MC88915FN70R2 [MOTOROLA]
88915 SERIES, PLL BASED CLOCK DRIVER, 7 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), PQCC28, PLASTIC, LCC-28;型号: | MC88915FN70R2 |
厂家: | MOTOROLA |
描述: | 88915 SERIES, PLL BASED CLOCK DRIVER, 7 TRUE OUTPUT(S), 1 INVERTED OUTPUT(S), PQCC28, PLASTIC, LCC-28 驱动 输出元件 |
文件: | 总13页 (文件大小:148K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
Features
The MC88915 Clock Driver utilizes phase–locked loop
technology to lock its low skew outputs’ frequency and phase
onto an input reference clock. It is designed to provide clock
distribution for high performance PC’s and workstations.
• Five Outputs (QO–Q4) with Output–Output Skew < 500
ps each being phase and frequency locked to the SYNC
input
The PLL allows the high current, low skew outputs to lock
onto a single clock input and distribute it with essentially zero
delay to multiple components on a board. The PLL also allows
the MC88915 to multiply a low frequency input clock and
distribute it locally at a higher (2X) system frequency. Multiple
88915’s can lock onto a single reference clock, which is ideal
for applications when a central system clock must be
distributed synchronously to multiple boards (see Figure 7).
• The phase variation from part–to–part between the SYNC
and FEEDBACK inputs is less than 550 ps (derived from
the t
PD
skew)
specification, which defines the part–to–part
• Input/Output phase–locked frequency ratios of 1:2, 1:1,
and 2:1 are available
• Input frequency range from 5MHz – 2X_Q FMAX spec
• Additional outputs available at 2X and +2 the system “Q”
frequency. Also a Q (180° phase shift) output available
Five “Q” outputs (QO–Q4) are provided with less than 500
ps skew between their rising edges. The Q5 output is inverted
(180° phase shift) from the “Q” outputs. The 2X_Q output runs
at twice the “Q” output frequency, while the Q/2 runs at 1/2 the
“Q” frequency.
• All outputs have ±36 mA drive (equal high and low) at
CMOS levels, and can drive either CMOS or TTL inputs.
All inputs are TTL–level compatible
• Test Mode pin (PLL_EN) provided for low frequency
testing. Two selectable CLOCK inputs for test or
redundancy purposes
The VCO is designed to run optimally between 20 MHz and
the 2X_Q Fmax specification. The wiring diagrams in Figure 5
detail the different feedback configurations which create
specific input/output frequency relationships. Possible
frequency ratios of the “Q” outputs to the SYNC input are 2:1,
1:1, and 1:2.
RST
4
V
Q5
2
GND Q4
V
2X_Q
26
CC
CC
3
1
28
27
FEEDBACK
REF_SEL
SYNC[0]
5
25
Q/2
GND
Q3
The FREQ_SEL pin provides one bit programmable
divide–by in the feedback path of the PLL. It selects between
divide–by–1 and divide–by–2 of the VCO before its signal
reaches the internal clock distribution section of the chip (see
the block diagram on page 2). In most applications
FREQ_SEL should be held high (÷1). If a low frequency
reference clock input is used, holding FREQ_SEL low (÷2) will
allow the VCO to run in its optimal range (>20 MHz).
6
24
23
22
21
20
19
7
V
(AN)
RC1
8
V
CC
CC
9
Q2
GND(AN)
SYNC[1]
10
11
GND
LOCK
In normal phase–locked operation the PLL_EN pin is held
high. Pulling the PLL_EN pin low disables the VCO and puts
the 88915 in a static “test mode”. In this mode there is no
frequency limitation on the input clock, which is necessary for
a low frequency board test environment. The second SYNC
input can be used as a test clock input to further simplify
board–level testing (see detailed description on page 11).
12
13
14
15
V
16
17
18
PLL_EN
GND Q0
Q1 GND
FREQ_SEL
CC
28–Lead Pinout (Top View)
A lock indicator output (LOCK) will go high when the loop is
in steady–state phase and frequency lock. The LOCK output
will go low if phase–lock is lost or when the PLL_EN pin is low.
Under certain conditions the lock output may remain low, even
though the part is phase–locked. Therefore the LOCK output
signal should not be used to drive any active circuitry; it should
be used for passive monitoring or evaluation purposes only.
FN SUFFIX
PLASTIC PLCC
CASE 776–02
ORDERING INFORMATION
MC88915FN55 PLCC
MC88915FN70 PLCC
Yield Surface Modeling and YSM are trademarks of Motorola, Inc.
