MSK111E [MSK]

HIGH SPEED POWER AMPLIFIER; 高速功率放大器


型号：	MSK111E
厂家：	M.S. KENNEDY CORPORATION
描述：	HIGH SPEED POWER AMPLIFIER 高速功率放大器放大器功率放大器
文件：	总5页 (文件大小：234K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ISO 9001 CERTIFIED BY DSCC

HIGH SPEED

POWER AMPLIFIER

111

(315) 701-6751

M.S.KENNEDY CORP.

4707 Dey Road Liverpool, N.Y. 13088

MIL-PRF-38534 CERTIFIED

FEATURES:

Replaces Apex WA-01

Internal 1.5KΩ Feedback Resistor

High Output Current: 400mA

ꢀery Fast Slew Rate: 3000ꢀ/µS

Fast Settling Time

Low Offset ꢀoltage: ± 5mꢀ

Offset Null Capability

DESCRIPTION:

The MSK 111 is a high speed operational amplifier which utilizes low impedance push-pull circuitry to achieve high

speed amplification. Laser trimmed offset voltage provides a high DC accuracy typically less than ± ±mꢀ. The

MSK 111 also offers an external offset null capability for applications in which zero offset is critical. The speed and

output current offered by the MSK 111 makes it an excellent choice for video processing circuits and high speed test

circuits. The MSK 111 is packaged in a hermetically sealed 8 pin TO-3 package.

EQUIVALENT SCHEMATIC

PIN-OUT INFORMATION

TYPICAL APPLICATIONS

Output

+ꢀCC

8 Balance

7 -ꢀCC

Sample and Hold Circuits

ꢀideo Processing

Line Drivers

6 +Input

5 -Input

Balance

Function Generators

Rev. B 10/05

ABSOLUTE MAXIMUM RATINGS

T^ST

Storage Temperature Range

Lead Temperature Range

(10 Seconds)

Total Supply ꢀoltage

Output Current

3±ꢀ

0.4A

± 6ꢀ

ꢀCC

-65°C to +150°C

300°C

TLD

IOUT

ꢀIN

Differential Input ꢀoltage

Common Mode Input ꢀoltage

Case Operating Temperature

MSK111

MSK111H/E

± ꢀCC

-40°C to +85°C

-55°C to +1±5°C

175°C

Junction Temperature

ELECTRICAL SPECIFICATIONS

Group A

MSK 111H/E

MSK 111

Parameter

Units

Test Conditions

Subgroup Min.

Max.

Typ.

Min.

Max.

Typ.

STATIC

Supply Voltge Range

± 12

± 16

± 30

± ±0

± 1±

± 28

± 12

± 16

± 3±

± 1±

± 28

Quiescent Current

INPUT

VIN=0V

2,3

µA

2,3

± ±

± 0.±

± 10

± 0.±

Input Offset Voltage

± 30

Input Bias Current

Common Mode Rejection 2

Power Supply Rejection 2

V^CM=± ±V

±4

7±

±4

7±

VCC=24V to 30V

OUTPUT

Output Voltage Swing

Output Current

f=1KHz RL=1KΩ

f=1KHz RL=±0Ω

VO=20VPP

± 10

± 11

± 10

± 11

400

Power Bandwidth

MHz

Settling Time

Slew Rate

10V Step

VOUT=± 10V RL=1KΩ

TC=2±°C

V/µS

2±00

3000

2.9

2±00

3000

2.9

3±

Propagation Delay 2

Thermal Resistance

Junction to Case @ 12±°C

°C/W

KΩ

Internal Feedback Resistor

1.497

1.±03

1.±

1.49±

1.±0±

1.±

NOTES:

Unless otherwise specified, VCC= 15V AV=10V/V and RL=∞ and Tc=25°C.

Guaranteed by design but not tested. Typical parameters are representative of actual device

performance but are for reference only.

Industrial grade and "E" suffix devices shall be tested to subgroups 1 and 4 unless otherwise specified.

Military grade devices ("H" suffix) shall be 100% tested to subgroups 1,2,3 and 4.

Subgroup 5 and 6 testing available upon request.

Subgroup 1,4 TA=TC=+25°C

Subgroup 2,5 TA=TC=+125°C

Subgroup 3,6 TA=TC=-55°C

Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle.

Rev. B 10/05

APPLICATION NOTES

POWER SUPPLY BYPASSING

HEAT SINKING

To select the correct heat sink for your application, refer

to the thermal model and governing equation below.

