PC33993DWB [MOTOROLA]
SPECIALTY INTERFACE CIRCUIT, PDSO32, SOIC-32;
| 型号： | PC33993DWB |
| 厂家： | 
MOTOROLA |
| 描述： | SPECIALTY INTERFACE CIRCUIT, PDSO32, SOIC-32 光电二极管 接口集成电路 |
| 文件： | 总27页 (文件大小：590K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Order Number MC33993/D
Rev 1, 12/2002
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Advanced Information
33993
Multiple Switch Detection Interface
The 33993 Multiple Switch Detection Interface is designed to detect the
closing and opening of up to 22 switch contacts. The switch status, either open
or closed, is transferred to the microprocessor through an SPI interface. The
device also features a 22 to 1 analog multiplexer for reading inputs as analog.
The analog input signal is buffered and provided on the AMUX output pin for
the MCU to read.
MULTIPLE SWITCH
DETECTION INTERFACE
The 33993 device has two modes of operation, Sleep and Normal. The
Sleep mode provides low quiescent current and enables the wake up features
of the device. Normal mode allows programming of the device and supplies
switch contacts with pull-up or pull down current as it monitors switch change
of state.
The 33993 is packaged in the 32-pin Wide Body SOIC, reducing circuit
board area. Low quiescent current makes the 33993 ideal for automotive and
industrial products requiring low sleep state currents. The internal block
diagram of the 33993 is illustrated in Figure 1.
32-Lead SOIC
0.65 mm Pitch
CASE 1324-02
Issue A
Features:
•
•
•
•
•
•
•
•
•
Designed to Operate 5.5 V < VPWR < 26 V
Switch Input Voltage Range –14 V to VPWR, 40 V MAX
Interfaces Directly to Microprocessor using 3.3/5.0 V SPI Protocol
Selectable wake up on Change of State
Selectable Wetting Current (16 mA or 2 mA)
8-Programmable Input (Switches to Battery or Ground)
14-Switch to Ground Inputs
ORDERING INFORMATION
Temperature
Device
Package
Range (TA)
PC33993DWB
32 Ld SOIC
-40°C to 125°C
V
PWR Standby Current < 100 µA, VDD Standby Current < 15 µA
Active Interrupt (INT) on Change of Switch State
33993 Simplified Application Schematic
V
DD
Power Supply
LVI
V
BAT
V
33993
BAT
BAT
MCU
Enable
SP0
SP1
V
PWR
Watchdog
Reset
V
DD
V
V
DD
SP7
WAKE
SI
MOSI
SCLK
SCLK
SG0
SG1
CS
CS
SO
INT
MISO
INT
AMUX
AN0
SG12
SG13
GND
This document contains information on a product under development.
Motorola reserves the right to change or discontinue this product without notice.
© Motorola, Inc. 2002
5V
VPWR
VPWR, VDD, 5V
SP0
Vpwr Vpwr
VPWR
VDD
POR
Bandgap
SleepPWR
16 mA
2.0 mA
GND
SP0
SP1
SP2
SP3
SP4
SP5
SP6
SP7
+
–
To SPI
4V Ref
16 mA
2.0 mA
Comparator
SP7
Vpwr Vpwr
16 mA
2.0 mA
5V
OSCILLATOR &
CLOCK CONTROL
VPWR
+
To SPI
4V Ref
2.0 mA
–
16 mA
Comparator
5V
Temperature
Monitor and
Control
5V
SG0
Vpwr Vpwr
5V
VPWR
16 mA
2.0 mA
125kΩ
5V
SG0
SG1
SG2
SG3
SG4
SG5
SG6
SG7
SG8
SG9
SG10
SG11
SG12
SG13
WAKE
+
To SPI
4V Ref
–
WAKE Control
Comparator
VDD
SPI Interface
& Control
125kΩ
INT
INT Control
VDD
MUX Interface
40 µA
CS
SCLK
SI
VDD
SO
SG13
Vpwr Vpwr
16 mA
2.0 mA
VDD
+
Analog Mux
Output
AMUX
+
To SPI
4V Ref
–
–
Comparator
Figure 1. 33993 Block Diagram
33993/D
2
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
V
DD
VBAT
VBAT
Power Supply
LVI
10K
0805
VPWR
SP0
SP1
Enable
10nF
0805
100 V
10nF
0805
100 V
VDD
Watchdog
MC68HCXX
Micro Controller
VDD
Reset
10nF
0805
100 V
VBAT
WAKE
SI
Shift Register
SP7
L
S
B
M
S
B
MOSI
MISO
10nF
0805
100 V
33993
SG0
SG1
SO
10nF
0805
100 V
SCLK
INT
CS
Parallel
Port
SG12
SG13
AMUX
AN0
AN1
Analog
Ports
10nF
0805
100 V
10nF
0805
100 V
VBAT
VBAT
VPWR
10nF
0805
100 V
SP0
SP1
10nF
0805
100 V
VDD
VDD
10nF
0805
100 V
SP7
33993
WAKE
SI
10nF
0805
100 V
SG0
SG1
SO
10nF
0805
100 V
SCLK
INT
CS
AMUX
SG12
SG13
10nF
0805
100 V
10nF
0805
100 V
Figure 2. Power Supply Always Active
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
3
V
DD
VBAT
VBAT
Power Supply
LVI
VPWR
SP0
SP1
Enable
10nF
0805
100 V
10nF
0805
100 V
Watchdog
MC68HCXX
Micro Controller
VDD
VDD
Reset
10nF
0805
100 V
VBAT
Shift Register
WAKE
SI
SP7
L
S
B
MOSI
MISO
M
S
B
10nF
0805
100 V
33993
SG0
SG1
SO
10nF
0805
100 V
SCLK
INT
CS
Parallel
Port
SG12
SG13
AMUX
AN0
AN1
Analog
Ports
10nF
0805
100 V
10nF
0805
100 V
VBAT
VBAT
VPWR
10nF
0805
100 V
SP0
SP1
10nF
0805
100 V
VDD
VDD
10nF
0805
100 V
SP7
33993
WAKE
SI
10nF
0805
100 V
SG0
SG1
SO
10nF
0805
100 V
SCLK
INT
CS
AMUX
SG12
SG13
10nF
0805
100 V
10nF
0805
100 V
Figure 3. Power Supply Shutdown
33993/D
4
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
GND
SI
SCLK
CS
SO
VDD
AMUX
INT
SP7
SP6
SP5
SP4
SG7
SG8
SG9
SG10
SG11
SG12
SG13
WAKE
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
2
3
4
5
SP0
SP1
SP2
SP3
SG0
SG1
SG2
SG3
SG4
SG5
SG6
VPWR
6
7
8
9
10
11
12
13
14
15
16
PIN FUNCTIONAL DESCRIPTION (32 WB SOIC)
Pin No.
Name
Description
1
GND
Ground for logic, analog and switch to battery inputs.
SPI control data input pin from MCU to 33993.
SPI control clock input pin.
2
3
SI
SCLK
CS
4
SPI control chip select input pin from MCU to 33993. Logic 0 allows data to be transferred in.
Programmable switch to battery or switch to ground input pin.
Programmable switch to battery or switch to ground input pin.
Programmable switch to battery or switch to ground input pin.
