MPXY8000_技术文档

MPXY8000

Rev 1, 12/2004

Freescale Semiconductor

Technical Data

Tire Pressure Monitoring Sensor

Temperature Compensated

and Calibrated, Fully Integrated,

Digital Output

MPXY8020A

MPXY8040A

The Freescale Semiconductor MPXY8000 series sensor is an 8-pin tire

monitoring sensor which is comprised of a variable capacitance pressure

sensing element, a temperature sensing element, and an interface circuit (with

a wake-up feature) all on a single chip. It is housed in a Super-Small Outline

Package (SSOP), which includes a media protection filter. Specifically designed

for the low power consumption requirements of tire pressure monitoring

systems, it can combine with a Freescale Semiconductor remote keyless entry

(RKE) system to facilitate a low-cost, highly integrated system.

TIRE PRESSURE

MONITORING SENSOR

MPXY8020A:

OPTIMIZED FOR 250 kPa – 450 kPa

MPXY8040A:

OPTIMIZED FOR 500 kPa – 900 kPa

Detailed Description

The block diagram of the MPXY8000 series sensor is shown in Figure 1. The

pressure sensor is a capacitive transducer constructed using surface

micromachining, the temperature sensor is constructed using a diffused

resistor, and the interface circuit is integrated onto the same die as the sensors

using a standard silicon CMOS process.

SUPER SMALL OUTLINE PACKAGE

CASE 1352-03

The conditioning of the pressure signal begins with a capacitance to voltage

conversion (C to V) followed by a switched capacitor amplifier. This amplifier

has adjustable offset and gain trimming. The offset and gain are factory

calibrated, with calibration values stored in the EEPROM trim register. This

amplifier also has temperature compensation circuits for both sensitivity and

offset, which also are factory adjusted using the EEPROM trim register.

PIN ASSIGNMENT

The pressure is monitored by a voltage comparator, which compares the

measured value against an 8-bit threshold adjusted by a serial input. By

adjusting the threshold and monitoring the state of the OUT pin the external

device can check whether a low-pressure threshold has been crossed, or

perform up to 8-bit A/D conversions.

S1/V_PP

V_DD

1

2

3

8 SO

7 CLK

6 DATA

V_SS

OUT 4

5 RST

The temperature is measured by a diffused resistor with a positive

temperature coefficient driven by a current source, thereby creating a voltage.

The room temperature value of this voltage is factory calibrated using the

EEPROM trim register. A two-channel multiplexer can route either the pressure

or temperature signal to a sampling capacitor that is monitored by a voltage

comparator with variable threshold adjust, providing a digital output for

temperature.

8-pin Super Small Outline Package (SSOP)

An internal low frequency, low power 5.4 kHz oscillator with a 14-stage

divider provides a periodic pulse to the OUT pin (divide by 16384 for 3 seconds).

This pulse can be used to wake up an external MCU to begin an interface with

the device. An additional 10-stage divider will provide a pulse every 52 minutes

which can be used to reset an external MCU.

ORDERING INFORMATION

Shipped in Tape &

Shipped In Rails

Reel

MPXY8020A6U

MPXY8040A6U

MPXY8020A6T1

MPXY8040A6T1

The power consumption can be controlled by several operational modes

selected by external pins.

V_DD

f_HF

S1

S0

Clock

Gen

Internal HF

OSC.

P_X

Digital

Control

Power

Control

Data

CLK

P_REF

C to V

Convert

AMP

P-Cell

Internal LF

OSC.

f_LF

P-Off

Trim

P-Gain

Trim

P-TCO

Trim

P-TCS

Trim

14-Stage

Divider

Lock

10-Stage

Divider

RST

8-Bit

Current

Source

8-Bit

D/A

Register

T-Off

Trim

2-Chan

MUX

-

3-Chan

MUX

COMP

+

OUT

V_SS

2-Chan

MUX

PTC

Res.

Sample CAP

AV_SS

t

AV_SS

Figure 1. MPXY8000 Series Sensor Block Diagram

Operating Modes

The device has several operating modes dependent on

the applied voltages to the S1 and S0 pins as shown in

Table 1. In all the modes listed the channel multiplexers, D/A

Register, LFO, and the output pulse dividers will always be

powered up as long as there is a voltage source connected to

the V_DDpin.

on the sample capacitor before powering down the

measuring circuitry.

