MPC860ED [MOTOROLA]
Family Hardware Specifications; 系列硬件规格
| 型号： | MPC860ED |
| 厂家： | 
MOTOROLA |
| 描述： | Family Hardware Specifications |
| 文件： | 总76页 (文件大小：805K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Hardware Specification
MPC860EC/D
Rev. 6.1, 11/2002
MPC860 Family
Hardware Specifications
This document contains detailed information on power considerations, DC/AC
electrical characteristics, and AC timing specifications for the MPC860 family.
This document contains the following topics:
Topic
Page
Part I, “Overview”
1
Part II, “Features”
2
Part III, “Maximum Tolerated Ratings”
Part IV, “Thermal Characteristics”
Part V, “Power Dissipation”
6
7
8
Part VI, “DC Characteristics”
9
Part VII, “Thermal Calculation and Measurement”
Part VIII, “Layout Practices”
10
13
13
41
43
65
66
70
74
Part IX, “Bus Signal Timing”
Part X, “IEEE 1149.1 Electrical Specifications”
Part XI, “CPM Electrical Characteristics”
Part XII, “UTOPIA AC Electrical Specifications”
Part XIII, “FEC Electrical Characteristics”
Part XIV, “Mechanical Data and Ordering Information”
Part XV, “Document Revision History”
Part I Overview
The MPC860 Quad Integrated Communications Controller (PowerQUICC™)
is a versatile one-chip integrated microprocessor and peripheral combination
designed for a variety of controller applications. It particularly excels in both
communications and networking systems. The PowerQUICC unit is referred to
as the MPC860 in this manual.
The MPC860 is a derivative of Motorola’s MC68360 Quad Integrated
Communications Controller (QUICC™), referred to here as the QUICC, that
implements the PowerPC architecture. The CPU on the MPC860 is a 32-bit
Features
MPC8xx core that incorporates memory management units (MMUs) and instruction and
data caches and that implements the PowePC instruction set. The communications
processor module (CPM) from the MC68360 QUICC has been enhanced by the addition of
the inter-integrated controller (I2C) channel. The memory controller has been enhanced,
enabling the MPC860 to support any type of memory, including high-performance
memories and new types of DRAMs. A PCMCIA socket controller supports up to two
sockets. A real-time clock has also been integrated.
Table 1 shows the functionality supported by the members of the MPC860 family.
Table 1. MPC860 Family Functionality
Cache (Kbytes)
Ethernet
1
Part
ATM
SCC
Ref.
Instruction
Cache
Data Cache
10T
10/100
MPC860DE
MPC860DT
MPC860DP
MPC860EN
MPC860SR
MPC860T
4
4
4
4
8
4
4
4
8
4
Up to 2
Up to 2
Up to 2
Up to 4
Up to 4
Up to 4
Up to 4
1
—
1
—
2
2
2
4
4
4
4
1
1
yes
yes
—
1,2,3
1,2,3
1
16
4
1
—
—
1
4
yes
yes
yes
yes
1,2
4
1,2,3
1,2,3
4
MPC860P
MPC855T
16
4
1
1
1
Supporting documentation for these devices refers to the following:
1. MPC860 PowerQUICC User’s Manual (MPC860UM/D, Rev. 1).
2. MPC8XX ATM Supplement (MPC860SARUM/AD).
3. MPC860T (Rev. D), Fast Ethernet Controller Supplement (MPC860TREVDSUPP).
4. MPC855T User’s Manual (MPC855TUM/D, Rev. 1).
Part II Features
The following list summarizes the key MPC860 features:
• Embedded single-issue, 32-bit MPC8xx core (implementing the PowerPC
architecture) with thirty-two 32-bit general-purpose registers (GPRs)
— The core performs branch prediction with conditional prefetch, without
conditional execution
— 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1)
– 16-Kbyte instruction caches are four-way, set-associative with 256 sets;
4-Kbyte instruction caches are two-way, set-associative with 128 sets.
– 8-Kbyte data caches are two-way, set-associative with 256 sets; 4-Kbyte data
caches are two-way, set-associative with 128 sets.
– Cache coherency for both instruction and data caches is maintained on 128-bit
(4-word) cache blocks.
2
MPC860 Family Hardware Specifications
MOTOROLA
Features
– Caches are physically addressed, implement a least recently used (LRU)
replacement algorithm, and are lockable on a cache block basis.
— Instruction and data caches are two-way, set-associative, physically addressed,
LRU replacement, and lockable on-line granularity.
— MMUs with 32-entry TLB, fully associative instruction, and data TLBs
— MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16
virtual address spaces and 16 protection groups
— Advanced on-chip-emulation debug mode
• Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
• 32 address lines
• Operates at up to 80 MHz
• Memory controller (eight banks)
— Contains complete dynamic RAM (DRAM) controller
— Each bank can be a chip select or RAS to support a DRAM bank
— Up to 15 wait states programmable per memory bank
— Glueless interface to DRAM, SIMMS, SRAM, EPROM, Flash EPROM, and
other memory devices.
— DRAM controller programmable to support most size and speed memory
interfaces
— Four CAS lines, four WE lines, one OE line
— Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
— Variable block sizes (32 Kbyte to 256 Mbyte)
— Selectable write protection
— On-chip bus arbitration logic
• General-purpose timers
— Four 16-bit timers or two 32-bit timers
— Gate mode can enable/disable counting
— Interrupt can be masked on reference match and event capture
• System integration unit (SIU)
— Bus monitor
— Software watchdog
— Periodic interrupt timer (PIT)
— Low-power stop mode
— Clock synthesizer
MOTOROLA
MPC860 Family Hardware Specifications
3
Features
— Decrementer, time base, and real-time clock (RTC) from the PowerPC
architecture
— Reset controller
— IEEE 1149.1 test access port (JTAG)
• Interrupts
— Seven external interrupt request (IRQ) lines
— 12 port pins with interrupt capability
— 23 internal interrupt sources
— Programmable priority between SCCs
— Programmable highest priority request
• 10/100 Mbps Ethernet support, fully compliant with the IEEE 802.3u Standard (not
available when using ATM over UTOPIA interface)
• ATM support compliant with ATM forum UNI 4.0 specification
— Cell processing up to 50–70 Mbps at 50-MHz system clock
— Cell multiplexing/demultiplexing
— Support ofAAL5 andAAL0 protocols on a per-VC basis. AAL0 support enables
OAM and software implementation of other protocols).
— ATM pace control (APC) scheduler, providing direct support for constant bit rate
(CBR) and unspecified bit rate (UBR) and providing control mechanisms
enabling software support of available bit rate (ABR)
— Physical interface support for UTOPIA (10/100-Mbps is not supported with this
interface) and byte-aligned serial (for example, T1/E1/ADSL)
— UTOPIA-mode ATM supports level-1 master with cell-level handshake,
multi-PHY (up to 4 physical layer devices), connection to 25-, 51-, or 155-Mbps
framers, and UTOPIA/system clock ratios of 1/2 or 1/3.
— Serial-mode ATM connection supports transmission convergence (TC) function
for T1/E1/ADSL lines; cell delineation; cell payload scrambling/descrambling;
automatic idle/unassigned cell insertion/stripping; header error control (HEC)
generation, checking, and statistics.
• Communications processor module (CPM)
— RISC communications processor (CP)
— Communication-specific commands (for example, GRACEFUL STOP TRANSMIT,
ENTER HUNT MODE, and RESTART TRANSMIT)
— Supports continuous mode transmission and reception on all serial channels
— Up to 8Kbytes of dual-port RAM
— 16 serial DMA (SDMA) channels
4
MPC860 Family Hardware Specifications
MOTOROLA
Features
— Three parallel I/O registers with open-drain capability
• Four baud-rate generators (BRGs)
— Independent (can be connected to any SCC or SMC)
— Allow changes during operation
— Autobaud support option
• Four serial communications controllers (SCCs)
— Ethernet/IEEE 802.3 optional on SCC1–4, supporting full 10-Mbps operation
(available only on specially programmed devices).
— HDLC/SDLC (all channels supported at 2 Mbps)
— HDLC bus (implements an HDLC-based local area network (LAN))
— Asynchronous HDLC to support PPP (point-to-point protocol)
— AppleTalk
— Universal asynchronous receiver transmitter (UART)
— Synchronous UART
— Serial infrared (IrDA)
— Binary synchronous communication (BISYNC)
— Totally transparent (bit streams)
— Totally transparent (frame based with optional cyclic redundancy check (CRC))
• Two SMCs (serial management channels)
— UART
— Transparent
— General circuit interface (GCI) controller
— Can be connected to the time-division multiplexed (TDM) channels
• One SPI (serial peripheral interface)
— Supports master and slave modes
— Supports multimaster operation on the same bus
• One I2C (inter-integrated circuit) port
— Supports master and slave modes
— Multiple-master environment support
• Time-slot assigner (TSA)
— Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation
— Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user
defined
— 1- or 8-bit resolution
MOTOROLA
MPC860 Family Hardware Specifications
5
Maximum Tolerated Ratings
— Allows independent transmit and receive routing, frame synchronization,
clocking
— Allows dynamic changes
— Can be internally connected to six serial channels (four SCCs and two SMCs)
• Parallel interface port (PIP)
— Centronics interface support
— Supports fast connection between compatible ports on the MPC860 or the
MC68360
• PCMCIA interface
— Master (socket) interface, release 2.1 compliant
— Supports two independent PCMCIA sockets
— Eight memory or I/O windows supported
• Low power support
— Full on—all units fully powered
— Doze—core functional units disabled, except time base decrementer, PLL,
memory controller, RTC, and CPM in low-power standby
— Sleep—all units disabled, except RTC and PIT, PLL active for fast wake up
— Deep sleep—all units disabled including PLL, except RTC and PIT
— Power down mode— all units powered down, except PLL, RTC, PIT, time base,
and decrementer
• Debug interface
— Eight comparators: four operate on instruction address, two operate on data
address, and two operate on data
— Supports conditions: = ≠ < >
— Each watchpoint can generate a break-point internally
• 3.3 V operation with 5-V TTL compatibility except EXTAL and EXTCLK
• 357-pin ball grid array (BGA) package
Part III Maximum Tolerated Ratings
This section provides the maximum tolerated voltage and temperature ranges for the
MPC860. Table 3-2 provides the maximum ratings.
This device contains circuitry protecting against damage due to high-static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application
of any voltages higher than maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced, if unused inputs are tied to an appropriate logic voltage
level (for example, either GND or Vdd).
6
MPC860 Family Hardware Specifications
MOTOROLA
Thermal Characteristics
Table 3-2. Maximum Tolerated Ratings
(GND = 0 V)
Rating
Symbol
Value
Unit
1
Supply Voltage
V
–0.3 to 4.0
V
V
DDH
V
–0.3 to 4.0
DDL
KAPWR
–0.3 to 4.0
V
VDDSYN
–0.3 to 4.0
V
2
Input Voltage
V
GND – 0.3 to VDDH
V
in
3
Temperature (Standard)
T
0
95
˚C
˚C
˚C
˚C
˚C
A(min)
T
j(max)
3
Temperature (Extended)
T
–40
A(min)
T
95
j(max)
Storage Temperature Range
T
–55 to 150
stg
1
The power supply of the device must start its ramp from 0.0 V.
2
Functional operating conditions are provided with the DC electrical specifications in Table 6-5. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
Caution:All inputs that tolerate 5V cannot be more than 2.5V greater than the supply voltage.This restriction applies
to power-up and normal operation (that is, if the MPC860 is unpowered, voltage greater than 2.5 V must not be
applied to its inputs).
3
Minimum temperatures are guaranteed as ambient temperature, T . Maximum temperatures are guaranteed as
A
junction temperature, T .
j
Part IV Thermal Characteristics
Table 4-3 shows the thermal characteristics for the MPC860.
Table 4-3. MPC860 Thermal Resistance Data
Rev
B, C, D
Rating
Environment
Symbol Rev A
Unit
1
2
Junction to Ambient
Natural Convection
Single layer board (1s)
Four layer board (2s2p)
R
31
20
26
16
8
40
25
32
21
15
7
°C/W
θJA
3
R
θJMA
3
Air Flow (200 ft/min) Single layer board (1s)
Four layer board (2s2p)
R
θJMA
θJMA
3
R
4
Junction to Board
R
θJB
θJC
5
Junction to Case
R
5
Junction to PackageTop Natural Convection
Ψ
1
2
JT
6
Air Flow (200 ft/min)
2
3
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
MOTOROLA
MPC860 Family Hardware Specifications
7
Power Dissipation
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3
Per JEDEC JESD51-6 with the board horizontal.