Programmable switch to battery or switch to ground input pin.
Switch to ground input pin.
5
SP0
6
SP1
7
SP2
8
SP3
9
SG0
SG1
SG2
SG3
SG4
SG5
SG6
VPWR
WAKE
SG13
SG12
SG11
SG10
10
11
12
13
14
15
16
17
18
19
20
21
Switch to ground input pin.
Switch to ground input pin.
Switch to ground input pin.
Switch to ground input pin.
Switch to ground input pin.
Switch to ground input pin.
Conditioned battery supply input pin. Pin requires external reverse battery protection.
Wake up power supply enable output - open drain output
Switch to ground input pin.
Switch to ground input pin.
Switch to ground input pin.
Switch to ground input pin.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
5
PIN FUNCTIONAL DESCRIPTION (32 WB SOIC)
Pin No.
Name
Description
22
SG9
Switch to ground input pin.
Switch to ground input pin.
Switch to ground input pin.
23
24
25
26
27
28
29
30
31
32
SG8
SG7
SP4
SP5
SP6
SP7
INT
Programmable switch to battery or switch to ground input pin.
Programmable switch to battery or switch to ground input pin.
Programmable switch to battery or switch to ground input pin.
Programmable switch to battery or switch to ground input pin.
Interrupt - Open drain output to MCU, used to indicate input switch change of state.
Analog multiplex output
AMUX
VDD
SO
5.0/3.3 V supply. Sets SPI communication level for SO driver.
SPI Serial output data pin. SO provides digital data from 33993 to MCU.
33993/D
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
6
MAXIMUM RATINGS
(All voltages are with respect to ground, unless otherwise noted.)
Rating
Symbol
Value
Unit
VDD Supply Voltage
—
-0.3 to 7.0
VDC
CS, SI, SO, SCLK, INT, AMUX (Note 1)
WAKE (Note 1)
—
—
—
-0.3 to 7.0
-0.3 to 40
-0.3 to 50
VDC
VDC
VDC
VPWR Supply Voltage (Note 1)
Switch Input Voltage Range
—
—
-14 to 40
6
VDC
MHz
Frequency of SPI Operation (VDD = 5.0 V)
ESD Voltage (Note 2)
VESD1
VESD2
4000
200
V
Human Body Model (Note 3) (Note 4)
Machine Model (Note 5)
Storage Temperature
Tstg
TC
TJ
- 55 to +150
- 40 to +125
- 40 to +150
1.7
°C
°C
°C
W
Operating Case Temperature
Operating Junction Temperature
Power Dissipation (TA = 25°C) (Note 6)
PD
Maximum Junction Temperature
—
-40 to + 150
°C
Thermal Resistance, Junction-to-Ambient Plastic Package
32 SOIC fine pitch, Case 1324
RθJA
RθJL
74
25
°C/W
Notes:
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. ESD data available upon request.
3. ESD1 testing is performed in accordance with the Human Body Model (CZap = 100 pF, RZap = 1500 Ω).
4. All pins when tested individually.
5. ESD2 testing is performed in accordance with the Machine Model (CZap = 200 pF, RZap = 0 Ω).
6. Maximum power dissipation at TJ =150° C junction temperature with no heat sink used.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
7
STATIC ELECTRICAL CHARACTERISTICS
(Characteristics noted under conditions of 3.1 V ≤ V ≤ 5.25 V, 8.0 V ≤ V
≤ 16 V, -40°C ≤ T ≤ 125°C, unless otherwise noted.
DD
PWR
C
Typical values, where applicable, reflect the parameter’s approximate average value with V
= 13 V, T = 25°C.)
A
PWR
Characteristic
Symbol
Min
Typ
Max
Units
Power Input
Supply Voltage Range
VPWR(QF)
VPWR(QF)
VPWR(FO)
5.5
26
8.0
—
—
—
8.0
40
26
V
Quasi-Functional (Note 7)
Fully Operational
Supply Current (All Switches Open, Normal Mode, Tri-state Disabled)
Sleep State Supply Current (Scan Timer = 64 mS, Switches Open)
Logic Supply Voltage
IPWR(ON)
IPWR(SS)
VDD
—
40
3.1
—
2
70
4
mA
µA
V
100
5.25
0.5
20
—
Logic Supply Current (All Switches Open, Normal Mode)
IDD
0.25
10
mA
µA
Sleep State Logic Supply Current (Scan Timer = 64 mS, Switches Open)
Switch Input
IDD(SS)
—
Pulse Wetting Current Switch to Battery (current sink)
IPULSE
IPULSE
12
12
15
16
18
18
2.2
2.2
4
mA
mA
mA
mA
%
Pulse Wetting Current Switch to Ground (current source)
Sustain Current Switch to Battery Input (current sink)
Sustain Current Switch to Ground Input (current source)
ISUSTAIN
ISUSTAIN
IMATCH
1.8
1.8
—
2.0
2.0
2.0
Sustain Current Matching Between Channels Switch to Ground Inputs
(MaxIsustain – MinIsustain)
-----------------------------------------------------------------------------
MinIsustain
× 100
Input Offset Current when Selected as Analog
IOFFSET
-2
1.4
2.5
2
µA
Input Offset Voltage when Selected as Analog
(V(SP&SG inputs) to AMUX output)
VOFFSET
-10
10
mV
Analog Operational Amplifier Output Voltage (sink 250 µA)
Analog Operational Amplifier Output Voltage (source 250 µA)
Switch Detection Threshold
VOL
VOH
—
10
—
30
—
mV
V
VDD - 0.1
3.70
-14
VTH
4.0
—
4.3
40
V
Switch Input Voltage Range
VIN
V
Global Over Temperature Monitor (Note 8) (Note 9)
TLIM
155
—
185
15
°C
°C
Over Temperature Shutdown Hysteresis (Note 9)
Notes:
TLIM(HYS)
5
10
7. Device operational; Table parameters may be out of specification. Junction temperature for VPWR greater than 26 must be considered.
8. Thermal shutdown of 16 mA pull-up and pull down current source only, 2 mA current source/sink and all other functions remain active.
9. This parameter is guaranteed by design, but not production tested.
33993/D
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
8
STATIC ELECTRICAL CHARACTERISTICS
(Characteristics noted under conditions of 3.1 V ≤ V ≤ 5.25 V, 8.0 V ≤ V
≤ 16 V, -40°C ≤ T ≤ 125°C, unless otherwise noted.
DD
PWR
C
Typical values, where applicable, reflect the parameter’s approximate average value with V
= 13 V, T = 25°C.)