1/97
REV 4
Motorola, Inc. 1997
MC88915
LOCK
FEEDBACK
SYNC (0)
VOLTAGE
0
1
PHASE/FREQ.
DETECTOR
CHARGE PUMP/LOOP
FILTER
CONTROLLED
M
U
X
OSCILLATOR
SYNC (1)
EXTERNAL REC NETWORK
(RC1 Pin)
REF_SEL
2x_Q
Q0
1
0
PLL_EN
MUX
D
Q
Q
(
÷
1)
2)
CP
1
R
R
R
M
U
X
(÷
DIVIDE
BY TWO
0
Q1
Q2
Q3
D
Q
CP
FREQ_SEL
RST
D
Q
Q
CP
PIN SUMMARY
Pin Name
Num
I/O
Function
1
1
1
1
1
1
5
1
1
1
1
1
1
11
SYNC[0]
SYNC[1]
REF_SEL
FREQ_SEL
FEEDBACK
RC1
Q(0–4)
Q5
2x_Q
Q/2
LOCK
RST
PLL_EN
Input
Input
Input
Input
Input
Reference clock input
Reference clock input
D
CP
Chooses reference between sync[0] & Sync[1]
Selects Q output frequency
Feedback input to phase detector
Input for external RC network
Clock output (locked to sync)
Inverse of clock output
R
R
R
Input
Output
Output
Output
Output
Output
Input
Q4
Q5
D
Q
Q
Q
2 x clock output (Q) frequency (synchronous)
Clock output(Q) frequency ÷ 2 (synchronous)
CP
Indicates phase lock has been achieved (high when locked)
Asynchronous reset (active low)
Disables phase–lock for low freq. testing
Power and ground pins (note pins 8, 10 are
“quiet” supply pins for internal logic only)
Input
D
V
,GND
CC
CP
Q/2
D
CP
R
MC88915 Block Diagram
MOTOROLA
2
TIMING SOLUTIONS
BR1333 — Rev 6
MC88915
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND; T =0° C to + 70° C, V
CC
= 5.0V ± 5%)
A
Symbol
Parameter
Test Conditions
V
Guaranteed Limit
Unit
V
CC
V
V
IH
Minimum High–Level Input
Voltage
V
= 0.1 V or V
– 0.1 V
4.75
5.25
2.0
2.0
out
CC
CC
V
IL
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or V
– 0.1 V
4.75
5.25
0.8
0.8
V
V
OH
Minimum High–Level Output
Voltage
V
= V or V
IH IL
4.75
5.25
4.01
4.51
V
in
1
= –36 mA
I
OH
V
OL
Maximum Low–Level Output
Voltage
V
= V or V
IH IL
4.75
5.25
0.44
0.44
V
in
1
= 36 mA
I
OL
I
Maximum Input Leakage Current
V = V
or GND
– 2.1 V
5.25
5.25
5.25
5.25
5.25
±1.0
µA
mA
mA
mA
mA
in
I
CC
CC
2
I
Maximum I /Input
CC
V = V
I
CCT
OLD
1.5
3
I
Minimum Dynamic Output Current
V
OLD
V
OHD
= 1.0V Max
88
–88
1.0
I
= 3.85 V Max
OHD
I
Maximum Quiescent Supply
Current (per Package)
V = V
I
or GND
CC
CC
1. I
and I are 12mA and –12mA respectively for the LOCK output.
OH
OL
2. The PLL_EN input pin is not guaranteed to meet this specification.
3. Maximum test duration is 2.0ms, one output loaded at a time.
CAPACITANCE AND POWER SPECIFICATIONS
Symbol
Parameter
Typical Values
Unit
pF
Conditions
C
Input Capacitance
4.5
40
V
CC
V
CC
V
CC
= 5.0 V
IN
C
Power Dissipation Capacitance
pF
= 5.0 V
= 5.0 V
PD
PD
Power Dissipation @ 33MHz with 50Ω Thevenin Termination
15 mW/Output
120 mW/Device
mW
1
T = 25°C
PD
Power Dissipation @ 33MHz with 50Ω Parallel Termination to GND
37.5 mW/Output
300 mW/Device
mW
V
= 5.0 V
T = 25° C
2
CC
SYNC INPUT TIMING REQUIREMENTS
Symbol
Parameter
Min
Max
Unit
t
, t
Maximum Rise and Fall times, (SYNC Inputs: From 0.8V – 2.0V)
–
3.0
ns
RISE FALL
FN55
36
FN70
28.5
1
200
t
Input Clock Period (SYNC Inputs)
ns
CYCLE
Duty Cycle
Input Duty Cycle (SYNC Inputs)
50% ±25%
1. Information in Fig. 5 and in the “General AC Specification Notes”, Note #3 describes this specification and its actual limits depending on the
application.