NOTE: All of the EEPROM trim bits will be powered up

regardless of whether the pressure or temperature

measuring circuitry is activated.

NOTE: If the voltage on the S1 pin exceeds 2.5 times the

voltage on the V_DDpin the device will be placed into its Trim/

Test Mode.

When only the S0 pin is at a logic one the pressure

measuring circuit in the device is powered up and the

pressure output signal is connected to the sample capacitor

through a multiplexer. When the S0 pin returns to the low

state the multiplexer will first turn off to store the signal on the

sample capacitor before powering down the measuring

circuitry.

NOTE: If the V_DDsupply source is switched off in order to

reduce current consumption, it is important that all input pins

be driven LOW to avoid powering up the device.

If any input pin (S1, S0, DATA, or CLK) is driven HIGH

while the V_DDsupply is switched off, the device may be

powered up through an ESD protection diode. In such a case,

the effective V_DDvoltage will be about 0.3 V less than the

voltage applied to the input pin, and the full device I_DDcurrent

will be drawn from the device driving input.

When only the S1 pin is at a logic one the temperature

measuring circuit in the device is powered up and the

temperature output signal is connected to the sample

capacitor through a multiplexer. When the S1 pin returns to

the low state the multiplexer will first turn off to store the signal

MPXY8000

Sensor Devices

2

Freescale Semiconductor

Table 1. Operating Modes

Circuitry Powered

Temp

Serial Data

Counter

Pressure

Measure

System

S1

S0

Operating Mode

A/D Output

LFO

Oscill.

Measure

System

Comp.

0

1

0

1

0

1

Standby/Reset

OFF

ON

OFF

ON

OFF

ON

ACTIVE

RESET

ACTIVE

Measure Pressure

Measure Temperature

Output Read

OFF

Pin Functions

The following paragraphs give a description of the general

function of each pin.

ground. The control IC operates from a single power supply.

Therefore, the conductors to the power supply should be

connected to the V_DDand V_SSpins and locally decoupled as

shown in Figure 2.

V_DDand V_SSPins

Power is supplied to the control IC through V_DDand V_SS

.

V_DDis the positive supply and V_SSis the digital and analog

MPXY8020A

To Other V_DDLoads

V_DD

0.1 µF

To Power Supply

V_SS

To Other V_SSReturns

Figure 2. Recommended Power Supply Connections

OUT Pin

The OUT pin normally provides a digital signal related to

OUT pin is driven high and will be clocked low when an

overflow is detected from a clock divider (divide by 16384)

driven by the LFO. This allows the OUT pin to wake up an

external device such as an MCU.

the voltage applied to the voltage comparator and the

threshold level shifted into an 8-bit register from an external

device. When the device is placed in the standby mode the

2/f _LFO

OUT

Standby

Operation

Wake Up

Measure

3 Sec

Figure 3. Pulse on OUT Pin During Standby Mode

RST Pin

The RST pin is normally driven high and will be clocked

low when an overflow is detected from total clock divider

(divide by 16,777,216) driven by the LFO. This allows the

RST pin to reset an external device such as an MCU. This

pulse will appear on the RST pin approximately every

52 minutes regardless of the operating mode of the device.

The pulse lasts for two cycles of the LFO oscillator as shown

in Figure 4. Since the RST pin is clocked from the same

divider string as the OUT pin, there will also be a pulse on the

OUT pin when the RST pin pulses every 52 minutes.

MPXY8000

Sensor Devices

Freescale Semiconductor

3

OUT

RST

2/f _LFO

Standby

≈ 3 Sec

≈ 52 Minutes

Figure 4. Pulse on RST Pin

S0 Pin

CLK Pin

The S0 pin is used to select the mode of operation as

shown in Table 1.

The S0 pin contains an internal Schmitt trigger as part of

its input to improve noise immunity. The S0 pin has an

internal pull-down device in order to provide a low level when

the pin is left unconnected.

The CLK pin is used to provide a clock used for loading

and shifting data into the DATA pin. The data on the DATA pin

is clocked into a shift register on the rising edge of the CLK

pin signal. The data is transferred to the D/A Register on the

eighth falling edge of the CLK pin. This protocol may be

handled by the SPI or SIOP serial I/O function found on some

MCU devices.