A
PWR
Characteristic
Symbol
Min
Typ
Max
Units
DIGITAL INTERFACE
Input Logic Voltage Thresholds (Note 10)
VINLOGIC
0.8
-10
—
—
2.2
10
V
SCLK, SI, Tri-state SO Input Current (0 V to VDD
)
ISCK,SI,TriSO
µA
CS Input Current (CS = VDD
)
IICS
-10
30
—
10
µA
CS Pull-Up Current (CS = 0 V)
IICS
—
—
100
VDD
µA
SO High State Output Voltage (ISO-high = -200 A)
VSO(HIGH)
VDD – 0.8
—
V
SO Low State Output Voltage (ISO-high = 1.6 mA)
VSO(LOW)
—
0.4
V
Input Capacitance on SCLK, SI, Tri-state SO (Note 11)
INT Internal Pull-Up Current
CIN
—
—
20
—
40
—
20
100
VDD
0.4
pF
µA
V
INT Voltage (INT = Open Circuit)
INT Voltage (IINT_B = 1 mA)
VINT(HIGH)
VINT(LOW)
VDD – 0.2
—
0.2
V
WAKE Internal Pull-Up Current
WAKE Voltage (WAKE = Open Circuit)
WAKE Voltage (IWAKE = 1mA)
—
20
4.0
—
40
4.3
0.2
100
5.2
0.4
µA
V
VWAKE(HIGH)
VWAKE(LOW)
V
WAKE Voltage (External Pull-Up)
Notes:
—
—
—
40
V
10. Upper and lower logic threshold voltage levels apply to SI, CS, and SCLK.
11. This parameter is guaranteed by design, but it is not production tested.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
9
DYNAMIC ELECTRICAL CHARACTERISTICS
(Characteristics noted under conditions of 3.1 V ≤ V ≤ 5.25 V, 8.0 V ≤ V
≤ 16 V, -40°C ≤ T ≤ 125°C, unless otherwise noted.
DD
PWR
C
Typical values, where applicable, reflect the parameter’s approximate average value with V
= 13 V, T = 25°C.)
A
PWR
Characteristic
Symbol
Min
Typ
Max
Units
SWITCH INPUT
Pulse Wetting Current Time
tPULSE(ON)
tINT-DLY
15
—
16
5.0
200
—
20
16
300
64
4
ms
µs
µs
ms
s
Interrupt Delay Time (Normal Mode)
Sleep Mode Switch Read Time
tREAD
100
0
Programmable Scan Timer (Sleep mode)
tSCAN TIMER
tINT TIMER
Programmable Interrupt Timer (Sleep mode)
DIGITAL INTERFACE TIMING (Note 12)
Required Low State Duration on VPWR for Reset (VPWR ≤ 0.2 V) (Note 12)
0.032
—
tRESET
—
—
10
µs
Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)
Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)
SI to Falling Edge of SCLK (Required Setup Time)
tLEAD
tLAG
100
50
16
20
—
—
—
—
—
5
—
—
—
—
—
—
55
55
55
ns
ns
ns
ns
ns
ns
ns
ns
ns
tSI(SU)
tSI(HOLD)
tr(SI)
Falling Edge of SCLK to SI (Required Hold Time)
SI, CS, SCLK Signal Rise Time (Note 13)
SI, CS, SCLK Signal Fall Time (Note 13)
tf(SI)
—
5
Time from Falling Edge of CS to SO Low Impedance (Note 14)
Time from Rising Edge of CS to SO High Impedance (Note 15)
Time from Rising Edge of SCLK to SO Data Valid (Note 16)
tSO(EN)
tSO(DIS)
tVALID
—
—
—
25
—
—
12. This parameter is guaranteed by design. Production test equipment uses 4.16 MHz, 5.0V SPI interface.
13. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
14. Time required for valid output status data to be available on SO pin.
15. Time required for output states data to be terminated at SO pin.
16. Time required to obtain valid data out from SO following the rise of SCLK with 200 pF load.
CS
0.2 V
DD
tlead
tlag
0.7 V
DD
DD
SCLK
0.2 V
tSI(su) tSI(hold)
0.7 V
DD
DD
SI
MSB in
0.2 V
tSO(dis)
tSO(en)
tvalid
0.7 V
DD
DD
SO
MSB out
LSB out
0.2 V
Figure 4. Input Timing Switching Characteristics
33993/D
10
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
PIN FUNCTIONAL DESCRIPTION
closed switches are reported as one. The negative transition of
CS Pin
The system MCU selects the 33993 to receive
communication using the CS pin. With the CS in a logic low
state, command words may be sent to the 33993 via SI pin and
switch status information can be received by the MCU via SO.
The falling edge of CS enables the SO output, latches the state
of the INT pin, and the state of the external switch inputs.
CS enables the SO driver.
The first positive transition of SCLK will make the status data
bit 24 available on the SO pin. Each successive positive clock
will make the next status data bit available for the MCU to read
on the falling edge of SCLK. The SI/SO shifting of the data
follows a first-in-first-out protocol with both input and output
words transferring the most significant bit (MSB) first.
Rising edge of CS initiates the following operation:
1. Disables the SO driver (high impedance)
INT Pin
2. INT pin is reset to logic [1], except when additional switch
changes occur during CS low. See Figure 11
The INT pin is an interrupt output from the 33993 device. The
INT pin is an open drain output with an internal pull-up to VDD
.
3. Activates the received command word, allowing the
33993 to act upon new data from switch inputs
In the Normal mode, a switch state change will trigger the INT
pin (when enabled). The INT pin and INT bit in the SPI register
are latched on the falling edge of CS. This permits the MCU to
determine the origin of the interrupt. When two 33993 devices
are used, only the device initiating the interrupt will have the INT
bit set. The INT pin is cleared on the rising edge of CS. The INT
pin will not clear with rising edge of CS if a switch contact
change has occurred while CS was low.
To avoid any spurious data, it is essential the high-to-low and
low-to-high transition of the CS signal occur only when SCLK is
in a logic low state. Internal to the 33993 device is an active pull-
up to VDD on CS.
In Sleep mode the negative edge of CS (VDD applied) will
wake up the 33993 device. Data received from the device
during CS wake up may not be accurate.
In a multiple 33993 device system with WAKE high and VDD
on (Sleep mode), the falling edge of INT will place all 33993s in
the Normal mode.
SCLK Pin
WAKE Pin
The system clock pin (SCLK) clocks the internal shift register
of the 33993. The serial input (SI) data is latched into the input
shift register on the falling edge of SCLK signal. The serial
output (SO) pin shifts the switch status bits out on the rising
edge of SCLK. The SO data is available for the MCU to read on
the falling edge of SCLK. False clocking of the shift register
must be avoided to guarantee validity of data. It is essential the
SCLK pin be in a logic low state whenever chip select pin CS
makes any transition. For this reason, it is recommended the
SCLK pin is commanded to a low logic state as long as the
device is not accessed and CS is in a logic high state. When the
CS is in a logic high state, any signal on the SCLK and SI pin
will be ignored and the SO pin is tri-stated, that is, in high
impedance.
The WAKE pin is an open drain output designed to control a
power supply enable pin. In the Normal mode, the WAKE pin
shall be low. In the Sleep mode, the WAKE pin shall be high.
The WAKE pin has a pull-up to the internal +5.0 V supply.
In Sleep mode WAKE will be high. The falling edge of WAKE
will place the 33993 in Normal mode. In Sleep mode, if VDD is
applied , INT must be high for negative edge of WAKE to wake
up the device. If VDD is not applied to the device in Sleep mode,
INT does not affect WAKE operation.
VPWR Pin
VPWR pin is battery input and power-on reset to the 33993 IC.
The VPWR pin requires external reverse battery and transient
protection. Maximum input voltage on VPWR is 50 Vs. All
SI Pin
wetting, sustain, and internal logic current is provided from
VPWR pin.