FREQUENCY SPECIFICATIONS (T =0° C to + 70° C, V
CC
= 5.0V ±5%, C = 50pF)
L
A
Guaranteed Minimum
Symbol
Parameter
MC88915FN55
55
27.5
1. Maximum Operating Frequency is guaranteed with the part in a phase–locked condition, and all outputs loaded at 50 pF.
MC88915FN70
70
35
Unit
MHz
MHz
1
f
Maximum Operating Frequency
(2X_Q Output)
Maximum Operating Frequency (Q0–Q4,Q5 Output)
max
TIMING SOLUTIONS
BR1333 — Rev 6
3
MOTOROLA
MC88915
AC ELECTRICAL CHARACTERISTICS (T =0° C to +70° C, V
CC
= 5.0V ±5%, C = 50pF)
A
L
Symbol
Parameter
Min
Max
Unit
t
, t
Rise and Fall Times, all Outputs Into a 50 pF, 500 Ω Load
1.0
2.5
ns
RISE FALL
(Outputs)
(Between 0.2V and 0.8V
)
CC
CC
3
t
, t
Rise and Fall Time, 2X_Q Output Into a 20 pF Load With Termina-
tion specified in note 2 (Between 0.8 V and 2.0 V)
0.5
1.6
ns
RISE FALL
(2X_Q Output)
3
t
Output Pulse Width (Q0, Q1, Q3, Q4, Q5, Q/2 @V /2)
CC
0.5t
– 0.5
0.5t
+ 0.5
Pulse Width
CYCLE
CYCLE
(Q0,Q1,Q3,Q4,
Q5,Q/2)
t
= 1/Freq. at which the “Q”
CYCLE
Outputs are running
ns
3
3
t
t
Output Pulse Width (Q2 Output @ V /2)
CC
0.5t
0.5t
0.5t
– 0.6
– 0.5
– 1.0
0.5t
0.5t
0.5t
+ 0.6
+ 0.5
+ 1.0
Pulse Width
(Q2 only)
CYCLE
CYCLE
CYCLE
CYCLE
CYCLE
CYCLE
Output Pulse Width (2X_Q Output @ 1.5 V) (See AC Note 2)
ns
ns
Pulse Width
(2X_Q Output)
3
t
Output Pulse Width (2X_Q Output @ V /2)
CC
Pulse Width
(2X_Q Output)
3
t
(470kΩ From RC1 to An.V
)
PD
(Sync–Feedback) SYNC input to feedback delay
(meas. @ SYNC0 or 1 and FEEDBACK input pins)
CC
–0.50
(470kΩ From RC1 to An.GND)
–1.05
ns
(See General AC Specification note 4 and Fig. 2 for explanation)
+1.25
–
+3.25
500
1,3
t
t
Output–to–Output Skew Between Outputs Q0 – Q4, Q/2
(Rising Edges Only)
ps
ps
ps
ms
ns
SKEWr
(Rising)
1,3
Output–to–Output Skew Between Outputs Q0 – Q4
(Falling Edges Only)
–
–
750
750
10
SKEWf
(Falling)
1,3
t
Output–to–Output Skew Between Outputs 2X_Q, Q/2, Q0 – Q4
Rising, Q5 Falling
SKEWall
2
t
Time Required to acquire Phase–Lock from time SYNC Input Sig-
1
LOCK
nal is Received.
t
Propagation Delay, RST to Any Output (High–Low)
1.5
13.5
PHL
(Reset – Q)
1. Under equally loaded conditions, C ≤50pF (±2pF), and at a fixed temperature and voltage.
L
2. With V
fully powered–on and an output properly connected to the FEEDBACK pin. t
Max. is with C1 = 0.1µF, t Min is with
LOCK
CC
C1 = 0.01µF.
LOCK
3. These specifications are not tested, they are guaranteed by statistical characterization. See General AC Specification note 1.