The CLK pin contains an internal Schmitt trigger as part of

its input to improve noise immunity. The CLK pin has an

internal pull-down device to provide a low level when the pin

is left unconnected.

S1 Pin

The S1 pin is used to select the mode of operation, as

shown in Table 1.

The S1 pin contains an internal Schmitt trigger as part of

its input to improve noise immunity. This pin has an internal

pull-down device to provide a low level when the pin is left

unconnected.

The S1 pin also serves the purpose of enabling factory trim

and test of the device.

The higher V_PPprogramming voltage for the internal

EEPROM trim register is also supplied through the S1 pin.

Output Threshold Adjust

The state of the OUT pin is driven by a voltage comparator

whose output state depends on the level of the input voltage

on the sample capacitor and the level of an adjustable 8-bit

threshold voltage. The threshold is adjusted by shifting data

bits into the D/A Register (DAR) via the DATA pin while

clocking the CLK pin. The timing of this data is shown in

Figure 4. Data is transferred into the serial shift register on

the rising edge of the CLK pin. On the falling edge of the 8^th

clock the data in the serial shift register is latched into the

parallel DAR register. The DAR remains powered up

whenever V_DDis present. The serial data is clocked into the

DATA pin starting with the MSB first. This sequence of

threshold select bits is shown in Table 2.

DATA Pin

The DATA pin is the serial data in (SDI) function for setting

the threshold of the voltage comparator.

The DATA pin contains an internal Schmitt trigger as part

of its input to improve noise immunity. This pin has an internal

pull-down device to provide a low level when the pin is left

unconnected.

Table 2. D/A Threshold Bit Assignment

Function

Bit Weight

Data Bit

LSB

1

D0

2

4

D1

D2

D3

D4

D5

D6

D7

Voltage Comparator Threshold Adjust (8 bits)

8

16

32

64

128

MSB

MPXY8000

Sensor Devices

4

Freescale Semiconductor

An analog to digital (A/D) conversion can be accomplished

with eight (8) different threshold levels in a successive

approximation algorithm; or the OUT pin can be set to trip at

some alarm level. The voltage on the sample capacitor will

maintain long enough for a single 8-bit conversion, but may

need to be refreshed with a new measured reading if the read

clock stream is corrupted during a transmission. In these two

modes the DATA and CLK pins should not be clocked to

reduce noise in the captured pressure or temperature data.

Any change in the DAR contents should be done during the

Standby or Output Read Modes.

Both the serial bit counter and the state of the DAR are

undefined following power up of the device. The serial bit

counter can be reset by cycling either the SO pin or the

S1/VPP pin to a high level and then back low. The DAR can

then be reset to the lowest level by holding the DATA pin low

while bursting the CLK pin with eight (8) clock pulses.

interval is longer than the specified hold time, t

.

SH

The counter that determines the number of clock pulses

into the device is reset whenever the device is placed into the

Measure Pressure or Measure Temperature Modes. This

provides a means to reset the data transfer count in case the

1

2

3

4

5

6

7

8

CLK

Data

MSB

BIT6

BIT5

BIT4

BIT3

BIT2

BIT1

LSB

Serial Data ∗

MSB

BIT6

BIT5

BIT4

BIT3

BIT2

BIT1

LSB

DAR Load *

Data

DAR *

(*) Denotes Internal Signal

Figure 5. Serial Data Timing

Temperature Sensor Output

Pressure Sensor Output

The pressure channel compares the output of its analog

measurement circuit to the D/A reference voltage. The device

is calibrated at two different nominal values depending on the

calibration option.

The temperature channel compares the output of a

positive temperature coefficient (PTC) resistor driven by a

switched current source. The current source is only active

when the temperature channel is selected.

APPLICATIONS

Suggested application example is shown in Figure 6.

Motion

Sense

Optional

S1

S0

+

V_DD

RF

Transmitter

3.0 V

Data

CLK

RST

OUT

State Machine

or MCU

MPXY8000

Series

Sensor

0.1 µF

V_SS

Figure 6. Application Example

MPXY8000

Sensor Devices

Freescale Semiconductor

5

ELECTRICAL SPECIFICATIONS

Maximum ratings are the extreme limits to which the

device can be exposed without permanently damaging it. The

device contains circuitry to protect the inputs against damage

from high static voltages; however, do not apply voltages

higher than those shown in the table below. Keep V_INand

V_OUTwithin the range V_SS≤ (V_INor V_OUT) ≤ V_DD

.