The SI pin is used for serial instruction data input. SI
information is latched into the input register on the falling edge
of SCLK. A logic high state present on SI will program a one in
the command word on the rising edge of the CS signal. To
program a complete word, 24 bits of information must be
entered into the device.
VDD Pin
The V input pin is used to determine logic levels on the
DD
microprocessor interface (SPI) pins. Current from V is used
DD
to drive SO output and the pull-up current for CS and INT
SO Pin
pins.V must be applied for wake up from negative edge of CS
DD
The serial output (SO) pin is the output from the shift register.
The SO pin remains tri-stated until the CS pin transitions to a
logic low state. All open switches are reported as zero, all
or INT.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
11
4.0 Vs are considered open. The opposite holds true when
inputs are programmed as switch-to-ground. Programming
features are defined in Table 13. Programming methods are
provided in the following section.
GND Pin
The GND pin provides ground for the IC as well as ground for
inputs programmed as switch to battery inputs.
SP0 – SP7 Pins
SG0 – SG13 Pins
The 33993 device has 8-switch inputs capable of being
programmed to read switch-to-ground or switch-to-battery
contacts. Transient battery voltages greater than 40 Vs must be
clamped by an external device. Surface mount 0805 MOV and
transient voltage suppressors (TVS) devices are available in
SOT23 packages. The input is compared with a 4.0 V
The SGx pins are switch-to-ground inputs only. The input is
compared with a 4.0 V reference. Voltages greater than 4.0 V
are considered open. Voltages less than 4.0 Vs are considered
closed. Programming features are defined in Table 13.
Programming methods are provided in the following section.
reference. When programmed to be switch-to-battery, voltages
greater than 4.0 Vs are considered closed. Voltages less than
33993/D
12
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
SYSTEM APPLICATION INFORMATION
FUNCTIONAL DESCRIPTION
Two or more 33993 devices may be used in a module
Introduction
system. Multiple IC’s may be SPI configured in parallel or serial.
Figures 6 and 7 show the configurations. When using the serial
configuration, 48-clock cycles are required to transfer data in/
out of the IC’s.
The 33993 device is an integrated circuit designed to provide
systems with ultra low quiescent sleep/wake up modes and a
robust interface between switch contacts and a
microprocessor. The 33993 replaces many of the discrete
components required when interfacing to microprocessors
based systems while providing switch ground offset protection,
contact wetting current and system wake up.
MC68HCxx
Micro controller
The 33993 features eight-programmable switch-to-ground or
switch-to-battery inputs and 14-switch-to-ground inputs. All
switch inputs may be read as analog inputs through the analog
multiplexer. Other features include a programmable wake up
timer, programmable interrupt timer, programmable wake up/
interrupt bits, and programmable wetting current settings.
MOSI
SI
33993
Shift Register
MISO
SO
SCLK
SCLK
CS
Parallel
Ports
INT
INT
This device is designed primarily for automotive but may be
used in a variety of other applications in computer,
telecommunications, and industrial controls.
The following sections describe the microprocessor
interface, programming modes and features of the 33993.
SI
33993
SO
Microprocessor Interface
SCLK
The 33993 device directly interfaces to 3.3 or 5.0 V micro
controller unit (MCU). SPI serial clock frequencies up to 6 MHz
may be used for programming and reading switch input status
(production tested at 4.16 MHz). Figure 5 illustrates the
configuration between an MCU and one 33993.
CS
INT
Figure 6. SPI Parallel Interface with Microprocessor
Serial Peripheral Interface (SPI) data is sent to the 33993
device through the SI input pin. As data is being clocked into the
SI pin, status information is being clocked out of the device by
the SO output pin. The response to a SPI command will always
return the switch status, interrupt flag and thermal flag. Input
switch states are latched into the SO register on the falling edge
of chip select. To complete a transfer of information between
the 33993 and MCU, 24 bits are required.
MC68HCxx
Micro controller
MOSI
SI
33993
16-Bit Shift Register
MISO
SO
SCLK
SCLK
.
Parallel
Ports
CS
INT
INT
MC68HCxx
33993
Micro controller
MOSI
MISO
SI
Shift Register
24-Bit Shift Register
SO
SI
33993
SO
SCLK
SCLK
Receive
Buffer
To Logic
CS
CS
Parallel
Ports
INT
INT
INT
Figure 7. SPI Serial Interface with Microprocessor
Figure 5. SPI Interface with Microprocessor
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
13
FUNCTIONAL DESCRIPTION
Registers capable of being programmed in Normal mode
Power Supply
are:
The 33993 is designed to operate from 5.5 to 40 Vs on the
PWR pin. Characteristics are provided from 8.0 to 16 Vs for the
•
•
•
•
Programmable Switch Register (settings command).
Wake up/Interrupt Register (wake up/interrupt command)
Wetting Current Register (metallic command)
Wetting Current Timer Register (wetting current timer
enable command)
V
device. Switch contact currents and the internal logic supply are
generated from the VPWR pin. The VDD supply pin is used to set
the SPI communication voltage levels, current source for the
SO driver and pull up current on INT and CS.
•
•
•
•
Tri-state Register (tri-state command)
VDD supply may be removed from the device to reduce
quiescent current. If VDD is removed while device is in NORMAL
mode, the device will remain in NORMAL mode. If VDD is
Analog Select Register (analog command)
Calibration of Timers (calibration command)
Reset (reset command)
removed in SLEEP mode the device will remain in SLEEP
mode until wake up input is received (WAKE high to low, switch
input or interrupt timer expires).
Figure 11 is a graphical description of the device operation in
Normal mode. Switch states are latched into the input register
on the falling edge of CS. The INT to the MCU is cleared on the
rising edge of CS. However, INT will not clear on rising edge of
CS if a switch has closed during SPI communication (CS low).
This prevents switch states from being missed by the MCU.
Removing VDD from the device disables SPI communication
and will not allow the device to wake up from INT and CS pins.
Power On Reset (POR)
Programmable Switch Register
Applying VPWR to the device will cause a Power On Reset
and place the device in NORMAL mode.
Inputs SP0 to SP7 may be programmable for Switch to
Battery or Switch to Ground. These inputs types are defined
using the settings command. To set an SPx input for switch to
battery, a logic [1] for the appropriate bit must be set. To set an
SPx input for switch to ground a logic [0] for the appropriate bit
must be set. The MCU may change or update the settings
register via software at any time in Normal mode. Regardless of
the setting, when the SPx input switch is closed a logic [1] will
be placed in the SO output register.
Default settings from power on reset via VPWR or Reset
Command are:
•
•
•
•
•
•
Programmable Switch – Set to Switch to Battery
All Inputs Set as Wake Up
Wetting Current - Set to 16 mA
Wetting Current Timer On (20 ms)
All Inputs Tri-state
Analog Select 00000 (no input channel selected)
Table 1. Settings Command
Modes of Operation
Settings Command
Not used
Batt/GND Select
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
The 33993 has two operating modes: NORMAL and SLEEP
modes.
0
0
0
0
0
0
0
1
X
X
X
X
X
X
X
X
sp
7
sp sp
6
sp sp
4
sp
2
sp sp
1
5
3
0
Wake up/Interrupt Register: The Wake up/Interrupt
register defines the inputs allowed to wake the 33993 from
Sleep mode or set the INT pin low in Normal mode.