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction to case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
6
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
Part V Power Dissipation
Table 5-4 provides power dissipation information. The modes are 1:1, where CPU and bus
speeds are equal, and 2:1 mode, where CPU frequency is twice bus speed.
Table 5-4. Power Dissipation (P )
D
1
2
Die Revision
Frequency (MHz)
Typical
Maximum
Unit
A.3 and Previous
25
40
50
33
50
66
50
66
66
80
450
700
870
375
575
750
656
TBD
722
851
550
850
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
1050
TBD
TBD
TBD
735
B.1 and C.1
D.3 and D.4
(1:1 Mode)
TBD
762
D.3 and D.4
(2:1 Mode)
909
1
Typical power dissipation is measured at 3.3 V.
Maximum power dissipation is measured at 3.5 V.
2
NOTE
Values in Table 5-4” represent VDDL-based power dissipation
and do not include I/O power dissipation overVDDH. I/O power
dissipation varies widely by application due to buffer current,
depending on external circuitry.
8
MPC860 Family Hardware Specifications
MOTOROLA
DC Characteristics
Part VI DC Characteristics
Table 6-5 provides the DC electrical characteristics for the MPC860.
Table 6-5. DC Electrical Specifications
Characteristic
Symbol
, V , VDDSYN
Min
Max
Unit
Operating Voltage at 40 MHz or Less
V
3.0
2.0
3.6
3.6
V
V
DDH DDL
KAPWR
(power-down mode)
KAPWR
(all other operating modes)
V
V
– 0.4
V
V
V
V
V
V
DDH
DDH
Operating Voltage Greater than 40 MHz
V
, V
, KAPWR,
3.135
2.0
3.465
DDH DDL
VDDSYN
KAPWR
(power-down mode)
3.6
KAPWR
(all other operating modes)
– 0.4
V
DDH
DDH
Input High Voltage (All Inputs Except EXTAL
and EXTCLK)
V
2.0
5.5
0.8
IH
Input Low Voltage
V
GND
V
V
IL
EXTAL, EXTCLK Input High Voltage
V
0.7 × (V
)
V
+ 0.3
IHC
DDH
DDH
Input Leakage Current, V = 5.5 V (Except
TMS, TRST, DSCK, and DSDI Pins)
I
—
100
10
µA
in
in
In
In
Input Leakage Current, V = 3.6 V (Except
I
—
—
µA
µA
in
TMS, TRST, DSCK, and DSDI Pins)
Input Leakage Current, V = 0 V (Except
I
10
in
TMS, TRST, DSCK, and DSDI Pins)
1
Input Capacitance
C
—
20
—
pF
V
in
Output High Voltage, I = –2.0 mA,
V
2.4
OH
OH
V
= 3.0 V (Except XTAL, XFC, and Open
DDH
Drain Pins)
Output Low Voltage
V
—
0.5
V
OL
IOL = 2.0 mA, CLKOUT
2
IOL = 3.2 mA
IOL = 5.3 mA
3
IOL = 7.0 mA, TXD1/PA14, TXD2/PA12
IOL = 8.9 mA, TS, TA, TEA, BI, BB,
HRESET, SRESET
1
Input capacitance is periodically sampled.
MOTOROLA
MPC860 Family Hardware Specifications
9
Thermal Calculation and Measurement
2
A(0:31), TSIZ0/REG, TSIZ1, D(0:31), DP(0:3)/IRQ(3:6), RD/WR, BURST, RSV/IRQ2, IP_B(0:1)/IWP(0:1)/
VFLS(0:1), IP_B2/IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/VF1, IP_B6/DSDI/AT0,
IP_B7/PTR/AT3, RXD1 /PA15, RXD2/PA13, L1TXDB/PA11, L1RXDB/PA10, L1TXDA/PA9, L1RXDA/PA8,
TIN1/L1RCLKA/BRGO1/CLK1/PA7, BRGCLK1/TOUT1/CLK2/PA6, TIN2/L1TCLKA/BRGO2/CLK3/PA5,
TOUT2/CLK4/PA4, TIN3/BRGO3/CLK5/PA3, BRGCLK2/L1RCLKB/TOUT3/CLK6/PA2, TIN4/BRGO4/CLK7/
PA1, L1TCLKB/TOUT4/CLK8/PA0, REJCT1/SPISEL/PB31, SPICLK/PB30, SPIMOSI/PB29,
BRGO4/SPIMISO/
PB28, BRGO1/I2CSDA/PB27, BRGO2/I2CSCL/PB26, SMTXD1/PB25, SMRXD1/PB24, SMSYN1/SDACK1/
PB23, SMSYN2/SDACK2/PB22, SMTXD2/L1CLKOB/PB21, SMRXD2/L1CLKOA/PB20, L1ST1/RTS1/PB19,
L1ST2/RTS2/PB18, L1ST3/L1RQB/PB17, L1ST4/L1RQA/PB16, BRGO3/PB15, RSTRT1/PB14, L1ST1/RTS1/
DREQ0/PC15, L1ST2/RTS2/DREQ1/PC14, L1ST3/L1RQB/PC13, L1ST4/L1RQA/PC12, CTS1/PC11,
TGATE1/CD1/PC10, CTS2/PC9, TGATE2/CD2/PC8, SDACK2/L1TSYNCB/PC7, L1RSYNCB/PC6, SDACK1/
L1TSYNCA/PC5, L1RSYNCA/PC4, PD15, PD14, PD13, PD12, PD11, PD10, PD9, PD8, PD5, PD6, PD7, PD4,
PD3, MII_MDC, MII_TX_ER, MII_EN, MII_MDIO, MII_TXD[0:3].
3
BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:5), CS(6)/CE(1)_B, CS(7)/CE(2)_B, WE0/BS_B0/IORD,
WE1/BS_B1/IOWR, WE2/BS_B2/PCOE, WE3/BS_B3/PCWE, BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/
GPL_B1, GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A,
CE1_A, CE2_A, ALE_B/DSCK/AT1, OP(0:1), OP2/MODCK1/STS, OP3/MODCK2/DSDO, BADDR(28:30).
Part VII Thermal Calculation and Measurement
For the following discussions, PD = (VDD × IDD) + PI/O, where PI/O is the power
dissipation of the I/O drivers.
7.1 Estimation with Junction-to-Ambient Thermal
Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (ºC)
RθJA = package junction-to-ambient thermal resistance (ºC/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value which provides a
quick and easy estimation of thermal performance. However, the answer is only an
estimate; test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA)
are possible.
7.2 Estimation with Junction-to-Case Thermal
Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a
junction-to-case thermal resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
10
MPC860 Family Hardware Specifications
MOTOROLA
Estimation with Junction-to-Board Thermal Resistance
where:
RθJA = junction-to-ambient thermal resistance (ºC/W)
RθJC = junction-to-case thermal resistance (ºC/W)
RθCA = case-to-ambient thermal resistance (ºC/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal
environment to affect the case-to-ambient thermal resistance, RθCA. For instance, the user
can change the air flow around the device, add a heat sink, change the mounting
arrangement on the printed circuit board, or change the thermal dissipation on the printed
circuit board surrounding the device. This thermal model is most useful for ceramic
packages with heat sinks where some 90% of the heat flows through the case and the heat
sink to the ambient environment. For most packages, a better model is required.
7.3 Estimation with Junction-to-Board Thermal
Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%)
is a two resistor model consisting of a junction-to-board and a junction-to-case thermal
resistance. The junction-to-case covers the situation where a heat sink is used or where a
substantial amount of heat is dissipated from the top of the package. The junction-to-board
thermal resistance describes the thermal performance when most of the heat is conducted
to the printed circuit board. It has been observed that the thermal performance of most
plastic packages and especially PBGA packages is strongly dependent on the board
temperature; see Figure 7-1.
100
9 0
8 0
7 0
6 0
5 0
4 0
3 0
2 0
1 0
0
0
2 0
4 0
6 0
8 0
Board Temperature Rise Above Ambient Divided by Package Power
Figure 7-1. Effect of Board Temperature Rise on Thermal Behavior
MOTOROLA
MPC860 Family Hardware Specifications
11
Estimation Using Simulation
If the board temperature is known, an estimate of the junction temperature in the
environment can be made using the following equation:
TJ = TB + (RθJB × PD)
where:
RθJB = junction-to-board thermal resistance (ºC/W)
TB = board temperature (ºC)
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be
ignored, acceptable predictions of junction temperature can be made. For this method to
work, the board and board mounting must be similar to the test board used to determine the
junction-to-board thermal resistance, namely a 2s2p (board with a power and a ground
plane) and vias attaching the thermal balls to the ground plane.
7.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is
needed. The simple two resistor model can be used with the thermal simulation of the
application [2], or a more accurate and complex model of the package can be used in the
thermal simulation.
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are
available, the thermal characterization parameter (ΨJT) can be used to determine the
junction temperature with a measurement of the temperature at the top center of the
package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
ΨJT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per JEDEC JESD51-2 specification
using a 40 gauge type T thermocouple epoxied to the top center of the package case. The
thermocouple should be positioned so that the thermocouple junction rests on the package.
A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of
wire extending from the junction. The thermocouple wire is placed flat against the package
case to avoid measurement errors caused by cooling effects of the thermocouple wire.
12
MPC860 Family Hardware Specifications
MOTOROLA
References
7.6 References
Semiconductor Equipment and Materials International
805 East Middlefield Rd
(415) 964-5111
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) specifications
(Available from Global Engineering Documents)
800-854-7179 or
303-397-7956
JEDEC Specifications
http://www.jedec.org
1. 1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA
Within anAutomotive Engine Controller Module,” Proceedings of SemiTherm, San
Diego, 1998, pp. 47–54.
2. 2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board
Thermal Resistance and Its Application in Thermal Modeling,” Proceedings of
SemiTherm, San Diego, 1999, pp. 212–220.
Part VIII Layout Practices
Each VDD pin on the MPC860 should be provided with a low-impedance path to the board’s
supply. Each GND pin should likewise be provided with a low-impedance path to ground.
The power supply pins drive distinct groups of logic on chip. The VDD power supply should
be bypassed to ground using at least four 0.1 µF-bypass capacitors located as close as
possible to the four sides of the package. The capacitor leads and associated printed circuit
traces connecting to chip VDD and GND should be kept to less than half an inch per
capacitor lead. A four-layer board is recommended, employing two inner layers as VCC and
GND planes.
All output pins on the MPC860 have fast rise and fall times. Printed circuit (PC) trace
interconnection length should be minimized in order to minimize undershoot and
reflections caused by these fast output switching times. This recommendation particularly
applies to the address and data busses. Maximum PC trace lengths of 6 inches are
recommended. Capacitance calculations should consider all device loads as well as
parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing
becomes especially critical in systems with higher capacitive loads because these loads
create higher transient currents in the VCC and GND circuits. Pull up all unused inputs or
signals that will be inputs during reset. Special care should be taken to minimize the noise
levels on the PLL supply pins.
Part IX Bus Signal Timing
Table 9-6 provides the bus operation timing for the MPC860 at 33, 40, 50, and 66 MHz.
The maximum bus speed supported by the MPC860 is 66 MHz. Higher-speed parts must
be operated in half-speed bus mode (for example, an MPC860 used at 80 MHz must be
configured for a 40 MHz bus).
MOTOROLA
MPC860 Family Hardware Specifications
13
Bus Signal Timing
The timing for the MPC860 bus shown assumes a 50-pF load for maximum delays and a
0-pF load for minimum delays.