Table 3. Maximum Ratings

Rating

Symbol

Value

Unit

Supply Voltage

V_DD

V

–0.3 to +4.0

Short Circuit Capability (all pins excluding V_DDand V_SS

Maximum High Voltage for 5 minutes

)

V_SC

V_DD

V_SS

V

Minimum Low Voltage for 5 minutes

Substrate Current Injection

I_SUB

600

µA

Current from any pin to V_SS–0.3 VDC)

Electrostatic Discharge

V_ESD

±1000

±200

V

Human Body Model (HBM)

Charged Device Model (CDM)

Machine Model (MM)

Storage Temperature Range

Standard Temperature Range

T_stg

°C

–40 to +150

ELECTRO STATIC DISCHARGE (ESD)

WARNING: This device is sensitive to electrostatic

discharge.

Extra precaution must be taken by the user to protect the

chip from ESD. A charge of over 1000 volts can accumulate

on the human body or associated test equipment. A charge

of this magnitude can alter the performance or cause failure

of the chip. When handling the pressure sensor, proper ESD

precautions should be followed to avoid exposing the device

to discharges which may be detrimental to its performance.

Operating Range

The limits normally expected in the application which define range of operation.

Table 4. Operating Range

Characteristic

Symbol

Min

Typ

Max

Units

V

2.1

3.0

3.6

V

Supply Voltage

DD

Operating Temperature Range

Standard Temperature Range

T_L

T_H

T_A

—

°C

+125

–40

Supply Current Drain

Standby Mode

−40°C to +85°C

+85°C to +100°C

+100°C to +125°C

I_STBY

—

0.6

0.8

1.5

0.9

1.2

2.2

µA

Read Mode

−40°C to +125°C

—

400

600

µA

I_READ

Measure Temperature Mode

−40°C to +125°C

I_TEMP

Measure Pressure Mode

−40°C to +10°C

+10°C to +60°C

—

1400

1300

1200

1800

1700

µA

I_PRESS

+60°C to +125°C

MPXY8000

Sensor Devices

6

Freescale Semiconductor

Table 5. Electrical Characteristics

+2.1 V ≤ V_DD≤ +3.6 V, T_L≤ T_A≤ T_H, unless otherwise specified.

Characteristic

Symbol

Min

Typ

Max

Units

Output High Voltage

DATA, OUT, RST (I_Load= 100 µA)

V_OH

—

V

V_DD–0.8

Output Low Voltage

DATA, OUT, RST (I_Load= -100 µA)

V_OL

—

0.4

V

Input High Voltage

S0, S1, DATA, CLK

V_IH

V_IL

0.7 x V_DD

—

0.3 x V_DD

—

V

Input Low Voltage

S0, S1, DATA, CLK

V_SS

Input Hysteresis (V_IH— V_IL)

V_HYS

100

200

mV

S0, S1, DATA, CLK

Input Low Current (at V_IL)

S0, S1, DATA, CLK

I_IL

µA

–5

–25

–35

–100

–140

Input High Current (at V_IH

S0, S1, DATA, CLK

)

µA ⁽²⁾

I_IH

Temperature Measurement (+2.5 V ≤ V_DD≤ 3.0 V)

T

36

52

97

155

204

241

249

42

57

47

62

counts

D/A Conversion Code at –40°C

D/A Conversion Code at –20°C

D/A Conversion Code at 25°C

D/A Conversion Code at 70°C

D/A Conversion Code at 100°C

D/A Conversion Code at 120°C

D/A Conversion Code at 125°C

–40

T

20

–

102

163

214

252

255

107

171

224

255

T₂₅

T₇₀

T₁₀₀

T₁₂₀

T₁₂₅

Temperature Measurement (+2.1 V ≤ V_DD≤ 3.6 V)