Normal Mode
Normal mode may be entered by the following events:
Programming the Wake up/Interrupt bit to logic [0] disables the
specific input from generating an interrupt and will disable the
specific input from waking the IC in Sleep mode. Programming
the Wake up/Interrupt bit to logic [1] enables the specific input
to generate an interrupt with switch change of state and will
enable the specific input as wake up. The MCU may change or
update the wake up/Interrupt register via software at any time in
Normal mode.
•
•
•
•
•
•
Application of VPWR to the IC
Change of Switch State (when enabled)
Falling Edge of WAKE
Falling Edge of INT (with VDD = 5.0 & WAKE at logic [1])
Falling Edge of CS (with VDD = 5.0V)
Interrupt Timer Expires
Only in Normal mode with VDD applied can the registers of
the 33993 be programmed through the SPI.
Table 2. Wake up/Interrupt Command
Wake up/Interrupt Command
Command Bits
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
1
0
X
X
X
X
X
X
X
X
sp
7
sp sp
sp sp
sp
2
sp sp
6
5
4
3
1
0
0
0
0
0
0
0
1
1
X
X
sg
sg sg
sg
sg sg
sg sg
sg
5
sg
4
sg sg
sg sg
13 12 11 10
9
8
7
6
3
2
1
0
33993/D
14
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
FUNCTIONAL DESCRIPTION (CONTINUED)
The MCU may change or update the wetting current timer
Wetting Current Register
register via software at any time in Normal mode. This allows
the MCU to control the amount of time wetting current is applied
to the switch contact. Programming the wetting current timer bit
to logic [0] will disable the wetting current timer. Programming
the wetting current timer bit to logic [1] will enable the wetting
current timer.
The 33993 has two levels of switch contact current, 16 mA
and 2 mA. The metallic command is used to set the switch
contact current level. Programming the metallic bit to logic [0]
will set the switch wetting current to 2 mA. Programming the
metallic bit to logic [1] will set the switch contact wetting current
to 16 mA. The MCU may change or update the metallic register
via software at any time in Normal mode Wetting current is
designed to provide higher levels of current during switch
closure. The higher level of current is designed to keep switch
contacts from building up oxides that form on the switch contact
surface.
Table 4. Wetting Current Timer Command
Wetting Current Timer
Commands
Command Bits
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
sp
7
sp sp
sp sp
sp
2
sp sp
6
5
4
3
1
0
sg
sg sg sg
sg sg
9
sg
7
sg sg
sg sg
sg
2
sg sg
13 12 11 10
8
6
5
4
3
1
0
Switch Contact Voltage
Tri-state Register
The tri-state command is use to set the SPx or SGx input
node as high impedance. By setting the tri-state register bit to
logic [1] the input will be high impedance regardless of the
metallic command setting. The comparator on each input
remains active. This command allows the use of each input as
a comparator with a 4.0 volt threshold. The MCU may change
or update the tri-state register via software at any time in
Normal mode.
16 mA Switch Wetting Current
2mA Switch Sustain Current
20 ms Wetting Current Timer
Table 5. Tri-State Command
Figure 8. Contact Wetting and Sustain Current
Tri-State Commands
Command Bits
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
Table 3. Metallic Command
0
0
0
0
0
0
0
0
1
1
0
0
0
1
1
0
X
X
X
X
X
X
X
X
X
X
sp
7
sp sp
sp sp
sp
2
sp sp
6
5
4
3
1
0
Metallic Command
Command Bits
sg
sg sg sg
sg sg
9
sg
7
sg sg
sg sg
sg
2
sg sg
13 12 11 10
8
6
5
4
3
1
0
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
X
X
X
X
X
X
X
X
X
X
sp
7
sp sp
sp
4
sp sp
sp sp
6
5
3
2
1
0
sg
sg sg
sg
sg sg
9
sg sg
7
sg
5
sg
4
sg sg
sg sg
13 12 11 10
8
6
3
2
1
0
Wetting Current Timer Register
Each switch input has a designated 20 ms timer. The timer
starts when the specific switch input crosses the
comparatorthreshold (4.0 V). When the 20 ms timer expires the
contact current is reduced from 16 mA to 2 mA. The wetting
current timer may be disabled for a specific input. When the
timer is disabled, 16 mA of current will continue to flow through
the closed switch contact. With multiple wetting current timers
disabled, power dissipation for the IC must be considered.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
15
FUNCTIONAL DESCRIPTION
Analog Select Register
The analog voltage ON switch inputs may be read by the
MCU using the analog command. Internal to the IC is a 22 to 1
analog multiplexer. The voltage present on the selected input
pin is buffered and made available on the AMUX output pin.
When selecting a channel to be read as analog, the desired
current (16 mA, 2 mA or high impedance) must also be set.
Setting bit 5 and bit 6 to [0,0] selects the input as high
impedence. Setting bit 5 and bit 6 to [0,1] selects the input as
2mA. Setting the bits to [1,0] selects the input as 16 mA. Setting
bit 5 and bit 6 to logic [1,1] in the analog select register is not
allowed and will set the input as an analog input with high
impedance. Analog currents set by the analog command are
pull up currents for all SGx and SPx inputs. The analog
command does not allow pull down currents on the SPx inputs.
Setting the current to 16 mA or 2 mA may be useful for reading
sensor inputs. Further information is provided in the Application
Notes in this Data Sheet.The MCU may change or update the
analog select register via software at any time in Normal mode.
Table 6. Analog Command
Current
Select
Analog Command
Not used
Input Select
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
0
3
0
2
0
1
0
0
0
0
0
0
0
0
1
1
0
X
X
X
X
X
X
X
X
X
16
ma
2
ma
Table 7. Analog Channel Select
Bit
43210
Analog Channel Select
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
No Input Selected
SG0
SG1
SG2
SG3
SG4
SG5
SG6
SG7
SG8
SG9
SG10
SG11
SG12
SG13
SP0
SP1
SP2
SP3
SP4
SP5
SP6
SP7
33993/D
16
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
FUNCTIONAL DESCRIPTION (CONTINUED)
a switch state change can exist without acknowledgement
Calibration of Timers
depends on the software response time to the interrupt. Figure
9 provides further information.
In cases where an accurate time base is required to minimize
quiescent current, the user may calibrate the internal timers
using the calibration command. The device is calibrated by
sending the calibration command. After the 33993 device
receives the calibration command the device will wait for a 512
µs logic [0] pulse on the CS pin. The pulse is used to calibrate
the internal clock. No other SPI pins should transition during this
512 µs calibration pulse. Because the oscillator frequency
changes with temperature, calibration is required for an
accurate time base. The calibration command may be used to
update the device on a periodic basis.
If desired the user may disable interrupts (wake up/interrupt
command) from the 33993 device and read the switch states on
a periodic basis. Switch activation and deactivation faster than
the MCU read rate will not be acknowledged.
The 33993 device will exit the Normal mode and enter the
Sleep mode only with a valid sleep command.
Sleep Mode Operation
Sleep mode is used to reduce system quiescent currents.
Sleep mode may be entered only by sending the sleep
command. All register settings programmed in Normal mode
will be maintained in Sleep mode.