Table 9-6. Bus Operation Timings
33 MHz
Min Max
30.30 30.30 25.00 30.30 20.00 30.30 15.15 30.30 ns
40 MHz
50 MHz
66 MHz
Num
Characteristic
Unit
Min Max
Min Max
Min Max
B1 CLKOUT period
B1a EXTCLK to CLKOUT phase skew
(EXTCLK > 15 MHz and MF <= 2)
–0.90 0.90 –0.90 0.90 –0.90 0.90 –0.90 0.90
–2.30 2.30 –2.30 2.30 –2.30 2.30 –2.30 2.30
–0.60 0.60 –0.60 0.60 –0.60 0.60 –0.60 0.60
–2.00 2.00 –2.00 2.00 –2.00 2.00 –2.00 2.00
ns
ns
ns
B1b EXTCLK to CLKOUT phase skew
(EXTCLK > 10 MHz and MF < 10)
B1c CLKOUT phase jitter (EXTCLK >
1
15 MHz and MF <= 2)
1
B1d CLKOUT phase jitter
ns
%
%
1
B1e CLKOUT frequency jitter (MF < 10)
B1f CLKOUT frequency jitter (10 < MF
—
—
0.50
2.00
—
—
0.50
2.00
—
—
0.50
2.00
—
—
0.50
2.00
1
< 500)
1
B1g CLKOUT frequency jitter (MF > 500)
—
—
3.00
0.50
—
—
—
3.00
0.50
—
—
—
3.00
0.50
—
—
—
3.00
0.50
—
%
%
2
B1h Frequency jitter on EXTCLK
B2 CLKOUT pulse width low
B3 CLKOUT width high
12.12
12.12
—
10.00
10.00
—
8.00
8.00
—
6.06
6.06
—
ns
ns
ns
ns
ns
—
—
—
—
3
B4 CLKOUT rise time
4.00
4.00
—
4.00
4.00
—
4.00
4.00
—
4.00
4.00
—
33
3
B5
CLKOUT fall time
—
—
—
—
B7 CLKOUT to A(0:31), BADDR(28:30), 7.58
RD/WR, BURST, D(0:31), DP(0:3)
invalid
6.25
5.00
3.80
B7a CLKOUT to TSIZ(0:1), REG, RSV,
AT(0:3), BDIP, PTR invalid
7.58
—
—
6.25
6.25
—
—
5.00
5.00
—
—
3.80
3.80
—
—
ns
ns
B7b CLKOUT to BR, BG, FRZ,VFLS(0:1), 7.58
VF(0:2) IWP(0:2), LWP(0:1), STS
4
invalid
B8 CLKOUT to A(0:31), BADDR(28:30)
RD/WR, BURST, D(0:31), DP(0:3)
valid
7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns
B8a CLKOUT to TSIZ(0:1), REG, RSV,
AT(0:3) BDIP, PTR valid
7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns
7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns
B8b CLKOUT to BR, BG, VFLS(0:1),
VF(0:2), IWP(0:2), FRZ, LWP(0:1),
4
STS valid
B9 CLKOUT to A(0:31), BADDR(28:30), 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns
RD/WR, BURST, D(0:31), DP(0:3),
TSIZ(0:1), REG, RSV, AT(0:3), PTR
High-Z
14
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
Table 9-6. Bus Operation Timings (continued)
33 MHz
Min Max
7.58 13.58 6.25 12.25 5.00 11.00 3.80 11.29 ns
40 MHz
50 MHz
66 MHz
Num
Characteristic
Unit
Min Max
Min Max
Min
Max
B11 CLKOUT to TS, BB assertion
B11a CLKOUT to TA, BI assertion (when
driven by the memory controller or
PCMCIA interface)
2.50
9.25
2.50
9.25
2.50
9.25
2.50
9.75
ns
B12 CLKOUT to TS, BB negation
7.58 14.33 6.25 13.00 5.00 11.75 3.80
2.50 11.00 2.50 11.00 2.50 11.00 2.50
8.54
9.00
ns
ns
B12a CLKOUT to TA, BI negation (when
driven by the memory controller or
PCMCIA interface)
B13 CLKOUT to TS, BB High-Z
7.58 21.58 6.25 20.25 5.00 19.00 3.80 14.04 ns
2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00 ns
B13a CLKOUT to TA, BI High-Z (when
driven by the memory controller or
PCMCIA interface)
B14 CLKOUT to TEA assertion
B15 CLKOUT to TEA High-Z
2.50 10.00 2.50 10.00 2.50 10.00 2.50
9.00
ns
2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00 ns
B16 TA, BI valid to CLKOUT (setup time) 9.75
—
—
9.75
—
—
9.75
—
—
6.00
4.50
—
—
ns
ns
B16a TEA, KR, RETRY, CR valid to
CLKOUT (setup time)
10.00
10.00
10.00
B16b BB, BG, BR, valid to CLKOUT (setup 8.50
—
—
—
—
—
—
—
8.50
1.00
2.00
6.00
1.00
4.00
2.00
—
—
—
—
—
—
—
8.50
1.00
2.00
6.00
1.00
4.00
2.00
—
—
—
—
—
—
—
4.00
2.00
2.00
6.00
2.00
4.00
2.00
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
5
time)
B17 CLKOUT to TA, TEA, BI, BB, BG, BR 1.00
valid (hold time)
B17a CLKOUT to KR, RETRY, CR valid
(hold time)
2.00
6.00
1.00
4.00
2.00
B18 D(0:31), DP(0:3) valid to CLKOUT
6
rising edge (setup time)
B19 CLKOUT rising edge to D(0:31),
6
DP(0:3) valid (hold time)
B20 D(0:31), DP(0:3) valid to CLKOUT
7
falling edge (setup time)
B21 CLKOUT falling edge to D(0:31),
7
DP(0:3) valid (hold time)
B22 CLKOUT rising edge to CS asserted 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns
GPCM ACS = 00
B22a CLKOUT falling edge to CS asserted
GPCM ACS = 10, TRLX = 0
—
8.00
—
8.00
—
8.00
—
8.00
ns
B22b CLKOUT falling edge to CS asserted 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns
GPCM ACS = 11, TRLX = 0,
EBDF = 0
MOTOROLA
MPC860 Family Hardware Specifications
15
Bus Signal Timing
Table 9-6. Bus Operation Timings (continued)
33 MHz
Min Max
40 MHz
Min Max
50 MHz
Min Max
66 MHz
Min Max
Num
Characteristic
Unit
B22c CLKOUT falling edge to CS asserted 10.86 17.99 8.88 16.00 7.00 14.13 5.18 12.31 ns
GPCM ACS = 11, TRLX = 0,
EBDF = 1
B23 CLKOUT rising edge to CS negated
GPCM read access, GPCM write
access ACS = 00, TRLX = 0, and
CSNT = 0
2.00
8.00
2.00
8.00
2.00
8.00
2.00
8.00
ns
B24 A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 0
5.58
13.15
—
—
—
4.25
10.50
—
—
—
3.00
8.00
—
—
—
1.79
5.58
—
—
—
ns
ns
ns
B24a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 0
B25 CLKOUT rising edge to OE, WE(0:3)
asserted
9.00
9.00
9.00
9.00
B26 CLKOUT rising edge to OE negated 2.00
9.00
—
2.00
9.00
—
2.00
9.00
—
2.00
9.00
—
ns
ns
B27 A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 1
35.88
43.45
—
29.25
23.00
16.94
B27a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 1
—
35.50
—
—
28.00
—
—
20.73
—
—
ns
ns
B28 CLKOUT rising edge to WE(0:3)
negated GPCM write access
CSNT = 0
9.00
9.00
9.00
9.00
B28a CLKOUT falling edge to WE(0:3)
negated GPCM write access
7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns
TRLX = 0, CSNT = 1, EBDF = 0
B28b CLKOUT falling edge to CS negated
GPCM write accessTRLX = 0, CSNT
= 1, ACS = 10, or ACS = 11, EBDF =
0
—
14.33
—
13.00
—
11.75
—
10.54 ns
B28c CLKOUT falling edge to WE(0:3)
negated GPCM write access
10.86 17.99 8.88 16.00 7.00 14.13 5.18 12.31 ns
TRLX = 0, CSNT = 1 write access
TRLX = 0, CSNT = 1, EBDF = 1
B28d CLKOUT falling edge to CS negated
GPCM write accessTRLX = 0, CSNT
= 1, ACS = 10, or ACS = 11, EBDF =
1
—
17.99
—
16.00
—
14.13
—
12.31 ns
B29 WE(0:3) negated to D(0:31), DP(0:3) 5.58
High-Z GPCM write access
—
—
4.25
10.5
—
—
3.00
8.00
—
—
1.79
5.58
—
—
ns
ns
CSNT = 0, EBDF = 0
B29a WE(0:3) negated to D(0:31), DP(0:3) 13.15
High-Z GPCM write access,
TRLX = 0, CSNT = 1, EBDF = 0
16
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
Table 9-6. Bus Operation Timings (continued)
33 MHz
40 MHz
50 MHz
66 MHz
Unit
Num
Characteristic
Min
Max
Min
Max
Min
Max
Min
Max
B29b CS negated to D(0:31), DP(0:3),
High-Z GPCM write access,
5.58
—
4.25
—
3.00
—
1.79
—
ns
ns
ACS = 00, TRLX = 0, and CSNT = 0
B29c CS negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 0, CSNT = 1, ACS = 10, or
ACS = 11, EBDF = 0
13.15
—
10.5
—
8.00
—
5.58
—
B29d WE(0:3) negated to D(0:31), DP(0:3) 43.45
High-Z GPCM write access,
—
—
35.5
35.5
—
—
28.00
28.00
—
—
20.73
29.73
—
—
ns
ns
TRLX = 1, CSNT = 1, EBDF = 0
B29e CS negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 1, CSNT = 1, ACS = 10, or
ACS = 11, EBDF = 0
43.45
B29f WE(0:3) negated to D(0:31), DP(0:3) 8.86
High-Z GPCM write access,
—
—
6.88
6.88
—
—
5.00
5.00
—
—
3.18
3.18
—
—
ns
ns
TRLX = 0, CSNT = 1, EBDF = 1
B29g CS negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 0, CSNT = 1, ACS = 10, or
ACS = 11, EBDF = 1
8.86
B29h WE(0:3) negated to D(0:31), DP(0:3) 38.67
High-Z GPCM write access,
—
—
31.38
31.38
—
—
24.50
24.50
—
—
17.83
17.83
—
—
ns
ns
TRLX = 1, CSNT = 1, EBDF = 1
B29i CS negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 1, CSNT = 1, ACS = 10, or
ACS = 11, EBDF = 1
38.67
B30 CS, WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
5.58
—
—
4.25
—
—
3.00
8.00
—
—
1.79
5.58
—
—
ns
ns
8
access
B30a WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM, write
access, TRLX = 0, CSNT = 1,
13.15
10.50
CS negated to A(0:31) invalid GPCM
write access, TRLX = 0, CSNT =1
ACS = 10, or ACS = 11, EBDF = 0
B30b WE(0:3) negated to A(0:31),
invalid GPCM BADDR(28:30) invalid
GPCM write access, TRLX = 1,
CSNT = 1. CS negated to A(0:31),
Invalid GPCM, write access,
43.45
—
35.50
—
28.00
—
20.73
—
ns
TRLX = 1, CSNT = 1, ACS = 10, or
ACS = 11, EBDF = 0
MOTOROLA
MPC860 Family Hardware Specifications
17
Bus Signal Timing
Table 9-6. Bus Operation Timings (continued)
33 MHz
40 MHz
50 MHz
66 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B30c WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access, TRLX = 0, CSNT = 1.
8.36
—
6.38
31.38
1.50
—
4.50
24.50
1.50
—
2.68
17.83
1.50
—
ns
CS negated to A(0:31) invalid GPCM
write access, TRLX = 0, CSNT = 1,
ACS = 10, ACS = 11, EBDF = 1
B30d WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access, TRLX = 1, CSNT =1.