1
RESET TIMING REQUIREMENTS
Symbol
, RST
Parameter
Minimum
Unit
t
Reset Recovery Time rising RST
edge to falling SYNC edge
9.0
ns
REC
to SYNC
t
, RST
LOW
Minimum Pulse Width,
RST input LOW
5.0
ns
W
1. These reset specs are valid only when PLL_EN is LOW and the part is in Test mode (not in phase–lock)
MOTOROLA
4
TIMING SOLUTIONS
BR1333 — Rev 6
MC88915
General AC Specification Notes
statistical characterization. In this way all units passing
the ATE test will meet or exceed the non–tested
specifications limits.
1. Several specifications can only be measured when the
MC88915 is in phase–locked operation. It is not possible
to have the part in phase–lock on ATE (automated test
equipment). Statistical characterization techniques were
used to guarantee those specifications which cannot be
measured on the ATE. MC88915 units were fabricated
with key transistor properties intentionally varied to
create a 14 cell designed experimental matrix. IC
performancewas characterized over a range of transistor
properties (represented by the 14 cells) in excess of the
expected process variation of the wafer fabrication area.
Response Surface Modeling (RSM) techniques were
used to relate IC performance to the CMOS transistor
properties over operation voltage and temperature. IC
Performance to each specification and fab variation were
used in conjunction with Yield Surface Modeling (YSM
) methodology to set performance limits of ATE testable
specifications within those which are to be guaranteed by
2. These two specs (t
RlSE/FALL
and t
Width 2X_Q
PULSE
output) guarantee that the MC88915 meets the 25 MHz
68040 P–Clock input specification (at 50 MHz). For these
two specs to be guaranteed by Motorola, the termination
scheme shown below in Figure 1 must be used.
3. The wiring Diagrams and written explanations in Figure 5
demonstratethe input and output frequencyrelationships
for three possible feedback configurations. The allowable
SYNC input range for each case is also indicated. There
are two allowable SYNC frequency ranges, depending
whether FREQ_SEL is high or low. Although not shown, it
is possible to feed back the Q5 output, thus creating a
180° phase shift between the SYNC input and the “Q”
outputs. Table 1 below summarizes the allowable SYNC
frequency range for each possible configuration.
Z
O
(CLOCK TRACE)
R
s
88915
2X_Q
Output
68040
P–Clock
Input
R
p
R = Z – 7
Ω
s
o
R = 1.5 Z
p
o
Figure 1. MC68040 P–Clock Input Termination Scheme
FREQ_SEL
Level
Feedback
Output
Allowable SYNC Input
Frequency Range (MHZ)
Corresponding VCO
Frequency Range
Phase Relationships
of the “Q” Outputs
to Rising SYNC Edge
HIGH
HIGH
HIGH
HIGH
LOW
LOW
LOW
LOW
Q/2
5 to (2X_Q FMAX Spec)/4
20 to (2X_Q FMAX Spec)
20 to (2X_Q FMAX Spec)
20 to (2X_Q FMAX Spec)
20 to (2X_Q FMAX Spec)
0°
0°
Any “Q” (Q0–Q4) 10 to (2X_Q FMAX Spec)/2
Q5
2X_Q
Q/2
10 to (2X_Q FMAX Spec)/2
20 to (2X_Q FMAX Spec)
180°
0°
2.5 to (2X_Q FMAX Spec)/8 20 to (2X_Q FMAX Spec)
0°
Any “Q” (Q0–Q4) 5 to (2X_Q FMAX Spec)/4
20 to (2X_Q FMAX Spec)
20 to (2X_Q FMAXSpec)
20 to (2X_Q FMAXSpec)
0°
Q5
5 to (2X_Q FMAX Spec)/4
10 to (2X_Q FMAX Spec)/2
180°
0°
2X_Q
Table 1. Allowable SYNC Input Frequency Ranges for Different Feedback Configurations.
4. A 1 MΩ resistor tied to either Analog V
CC
or Analog GND
lots described in note 1 while the part was in
phase–lockedoperation. Theactualmeasurementswere
made with a 10 MHz SYNC input (1.0 ns edge rate from
0.8 V – 2.0 V) with the Q/2 output fed back. The phase
measurements were made at 1.5 V. The Q/2 output was
as shown in Figure 2 is required to ensure no jitter is
present on the MC88915 outputs. This technique causes
a phase offset between the SYNC input and the output
connected to the FEEDBACK input, measured at the
input pins. The t
with process, temperature, and voltage. The specs were
arrived at by measuring the phase relationship for the 14
spec describes how this offset varies
terminatedattheFEEDBACKinputwith100ΩtoV
100 Ω to ground.
