31
J 16 PL
F
G
0.300 BSC
15
0.040
7.62 BSC
15
1.01
0.51
M
S
0.25 (0.010)
T
B
D 16 PL
°
°
0°
0°
M
S
0.25 (0.010)
T
A
0.020
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A
–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
16
9
B
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
1
8
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
MIN
MAX
0.770
0.270
0.175
0.021
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
F
C
L
0.740
0.250
0.145
0.015
0.040
S
0.070
1.77
SEATING
PLANE
–T
0.100 BSC
0.050 BSC
0.015
0.130
0.305
2.54 BSC
1.27 BSC
0.38
3.30
7.74
–
M
K
0.008
0.110
0.295
0.21
2.80
7.50
H
J
G
D 16 PL
M
S
0°
10°
0°
10°
M
M
0.25 (0.010)
T
A
0.020
0.040
0.51
1.01
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A
–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
9
8
–B
–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.25 (0.010)
B
1
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
MIN
9.80
3.80
1.35
0.35
0.40
MAX
10.00
4.00
1.75
0.49
MIN
MAX
0.393
0.157
0.068
0.019
0.049
0.386
0.150
0.054
0.014
0.016
0.050 BSC
0.008
0.004
F
K
R X 45°
C
1.25
1.27 BSC
–T
0.19
0.10
0.25
0.25
0.009
0.009
J
SEAT
–
ING
M
K
PLANE
D 16 PL
M
P
R
0
5.80
0.25
°
7
6.20
0.50
°
0
°
7°
0.244
0.019
0.229
0.010
M
S
S
0.25 (0.010)
T
B
A
MOTOROLA
6
MC54/74HC175
Motorolareserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representationorguaranteeregarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
andspecifically disclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
unintendedor unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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CODELINE
MC54/74HC175/D
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