38.67
—
—
—
—
ns
CS negated to A(0:31) invalid GPCM
write access TRLX = 1, CSNT = 1,
ACS = 10, or ACS = 11, EBDF = 1
B31 CLKOUT falling edge to CS valid—as 1.50
requested by control bit CST4 in the
corresponding word in UPM
6.00
6.00
6.00
6.00
ns
B31a CLKOUT falling edge to CS valid—as 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns
requested by control bit CST1 in the
corresponding word in UPM
B31b CLKOUT rising edge to CS valid—as 1.50
requested by control bit CST2 in the
corresponding word in UPM
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B31c CLKOUT rising edge to CS valid—as 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns
requested by control bit CST3 in the
corresponding word in UPM
B31d CLKOUT falling edge to CS valid—as 13.26 17.99 11.28 16.00 9.40 14.13 7.58 12.31 ns
requested by control bit CST1 in the
corresponding word in UPM, EBDF =
1
B32 CLKOUT falling edge to BS valid—as 1.50
requested by control bit BST4 in the
corresponding word in UPM
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B32a CLKOUT falling edge to BS valid—as 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns
requested by control bit BST1 in the
corresponding word in UPM, EBDF =
0
B32b CLKOUT rising edge to BS valid—as 1.50
requested by control bit BST2 in the
corresponding word in UPM
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B32c CLKOUT rising edge to BS valid—as 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns
requested by control bit BST3 in the
corresponding word in UPM
B32d CLKOUT falling edge to BS valid—as 13.26 17.99 11.28 16.00 9.40 14.13 7.58 12.31 ns
requested by control bit BST1 in the
corresponding word in UPM, EBDF =
1
18
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
Table 9-6. Bus Operation Timings (continued)
33 MHz
40 MHz
50 MHz
66 MHz
Unit
Num
Characteristic
Min
1.50
Max
Min
1.50
Max
Min
1.50
Max
Min
Max
B33 CLKOUT falling edge to GPL
valid—as requested by control bit
GxT4 in the corresponding word in
UPM
6.00
6.00
6.00
1.50
6.00
ns
B33a CLKOUT rising edge to GPL
valid—as requested by control bit
GxT3 in the corresponding word in
UPM
7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns
B34 A(0:31), BADDR(28:30), and D(0:31) 5.58
to CS valid—as requested by control
bit CST4 in the corresponding word in
UPM
—
—
—
—
—
—
—
4.25
10.50
16.75
4.25
—
—
—
—
—
—
—
3.00
8.00
—
—
—
—
—
—
—
1.79
5.58
9.36
1.79
5.58
9.36
1.79
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
B34a A(0:31), BADDR(28:30), and D(0:31) 13.15
to CS valid—as requested by control
bit CST1 in the corresponding word in
UPM
B34b A(0:31), BADDR(28:30), and D(0:31) 20.73
to CS valid—as requested by control
bit CST2 in the corresponding word in
UPM
13.00
3.00
B35 A(0:31), BADDR(28:30) to CS
valid—as requested by control bit
BST4 in the corresponding word in
UPM
5.58
B35a A(0:31), BADDR(28:30), and D(0:31) 13.15
to BS valid—as requested by control
bit BST1 in the corresponding word in
UPM
10.50
16.75
4.25
8.00
B35b A(0:31), BADDR(28:30), and D(0:31) 20.73
to BS valid—as requested by control
bit BST2 in the corresponding word in
UPM
13.00
3.00
B36 A(0:31), BADDR(28:30), and D(0:31) 5.58
to GPL valid—as requested by
control bit GxT4 in the corresponding
word in UPM
B37 UPWAIT valid to CLKOUT falling
6.00
1.00
7.00
—
—
6.00
1.00
—
—
6.00
1.00
—
—
6.00
1.00
—
—
ns
ns
9
edge
B38 CLKOUT falling edge to UPWAIT
9
valid
10
B39 AS valid to CLKOUT rising edge
—
—
7.00
7.00
—
—
7.00
7.00
—
—
7.00
7.00
—
—
ns
ns
B40 A(0:31), TSIZ(0:1), RD/WR, BURST, 7.00
valid to CLKOUT rising edge
MOTOROLA
MPC860 Family Hardware Specifications
19
Bus Signal Timing
Table 9-6. Bus Operation Timings (continued)
33 MHz
40 MHz
50 MHz
66 MHz
Num
Characteristic
Unit
Min
7.00
Max
Min
Max
Min
Max
Min
Max
B41 TS valid to CLKOUT rising edge
(setup time)
—
7.00
2.00
—
—
7.00
2.00
—
—
7.00
2.00
—
—
ns
ns
ns
B42 CLKOUT rising edge toTS valid (hold 2.00
time)
—
—
—
—
B43 AS negation to memory controller
signals negation
—
TBD
TBD
TBD
TBD
1
2
Phase and frequency jitter performance results are only valid if the input jitter is less than the prescribed value.
If the rate of change of the frequency of EXTAL is slow (i.e., it does not jump between the minimum and maximum
values in one cycle) or the frequency of the jitter is fast (i.e., it does not stay at an extreme value for a long time) then
the maximum allowed jitter on EXTAL can be up to 2%.
3
4
The timings specified in B4 and B5 are based on full strength clock.
The timing for BR output is relevant when the MPC860 is selected to work with external bus arbiter.The timing for BG
output is relevant when the MPC860 is selected to work with internal bus arbiter.
5
6
7
The timing required for BR input is relevant when the MPC860 is selected to work with internal bus arbiter.The timing
for BG input is relevant when the MPC860 is selected to work with external bus arbiter.
The D(0:31) and DP(0:3) input timings B18 and B19 refer to the rising edge of the CLKOUT in which the TA input
signal is asserted.
The D(0:31) and DP(0:3) input timings B20 and B21 refer to the falling edge of the CLKOUT.This timing is valid only
for read accesses controlled by chip-selects under control of the UPM in the memory controller, for data beats where
DLT3 = 1 in the UPM RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
8
9
The timing B30 refers to CS when ACS = 00 and to WE(0:3) when CSNT = 0.
The signal UPWAIT is considered asynchronous to the CLKOUT and synchronized internally. The timings specified
in B37 and B38 are specified to enable the freeze of the UPM output signals as described in Figure 9-17.
10
The AS signal is considered asynchronous to the CLKOUT.The timing B39 is specified in order to allow the behavior
specified in Figure 9-20.
Figure 9-2 is the control timing diagram.
20
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
2.0 V
2.0 V
CLKOUT
Outputs
Outputs
Inputs
0.8 V
0.8 V
A
B
2.0 V
0.8 V
2.0 V
0.8 V
A
B
2.0 V
2.0 V
0.8 V
0.8 V
D
C
2.0 V
0.8 V
2.0 V
0.8 V
D
C
2.0 V
0.8 V
2.0 V
0.8 V
Inputs
A
B
C
D
Maximum output delay specification.
Minimum output hold time.
Minimum input setup time specification.
Minimum input hold time specification.
Figure 9-2. Control Timing
Figure 9-3 provides the timing for the external clock.
CLKOUT
B1
B1
B3
B2
B4
B5
Figure 9-3. External Clock Timing
MOTOROLA
MPC860 Family Hardware Specifications
21
Bus Signal Timing
Figure 9-4 provides the timing for the synchronous output signals.
CLKOUT
B8
B7
B9
B9
Output
Signals
B8a
B8b
B7a
B7b
Output
Signals
Output
Signals
Figure 9-4. Synchronous Output Signals Timing
Figure 9-5 provides the timing for the synchronous active pull-up and open-drain output
signals.
CLKOUT
B13
B11
B12
B12a
B15
TS, BB
TA, BI
TEA
B13a
B11a
B14
Figure 9-5. Synchronous Active Pull-Up Resistor and Open-Drain Outputs Signals
Timing
22
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
Figure 9-6 provides the timing for the synchronous input signals.
CLKOUT
B16
B17
TA, BI
B16a
B17a
TEA, KR,
RETRY, CR
B16b
B17
BB, BG, BR
Figure 9-6. Synchronous Input Signals Timing
Figure 9-7 provides normal case timing for input data. It also applies to normal read
accesses under the control of the UPM in the memory controller.
CLKOUT
B16
B17
TA
B18
B19
D[0:31],
DP[0:3]
Figure 9-7. Input Data Timing in Normal Case
Figure 9-8 provides the timing for the input data controlled by the UPM for data beats
where DLT3 = 1 in the UPM RAM words. (This is only the case where data is latched on
the falling edge of CLKOUT.)
MOTOROLA
MPC860 Family Hardware Specifications
23
Bus Signal Timing
CLKOUT
TA
B20
B21
D[0:31],
DP[0:3]
Figure 9-8. Input Data Timing when Controlled by UPM in the Memory Controller
and DLT3 = 1
Figure 9-9 through Figure 9-12 provide the timing for the external bus read controlled by
various GPCM factors.
CLKOUT
B11
B8
B12
TS
A[0:31]
CSx
B22
B23
B25
B26
B19
OE
B28
WE[0:3]
B18
D[0:31],
DP[0:3]
Figure 9-9. External Bus Read Timing (GPCM Controlled—ACS = 00)
24
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
CLKOUT
TS
B11
B8
B12
A[0:31]
CSx
B22a
B24
B23
B25
B26
B19
OE
B18
D[0:31],
DP[0:3]
Figure 9-10. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 10)
CLKOUT
B11
B8
B12
TS
A[0:31]
CSx
B22b
B22c
B23
B24a
B25
B26
B19
OE
B18
D[0:31],
DP[0:3]
Figure 9-11. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 11)
MOTOROLA
MPC860 Family Hardware Specifications
25
Bus Signal Timing
CLKOUT
B11
B12
TS
A[0:31]
CSx
B8
B22a
B23
B27
B26
B19
OE
B27a
B22bB22c
B18
D[0:31],
DP[0:3]
Figure 9-12. External Bus Read Timing (GPCM Controlled—TRLX = 1, ACS = 10,
ACS = 11)
Figure 9-13 through Figure 9-15 provide the timing for the external bus write controlled by
various GPCM factors.
26
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
CLKOUT
TS
B11
B8
B12
B30
A[0:31]
CSx
B22
B23
B25
B28
WE[0:3]
OE
B29b
B29
B26
B8
B9
D[0:31],
DP[0:3]
Figure 9-13. External Bus Write Timing (GPCM Controlled—TRLX = 0, CSNT = 0)
MOTOROLA
MPC860 Family Hardware Specifications
27
Bus Signal Timing
CLKOUT
B11
B8
B12
TS
A[0:31]
CSx
B30aB30c
B28bB28d
B25
B22
B23
B29c B29g
WE[0:3]
OE
B29a
B26
B29f
B28aB28c
B8
B9
D[0:31],
DP[0:3]
Figure 9-14. External Bus Write Timing (GPCM Controlled—TRLX = 0, CSNT = 1)
28
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
CLKOUT
TS
B11
B12
B30b B30d
B8
A[0:31]
CSx
B28b B28d
B22
B23
B29e B29i
B29dB29h
B25
WE[0:3]
OE
B26
B29b
B28a B28c
B8
B9
D[0:31],
DP[0:3]
Figure 9-15. External Bus Write Timing (GPCM Controlled—TRLX = 1, CSNT = 1)
Figure 9-16 provides the timing for the external bus controlled by the UPM.
MOTOROLA
MPC860 Family Hardware Specifications
29
Bus Signal Timing
CLKOUT
B8
A[0:31]
B31a
B31d
B31c
B31b
B31
CSx
B34
B34a
B34b
B32aB32d
B32c
B32b
B32
BS_A[0:3],
BS_B[0:3]
B35 B36
B35b
B35a
B33a
B33
GPL_A[0:5],
GPL_B[0:5]
Figure 9-16. External Bus Timing (UPM Controlled Signals)
Figure 9-17 provides the timing for the asynchronous asserted UPWAIT signal controlled
by the UPM.
30
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
CLKOUT
UPWAIT
CSx
B37
B38
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 9-17. Asynchronous UPWAIT Asserted Detection in UPM Handled Cycles
Timing
Figure 9-18 provides the timing for the asynchronous negated UPWAIT signal controlled
by the UPM.
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 9-18. Asynchronous UPWAIT Negated Detection in UPM Handled Cycles
Timing
Figure 9-19 provides the timing for the synchronous external master access controlled by
the GPCM.
MOTOROLA
MPC860 Family Hardware Specifications
31
Bus Signal Timing
CLKOUT
TS
B41
B40
B42
A[0:31],
TSIZ[0:1],
R/W, BURST
B22
CSx
Figure 9-19. Synchronous External Master Access Timing (GPCM Handled ACS =
00)
Figure 9-20 provides the timing for the asynchronous external master memory access
controlled by the GPCM.
CLKOUT
B39
AS
B40
A[0:31],
TSIZ[0:1],
R/W
B22
CSx
Figure 9-20. Asynchronous External Master Memory Access Timing
(GPCM Controlled—ACS = 00)
Figure 9-21 provides the timing for the asynchronous external master control signals
negation.
32
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
AS
B43
CSx, WE[0:3],
OE, GPLx,
BS[0:3]
Figure 9-21. Asynchronous External Master—Control Signals Negation Timing
Table 9-7 provides interrupt timing for the MPC860.