Both the negative and the positive supplies must be

effectively decoupled with a high and low frequency

bypass circuit to avoid power supply induced oscilla-

tion. An effective decoupling scheme consists of a 0.01

microfarad ceramic capacitor in parallel with a 4.7 mi-

crofarad tantalum capacitor from each power supply pin

to ground. All power supply decoupling capacitors should

be placed as close to the package power supply pins as

possible.

Thermal Model:

Output, power supply, and bypass leads should be kept

as short as possible. Long connections can add signifi-

cant inductance, raising impedance and limiting output

current slew rate. This is especially true in the video

frequency range.

The case of the MSK 111 is electrically isolated and

should be connected to a common ground plane. In ad-

dition to the case, the input signal and input resistors

should be connected to this common ground plane us-

ing a single point grounding scheme. This will help to

prevent undesired current feedback that can cause in-

stability in the circuit.

Governing Equation:

TJ = PD x (RθJC + RθCS + RθSA) + TA

Where

GAIN

The MSK 111, unlike most operational amplifiers, has

an internal feedback resistor. The value of this resistor

is 1.5KΩ. Fewer external components are required to

configure the MSK 111 in either inverting or non-invert-

ing modes. Using an internal feedback resistor shortens

the feedback path, lowering summing node capacitance

to ground and stabilizing high frequency characteristics.

= Junction Temperature

= Total Power Dissipation

RθJC = Junction to Case Thermal Resistance

^{RθCS = Case to Hea}I^tN^{Sink Thermal Resistance}

RθSA = Heat Sink to Ambient Thermal Resistance

= Case Temperature

= Ambient Temperature

= Sink Temperature

OUTPUT OFFSET NULL

Typically,the MSK 111 has an input offset voltage of

less than ± ±mꢀ. The input offset voltage is laser

trimmed to less than ± 5mꢀ, but in applications where

offset is critical, the balance pins may be used to null

the offset to zero. A ±0KΩ potentiometer may be placed

between pins 4 and 8 with the wiper arm connected to

+ꢀCC. If the balance function is not used pins 4 and 8

should not be connected (floating). However, if settling

time is extremely important, pin 8 should be tied to the

AC ground with a 100-150pF capacitor.

Example:

In our example the amplifier application requires the output

to drive a 10 volt peak sine wave across a 50 ohm load for

0.± amp of output current. For a worst case analysis we will

treat the 0.± amp peak output current as a D.C. output cur-

rent. The power supplies are ± 15 ꢀDC.

1.) Find Power Dissipation

PD=[(quiescent current) x (+ꢀCC - (ꢀCC))] + [(ꢀS - ꢀO) x IOUT]

=(±8 mA) x (30ꢀ) + (5ꢀ) x (0.±A)

=0.84W + 1W

SAFE OPERATING AREA-POWER DISSIPATION

=1.84W

The safe operating area curve is a graphical represen-

tation of the power handling capability of the amplifier

under various conditions. The wire bond current carry-

ing capability, transistor junction temperature and sec-

ondary breakdown limitations are all incorporated into

the safe operating area curves. All applications should

be checked against the S.O.A. curves to ensure high

M.T.B.F.

±.) For conservative design, set TJ = +150°C.

3.) For this example, worst case TA = +±5°C.

4.) RθJC = 31°C/W

5.) Rearrange governing equation to solve for RθSA:

RθSA = (TJ - TA) / PD - (RθJC) - (RθCS)

= (150°C-±5°C)/1.84W-(31°C/W)-(0.15°C/W)

= 36°C/W

The heat sink in this example must have a thermal resis-

tance of no more than 36°C/W to maintain a junction tempera-

ture of less than +150°C. This calculation assumes a case to

sink thermal resistance of 0.15°C/W.

Rev. B 10/05

TYPICAL PERFORMANCE CURVES

Rev. B 10/05

MECHANICAL SPECIFICATIONS

CONTAINS INTERNAL BeO (BERYLLIUM OXIDE)

WEIGHT = 15 GRAMS TYPICAL

NOTE: ALL DIMENSIONS ARE ± 0.010 INCHES UNLESS OTHERWISE LABELED

ORDERING INFORMATION

Part

Screening Level

Number

Industrial

MSK111

EXTENDED RELIABILITY

MIL-PRF-38534 CLASS H

MSK111E

MSK111H

M.S. Kennedy Corp.

4707 Dey Road, Liverpool, New York 13088

Phone (315) 701-6751

FAX (315) 701-6752

www.mskennedy.com

The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make

changes to its products or specifications without notice, however, and assumes no liability for the use of its products.

Please visit our website for the most recent revision of this datasheet.

Rev. B 10/05

MSK111E [MSK]

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