Table 8. Calibration Command
Calibration Command
Command Bits
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
The 33993 will exit Sleep mode and enter Normal mode due
to any of the following events:
0
0
0
0
1
0
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
•
•
•
•
•
•
Input Switch Change of State (when enabled)
Interrupt Timer Expire
Falling Edge of WAKE
Falling Edge of INT (with VDD = 5.0 & WAKE at logic [1])
Falling Edge of CS (with VDD = 5.0V)
Power On Reset (POR)
Reset
The reset command resets all registers to Power On Reset
(POR) state. See Table 4 for POR states or POR in this section
of the Data Sheet.
Table 9. Reset Command
The VDD supply may be removed from the device during
Sleep mode. However removing VDD from the device in Sleep
mode will disable a wake up from Falling Edge of INT and CS.
Reset Command
Command Bits
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
0
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Note: In cases where CS is used to wake the device, the first SO data
message is not valid.
The sleep command contains settings for two programmable
timers for Sleep mode (Interrupt timer, Scan timer).
Normal Mode Operation
The operation of the device in Normal mode is defined by the
states of the previously discussed registers. A typical
application may have the following settings:
Table 10. Sleep Command
Sleep Command
Command Bits
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
•
•
•
•
•
•
Programmable Switch – Set to Switch to Ground
All Inputs Set as Wake Up
Wetting Current - Set to 16 mA
Wetting Current Timer On (20 ms)
All inputs Tri-state-disabled (comparator is active)
Analog select 00000 (no input channel selected)
0
0
0
0
1
1
0
0
X
X
X
X
X
X
X
X
X
X
The interrupt timer is used as a periodic wake up timer. When
the timer expires an interrupt is generated and the device enters
Normal mode. The interrupt timer is a fail-safe timer designed
to guarantee module wake up.
With the device programmed as above an interrupt will be
generated with each switch contact change of state (open to
close or close to open) and 16 mA of contact wetting current will
be source for 20 ms. The INT pin will remain low until switch
status is acknowledged by the microprocessor. It is critical to
understand INT will not be cleared on the rising edge of CS if a
switch closure occurs while CS is low. The maximum duration
The scan timer sets the polling period of switch inputs during
Sleep mode. For example: In Sleep mode with scan timer set to
32 ms the 33993 will wake up every 32 ms for 125 µs and read
switch status.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
17
FUNCTIONAL DESCRIPTION (CONTINUED)
The table below illustrates the programmable settings of the The table below illustrates the programmable settings of the
Interrupt timer.
Scan timer.
Table 11. Interrupt Timer
Table 12. Scan Timer
Bit
543
Bit
210
Interrupt Period
SCAN Period
000
001
010
011
100
101
110
111
32 ms
64 ms
000
001
010
011
100
101
110
111
No Scan
1 ms
128 ms
256 ms
512 ms
1.024s
2.048s
4.096s
2 ms
4 ms
8 ms
16 ms
32 ms
64 ms
The scan timer sets the polling period between input switch
reads in Sleep mode. The period is set in the sleep command
and may be set to 000 (no period) to 111 (64 ms). In Sleep
mode when the scan timer expires, inputs will behave as
programmed prior to sleep command. The 33993 will wake up
for approximately 125 µs and read the switch inputs. At the end
of the 125 µs the input switch states are compared with the
switch state prior to sleep command. When switch state
changes are detected an interrupt (when enabled - see Wake
Up/Interrupt Command) is generated and the device enters
Normal mode. Without switch state changes, the 33993 will
reset the scan timer, inputs become tri-state, and the Sleep
mode continues until scan timer expires again.
It is critical to note the Interrupt and Scan timers are disabled
in the Normal mode.
Figure 10 is a graphical description of how the 33993 device
exits Sleep mode and enters Normal mode. Notice the device
will exit Sleep mode when the interrupt timer expires or when a
switch change of state occurs. The falling edge of INT triggers
the MCU to wake from sleep state.
Over Temperature
With multiple switch inputs closed and the device
programmed with the wetting current timer disabled,
considerable power is dissipated by the IC. For this reason
global temperature monitoring is implemented. Temperature
monitor is active in the Normal mode only. When activated,
Over Temperature monitor will:
•
•
•
Force all 16 mA pull-up and pull down current sources to
revert to 2mA current sources.
Maintain the 2 mA current source and all other
functionality
I=V/R or 0.270V/100ohm = 2.7mA
Set the Over Temperature bit in the SPI output register
An interrupt will be generated when Over Temperature
monitor has been detected. The Over Temperature bit in the
SPI word will be cleared on rising edge of CS provided the die
temperature has cooled below the specification limit. When die
temperature has cooled below thermal limit the device will
resume previously programmed settings.
Inputs active for 125 us
out of 32 ms
I=V/R or 6mV/100ohm = 60 uA
Table 13 provides a comprehensive list of SPI commands
recognize by the 33993 and the reset state of each register
Figure 9. Sleep Current Waveform
33993/D
18
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
Table 13. .SPI COMMAND REGISTER DEFAULT SETTINGS
Command Bits Setting Bits
MSB
23
0
22
0
21
0
20
0
19
0
18
0
17
0
16
0
15
X
14
X
13
X
12
X
11
X
10
X
9
8
7
6
5
4
3
2
1
0
Switch Status
Command
X
X
X
X
X
X
X
X
X
X
Settings command
(SI)
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Bat=1,Gnd=0
wake up/interrupt bit
(default is wake up)
wakeup=1,
nonwakeup=0
wake up/interrupt bit
(default is wake up)
wakeup=1,
0
0
0
0
0
0
1
1
X
X
1
1
1
1
1
1
1
1
1
1
1
1
1
1
nonwakeup=0
Metallic command
1(SI)
M = 1, N = 0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
1
X
X
X
X
X
1
X
1
X
1
X
1
X
1
X
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Metallic command
1(SI)
M = 1, N = 0
Analog command (SI)
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
16mA 2mA
0
1
0
1
0
1
0
1
0
1
0
0
Wetting Current
Timer
1
1
Enable Default = on
on = 1, off = 0
Wetting Current
Timer
0
0
0
0
1
0
0
0
X
X
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Enable Default = on
on = 1, off = 0
Tri-State Command
Tri-State=1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
1
0
1
1
0
1
0
1
0
X
X
X
X
X
X
X
X
X
1
X
1
X
1
X
1
X
1
X
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
X
1
1
Tri-State Command
Tri-State=1
Calibration
Command
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Sleep command (SI)
int
int
int
scan scan scan
timer timer timer timer timer timer
Reset Command
Test Mode (SI)
0
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
SO response will
always send
them
flg
int
flg
SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SG13 SG12 SG11 SG10 SG9 SG8 SG7 SG6 SG5 SG4 SG3 SG2 SG1 SG0
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
19
VPWR
VDD
WAKE
INT
CS
Source/
Sink On
SO
Figure 10. Sleep Mode to Normal Mode Operation
VPWR
VDD
INT
CS
SGx
Figure 11. Normal Mode Interrupt Operation
33993/D
20
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
APPLICATION NOTES
Introduction
Metallic/Elastomeric Switch
The 33993 device primary function is the detection of open
or closed switch contacts. However, there are many features
allowing the device to be used in a variety of applications. The
following list of applications should be considered for the IC:
Metallic switch contacts often develop higher contact
resistance over time due to contact corrosion. The corrosion is
induced by humidity, salt and other elements that exist in the
environment. For this reason the 33993 provides two settings
for contacts. When programmed for metallic switches the
device provides higher wetting current to keep switch contacts
free of oxides. The higher current occurs for the first 20 ms of
closed switch. After the time period set by the MCU, the wetting
current timer command may be sent again to enable the timer.