and
PD
CC
TIMING SOLUTIONS
BR1333 — Rev 6
5
MOTOROLA
MC88915
ANALOG VCC
RC1
EXTERNAL LOOP FILTER
470K
Ω
REFERENCE
RESISTOR
RC1
R2
330
Ω
R2
C1
330
Ω
470K
REFERENCE
RESISTOR
Ω
0.1
µ
F
0.1µF
C1
ANALOG GND
ANALOG GND
With the 470K
measured at the input pins is:
Ω
resistor tied in this fashion, the t specification
PD
With the 470K
measured at the input pins is:
Ω
resistor tied in this fashion, the t
PD
specification
t
= 2.25ns
±
1.0ns
t
= –0.775ns ± 0.275ns
PD
PD
3.0V
3.0V
SYNC INPUT
SYNC INPUT
–0.775ns OFFSET
2.25ns OFFSET
5.0V
5.0V
FEEDBACK OUTPUT
FEEDBACK OUTPUT
Figure 2. Depiction of the Fixed SYNC to Feedback Offset (tPD) Which is
Present When a 470KΩ Resistor is Tied to VCC or Ground
5. Thet
specificationguaranteesthattherisingedges
distributionof these outputs are provided in table 2. When
taking the skew data, Q0 was used as a reference, so all
measurements are relative to thisoutput. Theinformation
in Table 2 is derived from measurements taken from the
14 process lots described in Note 1, over the temperature
and voltage range.
SKEWr
of outputs Q/2, Q0, Q1, Q2, Q3, and Q4 will always fall
within a 500ps window within one part. However, if the
relative position of each output within this window is not
specified, the 500 ps window must be added to each side
of the tPD specification limits to calculate the total
part–to–part skew. For this reason the absolute
–
(ps)
+
(ps)
Output
Q0
0
0
Q1
–72
–44
–40
–274
–16
–633
40
Q2
276
255
–34
250
–35
Q3
Q4
Q/2
2X_Q
Table 2. Relative Positions of Outputs Q/2, Q0–Q4, 2X_Q, Within the 500ps t
SKEWr
Spec Window
MOTOROLA
6
TIMING SOLUTIONS
BR1333 — Rev 6
MC88915
6. Calculation of Total Output–to–Skew between multiple
parts (Part–to–Part skew)
– 0.32ns] = –1.37ns is the lower t
PD
limit, and [–0.5ns +
0.32ns] = –0.18ns is the upper limit. Therefore the worst
case skew of output Q2 between any number of parts is
|(–1.37) – (–0.18)| = 1.19ns. Q2 has the worst case skew
distribution of any output, so 1.2ns is the absolute worst
case output–to–output skew between multiple parts.
By combining the t
specification and the information in
PD
Note 5, the worst case output–to–output skew between
multiple 88915’s connected in parallel can be calculated.
This calculation assumes that all parts have a common
SYNC input clock with equal delay of that input signal to
each part. This skew value is valid at the 88915 output
pins only (equally loaded), it does not include PCB trace
delays due to varying loads.
7. Note 4 explains that the t
PD
specification was measured
and is guaranteed for the configuration of the Q/2 output
connected to the FEEDBACK pin and the SYNC input
running at 10MHz. The fixed offset (t ) as described
PD
With a 1MΩ resistor tied to analog V
as shown in note
above has some dependence on the input frequency and
at what frequency the VCO is running. The graphs of
Figure 3 demonstrate this dependence.
CC
spec. limits between SYNC and the Q/2 output
4, the t
PD
(connected to the FEEDBACK pin) are –1.05ns and
–0.5ns. To calculate the skew of any given output
between two or more parts, the absolute value of the
distribution of that output given in table 2 must be
The data presented in Figure 3 is from devices
representing process extremes, and the measurements
subtracted and added to the lower and upper t
limits respectively. ForoutputQ2, [276–(–44)]=320psis
the absolute value of the distribution. Therefore [–1.05ns
spec
were also taken at the voltage extremes (V = 5.25V
PD
CC
and 4.75V). Therefore the data in Figure 3 is a realistic
representation of the variation of t
.
PD
–0.50
–0.5
–0.75
–1.0
tPD
tPD
SYNC to
FEEDBACK
(ns)
SYNC to
FEEDBACK
(ns)
–1.00
–1.25
–1.50
–1.5
–2.0
2.5
5.0
7.5
10.0
12.5
15.0
17.5
2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5
SYNC INPUT FREQUENCY (MHz)
SYNC INPUT FREQUENCY (MHz)
Figure 3a.