Table 9-7. Interrupt Timing
All Frequencies
1
Num
Characteristic
Unit
Min
Max
I39
I40
I41
I42
I43
IRQx valid to CLKOUT rising edge (setup time)
IRQx hold time after CLKOUT
IRQx pulse width low
6.00
2.00
3.00
3.00
—
—
—
—
—
ns
ns
ns
ns
—
IRQx pulse width high
IRQx edge-to-edge time
4 × T
CLOCKOUT
1
The timings I39 and I40 describe the testing conditions under which the IRQ lines are tested when being defined as
level sensitive. The IRQ lines are synchronized internally and do not have to be asserted or negated with reference
to the CLKOUT.
The timings I41, I42, and I43 are specified to allow the correct function of the IRQ lines detection circuitry, and has
no direct relation with the total system interrupt latency that the MPC860 is able to support.
Figure 9-22 provides the interrupt detection timing for the external level-sensitive lines.
CLKOUT
I39
I40
IRQx
Figure 9-22. Interrupt Detection Timing for External Level Sensitive Lines
Figure 9-23 provides the interrupt detection timing for the external edge-sensitive lines.
MOTOROLA
MPC860 Family Hardware Specifications
33
Bus Signal Timing
CLKOUT
I41
I42
IRQx
I43
I43
Figure 9-23. Interrupt Detection Timing for External Edge Sensitive Lines
Table 9-8 shows the PCMCIA timing for the MPC860.
Table 9-8. PCMCIA Timing
33 MHz
40 MHz
50 MHz
66 MHz
Num
Characteristic
Unit
Min
20.73
Max
Min
Max
Min
Max
Min
Max
P44 A(0:31), REG valid to PCMCIA
—
16.75
—
13.00
—
9.36
—
ns
1
Strobe asserted
1
P45 A(0:31), REG valid to ALE negation 28.30
—
23.00
—
18.00
—
13.15
—
ns
ns
ns
ns
ns
ns
P46 CLKOUT to REG valid
7.58 15.58 6.25 14.25 5.00 13.00 3.79 11.84
8.58 7.25 6.00 4.84
P47 CLKOUT to REG invalid
—
—
—
—
P48 CLKOUT to CE1, CE2 asserted
P49 CLKOUT to CE1, CE2 negated
7.58 15.58 6.25 14.25 5.00 13.00 3.79 11.84
7.58 15.58 6.25 14.25 5.00 13.00 3.79 11.84
P50 CLKOUT to PCOE, IORD, PCWE,
IOWR assert time
—
11.00
11.00
—
11.00
—
11.00
P51 CLKOUT to PCOE, IORD, PCWE,
IOWR negate time
2.00 11.00 2.00 11.00 2.00 11.00 2.00 11.00
7.58 15.58 6.25 14.25 5.00 13.00 3.79 10.04
ns
P52 CLKOUT to ALE assert time
P53 CLKOUT to ALE negate time
P54 PCWE, IOWR negated to D(0:31)
ns
ns
ns
—
15.58
—
14.25
—
—
13.00
—
—
11.84
—
5.58
4.25
8.00
2.00
3.00
1.79
1
invalid
P55 WAITA and WAITB valid to CLKOUT 8.00
—
—
—
—
8.00
2.00
—
—
8.00
2.00
—
—
ns
ns
1
rising edge
P56 CLKOUT rising edge to WAITA and
2.00
1
WAITB invalid
34
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
1
PSST = 1. Otherwise add PSST times cycle time.
PSHT = 0. Otherwise add PSHT times cycle time.
These synchronous timings define when the WAITx signals are detected in order to freeze
(or relieve) the PCMCIA current cycle. The WAITx assertion will be effective only if it is
detected 2 cycles before the PSL timer expiration. See PCMCIA Interface in the MPC860
PowerQUICC User s Manual.
Figure 9-24 provides the PCMCIA access cycle timing for the external bus read.
CLKOUT
TS
P44
A[0:31]
P46
P48
P45
P47
P49
P51
P52
REG
CE1/CE2
PCOE, IORD
ALE
P50
P53
P52
B18
B19
D[0:31]
Figure 9-24. PCMCIA Access Cycles Timing External Bus Read
Figure 9-25 provides the PCMCIA access cycle timing for the external bus write.
MOTOROLA
MPC860 Family Hardware Specifications
35
Bus Signal Timing
CLKOUT
TS
P44
P45
A[0:31]
P46
P48
P47
P49
P51
P52
B9
REG
CE1/CE2
CWE, IOWR
ALE
P50
P53
B8
P54
P52
D[0:31]
Figure 9-25. PCMCIA Access Cycles Timing External Bus Write
Figure 9-26 provides the PCMCIA WAIT signals detection timing.
CLKOUT
P55
P56
WAITx
Figure 9-26. PCMCIA WAIT Signals Detection Timing
Table 9-9 shows the PCMCIA port timing for the MPC860.
36
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
Table 9-9. PCMCIA Port Timing
33 MHz
40 MHz
50 MHz
66 MHz
Unit
Num
Characteristic
Min
Max
Min
Max
Min
Max
Min
Max
P57 CLKOUT to OPx valid
—
19.00
—
—
19.00
—
—
19.00
—
—
19.00
—
ns
ns
ns
ns
1
P58 HRESET negated to OPx drive
25.73
21.75
5.00
1.00
18.00
5.00
1.00
14.36
5.00
1.00
P59 IP_Xx valid to CLKOUT rising edge 5.00
—
—
—
—
P60 CLKOUT rising edge to IP_Xx
invalid
1.00
—
—
—
—
1
OP2 and OP3 only.
Figure 9-27 provides the PCMCIA output port timing for the MPC860.
CLKOUT
P57
Output
Signals
HRESET
P58
OP2, OP3
Figure 9-27. PCMCIA Output Port Timing
Figure 9-28 provides the PCMCIA output port timing for the MPC860.
CLKOUT
P59
P60
Input
Signals
Figure 9-28. PCMCIA Input Port Timing
Table 9-10 shows the debug port timing for the MPC860.
MOTOROLA
MPC860 Family Hardware Specifications
37
Bus Signal Timing
Table 9-10. Debug Port Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
P61 DSCK cycle time
3 × T
—
—
—
—
ns
ns
ns
ns
ns
CLOCKOUT
P62 DSCK clock pulse width
P63 DSCK rise and fall times
P64 DSDI input data setup time
P65 DSDI data hold time
1.25 × T
CLOCKOUT
0.00
3.00
—
8.00
5.00
0.00
0.00
—
P66 DSCK low to DSDO data valid
P67 DSCK low to DSDO invalid
15.00
2.00
Figure 9-29 provides the input timing for the debug port clock.
DSCK
D61
D62
D61
D62
D63
D63
Figure 9-29. Debug Port Clock Input Timing
Figure 9-30 provides the timing for the debug port.
DSCK
D64
D65
DSDI
D66
D67
DSDO
Figure 9-30. Debug Port Timings
38
MPC860 Family Hardware Specifications
MOTOROLA
Bus Signal Timing
Table 9-11 shows the reset timing for the MPC860.
Table 9-11. Reset Timing
33 MHz
40 MHz
50 MHz
66 MHz
Unit
Num
Characteristic
Min
Max
Min
Max
Min
Max
Min
Max
R69 CLKOUT to HRESET high
impedance
—
—
20.00
—
—
20.00
—
—
20.00
—
20.00
ns
ns
ns
R70 CLKOUT to SRESET high
impedance
20.00
20.00
20.00
—
20.00
R71 RSTCONF pulse width
515.15
—
—
—
—
425.00
—
340.00
—
—
—
—
257.58
—
—
—
—
R72
—
—
—
R73 Configuration data to HRESET rising 504.55
edge setup time
425.00
350.00
277.27
ns
ns
ns
ns
ns
ns
ns
R74 Configuration data to RSTCONF
rising edge setup time
350.00
0.00
0.00
—
—
—
350.00
0.00
—
—
350.00
0.00
0.00
—
—
—
350.00
0.00
0.00
—
—
—
R75 Configuration data hold time after
RSTCONF negation
R76 Configuration data hold time after
HRESET negation
—
0.00
—
—
—
R77 HRESET and RSTCONF asserted to
data out drive
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
R78 RSTCONF negated to data out high
impedance
—
—
—
—
—
R79 CLKOUT of last rising edge before
chip three-state HRESET to data out
high impedance
—
—
—
R80 DSDI, DSCK setup
90.91
0.00
—
—
—
75.00
0.00
—
—
—
60.00
0.00
—
—
—
45.45
0.00
—
—
—
ns
ns
ns
R81 DSDI, DSCK hold time
R82 SRESET negated to CLKOUT rising 242.42
edge for DSDI and DSCK sample
200.00
160.00
121.21
Figure 9-31 shows the reset timing for the data bus configuration.
MOTOROLA
MPC860 Family Hardware Specifications
39
Bus Signal Timing
HRESET
R71
R76
RSTCONF
D[0:31] (IN)
R73
R74
R75
Figure 9-31. Reset Timing—Configuration from Data Bus
Figure 9-32 provides the reset timing for the data bus weak drive during configuration.
CLKOUT
R69
HRESET
R79
RSTCONF
R77
R78
D[0:31] (OUT)
(Weak)
Figure 9-32. Reset Timing—Data Bus Weak Drive During Configuration
Figure 9-33 provides the reset timing for the debug port configuration.
40
MPC860 Family Hardware Specifications
MOTOROLA
IEEE 1149.1 Electrical Specifications
CLKOUT
SRESET
R70
R81
R82
R80
R80
R81
DSCK, DSDI
Figure 9-33. Reset Timing—Debug Port Configuration
Part X IEEE 1149.1 Electrical Specifications
Table 10-12 provides the JTAG timings for the MPC860 shown in Figure 10-34 through
Figure 10-37.
Table 10-12. JTAG Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
J82 TCK cycle time
100.00
40.00
0.00
5.00
25.00
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
J83 TCK clock pulse width measured at 1.5 V
J84 TCK rise and fall times
10.00
—
J85 TMS, TDI data setup time
J86 TMS, TDI data hold time
—
J87 TCK low to TDO data valid
27.00
—
J88 TCK low to TDO data invalid
0.00
—
J89 TCK low to TDO high impedance
J90 TRST assert time
20.00
—
100.00
40.00
—
J91 TRST setup time to TCK low
—
J92 TCK falling edge to output valid
J93 TCK falling edge to output valid out of high impedance
J94 TCK falling edge to output high impedance
J95 Boundary scan input valid to TCK rising edge
J96 TCK rising edge to boundary scan input invalid
50.00
50.00
50.00
—
—
—
50.00
50.00
—
MOTOROLA
MPC860 Family Hardware Specifications
41
IEEE 1149.1 Electrical Specifications
TCK
J82
J83
J82
J83
J84
J84
Figure 10-34. JTAG Test Clock Input Timing
TCK
TMS, TDI
TDO
J85
J86
J87
J88
J89
Figure 10-35. JTAG Test Access Port Timing Diagram
TCK
J91
J90
TRST
Figure 10-36. JTAG TRST Timing Diagram
42
MPC860 Family Hardware Specifications
MOTOROLA
CPM Electrical Characteristics
TCK
J92
J93
J94
Output
Signals
Output
Signals
J95
J96
Output
Signals
Figure 10-37. Boundary Scan (JTAG) Timing Diagram
Part XI CPM Electrical Characteristics
This section provides the AC and DC electrical specifications for the communications
processor module (CPM) of the MPC860.
11.1 PIP/PIO AC Electrical Specifications
Table 11-13 provides the PIP/PIO AC timings as shown in Figure 11-38 through
Figure 11-42.
Table 11-13. PIP/PIO Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
21
22
23
24
25
26
27
28
29
30
31
Data-in setup time to STBI low
0
2.5 – t3
1.5
—
—
—
—
—
—
2
ns
CLK
CLK
ns
1
Data-In hold time to STBI high
STBI pulse width
STBO pulse width
1 CLK – 5 ns
Data-out setup time to STBO low
Data-out hold time from STBO high
STBI low to STBO low (Rx interlock)
STBI low to STBO high (Tx interlock)
Data-in setup time to clock high
Data-in hold time from clock high
Clock low to data-out valid (CPU writes data, control, or direction)
2
5
CLK
CLK
CLK
CLK
ns
—
2
—
—
—
25
15
7.5
—
ns
ns
1
t3 = Specification 23.
