MPXH6300A6T1 [NXP]
Pressure Sensor, 5V, 20/304kPa, SOP 8, Reel;
| 型号： | MPXH6300A6T1 |
| 厂家： | 
NXP |
| 描述： | Pressure Sensor, 5V, 20/304kPa, SOP 8, Reel 传感器 换能器 |
| 文件： | 总14页 (文件大小：236K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
escale Semiconductor
Data Sheet: Technical Data
Document Number: MPXH6300A
Rev. 6.0, 09/2015
MPXH6300A, 20 to 300 kPa, Absolute,
Integrated, Pressure Sensor
MPXH6300A
Freescale's MPXH6300A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-chip
integration make the Freescale pressure sensor a logical and economical choice
for the system designer.
Super small outline package
The MPXH6300A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
MPXH6300A6U/6T1 MPXH6300AC6U/6T1
Case 98ARH99066A Case 98ARH99089A
Features
•
•
•
•
•
•
•
•
Improved accuracy at high temperature
Available in super small outline package
Top view
1.5% maximum error over 0 °C to 85 °C
Fully calibrated and compensated
DNC 5
DNC 6
DNC 7
DNC 8
4 VOUT
3 GND
2 VS
Ideally suited for microprocessor or microcontroller-based systems
Temperature compensated from -40 °C to +125 °C
Durable thermoplastic surface mount package
1 DNC
Package porting and mounting options enable tube attachment for liquefied
natural gas (LPG) or remote sensing applications
Typical applications
Pin 1 identification,
chamfered corner.
•
•
•
•
Fuel injected car engines
Vehicles powered by green gases (for example LPG and CNG)
Small engines
Pinout
Industrial controls
Ordering information
# of Ports
Pressure type
Device
marking
Part number
Shipping
Package
None Single
Dual
Gauge
Differential Absolute
MPXH6300A6U
MPXH6300A6T1
MPXH6300AC6U
MPXH6300AC6T1
Rail
98ARH99066A
•
•
•
•
•
•
•
•
MPXH6300A
MPXH6300A
MPXH6300A
MPXH6300A
Tape and Reel 98ARH99066A
Rail 98ARH99089A
Tape and Reel 98ARH99089A
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2007, 2010, 2012, 2015 Freescale Semiconductor, Inc. All rights reserved.
Contents
1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Pressure (P1)/Vacuum (P2) Side Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
3
4
5
Related Documentation
The MPXH6300A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at:
http://www.freescale.com/
2. In the Keyword search box at the top of the page, enter the device number MPXH6300A.
3. In the Refine Your Result pane on the left, click on the Documentation link.
MPXH6300A
Sensors
2
Freescale Semiconductor, Inc.
1
General Description
1.1
Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Thin Film
Temperature
Compensation
and
Sensing
Element
VOUT
Gain Stage #1
Pins 1, 5, 6, 7, and 8 are internal device connections.
Do not connect to external circuitry or ground.
GND
Figure 1. Integrated pressure sensor block diagram
1.2
Pinout
DNC 5
DNC 6
DNC 7
DNC 8
4 VOUT
3 GND
2 VS
1 DNC
Pin 1 identification,
chamfered corner.
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin
1
Name
DNC
VS
Function
Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner.
Voltage supply
2
3
GND
VOUT
DNC
DNC
DNC
DNC
Ground
4
Output voltage
5
Do not connect to external circuitry or ground.
Do not connect to external circuitry or ground.
Do not connect to external circuitry or ground.
Do not connect to external circuitry or ground.
6
7
8
MPXH6300A
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Freescale Semiconductor, Inc.
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2
Mechanical and Electrical Specifications
2.1
Maximum ratings
Table 2. Maximum ratings(1)
Parametrics
Symbol
Pmax
Tstg
Value
1200
Units
kPa
Maximum pressure (P1 > P2)
-40 to +125
-40 to +125
0.5
°C
Storage temperature
TA
°C
Operating temperature
Output source current @ full-scale output(2)
Output sink current @ minimum pressure offset(2)
Io+
mAdc
mAdc
Io-
-0.5
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit.