T

36

52

97

154

203

240

249

42

57

49

64

counts

D/A Conversion Code at –40°C

D/A Conversion Code at –20°C

D/A Conversion Code at 25°C

D/A Conversion Code at 70°C

D/A Conversion Code at 100°C

D/A Conversion Code at 120°C

D/A Conversion Code at 125°C

–40

T

20

–

102

163

214

252

255

107

172

225

255

T₂₅

T₇₀

T₁₀₀

T₁₂₀

T₁₂₅

Temperature Sensitivity at 25°C

—

0.80

°C/bit

Approximate Temperature Output Response

OUT = 74.7461 + 0.9752 x Ta + 0.0041 x Ta^2

counts

8

7

6

5

4

3

2

1

0

-40

-20

0

20

40

60

80

100

120

Temperature (°C)

Figure 7. Temperature Error vs Temperature at V_DD= 3.0 V

MPXY8000

Sensor Devices

Freescale Semiconductor

7

Table 6. Control Timing

+2.1 V ≤ V_DD≤ +3.6 V, T_L≤ T_A≤ T_H, unless otherwise specified.

Characteristic

Symbol

Min

Typ

Max

Units

HFO Measurement Clock Frequency

f_HF

100

135

150

kHz

LFO Wake Up Clock Frequency

Ta = –40°C, +2.1V ≤ V_DD≤ +3.6

Ta = +25°C, +2.1V ≤ V_DD≤ +3.6

Ta = +125°C, +2.1V ≤ V_DD≤ +3.6

f_LF

3300

3900

3800

5400

5300

8000

7700

7000

Hz

Wake Up Pulse

Pulse Timing

Pulse Width

t_WAKE

t_WPW

—

16384

2

—

LFO clocks

Reset Pulse

Pulse Timing

Pulse Width

t_RESET

t_RPW

—

16,777,216

2

—

LFO clocks

Minimum Setup Time (DATA edge to CLK rise)

Minimum Hold Time (CLK rise to DATA change)

t_SETUP

t_HOLD

100

—

nSec

Measurement Response Time

Recommended time to hold device in measurement mode

Temperature

Pressure

t_TMEAS

t_PMEAS

—

200

500

—

µSec

Read Response Time (see Figure 8)

From 90% V_DDon S0 to OUT less than V_OLor greater than V_OH

t_READ

—

50

—

100

—

µSec

Sample Capacitor Discharge Time

From initial full scale D/A count (255) to drop 2 counts (253)

t_SH

20

mSec

V_DD

6.32 kΩ

Test Point

10.91 kΩ

50 pF

Figure 8. Control Timing Test Load for OUT and RST Pins

MPXY8000

Sensor Devices

8

Freescale Semiconductor

SENSOR CHARACTERISTICS (MPXY8020A)

Pressure Transfer Function

kPa = 2.5 x Output ± (Pressure Error)

Output = 8-bit digital pressure measurement (between 0-255)

Pressure Error (±kPa): 50 kPa ≤ P < 250 kPa

T[°C] \ V_DD[V]

2.1

2.5

2.7

3.0

3.3

3.6

72.5

57.5

72.5

95.0

72.5

57.5

72.5

92.5

32.5

25.0

27.5

37.5

57.5

32.5

25.0

37.5

47.5

32.5

25.0

37.5

47.5

35.0

27.5

37.5

47.5

–40

–20

0

25

70

100

125

Pressure Error (±kPa): 250 kPa ≤ P ≤ 450 kPa

T[°C] \ V_DD[V]

2.1

2.5

2.7

3.0

3.3

3.6

40.0

32.5

30.0

35.0

40.0

62.5

40.0

25.0

40.0

60.0

25.0

15.0

10.0

7.5

25.0

15.0

10.0

7.5

25.0

15.0

10.0

7.5

30.0

20.0

15.0

30.0

35.0

–40

–20

0

25

70

10.0

25.0

35.0

7.5

100

125

25.0

35.0

25.0

35.0

Pressure Error (±kPa): 450 kPa < P ≤ 600 kPa

T[°C] \ V_DD[V]

2.1

2.5

2.7

3.0

3.3

3.6

70.0

55.0

70.0

90.0

70.0

55.0

70.0

90.0

37.5

25.0

22.5

25.0

32.5

47.5

37.5

25.0

22.5

25.0

32.5

47.5

37.5

25.0

22.5

25.0

32.5

47.5

40.0

35.0

40.0

52.5

–40

–20

0

25

70

100

125

Areas marked in grey indicate the typical operating range.