MOTOROLA
MPC860 Family Hardware Specifications
43
PIP/PIO AC Electrical Specifications
DATA-IN
21
22
23
STBI
27
24
STBO
Figure 11-38. PIP Rx (Interlock Mode) Timing Diagram
DATA-OUT
25
26
24
STBO
(Output)
28
23
STBI
(Input)
Figure 11-39. PIP Tx (Interlock Mode) Timing Diagram
DATA-IN
21
22
23
24
STBI
(Input)
STBO
(Output)
Figure 11-40. PIP Rx (Pulse Mode) Timing Diagram
44
MPC860 Family Hardware Specifications
MOTOROLA
IDMA Controller AC Electrical Specifications
DATA-OUT
25
26
24
STBO
(Output)
23
STBI
(Input)
Figure 11-41. PIP TX (Pulse Mode) Timing Diagram
CLKO
DATA-IN
29
30
31
DATA-OUT
Figure 11-42. Parallel I/O Data-In/Data-Out Timing Diagram
11.2 IDMA Controller AC Electrical Specifications
Table 11-14 provides the IDMA controller timings as shown in Figure 11-43 through
Figure 11-46.
Table 11-14. IDMA Controller Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
40
41
42
DREQ setup time to clock high
7
3
—
—
12
ns
ns
ns
DREQ hold time from clock high
SDACK assertion delay from clock high
—
MOTOROLA
MPC860 Family Hardware Specifications
45
IDMA Controller AC Electrical Specifications
Table 11-14. IDMA Controller Timing (continued)
All Frequencies
Num
Characteristic
Unit
Min
Max
43
44
45
46
SDACK negation delay from clock low
SDACK negation delay from TA low
SDACK negation delay from clock high
—
—
—
7
12
20
15
—
ns
ns
ns
ns
TA assertion to falling edge of the clock setup time (applies to
external TA)
CLKO
(Output)
41
40
DREQ
(Input)
Figure 11-43. IDMA External Requests Timing Diagram
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
43
DATA
46
TA
(Input)
SDACK
Figure 11-44. SDACK Timing Diagram—Peripheral Write, Externally-Generated TA
46
MPC860 Family Hardware Specifications
MOTOROLA
IDMA Controller AC Electrical Specifications
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
44
DATA
TA
(Output)
SDACK
Figure 11-45. SDACK Timing Diagram—Peripheral Write, Internally-Generated TA
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
45
DATA
TA
(Output)
SDACK
Figure 11-46. SDACK Timing Diagram—Peripheral Read, Internally-Generated TA
MOTOROLA
MPC860 Family Hardware Specifications
47
Baud Rate Generator AC Electrical Specifications
11.3 Baud Rate Generator AC Electrical Specifications
Table 11-15 provides the baud rate generator timings as shown in Figure 11-47.
Table 11-15. Baud Rate Generator Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
50
51
52
BRGO rise and fall time
BRGO duty cycle
BRGO cycle
—
40
40
10
60
—
ns
%
ns
50
50
BRGOX
51
51
52
Figure 11-47. Baud Rate Generator Timing Diagram
11.4 Timer AC Electrical Specifications
Table 11-16 provides the general-purpose timer timings as shown in Figure 11-48.
Table 11-16. Timer Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
61
62
63
64
65
TIN/TGATE rise and fall time
10
1
—
—
—
—
25
ns
TIN/TGATE low time
TIN/TGATE high time
TIN/TGATE cycle time
CLKO low to TOUT valid
CLK
CLK
CLK
ns
2
3
3
48
MPC860 Family Hardware Specifications
MOTOROLA
Serial Interface AC Electrical Specifications
CLKO
60
61
63
62
TIN/TGATE
(Input)
61
64
65
TOUT
(Output)
Figure 11-48. CPM General-Purpose Timers Timing Diagram
11.5 Serial Interface AC Electrical Specifications
Table 11-17 provides the serial interface timings as shown in Figure 11-49 through
Figure 11-53.
Table 11-17. SI Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
1, 2
70
71
L1RCLK, L1TCLK frequency (DSC = 0)
L1RCLK, L1TCLK width low (DSC = 0)
—
SYNCCLK/2.5 MHz
2
P + 10
P + 10
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MHz
3
71a L1RCLK, L1TCLK width high (DSC = 0)
72
73
74
75
76
77
78
L1TXD, L1ST(1–4), L1RQ, L1CLKO rise/fall time
L1RSYNC, L1TSYNC valid to L1CLK edge (SYNC setup time)
L1CLK edge to L1RSYNC, L1TSYNC, invalid (SYNC hold time)
L1RSYNC, L1TSYNC rise/fall time
15.00
—
20.00
35.00
—
—
15.00
—
L1RXD valid to L1CLK edge (L1RXD setup time)
L1CLK edge to L1RXD invalid (L1RXD hold time)
17.00
13.00
10.00
10.00
10.00
10.00
10.00
0.00
—
4
L1CLK edge to L1ST(1–4) valid
45.00
45.00
45.00
55.00
55.00
42.00
78A L1SYNC valid to L1ST(1–4) valid
79
80
L1CLK edge to L1ST(1–4) invalid
L1CLK edge to L1TXD valid
4
80A L1TSYNC valid to L1TXD valid
81
82
L1CLK edge to L1TXD high impedance
L1RCLK, L1TCLK frequency (DSC =1)
—
16.00 or
SYNCCLK/2
MOTOROLA
MPC860 Family Hardware Specifications
49
Serial Interface AC Electrical Specifications
Table 11-17. SI Timing (continued)
All Frequencies
Num
Characteristic
Unit
Min
Max
83
L1RCLK, L1TCLK width low (DSC =1)
P + 10
P + 10
—
—
—
ns
ns
ns
3
83a L1RCLK, L1TCLK width high (DSC = 1)
84
85
L1CLK edge to L1CLKO valid (DSC = 1)
30.00
—
4
L1RQ valid before falling edge of L1TSYNC
1.00
L1TCL
K
2
86
87
88
L1GR setup time
42.00
42.00
—
—
—
ns
ns
ns
L1GR hold time
L1CLK edge to L1SYNC valid (FSD = 00) CNT = 0000, BYT = 0,
DSC = 0)
0.00
1
2
3
4
The ratio SYNCCLK/L1RCLK must be greater than 2.5/1.
These specs are valid for IDL mode only.
Where P = 1/CLKOUT. Thus, for a 25-MHz CLKO1 rate, P = 40 ns.
These strobes and TxD on the first bit of the frame become valid after L1CLK edge or L1SYNC, whichever is later.
L1RCLK
(FE=0, CE=0)
(Input)
71
70
71a
72
L1RCLK
(FE=1, CE=1)
(Input)
RFSD=1
75
74
L1RSYNC
(Input)
73
77
L1RXD
(Input)
BIT0
76
78
79
L1ST(4-1)
(Output)
Figure 11-49. SI Receive Timing Diagram with Normal Clocking (DSC = 0)
50
MPC860 Family Hardware Specifications
MOTOROLA
Serial Interface AC Electrical Specifications
L1RCLK
(FE=1, CE=1)
(Input)
72
83a
82
L1RCLK
(FE=0, CE=0)
(Input)
RFSD=1
75
L1RSYNC
(Input)
73
74
77
L1RXD
(Input)
BIT0
76
78
79
L1ST(4-1)
(Output)
84
L1CLKO
(Output)
Figure 11-50. SI Receive Timing with Double-Speed Clocking (DSC = 1)
MOTOROLA
MPC860 Family Hardware Specifications
51
Serial Interface AC Electrical Specifications
L1TCLK
(FE=0, CE=0)
(Input)
71
70
72
L1TCLK
(FE=1, CE=1)
(Input)
73
TFSD=0
75
74
L1TSYNC
(Input)
80a
BIT0
80
81
L1TXD
(Output)
79
78
L1ST(4-1)
(Output)
Figure 11-51. SI Transmit Timing Diagram (DSC = 0)
52
MPC860 Family Hardware Specifications
MOTOROLA
Serial Interface AC Electrical Specifications
L1RCLK
(FE=0, CE=0)
(Input)
72
83a
82
L1RCLK
(FE=1, CE=1)
(Input)
TFSD=0
75
L1RSYNC
(Input)
73
74
81
L1TXD
(Output)
BIT0
80
78a
79
L1ST(4-1)
(Output)
78
84
L1CLKO
(Output)
Figure 11-52. SI Transmit Timing with Double Speed Clocking (DSC = 1)
MOTOROLA
MPC860 Family Hardware Specifications
53
Serial Interface AC Electrical Specifications
Figure 11-53. IDL Timing
54
MPC860 Family Hardware Specifications
MOTOROLA
SCC in NMSI Mode Electrical Specifications
11.6 SCC in NMSI Mode Electrical Specifications
Table 11-18 provides the NMSI external clock timing.
Table 11-18. NMSI External Clock Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
1
100 RCLK1 and TCLK1 width high
1/SYNCCLK
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
101 RCLK1 and TCLK1 width low
1/SYNCCLK + 5
102 RCLK1 and TCLK1 rise/fall time
—
15.00
50.00
50.00
—
103 TXD1 active delay (from TCLK1 falling edge)
104 RTS1 active/inactive delay (from TCLK1 falling edge)
105 CTS1 setup time to TCLK1 rising edge
106 RXD1 setup time to RCLK1 rising edge
0.00
0.00
5.00
5.00
5.00
5.00
—
2
107 RXD1 hold time from RCLK1 rising edge
—
108 CD1 setup Time to RCLK1 rising edge
—
1
2
The ratios SYNCCLK/RCLK1 and SYNCCLK/TCLK1 must be greater than or equal to 2.25/1.
Also applies to CD and CTS hold time when they are used as an external sync signal.
Table 11-19 provides the NMSI internal clock timing.
Table 11-19. NMSI Internal Clock Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
1
100 RCLK1 and TCLK1 frequency
0.00
—
SYNCCLK/3
MHz
ns
102 RCLK1 and TCLK1 rise/fall time
—
30.00
30.00
—
103 TXD1 active delay (from TCLK1 falling edge)
104 RTS1 active/inactive delay (from TCLK1 falling edge)
105 CTS1 setup time to TCLK1 rising edge
106 RXD1 setup time to RCLK1 rising edge
0.00
0.00
40.00
40.00
0.00
40.00
ns
ns
ns
—
ns
2
107 RXD1 hold time from RCLK1 rising edge
—
ns
108 CD1 setup time to RCLK1 rising edge
—
ns
1
2
The ratios SYNCCLK/RCLK1 and SYNCCLK/TCLK1 must be greater or equal to 3/1.
Also applies to CD and CTS hold time when they are used as an external sync signals.
Figure 11-54 through Figure 11-56 show the NMSI timings.
MOTOROLA
MPC860 Family Hardware Specifications
55
SCC in NMSI Mode Electrical Specifications
RCLK1
102
102
101
106
100
RxD1
(Input)
107
108
CD1
(Input)
107
CD1
(SYNC Input)
Figure 11-54. SCC NMSI Receive Timing Diagram
TCLK1
102
102
101
100
TxD1
(Output)
103
105
RTS1
(Output)
104
104
CTS1
(Input)
107
CTS1
(SYNC Input)
Figure 11-55. SCC NMSI Transmit Timing Diagram
56
MPC860 Family Hardware Specifications
MOTOROLA
Ethernet Electrical Specifications
TCLK1
102
102
101
100
TxD1
(Output)
103
RTS1
(Output)
104
107
104
105
CTS1
(Echo Input)
Figure 11-56. HDLC Bus Timing Diagram
11.7 Ethernet Electrical Specifications
Table 11-20 provides the Ethernet timings as shown in Figure 11-57 through Figure 11-61.
Table 11-20. Ethernet Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
120 CLSN width high
121 RCLK1 rise/fall time
122 RCLK1 width low
123 RCLK1 clock period
124 RXD1 setup time
125 RXD1 hold time
40
—
—
15
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
40
80
20
5
1
120
—
—
126 RENA active delay (from RCLK1 rising edge of the last data bit)
127 RENA width low
10
100
—
—
—
128 TCLK1 rise/fall time
15
—
129 TCLK1 width low
40
99
10
10
10
1
130 TCLK1 clock period
101
50
50
50
131 TXD1 active delay (from TCLK1 rising edge)
132 TXD1 inactive delay (from TCLK1 rising edge)
133 TENA active delay (from TCLK1 rising edge)
MOTOROLA
MPC860 Family Hardware Specifications
57
Ethernet Electrical Specifications
Table 11-20. Ethernet Timing (continued)
All Frequencies
Num
Characteristic
Unit
Min
Max
134 TENA inactive delay (from TCLK1 rising edge)
135 RSTRT active delay (from TCLK1 falling edge)
136 RSTRT inactive delay (from TCLK1 falling edge)
137 REJECT width low
10
10
10
1
50
50
50
—
20
20
ns
ns
ns
CLK
ns
2
138 CLKO1 low to SDACK asserted
—
—
2
139 CLKO1 low to SDACK negated
ns
1
2
The ratios SYNCCLK/RCLK1 and SYNCCLK/TCLK1 must be greater or equal to 2/1.
