MPXH6250A6U [MOTOROLA]
HIGH TEMPERATURE ACCURACY INTEGRATED SILICON PRESSURE SENSOR; 高温度精度集成硅压力传感器型号: | MPXH6250A6U |
厂家: | MOTOROLA |
描述: | HIGH TEMPERATURE ACCURACY INTEGRATED SILICON PRESSURE SENSOR |
文件: | 总8页 (文件大小:295K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Freescale Semiconductor, Inc.
Order this document
by MPXH6250A
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
MPXH6250A
SERIES
INTEGRATED
PRESSURE SENSOR
20 to 250 kPa (3.0 to 36 psi)
0.3 to 4.9 Volts Output
Motorola’s MPXH6250A series sensor integrates on–chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature compensation.
The small form factor and high reliability of on–chip integration make the Motorola pressure
sensor a logical and economical choice for the system designer.
The MPXH6250A series piezoresistive transducer is a state–of–the–art, monolithic,
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor processing to
provide an accurate, high level analog output signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure
sensor chip.
SUPER SMALL OUTLINE
PACKAGE
Features
• Improved Accuracy at High Temperature
• Available in Small and Super Small Outline Packages
• 1.5% Maximum Error over 0° to 85°C
MPXH6250A6T1
CASE 1317
• Ideally suited for Microprocessor or Microcontroller–Based Systems
• Temperature Compensated from –40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
Application Examples
• Industrial Controls
• Engine Control/Manifold Absolute Pressure (MAP)
MPXH6250AC6T1
CASE 1317A
V
S
PIN NUMBER
1
2
3
4
N/C
5
6
7
8
N/C
N/C
N/C
N/C
V
S
Gnd
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #2
AND
V
out
SENSING
ELEMENT
GROUND
V
out
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is denoted by the
chamfered corner of the package.
REFERENCE
SHIFT CIRCUITRY
GAIN STAGE #1
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor
Schematic
REV 0
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MAXIMUM RATINGS(1)
Parametrics
Symbol
Value
1000
Units
kPa
Maximum Pressure (P1 u P2)
Storage Temperature
P
max
T
stg
–40° to +125°
–40° to +125°
0.5
°C
Operating Temperature
T
A
°C
(2)
Output Source Current @ Full Scale Output
I +
o
mAdc
mAdc
(2)
Output Sink Current @ Minimum Pressure Offset
NOTES:
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from V to Gnd or V to V in the application circuit.
I –
o
–0.5
out
out
S
OPERATING CHARACTERISTICS (V = 5.1 Vdc, T = 25°C unless otherwise noted, P1 u P2.)
S
A
Characteristic
Symbol
Min
Typ
—
Max
250
Unit
kPa
Vdc
Pressure Range
P
OP
20
(1)
Supply Voltage
V
4.74
—
5.1
5.46
10
S
Supply Current
I
o
6.0
mAdc
Vdc
(2)
Minimum Pressure Offset
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
V
0.133
0.204
0.274
off
@ V = 5.1 Volts
S
(3)
Full Scale Output
V
FSO
4.826
4.552
4.896
4.692
4.966
4.833
Vdc
Vdc
@ V = 5.1 Volts
S
(4)
Full Scale Span
V
FSS
@ V = 5.1 Volts
S
(5)
Accuracy
—
—
—
—
—
—
—
20.4
1.0
1.5
—
—
—
—
%V
FSS
Sensitivity
V/P
mV/kPa
ms
(6)
Response Time
t
R
(7)
Warm–Up Time
—
—
20
ms
(8)
Offset Stability
ā0.25
%V
FSS
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Offset (V ) is defined as the output voltage at the minimum rated pressure.
off
3. Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure.
FSO
4. Full Scale Span (V
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
•
•
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25°C.
•
•
TcSpan:
TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXH6250A SERIES
Motorola Sensor Device Data
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2
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DIE
FLUORO SILICONE
GEL DIE COAT
STAINLESS
+5.1 V
STEEL CAP
P1
WIRE BOND
THERMOPLASTIC
CASE
V
S
Pin 2
MPXH6250A
LEAD
FRAME
100 nF
V
out
Pin 4
to ADC
47 pF
51 K
GND Pin 3
ABSOLUTE ELEMENT
SEALED VACUUM REFERENCE
DIE BOND
Figure 2. Cross Sectional Diagram SSOP
(not to scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
5.0
TRANSFER FUNCTION:
4.5
4.0
V = V * (0.0040*P-0.040) Error
out s
= 5.1 Vdc
V
S
TEMP = 0 to 85°C
3.5
3.0
2.5
MAX
2.0
1.5
1.0
0.5
0
TYP
MIN
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85°C temperature range.