Figure 3b.
t
versus Frequency Variation for Q/2 Output Fed
t
versus Frequency Variation for Q4 Output Fed
PD
PD
Back, Including Process and Voltage Variation @ 25
°
C
Back, Including Process and Voltage Variation @ 25
°
C
(With 1M
Ω
Resistor Tied to Analog V
)
(With 1M
Ω
Resistor Tied to Analog V
)
CC
CC
3.5
3.0
2.5
2.0
1.5
1.0
0.5
3.5
3.0
2.5
tPD
SYNC to
FEEDBACK
(ns)
tPD
SYNC to
FEEDBACK
(ns)
2.0
1.5
1.0
0.5
2.5
5.0
7.5
10.0
12.5
15.0
17.5
0
5
10
15
20
25
SYNC INPUT FREQUENCY (MHz)
SYNC INPUT FREQUENCY (MHz)
Figure 3c.
Figure 3d.
t
versus Frequency Variation for Q/2 Output Fed
t
versus Frequency Variation for Q4 Output Fed
PD
Back, Including Process and Voltage Variation @ 25
(With 1M Resistor Tied to Analog GND)
PD
°
C
Back, Including Process and Voltage Variation @ 25
°
C
Ω
(With 1MΩ Resistor Tied to Analog GND)
TIMING SOLUTIONS
BR1333 — Rev 6
7
MOTOROLA
MC88915
SYNC INPUT
(SYNC[1] or
SYNC[0])
t
SYNC INPUT
CYCLE
t
PD
FEEDBACK
INPUT
Q/2 OUTPUT
t
t
t
SKEWf
SKEWf
SKEWr
t
t
SKEWR
SKEWALL
Q0 – Q4
OUTPUTS
t
CYCLE “Q” OUTPUTS
Q5 OUTPUT
2X_Q OUTPUT
Figure 4. Output / Input Switching Waveforms and Timing Diagrams
(These waveforms represent the hook–up configuration of Figure 5a on page 9)
Timing Notes:
• The MC88915 aligns rising edges of the FEEDBACK input and SYNC input, therefore the SYNC input does
not require a 50% duty cycle.
• All skew specs are measured between the V /2 crossing point of the appropriate output edges.All skews
CC
are specified as ‘windows’, not as a ± deviation around a center point.
• If a “Q” output is connected to the FEEDBACK input (this situation is not shown), the “Q” output frequency
would match the SYNC input frequency, the 2X_Q output would run at twice the SYNC frequency, and the
Q/2 output would run at half the SYNC frequency.
MOTOROLA
8
TIMING SOLUTIONS
BR1333 — Rev 6
MC88915
50 MHz SIGNAL
12.5 MHz FEEDBACK SIGNAL
HIGH
1:2 Input to “Q” Output Frequency Relationship
RST
Q4
2X_Q
Q5
FEEDBACK
REF_SEL
SYNC[0]
Q/2
Q3
Q2
In this application, the Q/2 output is connected to
the FEEDBACK input. The internal PLL will line up
the positive edges of Q/2 and SYNC, thus the Q/2
frequency will equal the SYNC frequency. The “Q”
outputs (Q0–Q4, Q5) will always run at 2X the Q/2
frequency, and the 2X_Q output will run at 4X the
Q/2 frequency.
LOW
12.5 MHz INPUT
CRYSTAL
OSCILLATOR
MC88915
25MHz
“Q”
CLOCK
OUTPUTS
ANALOG V
CC
EXTERNAL
LOOP
FILTER
RC1
ANALOG GND
PLL_EN
Q1
Allowable Input Frequency Range:
FQ_SEL
HIGH
Q0
5MHz to (2X_Q FMAX Spec)/4 (for FREQ_SEL HIGH)
2.5MHz to (2X_Q FMAX Spec)/8 (for FREQ_SEL LOW)
HIGH
Figure 5a. Wiring Diagram and Frequency Relationships With Q/2 Output Feed Back
50 MHz SIGNAL
25 MHz FEEDBACK SIGNAL
HIGH
1:1 Input to “Q” Output Frequency Relationship
RST
Q5
Q4
2X_Q
12.5 MHz
SIGNAL
FEEDBACK
REF_SEL
SYNC[0]
Q/2
Q3
Q2
In this application, the Q4 output is connected to
the FEEDBACK input. The internal PLL will line up
the positive edges of Q4 and SYNC, thus the Q4
frequency (and the rest of the “Q” outputs) will
equal the SYNC frequency. The Q/2 output will al-
LOW
25 MHZ INPUT
CRYSTAL
25MHz
“Q”
CLOCK
MC88915
OSCILLATOR
ANALOG V
CC
EXTERNAL
LOOP
FILTER
RC1
OUTPUTS ways run at 1/2 the “Q” frequency, and the 2X_Q
output will run at 2X the “Q” frequency.