The user must consider power dissipation on the device when
disabling the timer (see Over Temperature Operation).
•
•
•
•
•
Sensor Power Supply
Switch Monitor for Metallic or Elastomeric Switches
Analog Sensor Inputs (ratio metric)
Power Mosfet/LED Driver & Monitor
Multiple 33993 Devices in Module System
switch closure. Where longer duration of wetting current is
desired, the user may send the wetting current timer command
and disable the timer. Wetting current will be continuous to the
To increase the amount of wetting current for a switch contact
the user has two options. Higher wetting current to a switch may
be achieved by paralleling SGx or SPx inputs. This will increase
wetting current by 16 mA for each input added to the switch
contact. The second option is to simply and an external resistor
pull up to the VPWR supply for switch to ground inputs or a
resistor to ground for a switch to battery input. Adding an
external resistor has no effect on the operation of the device.
Sensor Power Supply
Each input may be used to supply current to sensors external
to a module. Many sensors such as hall effect, pressure
sensors and temperature sensors require a supply voltage to
power the sensor and provide an open collector or analog
output. The diagram below shows how the 33993 may be used
to supply power and interface to these types of sensors. In an
application where the input makes continuous transitions,
consider using the wake up/interrupt command to disable the
interrupt for the particular input.
Elastomeric switch contacts are made of carbon and have a
high contact resistance. Resistance of 1K is common.
Applications with elastomeric switches, the pull-up and pull
down currents must be reduced to prevent excessive power
dissipation at the contact. Programming for lower current
settings is provided in the Functional Description section of this
specification.
33993
VBAT
SP0
VPWR
SP1
VDD
MCU
VDD
VBAT
SP7
WAKE
SI
MOSI
SCLK
SG0
SG1
SCLK
Vpwr Vpwr
CS
CS
SO
INT
MISO
INT
16 mA
2.0 mA
2.0 mA
2.5 KΩ
16 mA
SG12
SG13
Vpwr Vpwr
16 mA
HALL-EFFECT
SENSOR
Reg
X
IOC[7:0]
input capture
timer port
2.5 KΩ
Figure 12. Sensor Power Supply
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
21
Analog Sensor Inputs
to calculate the error in the A/D conversion. By placing a 2.0K,
0.1 percent resistor in the end of line test equipment and
assuming a perfect 2.0 mA current source from the 33993 a
calculated A/D conversion may be obtained. Using the equation
yields
The 33993 features a 22 to 1 analog multiplexer. Setting the
binary code for a specific input in the analog command allows
the micro controller to perform analog to digital conversion on
any of the 22 inputs. On rising edge of CS the multiplexer
connects a requested input to the AMUX pin. The AMUX pin is
clamped to max of VDD Vs regardless of the higher voltages
I1 Þ R1
------------------
ADC =
× 255
present on the input pin. After an input has been selected as the
analog, the corresponding bit in next SO data stream will be
logic [0].
I2 Þ R2
The input pin, when selected as analog may be configured
as analog with high impedance, analog with 2 mA pull up or
analog with 16 mA pull up. The following diagram show how the
33993 may be used to provide a ratiometric reading of variable
resistive input.
2mA 2K
-------------------------------
ADC =
× 255
2mA 2.39K
ADC = 213counts
The ADC value of 213 counts is the value with zero percent
error (neglecting the resistor tolerance and AMUX input offset
voltage). Now we can calculate the count value induced by the
mismatch in current sources. From a sample device the
maximum current source was measured at 2.05 mA and
minimum current source was measured at 1.99 mA. This yields
three percent error in A/D conversion. The A/D measurement
will be as follows.
33993
V
BAT
SP0
SP1
V
PWR
V
DD
MCU
V
DD
V
BAT
SP7
WAKE
SI
MOSI
SCLK
SG0
SG1
SCLK
V
V
PWR
PWR
CS
CS
SO
INT
1.99mA 2K
2.05mA 2.39K
---------------------------------------
ADC =
× 255
MISO
INT
16 mA
2.0 mA
I
1
2.0 mA
SG12
SG13
AMUX
AN0
ADC = 207counts
R
V
V
PWR
1
PWR
Analog Sensor
or Analog Switch
Analog
Ports
16 mA
2.0 mA
This A/D conversion is three percent low in value. The error
correction factor of 1.03 my be used to correct the value.
I
ADC = 207counts 1.03
ADC = 213counts
2
2.0 mA
4.54 V to 5.02 V
VREF(H)
2.39 K
0.1%
R
2
VREF(L)
2
Figure 13. Analog Ratiometric Conversion
An error correction factor may then be stored in E memory
and used in the A/D calculation for the specific input. Each input
used as analog measurement will have a dedicated calibrated
error correction factor.
To read a potentiometer sensor, the wiper should be
grounded and brought back to the module ground, illustrated in
Figure 11. With the wiper changing the impedance of the
sensor, the analog voltage on the input will represent the
position of the sensor.
Using the Analog feature to provide 2 mA of pull-up current
to an analog sensor may induce error due to the accuracy of the
current source. For this reason, a ratiometric conversion must
be considered. Using two current sources (one for the sensor
and one to set the reference voltage to the A/D converter) will
yield a maximum error (due to the 33993) of four percent.
Higher accuracy may be achieved through module level
calibration. In this example we use the resistor values from
Figure 11, and assume the current sources are four percent
from each other. The user may use the module end of line tester
33993/D
22
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
APPLICATION NOTES (CONTINUED)
Power MOSFET/LED Driver & Monitor
•
Tri-state command -disable tri-state for SPx
Because of the flexible programming of the 33993 device, it
may be used to drive small loads like LEDs or MOSFET gates.
It was specifically designed to power up in the Normal mode
with the inputs tri-state. This was done to insure the LEDs or
MOSFETs connected to the 33993 power up in the off-state.
The Switch Programmable (SP0-SP7) inputs have a source
and sink capability, providing effective MOSFET gate control.
To complete the circuit, a pull down resistor should be used to
keep the gate from floating during the Sleep modes. An SGx
input may be used to monitor the drain voltage for open load
detection. An external resistor on the SGx input is used to
adjust the comparator threshold in the mosfet ON state. The
drain to source voltage may also be monitored using the analog
command for the SGx input. See Figure 14 below.
After the tri-state command is sent (tri-state disable) the
MOSFET gate will be pulled to ground. From this point forward
the MOSFET may be turned ON and OFF by sending the
setting command.
•
•
Settings command - SPx as switch to ground (MOSFET
ON)
Settings command - SPx as switch to battery (MOSFET
OFF)
Monitoring of the MOSFET drain in the OFF state provides
open load detection. This is done by using an SGx input
comparator. With the SGx input in tri-state the load will pull-up
the SGx input to battery. With open load the SGx pin is pulled
down to ground through an external resistor. The open load is
indicated by a logic [1] in the SO data bit.