2.2
Operating characteristics
Table 3. Operating characteristics (VS = 5.1 VDC, TA = 25 °C unless otherwise noted, P1 > P2.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
20
—
304
kPa
Pressure range
Supply voltage(1)
Supply current
VS
IO
4.74
—
5.1
6.0
5.46
10
VDC
mAdc
VDC
Minimum pressure offset(2) (0 to 85 °C) @ VS = 5.1 Volts
Full-scale output(3) (0 to 85 °C) @ VS = 5.1 Volts
Full-scale span(4) (0 to 85 °C) @ VS = 5.1 Volts
VOFF
0.241
0.306
0.371
VFSO
VFSS
4.847
4.476
4.912
4.606
4.977
4.736
VDC
VDC
Accuracy(5) (0 to 85 °C)
Sensitivity
—
V/P
tR
—
—
—
—
—
—
16.2
1.0
1.5
—
—
—
—
%VFSS
mV/kPa
ms
Response time(6)
Warm-up time(7)
—
20
ms
Offset stability(8)
—
0.25
%VFSS
1.Device is ratiometric within this specified excitation range.
2.Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure.
4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressures
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25 °C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25 °C
TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C.
Variation from Nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C.
6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test.
MPXH6300A
Sensors
4
Freescale Semiconductor, Inc.
3
On-chip Temperature Compensation and Calibration
Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A).
Figure 4 shows a typical application circuit (output source current operation).
Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for
operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm. The MPXH6300A pressure sensor operating characteristics, internal reliability and
qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Fluorosilicone
Gel Die Coat
Stainless Steel
Cap
Die
P1
Thermoplastic
Case
Wire Bond
Lead frame
Die Bond
Absolute Element
Sealed
Vacuum Reference
Figure 3. Cross-sectional diagram (not-to-scale)
+5.1 V
VS
VOUT
To ADC
100 nF
1 μF
GND
47 pF
51 K
Figure 4. Recommended power supply decoupling and output filtering
MPXH6300A
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Freescale Semiconductor, Inc.
5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Transfer Function:
VOUT = VS*(.00318*P-.00353) ± Error
VS = 5.1 Vdc
Temperature = 0 to 85 °C
MAX
TYP
MIN
Pressure (Reference to Sealed Vacuum) in kPa
Figure 5. Output vs. absolute pressure
Nominal Transfer Value: Vout = VS x (0.00318 x P - 0.00353)
± (Pressure Error x Temp Factor x 0.00318 x VS)
VS = 5.1 0.36 Vdc
Figure 6. Transfer function
4.0
3.0
2.0
1.0
0.0
Break Points
Multiplier
Temp
-40
0 to 85
125
3
1
3
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0 °C to -40 °C and from 85 °C to 125 °C.
Figure 7. Temperature error band
Error Limits for Pressure
Pressure (in kPa)
4.0
3.0
2.0
1.0
0.0
20
60
100
140
180
220
260
300
-1.0
-2.0
-3.0
-4.0
Pressure
Error (Max)
±4.0 (kPa)
20 to 304 (kPa)
Figure 8. Pressure error band
MPXH6300A
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Freescale Semiconductor, Inc.
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4
Package Information
4.1
Minimum recommended footprint for surface mounted applications
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 9. SSOP footprint
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
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4.2
Package Dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf.
Case 98ARH99066A, super small outline package, surface mount
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
8
Case 98ARH99066A, super small outline package, surface mount
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
9
Case 98ARH99066A, super small outline package, surface mount
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
10
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf.
Case 98ARH99089A, super small outline package, surface mount
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
11
Case 98ARH99089A, super small outline package, surface mount
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
12
5
Revision History
Table 4. Revision history
Revision
number
Revision
date
Description
5.1
05/2012
• Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H.
• Corrected figure 4.
• Updated format.
6.0
09/2015
MPXH6300A
Sensors
Freescale Semiconductor, Inc.
13
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information in this document.
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© 2007, 2010, 2012, 2015 Freescale Semiconductor, Inc.
Document Number: MPXH6300A
Rev. 6.0
09/2015
相关型号：
MPXH6300AC6U
High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure
FREESCALE
MPXH6400A6T1
ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-58.01Psi, 1.5%, 0.20-4.80V, SQUARE, SURFACE MOUNT, SO-8
MOTOROLA
MPXH6400A6U
ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-58.01Psi, 1.5%, 0.20-4.80V, SQUARE, SURFACE MOUNT, SO-8
MOTOROLA
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