SDACK is asserted whenever the SDMA writes the incoming frame DA into memory.
CLSN(CTS1)
(Input)
120
Figure 11-57. Ethernet Collision Timing Diagram
RCLK1
121
121
124
123
Last Bit
RxD1
(Input)
125
126
127
RENA(CD1)
(Input)
Figure 11-58. Ethernet Receive Timing Diagram
58
MPC860 Family Hardware Specifications
MOTOROLA
Ethernet Electrical Specifications
TCLK1
128
128
129
131
121
TxD1
(Output)
132
133
134
TENA(RTS1)
(Input)
RENA(CD1)
(Input)
(NOTE 2)
NOTES:
1. Transmit clock invert (TCI) bit in GSMR is set.
2. If RENA is deasserted before TENA, or RENA is not asserted at all during transmit, then the
CSL bit is set in the buffer descriptor at the end of the frame transmission.
Figure 11-59. Ethernet Transmit Timing Diagram
RCLK1
RxD1
(Input)
0
1
1
BIT1
125
BIT2
136
Start Frame
RSTRT
(Output)
Figure 11-60. CAM Interface Receive Start Timing Diagram
REJECT
137
Figure 11-61. CAM Interface REJECT Timing Diagram
MOTOROLA
MPC860 Family Hardware Specifications
59
SMC Transparent AC Electrical Specifications
11.8 SMC Transparent AC Electrical Specifications
Table 11-21 provides the SMC transparent timings as shown in Figure 11-62.
Table 11-21. SMC Transparent Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
1
150 SMCLK clock period
151 SMCLK width low
151A SMCLK width high
152 SMCLK rise/fall time
100
50
50
—
10
20
5
—
—
—
15
50
—
—
ns
ns
ns
ns
ns
ns
ns
153 SMTXD active delay (from SMCLK falling edge)
154 SMRXD/SMSYNC setup time
155 RXD1/SMSYNC hold time
1
SYNCCLK must be at least twice as fast as SMCLK.
SMCLK
152
152
151
151
150
SMTXD
(Output)
NOTE
154
153
155
SMSYNC
154
155
SMRXD
(Input)
NOTE:
1. This delay is equal to an integer number of character-length clocks.
Figure 11-62. SMC Transparent Timing Diagram
11.9 SPI Master AC Electrical Specifications
Table 11-22 provides the SPI master timings as shown in Figure 11-63 and Figure 11-64.
60
MPC860 Family Hardware Specifications
MOTOROLA
SPI Master AC Electrical Specifications
Table 11-22. SPI Master Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
160 MASTER cycle time
4
2
1024
512
—
t
t
cyc
161 MASTER clock (SCK) high or low time
162 MASTER data setup time (inputs)
163 Master data hold time (inputs)
164 Master data valid (after SCK edge)
165 Master data hold time (outputs)
166 Rise time output
cyc
50
0
ns
ns
ns
ns
ns
ns
—
—
0
20
—
—
—
15
167 Fall time output
15
SPICLK
(CI=0)
(Output)
161
163
167
166
167
161
160
SPICLK
(CI=1)
(Output)
162
166
Data
165
SPIMISO
(Input)
msb
167
lsb
msb
164
166
SPIMOSI
(Output)
msb
Data
lsb
msb
Figure 11-63. SPI Master (CP = 0) Timing Diagram
MOTOROLA
MPC860 Family Hardware Specifications
61
SPI Slave AC Electrical Specifications
SPICLK
(CI=0)
(Output)
161
167
166
167
161
160
SPICLK
(CI=1)
(Output)
163
162
166
SPIMISO
(Input)
msb
167
Data
165
lsb
msb
164
166
SPIMOSI
(Output)
msb
Data
lsb
msb
Figure 11-64. SPI Master (CP = 1) Timing Diagram
11.10SPI Slave AC Electrical Specifications
Table 11-23 provides the SPI slave timings as shown in Figure 11-65 and Figure 11-66.
Table 11-23. SPI Slave Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
170 Slave cycle time
2
—
—
—
—
—
—
—
50
t
cyc
171 Slave enable lead time
172 Slave enable lag time
15
15
1
ns
ns
173 Slave clock (SPICLK) high or low time
174 Slave sequential transfer delay (does not require deselect)
175 Slave data setup time (inputs)
t
cyc
cyc
1
t
20
20
—
ns
ns
ns
176 Slave data hold time (inputs)
177 Slave access time
62
MPC860 Family Hardware Specifications
MOTOROLA
SPI Slave AC Electrical Specifications
SPISEL
(Input)
172
171
174
SPICLK
(CI=0)
(Input)
173
182
181
173
170
SPICLK
(CI=1)
(Input)
177
181
182
180
178
SPIMISO
(Output)
msb
175
Data
lsb
Undef
msb
msb
179
176
181 182
lsb
SPIMOSI
(Input)
msb
Data
Figure 11-65. SPI Slave (CP = 0) Timing Diagram
SPISEL
(Input)
172
174
171
170
SPICLK
(CI=0)
(Input)
173
182
181
182
173
181
SPICLK
(CI=1)
(Input)
177
180
178
SPIMISO
(Output)
msb
msb
msb
Undef
175
Data
lsb
179
176
msb
181 182
Data
SPIMOSI
(Input)
lsb
Figure 11-66. SPI Slave (CP = 1) Timing Diagram
MOTOROLA
MPC860 Family Hardware Specifications
63
I2C AC Electrical Specifications
2
11.11I C AC Electrical Specifications
Table 11-24 provides the I2C (SCL < 100 kHz) timings.
2
Table 11-24. I C Timing (SCL < 100 kHZ)
All Frequencies
Num
Characteristic
Unit
Min
Max
200 SCL clock frequency (slave)
200 SCL clock frequency (master)
0
100
100
—
kHz
kHz
µs
µs
µs
µs
µs
µs
ns
1
1.5
4.7
4.7
4.0
4.7
4.0
0
202 Bus free time between transmissions
203 Low period of SCL
—
204 High period of SCL
205 Start condition setup time
206 Start condition hold time
207 Data hold time
—
—
—
—
208 Data setup time
250
—
—
209 SDL/SCL rise time
1
µs
ns
210 SDL/SCL fall time
—
300
—
211 Stop condition setup time
4.7
µs
1
SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3 × pre_scaler × 2).
The ratio SYNCCLK/(BRGCLK / pre_scaler) must be greater or equal to 4/1.
Table 11-25 provides the I2C (SCL > 100 kHz) timings.
2
Table 11-25. . I C Timing (SCL > 100 kHZ)
All Frequencies
Num
Characteristic
Expression
Unit
Min
Max
200 SCL clock frequency (slave)
200 SCL clock frequency (master)
fSCL
fSCL
0
BRGCLK/48
Hz
Hz
s
1
BRGCLK/16512
1/(2.2 * fSCL)
1/(2.2 * fSCL)
1/(2.2 * fSCL)
1/(2.2 * fSCL)
1/(2.2 * fSCL)
0
BRGCLK/48
202 Bus free time between transmissions
203 Low period of SCL
—
—
s
204 High period of SCL
205 Start condition setup time
206 Start condition hold time
207 Data hold time
—
s
—
s
—
s
—
—
s
208 Data setup time
1/(40 * fSCL)
—
s
209 SDL/SCL rise time
1/(10 * fSCL)
1/(33 * fSCL)
—
s
210 SDL/SCL fall time
—
s
211 Stop condition setup time
1/2(2.2 * fSCL)
s
64
MPC860 Family Hardware Specifications
MOTOROLA
UTOPIA AC Electrical Specifications
1
SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3) × pre_scaler × 2).
The ratio SYNCCLK/(BRGCLK / pre_scaler) must be greater or equal to 4/1.
Figure 11-67 shows the I2C bus timing.
SDA
202
203
204
208
205
207
SCL
206
209
210
211
2
Figure 11-67. I C Bus Timing Diagram
Part XII UTOPIA AC Electrical Specifications
Table 12-26 shows the AC electrical specifications for the UTOPIA interface.
Table 12-26. UTOPIA AC Electrical Specifications
Num
Signal Characteristic
Direction
Min
Max
Unit
U1
UtpClk rise/fall time (Internal clock option)
Output
—
50
—
—
40
—
2
3.5
50
50
3.5
60
50
16
—
ns
%
Duty cycle
Frequency
MHz
ns
U1a UtpClk rise/fall time (external clock option)
Input
Duty cycle
Frequency
%
MHz
ns
U2
U3
U4
U5
RxEnb and TxEnb active delay
Output
Input
UTPB, SOC, Rxclav and Txclav setup time
UTPB, SOC, Rxclav and Txclav hold time
8
ns
Input
1
—
ns
UTPB, SOC active delay (and PHREQ and PHSEL active delay
in MPHY mode)
Output
2
16
ns
Figure 12-68 shows signal timings during UTOPIA receive operations.
MOTOROLA
MPC860 Family Hardware Specifications
65
FEC Electrical Characteristics
U1
U1
UtpClk
U5
PHREQn
U3
U4
RxClav
HighZ at MPHY
U2
RxEnb
UTPB
SOC
U3
U4
Figure 12-68. UTOPIA Receive Timing
Figure 12-69 shows signal timings during UTOPIA transmit operations.
U1
U1
UtpClk
U5
PHSELn
U3
U4
TxClav
Y
HighZ at MPHY
U2
TxEnb
UTPB
SOC
U5
Figure 12-69. UTOPIA Transmit Timing
Part XIII FEC Electrical Characteristics
This section provides theAC electrical specifications for the Fast Ethernet controller (FEC).
Note that the timing specifications for the MII signals are independent of system clock
frequency (part speed designation). Also, MII signals use TTL signal levels compatible
with devices operating at either 5.0 V or 3.3 V.
66
MPC860 Family Hardware Specifications
MOTOROLA
MII Receive Signal Timing (MII_RXD[3:0], MII_RX_DV, MII_RX_ER, MII_RX_CLK)
13.1 MII Receive Signal Timing (MII_RXD[3:0],
MII_RX_DV, MII_RX_ER, MII_RX_CLK)
The receiver functions correctly up to a MII_RX_CLK maximum frequency of 25 MHz
+1%. There is no minimum frequency requirement. In addition, the processor clock
frequency must exceed the MII_RX_CLK frequency – 1%.
Table 13-27 provides information on the MII receive signal timing.
Table 13-27. MII Receive Signal Timing
Num
Characteristic
Min
Max
Unit
M1
M2
M3
MII_RXD[3:0], MII_RX_DV, MII_RX_ER to MII_RX_CLK setup
MII_RX_CLK to MII_RXD[3:0], MII_RX_DV, MII_RX_ER hold
MII_RX_CLK pulse width high
5
5
—
—
ns
ns
35%
65%
MII_RX_CLK
period
M4
MII_RX_CLK pulse width low
35%
65%
MII_RX_CLK
period
Figure 13-70 shows MII receive signal timing.
M3
MII_RX_CLK (Input)
M4
MII_RXD[3:0] (Inputs)
MII_RX_DV
MII_RX_ER
M1
M2
Figure 13-70. MII Receive Signal Timing Diagram
13.2 MII Transmit Signal Timing (MII_TXD[3:0],
MII_TX_EN, MII_TX_ER, MII_TX_CLK)
The transmitter functions correctly up to a MII_TX_CLK maximum frequency of
25 MHz +1%. There is no minimum frequency requirement. In addition, the processor
clock frequency must exceed the MII_TX_CLK frequency – 1%.
Table 13-28 provides information on the MII transmit signal timing.
MOTOROLA
MPC860 Family Hardware Specifications
67
MII Async Inputs Signal Timing (MII_CRS, MII_COL)
Table 13-28. MII Transmit Signal Timing
Num
Characteristic
Min
Max
Unit
M5
M6
M7
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER invalid
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER valid
MII_TX_CLK pulse width high
5
—
25
ns
—
35
65%
MII_TX_CLK
period
M8
MII_TX_CLK pulse width low
35%
65%
MII_TX_CLK
period
Figure 13-71 shows the MII transmit signal timing diagram.