ANALOG GND
PLL_EN
FQ_SEL
HIGH
Q0
Q1
Allowable Input Frequency Range:
10MHz to (2X_Q FMAX Spec)/2 (for FREQ_SEL HIGH)
5MHz to (2X_Q FMAX Spec)/4 (for FREQ_SEL LOW)
HIGH
Figure 5b. Wiring Diagram and Frequency Relationships With Q4 Output Feed Back
50 MHz FEEDBACK SIGNAL
HIGH
RST
Q4
2X_Q
Q/2
Q5
2:1 Input to “Q” Output Frequency Relationship
12.5 MHz
SIGNAL
FEEDBACK
REF_SEL
SYNC[0]
LOW
In this application, the 2X_Q output is connected
to the FEEDBACK input. The internal PLL will line
up the positive edges of 2X_Q and SYNC, thus the
2X_Q frequency will equal the SYNC frequency.
The Q/2 output will always run at 1/4 the 2X_Q fre-
quency, and the “Q” outputs will run at 1/2 the
2X_Q frequency.
50 MHz INPUT
MC88915
CRYSTAL
Q3
Q2
25MHz
“Q”
CLOCK
OUTPUTS
OSCILLATOR
ANALOG V
CC
EXTERNAL
LOOP
FILTER
RC1
ANALOG GND
PLL_EN
Q1
FQ_SEL
HIGH
Q0
Allowable Input Frequency Range:
HIGH
20MHz to (2X_Q FMAX Spec) (for FREQ_SEL HIGH)
10MHz to (2X_Q FMAX Spec)/2 (for FREQ_SEL LOW)
Figure 5c. Wiring Diagram and Frequency Relationships with 2X_Q Output Feed Back
TIMING SOLUTIONS
BR1333 — Rev 6
9
MOTOROLA
MC88915
BOARD V
CC
47Ω
8
9
ANALOG V
CC
470KΩ
330
Ω
ANALOG LOOP FILTER/VCO
SECTION OF THE MC88915
28–PIN PLCC PACKAGE (NOT
DRAWN TO SCALE)
0.1
µ
F HIGH
FREQ
10
µF LOW
RC1
FREQ BYPASS
BYPASS
0.1µF (LOOP
FILTER CAP)
10 ANALOG GND
47Ω
A SEPARATE ANALOG POWER SUPPLY IS NOT NECESSARY AND
SHOULDNOTBEUSED. FOLLOWINGTHESEPRESCRIBEDGUIDELINES
ISALLTHATISNECESSARYTOUSETHEMC88915INANORMALDIGITAL
ENVIRONMENT.
BOARD GND
Figure 6. Recommended Loop Filter and Analog Isolation Scheme for the MC88915
Notes Concerning Loop Filter and Board Layout Issues
1. Figure 6 shows a loop filter and analog isolation scheme
which will be effective in most applications. The following
guidelines should be followed to ensure stable and
jitter–free operation:
is to give the 88915 additional protection from the power
supply and ground plane transients that can occur in a
high frequency, high speed digital system.
1c.There are no special requirements set forth for the loop
filter resistors (470K and 330Ω). The loop filter capacitor
(0.1µF) can be a ceramic chip capacitior, the same as a
standard bypass capacitor.
1a.All loop filter and analog isolation components should be
tied as close to the package as possible. Stray current
passing through the parasitics of long traces can cause
undesirable voltage transients at the RC1 pin.
1d.The 470K reference resistor injects current into the
internal charge pump of the PLL, causing a fixed offset
between the outputs and the SYNC input. This also
prevents excessive jitter caused by inherent PLL
dead–band. If the VCO (2X_Q output) is running above
40MHz, the 470K resistor provides the correct amount of
current injection into the charge pump (2–3µA). If the
VCO is running below 40MHz, a 1MΩ reference resistor
should be used (instead of 470K).