MPXY8000

Sensor Devices

Freescale Semiconductor

9

SENSOR CHARACTERISTICS (MPXY8020A)

Pressure Error

30.0

25.0

20.0

15.0

10.0

5.0

0.0

50

100

400

450

500

550

600

150

200

250

300

350

Pressure [kPa]

Figure 9. Pressure Error vs Pressure at T = 25°C, 2.7 V ≤ V_DD≤ 3.3 V

35.0

30.0

25.0

20.0

15.0

10.0

5.0

0.0

2.1

2.3

2.5

2.7

2.9

3.1

3.3

3.5

V_DD[V]

Figure 10. Pressure Error vs V_DDat T = 25°C, 250 kPa ≤ P ≤ 450 kPa

35.0

30.0

25.0

20.0

15.0

10.0

5.0

0.0

–40.0

–20.0

0.0

20.0

40.0

60.0

80.0

100.0

120.0

Temperature [C]

Figure 11. Pressure Error vs Temperature at V_DD= 3.0 V, 250 kPa ≤ P ≤ 450 kPa

MPXY8000

Sensor Devices

Freescale Semiconductor

10

SENSOR CHARACTERISTICS (MPXY8040A)

Pressure Transfer Function

kPa = 5.0 x Output ± (Pressure Error)

Output = 8-bit digital pressure measurement (between 0-255)

Pressure Error [±kPa]: 50 kPa ≤ P < 500 kPa

T[°C] \ V_DD[V]

2.1

2.3

2.5

2.7

3.0

3.3

3.6

80

70

60

55

70

80

90

75

60

50

45

55

70

85

70

55

45

40

50

65

80

70

55

45

40

50

65

80

70

55

45

40

50

65

80

70

55

45

50

65

80

75

60

55

50

55

70

80

–40

–20

0

25

70

100

125

Pressure Error [±kPa]: 500 kPa ≤ P ≤ 900 kPa

T[°C] \ V_DD[V]

2.1

2.3

2.5

2.7

3.0

3.3

3.6

75

50

40

60

90

65

35

30

45

85

60

25

20

35

80

60

25

20

35

80

60

25

20

35

80

60

40

25

45

80

65

50

35

60

80

–40

–20

0

25

70

100

125

Areas marked in grey indicate the typical operating range.

(*) Output will max out (255 counts) at 1,275 kPa or higher, but pressure sensor output is not specified above 900 kPa.

MPXY8000

Sensor Devices

Freescale Semiconductor

11

SENSOR CHARACTERISTICS (MPXY8040A)

Pressure Error

50.0

40.0

30.0

20.0

10.0

0.0

50

150

250

350

450

550

650

750

850

Pressure [kPa]

Figure 12. Pressure Error vs Pressure at T= 25°C, 2.5 V ≤ V_DD≤ 3.0 V

45.0

40.0

35.0

30.0

25.0

20.0

15.0

10.0

5.0

0.0

2.1

2.3

2.5

2.7

2.9

3.1

3.3

3.5

V_DD[V]

Figure 13. Pressure Error vs V_DDat T = 25°C, 500 kPa ≤ P ≤ 900kPa

80.0

70.0

60.0

50.0

40.0

30.0

20.0

10.0

0.0

–40

–20

0

20

40

60

80

100

120

Temperature [C]

Figure 14. Pressure Error vs Temperature at V_DD= 3.0 V, 500 kPa ≤ P ≤ 900kPa

MPXY8000

Sensor Devices

Freescale Semiconductor

12

MECHANICAL SPECIFICATIONS

Maximum ratings are the extreme limits to which the

device can be exposed without permanently damaging it.

Keep V_INand V_OUTwithin the range V_SS≤ (V_INor V_OUT) ≤

V_DD

.

Table 7. Maximum Ratings

Rating

Symbol

Value

Unit

Maximum Pressure¹

kPa¹

p_max

1400

Centrifugal Force Effects (3 axis)

Pressure measurement change less than 1% FSS

g_CENT

g_shock

2000

g

Unpowered Shock (three sides, 0.5 mSec duration)

Note:

1. Tested for 5 minutes at 25°C.

Media Compatibility

Media compatibility is as specified in Freescale Semiconductor document “SPD TPM Media Test.”