M7
MII_TX_CLK (Input)
M5
M8
MII_TXD[3:0] (Outputs)
MII_TX_EN
MII_TX_ER
M6
Figure 13-71. MII Transmit Signal Timing Diagram
13.3 MII Async Inputs Signal Timing (MII_CRS,
MII_COL)
Table 13-29 provides information on the MII async inputs signal timing.
Table 13-29. MII Async Inputs Signal Timing
Num
Characteristic
Min
Max
Unit
M9
MII_CRS, MII_COL minimum pulse width
1.5
—
MII_TX_CLK
period
Figure 13-72 shows the MII asynchronous inputs signal timing diagram.
MII_CRS, MII_COL
M9
Figure 13-72. MII Async Inputs Timing Diagram
68
MPC860 Family Hardware Specifications
MOTOROLA
MII Serial Management Channel Timing (MII_MDIO, MII_MDC)
13.4 MII Serial Management Channel Timing
(MII_MDIO, MII_MDC)
Table 13-30 provides information on the MII serial management channel signal timing. The
FEC functions correctly with a maximum MDC frequency in excess of 2.5 MHz. The exact
upper bound is under investigation.
Table 13-30. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
M10 MII_MDC falling edge to MII_MDIO output invalid (minimum
propagation delay)
0
—
ns
M11 MII_MDC falling edge to MII_MDIO output valid (max prop delay)
M12 MII_MDIO (input) to MII_MDC rising edge setup
M13 MII_MDIO (input) to MII_MDC rising edge hold
M14 MII_MDC pulse width high
—
10
25
—
ns
ns
ns
0
—
40%
60%
MII_MDC
period
M15 MII_MDC pulse width low
40%
60%
MII_MDC
period
Figure 13-73 shows the MII serial management channel timing diagram.
M14
MM15
MII_MDC (Output)
M10
MII_MDIO (Output)
M11
MII_MDIO (Input)
M12
M13
Figure 13-73. MII Serial Management Channel Timing Diagram
MOTOROLA
MPC860 Family Hardware Specifications
69
Mechanical Data and Ordering Information
Part XIV Mechanical Data and Ordering
Information
Table 14-31 provides information on the MPC860 revision D.3 and D.4 derivative devices.
Table 14-31. MPC860 Family Revision D.3 and D.4 Derivatives
2
Number of Ethernet Support
Multi-Channel
HDLC Support
ATM
Support
Device
1
SCCs
(Mbps)
MPC855T
MPC860DE
MPC860DT
MPC860DP
MPC860EN
MPC860SR
MPC860T
1
2
10/100
10
yes
N/A
Yes
Yes
N/A
Yes
Yes
Yes
yes
N/A
Yes
Yes
N/A
Yes
Yes
Yes
10/100
10/100
10
4
10
10/100
10/100
MPC860P
1
2
Serial communications controller (SCC).
Up to 4 channels at 40 MHz or 2 channels at 25 MHz.
Table 14-32 identifies the packages and operating frequencies available for the MPC860.
Table 14-32. MPC860 Family Package/Frequency Availability
Frequency
(MHz)
Temperature
(Tj)
Package Type
Order Number
70
MPC860 Family Hardware Specifications
MOTOROLA
Mechanical Data and Ordering Information
Table 14-32. MPC860 Family Package/Frequency Availability (continued)
1
Ball grid array
(ZP suffix)
50
66
80
50
66
0° to 95°C
0° to 95°C
0° to 95°C
XPC860DEZP50nn
XPC860DTZP50nn
XPC860ENZP50nn
XPC860SRZP50nn
XPC860TZP50nn
XPC855TZP50D4
XPC860DEZP66nn
XPC860DTZP66nn
XPC860ENZP66nn
XPC860SRZP66nn
XPC860TZP66nn
XPC855TZP66D4
XPC860DEZP80nn
XPC860DTZP80nn
XPC860ENZP80nn
XPC860SRZP80nn
XPC860TZP80nn
XPC855TZP80D4
Ball grid array
(CZP suffix)
–40° to 95°C XPC860DECZP50nn
XPC860DTCZP50nn
XPC860ENCZP50nn
XPC860SRCZP50nn
XPC860TCZP50nn
XPC855TCZP50D4
–40° to 95°C XPC860DECZP66nn
XPC860DTCZP66nn
XPC860ENCZP66nn
XPC860SRCZP66nn
XPC860TCZP66nn
XPC855TCZP66D4
1
Where nn specifies version D.3 (as D3) or D.4 (as D4).
Table 14-33 identifies the packages and operating frequencies available for the MPC860P.
Table 14-33. MPC860P Package/Frequency Availability
Frequency
(MHz)
Temperature
(Tj)
Package Type
Order Number
1
Ball grid array
(ZP suffix)
50
66
80
50
66
0° to 95°C
0° to 95°C
0° to 95°C
XPC860DPZP50nn
XPC860PZP50nn
XPC860DPZP66nn
XPC860PZP66nn
XPC860DPZP80nn
XPC860PZP80nn
Ball grid array
(CZP suffix)
–40° to 95°C XPC860DPCZP50nn
XPC860PCZP50nn
–40° to 95°C XPC860DPCZP66nn
XPC860PCZP66nn
1
Where nn specifies version D.3 (as D3) or D.4 (as D4).
MOTOROLA
MPC860 Family Hardware Specifications
71
Pin Assignments
14.1 Pin Assignments
Figure 14-74 shows the top view pinout of the PBGA package. For additional information,
see the MPC860 PowerQUICC User’s Manual, or the MPC855T User’s Manual.
NOTE:This is the top view of the device.
W
PD10 PD8
PD14 PD13 PD9
PA0 PB14 PD15
PD3
IRQ7 D0
D4
D1
D2
D3
D5
VDDL
D20
D6
D7
D29
DP1
DP2 CLKOUT IPA3
V
U
T
VSSSYN1
N/C
PD6 M_Tx_EN IRQ0 D13
D27
D10
D14
D18
D24
D28
DP3
DP0
PD4
PD5 IRQ1
D8
D23
D17
D11
D9
D16
D15
D19
D22
D21
D25
D26
D31
D30 IPA5 IPA4 IPA2
IPA6 IPA0 IPA1 IPA7
N/C VSSSYN
XFC VDDSYN
PA1
PC6
PC5 PC4 PD11
PA2 PB15 PD12
PD7 VDDH D12
VDDH
R
P
N
M
L
VDDH
WAIT_B WAIT_A
VDDL RSTCONF
KAPWR
PORESET
SRESET
PA4 PB17 PA3 VDDL
PB19 PA5 PB18 PB16
GND
GND
XTAL
TEXP
HRESET
EXTCLK EXTAL
PA7
PC8
PA6
PC7
BADDR28
AS
MODCK2
OP0
BADDR29
VDDL
PB22 PC9
PA8 PB20
OP1 MODCK1
K
J
PC10 PA9 PB23 PB21
PC11 PB24 PA10 PB25
GND
BADDR30 IPB6 ALEA IRQ4
IPB5 IPB1 IPB2 ALEB
M_COL IRQ2 IPB0 IPB7
H
G
F
VDDL M_MDIO TDI
TCK
TRST TMS TDO PA11
PB26 PC12 PA12 VDDL
PB27 PC13 PA13 PB29
PB28 PC14 PA14 PC15
BR
VDDL
CS3
IRQ6 IPB4 IPB3
GND
GND
TS
BI
IRQ3 BURST
VDDH
VDDH
CS6
E
D
C
B
A
BG
BB
A8
A9
N/C
A12
A13
N/C
A16
A17
A15
A20
A21
A19
A24
A23
A25
A18 BSA0 GPLA0 N/C
CS2 GPLA5 BDIP TEA
PB30 PA15 PB31
A3
A6
A26 TSIZ1 BSA1 WE0 GPLA1 GPLA3 CS7
CS0
TA GPLA4
A0
19
A1
A4
A10
A22 TSIZ0 BSA3 M_CRS WE2 GPLA2 CS5 CE1A WR GPLB4
A2
18
A5
17
A7
16
A11
15
A14
14
A27
13
A29
12
A30
11
A28
10
A31 VDDL BSA2 WE1 WE3 CS4 CE2A CS1
9
8
7
6
5
4
3
2
1
Figure 14-74. Pinout of the PBGA Package
72
MPC860 Family Hardware Specifications
MOTOROLA
Mechanical Dimensions of the PBGA Package
14.2 Mechanical Dimensions of the PBGA Package
For more information on the printed circuit board layout of the PBGA package, including
thermal via design and suggested pad layout, please refer to Motorola Application Note,
Plastic Ball Grid Array (order number: AN1231/D), available from your local Motorola
sales office. Figure 14-75 shows the mechanical dimensions of the PBGA package.
C
0.2
4X
0.2 C
0.25 C
0.35 C
D
A
E2
E
D2
B
TOP VIEW
A2
A3
A1
A
D1
SIDE VIEW
18X e
NOTES:
1. Dimensions and tolerancing per ASME Y14.5M, 1994.
2. Dimensions in millimeters.
W
V
U
T
3. Dimension b is the maximum solder ball diameter
measured parallel to datum C.
R
P
N
M
L
K
J
E1
H
G
F
MILLIMETERS
E
D
C
B
A
DIM MIN
MAX
2.05
0.70
1.35
0.90
0.90
A
A1
A2
A3
b
---
0.50
0.95
0.70
0.60
1
3
5
7
9
11 13 15 17 19
2
4 6 8 10 12 14 16 18
357X
b
BOTTOM VIEW
M
0.3
C A B
C
D
25.00 BSC
22.86 BSC
M
0.15
D1
D2
e
22.40
22.60
1.27 BSC
25.00 BSC
22.86 BSC
E
E1
E2
22.40
22.60
Case No. 1103-01
Figure 14-75. Mechanical Dimensions and Bottom Surface Nomenclature
of the PBGA Package
MOTOROLA
MPC860 Family Hardware Specifications
73
Document Revision History
Part XV Document Revision History
Table 15-34 lists significant changes between revisions of this document.
Table 15-34. Document Revision History
Revision
5.1
Date
Change
11/2001
Revised template format, removed references to MAC functionality, changed Table 9-6
B23 max value @ 66 Mhz from 2ns to 8ns, added this revision history table
6
10/2002
11/2002
Added the MPC855T. Corrected Figure 9-25 on page 36.
6.1
Corrected UTOPIA RXenb* and TXenb* timing values. Changed incorrect usage of Vcc
to Vdd. Corrected dual port RAM to 8Kbytes.
74
MPC860 Family Hardware Specifications
MOTOROLA
Document Revision History
THIS PAGE INTENTIONALLY LEFT BLANK
MOTOROLA
MPC860 Family Hardware Specifications
75
HOW TO REACH US:
USA/EUROPE/LOCATIONS NOT LISTED:
Motorola Literature Distribution
P.O. Box 5405, Denver, Colorado 80217
1-303-675-2140 or 1-800-441-2447
JAPAN:
Motorola Japan Ltd.
SPS, Technical Information Center
3-20-1, Minami-Azabu Minato-ku
Tokyo 106-8573 Japan
81-3-3440-3569
Information in this document is provided solely to enable system and software implementers to use
Motorola products.There are no express or implied copyright licenses granted hereunder to design
or fabricate any integrated circuits or integrated circuits based on the information in this document.
ASIA/PACIFIC:
Motorola Semiconductors H.K. Ltd.
Silicon Harbour Centre, 2 Dai King Street
Tai Po Industrial Estate, Tai Po, N.T., Hong Kong
852-26668334
Motorola reserves the right to make changes without further notice to any products herein.
Motorola makes no warranty, representation or guarantee regarding the suitability of its products
for any particular purpose, nor does Motorola assume any liability arising out of the application or
use of any product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters which may be provided in
Motorola data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated
for each customer application by customer’s technical experts. Motorola does not convey any
license under its patent rights nor the rights of others. Motorola products are not designed,
intended, or authorized for use as components in systems intended for surgical implant into the
body, or other applications intended to support or sustain life, or for any other application in which
the failure of the Motorola product could create a situation where personal injury or death may
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reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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TECHNICAL INFORMATION CENTER:
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DOCUMENT COMMENTS:
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digital dna is a trademark of Motorola, Inc. All other product or service names are the property of
their respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
© Motorola, Inc. 2002
MPC860EC/D
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