The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure
signal to be transmitted to the silicon diaphragm. The
MPXH6250A series pressure sensor operating characteris-
tics, internal reliability and qualification tests are based on
use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long–term reliability. Contact the factory for information re-
garding media compatibility in your application.
MPXH6250A SERIES
Motorola Sensor Device Data
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Transfer Function (MPXH6250A)
Nominal Transfer Value: Vout = VS x (0.004 x P – 0.040)
(Pressure Error x Temp. Factor x 0.004 x VS)
VS = 5.1 0.36 Vdc
Temperature Error Band
MPXH6250A Series
4.0
3.0
2.0
1.0
0.0
Break Points
Temp
Multiplier
- 40
3
0 to 85
125
1
1.75
Temperature
Error
Factor
-40
-20
0
20
40
60
80
100
120
140
Temperature in C°
NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C
Pressure Error Band
Error Limits for Pressure
4.0
3.0
2.0
1.0
0.0
Pressure (in kPa)
20
60
100
140
180
220
260
300
-1.0
-Ă2.0
-Ă3.0
-4.0
Pressure
20 to 250 (kPa)
Error (Max)
Ă3.45 (kPa)
ORDERING INFORMATION — SUPER SMALL OUTLINE PACKAGE
Device Type
Options
Case No.
1317
MPX Series Order No.
Packing Options
Rails
Marking
MPXH6250A
MPXH6250A
MPXH6250A
MPXH6250A
Basic Element
Absolute, Element Only
Absolute, Element Only
Absolute, Axial Port
Absolute, Axial Port
MPXH6250A6U
MPXH6250A6T1
MPXH6250AC6U
MPXH6250AC6T1
1317
Tape and Reel
Rails
Ported Element
1317A
1317A
Tape and Reel
MPXH6250A SERIES
Motorola Sensor Device Data
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SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
pad geometry, the packages will self–align when subjected to
a solder reflow process. It is always recommended to fabri-
cate boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.050
0.387
9.83
1.27
TYP
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
MPXH6250A SERIES
Motorola Sensor Device Data
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SUPER SMALL OUTLINE PACKAGE DIMENSIONS
2X
0.006 C
A
B
0.420
0.400
0.050
NOTES:
1. ALL DIMENSIONS ARE IN INCHES.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M-1994.
0.025
3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS. MOLD FLASH OR PROTRUSIONS
SHALL NOT EXCEED .006 INCHES PER SIDE.
4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.
5. DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE .008 INCHES MAXIMUM.
0.300
0.280
3
0.019
0.014
8X
5
M
0.004
C A B
0.300
0.280
A
B
3
0.298
0.278
.010
GAGE
PLANE
0.165
0.145
0.010
0.002
°
10
0.023
0.013
°
0
0.004
DETAIL E
DETAIL E
SEATING
PLANE
C
CASE 1317–03
ISSUE B
MPXH6250A SERIES
Motorola Sensor Device Data
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SUPER SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
2X
0.006 C
A
B
NOTES:
1. ALL DIMENSIONS ARE IN INCHES.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M-1994.
0.420
0.400
3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS. MOLD FLASH OR PROTRUSIONS
SHALL NOT EXCEED .006 INCHES PER SIDE.
4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.
5. DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE .008 INCHES MAXIMUM.
0.050
0.025
0.345
0.325
0.018
0.014
8X
5
.014
M
0.004
C A B
GAGE
PLANE
0.345
0.325
B
A
0.010
0.002
°
10
0.048
0.038
°
0
DETAIL E
0.130
0.110
0.200
0.180
0.300
0.280
0.390
0.370
3
0.004
0.300
0.280
A
B
DETAIL E
3
SEATING
PLANE
C
BOTTOM VIEW
CASE 1317A–01
ISSUE A
MPXH6250A SERIES
Motorola Sensor Device Data
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Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including
“Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the
rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part.
MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective
owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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