VBATT
The analog command may be used to monitor the drain
voltage in the mosfet ON state. By sourcing 2 mA of current to
the 1.5KΩ resistor the analog voltage on the SGx pin will be
approximately
SG0
Vpwr Vpwr
16 mA
2.0 mA
1.5KΩ
SG0
AMUX
100KΩ
+
To SPI
V sgx = Is (gx . (1.5K + V ds))
4V Ref
–
Comparator
As the voltage on the drain of the MOSFET increases, so
does the voltage on the SGx pin. With the SGx pin selected as
analog the MCU may perform the A/D conversion.
SP0
Vpwr Vpwr
16 mA
2.0 mA
SP0
Using this method for controlling unclamped inductive loads
is not recommended. Inductive flyback voltages greater than
VPWR may damage the IC.
+
To SPI
4V Ref
2.0 mA
–
16 mA
Comparator
The SP0 to SP7 pins of this device may also be used to send
signals from one module to another. Operation is similar to the
gate control of a MOSFET.
SG13
Vpwr Vpwr
16 mA
2.0 mA
SG13
For LED applications a resistor in series with the LED is
recommended but not required. The Switch to Ground inputs
are recommended for LED application. To drive the LED use
the following commands:
+
To SPI
4V Ref
–
Comparator
Figure 14. MOSFET or LED Driver Output
•
•
Wetting current timer enable command -disable SGx
wetting current timer
Metallic command -set SGx to 16 mA
The sequence of commands (from Normal mode with inputs
tri-state) required to set up the device to drive the gate are as
follows:
From this point forward the LED may be turned ON and OFF
using the tri-state command:
•
•
•
Wetting current timer enable command -disable SPx
wetting current timer
Metallic command -set SPx to 16 mA or 2 mA gate drive
current
•
•
Tri-state command -disable tri-state for SGx (LED ON)
Tri-state command -disable tri-state for SGx (LED OFF)
These parameters are easily programmed via SPI
commands in Normal mode.
Settings command - set SPx as switch to battery
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
23
APPLICATION NOTES (CONTINUED)
Multiple 33993 Devices in a Module System can determine the source of the WAKE up by reading the
interrupt flag.
Multiple 33993 devices may be used in a module system.
SPI control may be achieved in parallel or serial. However,
when Parallel mode is used each device is addressed
independently. Therefore, when sending the sleep command
one device will enter sleep before the other. For multiple
devices in a system, it is recommended the devices are
controlled in serial (S0 from first device is connected to SI of
second device). With two devices, 48 clock pulses are required
to shift data in. When the WAKE feature is used to enable the
power supply, both WAKE pins should be connected to the
enable pin on the power supply. The INT pins may be
connected to one interrupt pin on the MCU or may have their
own dedicated interrupt to the MCU.
Cost and Flexibility
The bottom line relates to system cost. Systems requiring a
significant number of switch interfaces have many discrete
components. Discrete components on standard PWB consume
board space and must be checked for solder joint integrity. An
integrated approach reduces solder joints, consumes less
board space, and offers wider operating voltage and greater
flexibility. Another noteworthy advantage the 33993 device is it
offers analog interface capability. High impedance analog
circuits are susceptible to noise from other signals on the PWB.
By implementing a short analog signal to the 33993 and
allowing it to buffer the signal reduces the susceptibility. By
implementing the analog method mentioned in the Application
section, an accurate ratio metric conversion may be
The transition from Normal mode to Sleep mode is done by
sending the sleep command. With the devices connected in
serial and sleep command sent, both will enter Sleep mode on
rising edge of CS. When Sleep mode is entered, the WAKE pin
will be logic [1]. If either device wakes up the WAKE pin will
transition low, waking the other device.
accomplished. The method also reduces system wiring and
failure modes over conventional systems.
A condition exists where the MCU is sending the sleep
command (CS logic [0]) and a switch input changes state. With
this event the device detecting this input will not transition to
Sleep mode while the second device will enter Sleep mode. In
this case two switch status commands must be sent to receive
accurate switch status data. The first switch status command
will wake the device in Sleep mode. Switch status data may not
be valid from the first switch status command because the time
required for the input voltage to rise above the 4.0 V input
comparator threshold. This time is dependant on the
impedance of SG or SP node. The second switch status
command will provide accurate switch status information. It is
recommended for software to wait 10 to 20 ms between the two
switch status commands, allowing time for switch input voltages
to stabilize. With all switch states acknowledged by the MCU,
the sleep sequence may be initiated. All parameters for Sleep
mode should be updated prior to sending the sleep command.
The 33993 IC has an internal 5.0 V supply from VPWR pin. A
POR circuit monitors the internal 5.0 V supply. In the event of
transients on the VPWR pin an internal reset may occur. Upon
reset the 33993 will enter Normal mode with the internal
registers as defined in Table 13. Therefore, it is recommended
the MCU periodically update all registers internal to the IC.
Using the WAKE Feature
The 33993 provides a WAKE output designed to control an
enable pin on system power supply. While in the Normal mode,
the WAKE output is low, enabling the power supply. In the
Sleep mode, the WAKE pin is high, disabling the power supply.
The WAKE pin has a passive pull-up to the internal 5.0 V
supply.
During the Sleep mode, a switch closure will set the WAKE
pin low, causing the 33993 to enter the Normal mode. The
power supply will then be activated, supplying power to the V
DD
pin and the microprocessor and the 33993. The microprocessor
33993/D
24
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
PACKAGE DIMENSIONS
NOTES:
32-Lead SOIC
0.65 mm Pitch
CASE 1324-02
Issue A
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
3. DATUMS B AND C TO BE DETERMINED AT
THE PLANE WHERE THE BOTTOM OF THE
LEADS EXIT THE PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS.
MOLD FLASH, PROTRUSION OR GATE BURRS
SHALL NOT EXCEED 0.15 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.25 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL NOT CAUSE
THE LEAD WIDTH TO EXCEED 0.4 MM PER
SIDE. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT.
MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD SHALL NOT LESS
THAN 0.07 MM.
10.3
7.6
7.4
C
B
2.65
2.35
5
9
30X
1
32
0.65
PIN 1 ID
4
9
11.1
10.9
C
L
B
B
7. EXACT SHAPE OF EACH CORNER IS
OPTIONAL.
16
17
8. THESE DIMENSIONS APPLY TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.10 MM
AND 0.3 MM FROM THE LEAD TIP.
SEATING
PLANE
A
5.15
2X 16 TIPS
0.3
32X
9. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTER-LEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
0.10 A
A
B C
A
A
(0.29)
BASE METAL
0.25
0.19
(0.203)
R0.08 MIN
0.25
°
0
0.38
0.22
0.29
0.13
GAUGE PLANE
MIN
PLATING
6
M
M
0.13
C A
B
8
0.9
0.5
SECTION A-A
°
°
8
0
ROTATED 90 CLOCKWISE
°
SECTION B-B
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33993/D
25
33993/D
26
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
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or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do
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33993/D
相关型号：
PC33999EKR2
1.2A PWM BASED PRPHL DRVR, PDSO54, 0.65 MM PITCH, LEAD FREE, EXPOSED PAD, PLASTIC, SOIC-54
NXP
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