1b.The 47Ω resistors, the 10µF low frequency bypass
capacitor, andthe0.1µF high frequency bypass capacitor
form a wide bandwidth filter that will minimize the 88915’s
sensitivity to voltage transients from the system digital
V
supply and ground planes. This filter will typically
CC
ensure that a 100mV step deviation on the digital V
CC
supply will cause no more than a 100pS phase deviation
on the 88915 outputs. A 250mV step deviation on V
CC
using the recommended filter values should cause no
more than a 250pS phase deviation; if a 25µF bypass
2. In addition to the bypass capacitors used in the analog
capacitor is used (instead of 10µF) a 250mV V
should cause no more than a 100pS phase deviation.
step
CC
filter of Figure 6, there should be a 0.1µF bypass
capacitorbetweeneachoftheother(digital)fourV
pins
CC
If good bypass techniques are used on a board design
and the board ground plane. This will reduce output
switching noise caused by the 88915 outputs, in addition
toreducingpotentialfornoiseinthe‘analog’sectionofthe
chip. These bypass capacitors should also be tied as
close to the 88915 package as possible.
near components which may cause digital V
and
step deviations
CC
ground noise, the above described V
CC
should not occur at the 88915’s digital V
supply. The
purpose of the bypass filtering scheme shown in Figure 6
CC
MOTOROLA
10
TIMING SOLUTIONS
BR1333 — Rev 6
MC88915
CPU
CMMU
CPU
CMMU
CMMU
CARD
MC88915
PLL
2f
CLOCK
@ f
CMMU
CMMU
SYSTEM
CLOCK
SOURCE
CPU
CMMU
CMMU
CARD
CMMU
CPU
MC88915
PLL
2f
DISTRIBUTE
CLOCK @ f
CMMU
CMMU
CLOCK @ 2f
AT POINT OF USE
PLL
MEMORY
CONTROL
2f
MEMORY
CARDS
CLOCK @ 2f
AT POINT OF USE
Figure 7. Representation of a Potential Multi–Processing Application Utilizing the MC88915
for Frequency Multiplication and Low Board–to–Board Skew
MC88915 System Level Testing Functionality
When the PLL_EN pin is low, the VCO is disabled and the 88915 is in low frequency “test mode”. In test mode (with FREQ_SEL
high), the 2X_Q output is inverted from the selected SYNC input, and the “Q” outputs are divide–by–2 (negative edge triggered)
of the SYNC input, and the Q/2 output is divide–by–4. With FREQ_SEL low the 2X_Q output is divide–by–2 of the SYNC, the “Q”
outputs divide–by–4, and the Q/2 output divide–by–8. These relationships can be seen on the block diagram. A recommended
test configuration would be to use SYNC0 as the test clock input, and tie PLL_EN and REF_SEL together and connect them to
the test select logic. When these inputs are low, the 88915 is in test mode and the SYNC0 input is selected.
Thisfunctionalityisneededsincemostboard–leveltestersrunat1MHzorbelow, andthe88915cannotlockontothatlowofan
input frequency. In the test mode described above, any frequency test signal can be used.
TIMING SOLUTIONS
BR1333 — Rev 6
11
MOTOROLA
MC88915
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PACKAGE
CASE 776–02
ISSUE D
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
D
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
Z
–M–
–L–
W
D
S
S
S
0.010 (0.250)
T
L–M
N
X
G1
V
28
1
VIEW D–D
M
S
S
S
A
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
M
S
S
0.007 (0.180)
T
L–M
N
H
Z
M
S
T
N
R
K1
C
E
0.004 (0.100)
SEATING
PLANE
G
K
–T–
VIEW S
J
M
S
S
0.007 (0.180)
T
L–M
N
F
G1
S
S
S
0.010 (0.250)
T
L–M
N
VIEW S
NOTES:
INCHES
MILLIMETERS
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
MAX
0.495
0.495
0.180
0.110
0.019
MIN
12.32
12.32
4.20
MAX
12.57
12.57
4.57
0.485
0.485
0.165
0.090
0.013
2.29
2.79
0.33
0.48
0.050 BSC
1.27 BSC
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
–––
0.032
–––
–––
0.456
0.456
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
–––
0.81
–––
–––
11.58
11.58
1.21
1.21
1.42
0.50
10
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
2
2
0.410
0.040
0.430
–––
10.42
1.02
10.92
–––
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
MOTOROLA
12
TIMING SOLUTIONS
BR1333 — Rev 6
MC88915
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
Opportunity/Affirmative Action Employer.
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;
P.O. Box 5405; Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MC88915/D
◊
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