MPXY8000

Sensor Devices

Freescale Semiconductor

13

NOTES

MPXY8000

Sensor Devices

14

Freescale Semiconductor

PACKAGE DIMENSIONS

2X

2 PLACES 4 TIPS

0.006 C

A

B

A

.420

.400

6X

NOTES:

.050

1. CONTROLLING DIMENSION: INCH.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M-1994.

3. DIMENSIONS DO NOT INCLUDE MOLD FLASH

OR PROTRUSIONS. MOLD FLASH AND PROTRUSIONS

SHALL NOT EXCEED 0.006 PER SIDE.

4. ALL VERTICAL SURFACES TO BE 5˚ MAXIMUM.

5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION.

ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008

MAXIMUM.

5

8

4

.025

.300

.280

3

1

8X

.019

.014

5

M

0.004

C A B

3

.300

.280

B

.160

.140

.292

.272

GAGE

PLANE

.006

.000

.175

.155

7˚

0˚

.014

.011

.009

.041

.031

8X

DETAIL G

0.004

DETAIL G

SEATING

PLANE

C

CASE 1352-03

ISSUE B

MPXY8000

Sensor Devices

Freescale Semiconductor

15

How to Reach Us:

Home Page:

www.freescale.com

E-mail:

support@freescale.com

USA/Europe or Locations Not Listed:

Freescale Semiconductor

Technical Information Center, CH370

1300 N. Alma School Road

Chandler, Arizona 85224

+1-800-521-6274 or +1-480-768-2130

support@freescale.com

Europe, Middle East, and Africa:

Freescale Halbleiter Deutschland GmbH

Technical Information Center

Schatzbogen 7

81829 Muenchen, Germany

+44 1296 380 456 (English)

+46 8 52200080 (English)

+49 89 92103 559 (German)

+33 1 69 35 48 48 (French)

support@freescale.com

Information in this document is provided solely to enable system and software

implementers to use Freescale Semiconductor products. There are no express or

implied copyright licenses granted hereunder to design or fabricate any integrated

circuits or integrated circuits based on the information in this document.

Freescale Semiconductor reserves the right to make changes without further notice to

any products herein. Freescale Semiconductor makes no warranty, representation or

guarantee regarding the suitability of its products for any particular purpose, nor does

Freescale Semiconductor assume any liability arising out of the application or use of any

product or circuit, and specifically disclaims any and all liability, including without

limitation consequential or incidental damages. “Typical” parameters that may be

provided in Freescale Semiconductor data sheets and/or specifications can and do vary

in different applications and actual performance may vary over time. All operating

parameters, including “Typicals”, must be validated for each customer application by

customer’s technical experts. Freescale Semiconductor does not convey any license

under its patent rights nor the rights of others. Freescale Semiconductor products are

not designed, intended, or authorized for use as components in systems intended for

surgical implant into the body, or other applications intended to support or sustain life,

or for any other application in which the failure of the Freescale Semiconductor product

could create a situation where personal injury or death may occur. Should Buyer

purchase or use Freescale Semiconductor products for any such unintended or

unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and

its officers, employees, subsidiaries, affiliates, and distributors harmless against all

claims, costs, damages, and expenses, and reasonable attorney fees arising out of,

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unintended or unauthorized use, even if such claim alleges that Freescale

Japan:

Freescale Semiconductor Japan Ltd.

Headquarters

ARCO Tower 15F

1-8-1, Shimo-Meguro, Meguro-ku,

Tokyo 153-0064

Japan

0120 191014 or +81 3 5437 9125

support.japan@freescale.com

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Freescale Semiconductor Hong Kong Ltd.

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+800 2666 8080

support.asia@freescale.com

For Literature Requests Only:

Freescale Semiconductor Literature Distribution Center

P.O. Box 5405

Semiconductor was negligent regarding the design or manufacture of the part.

Denver, Colorado 80217

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.

All other product or service names are the property of their respective owners.

1-800-441-2447 or 303-675-2140

Fax: 303-675-2150

LDCForFreescaleSemiconductor@hibbertgroup.com

MPXY8000

Rev. 1

12/2004


型号：	MPXY8000
厂家：	MOTOROLA
描述：	Tire Pressure Monitoring Sensor Temperature Compensated 胎压监测传感器温度补偿传感器温度补偿监控
文件：	总16页 (文件大小：142K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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