MSK739E [MSK]

ULTRA-ACCURATE/HIGH SLEW RATE INVERTING OPERATIONAL AMPLIFIER; ULTRA -准确/高压摆率反相运算放大器
MSK739E
型号: MSK739E
厂家: M.S. KENNEDY CORPORATION    M.S. KENNEDY CORPORATION
描述:

ULTRA-ACCURATE/HIGH SLEW RATE INVERTING OPERATIONAL AMPLIFIER
ULTRA -准确/高压摆率反相运算放大器

运算放大器 放大器电路 高压
文件: 总6页 (文件大小:298K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ISO-9001 CERTIFIED BY DSCC  
ULTRA-ACCURATE/HIGH SLEW RATE 739  
Very Fast Setting Time - 10nS to 0.1% Typical  
Very Fast Slew Rate - 5500 V/µS Typical  
Unity Gain Bandwidth - 220 MHz Typical  
Low Noise - 0.15uVrms Typical (f=0.1Hz to 10Hz)  
Very Accurate (Low Offset) ±75µV Max.  
Pin Compatable with AD9610  
INVERTING  
OPERATIONAL AMPLIFIER  
M.S.KENNEDY CORP.  
4707 Dey Road Liverpool, N.Y. 13088  
(315) 701-6751  
FEATURES:  
MIL-PRF-38534 QUALIFIED  
DESCRIPTION:  
The MSK 739 is an inverting composite operational amplifier that combines extremely high bandwidth and slew rate with  
excellent D.C. accuracy to produce an amplifier perfectly suited for high performance data aquisition and conversion as well  
as high speed commmunication and line drive. The performance of the MSK 739 is guaranteed over the full military tem-  
perature range and for more cost sensitive applications is available in an industrial version. The standard package style is a  
space efficient 12 pin TO-8. However, alternate package styles are available upon request.  
EQUIVALENT SCHEMATIC  
EQUIVALENT SCHEMATIC  
TYPICAL APPLICATIONS  
PIN-OUT INFORMATION  
1
2
3
4
5
6
7 Ground  
8 NC  
9 Negative Power Supply  
10 Negative Short Circuit  
11 Output  
High Performance Data Aquisition  
Coaxial Line Driver  
Data Conversion Circuits  
High Speed Communications  
Ultra High Resolution Video Amplifier  
Positive Power Supply  
NC  
Case Ground  
Internal Feedback  
Inverting Input  
Non-Inverting Input  
12 Positive Short Circuit  
Rev. A 4/02  
1
ABSOLUTE MAXIMUM RATINGS  
Storage Temperature Range  
Lead Temperature Range  
(10 Seconds Soldering)  
Power Dissipation  
Junction Temperature  
Case Operating Temperature Range  
-65°C to +150°C  
300°C  
Supply Voltage  
TST  
TLD  
±VCC  
IOUT  
VIN  
+18V  
±200mA  
±12V  
Peak Output Current  
Differential Input Voltage  
Thermal Resistance  
Junction to Case  
See Curve  
150°C  
PD  
TJ  
TC  
RTH  
46°C/W  
Output Devices Only  
(MSK739B/E)  
(MSK739)  
-55°C to+125°C  
-25°C to +85°C  
ELECTRICAL SPECIFICATIONS  
±Vcc=±15V Unless Otherwise Specified  
Group A  
MSK 739B/E  
MSK 739  
Test Conditions  
Parameter  
Subgroup  
Typ.  
Min.  
Max.  
Min.  
Typ.  
Max.  
Units  
STATIC  
Supply Voltage Range  
Quiescent Current  
-
1
±15  
±37  
-
2
±18  
±37  
±39  
-
±12  
±18  
V
±12  
±15  
±35  
±36  
45  
Vin=0V  
Av=-1V/V  
-
-
-
±40  
mA  
-
-
-
2,3  
-
-
-
mA  
2
Thermal Resistance  
Output Devices Junction to Case  
48  
°C/W  
INPUT  
Input Offset Voltage  
Vin=0V Av=-100V/V  
Vin=0V  
1
-
-
-
-
-
-
-
-
-
-
-
±50  
±100  
±75  
µV  
µV/°C  
nA  
-
-
-
-
-
-
-
-
-
-
-
±25  
±0.5  
±10  
±15  
5
Input Offset Voltage Drift  
2,3  
±0.75  
±2.0  
±1.5  
7
Input Bias Current  
Vcm=0V  
1
±20  
-
±60  
±40  
Either Input  
Vcm=0V  
2,3  
-
±80  
nA  
Input Offset Current  
1
10  
-
30  
nA  
20  
40  
-
2,3  
-
-
nA  
5
2
Input Impedance  
F=DC Differential  
Vcc=±5V  
F= 0.1Hz To 10Hz  
F=1KHz  
-
-
-
-
-
5
MΩ  
5
2
Power Supply Rejection Ratio  
2
20  
-
µV/V  
µVp-p  
nVHz  
pAHz  
1
8
-
2
Input Noise Voltage  
0.2  
4
0.15  
3.8  
0.6  
Input Noise Voltage Density  
Input Noise Current Density  
2
2
-
-
F=1KHz  
0.7  
-
-
OUTPUT  
Output Voltage Swing  
Output Current  
RL=100Av=-3V/V F10MHz  
TJ<150°C  
4
4
-
±12.5  
±120  
15  
±10  
±100  
-
-
-
V
±10 ±12.5  
±100 ±120  
-
-
mA  
nS  
2
Settling Time  
1
0.1% 10V step RL=1KΩ  
RL=100Vo=±10V  
RL=100Ω  
45  
-
-
10  
22  
35  
-
Full Power Bandwidth  
4
-
20  
15  
MHz  
MHz  
20  
2
Bandwidth (Small Signal)  
190  
165  
-
175  
220  
-
TRANSFER CHARACTERISTICS  
Slew Rate  
VOUT=±10V RL=1KAv= -1.5V/V  
RL=1KF=1KHz VOUT=±10V  
4
4
4000  
100  
3500  
95  
4000  
105  
-
-
5500  
110  
-
-
V/µS  
dB  
2
Open Loop Voltage Gain  
NOTES:  
1
AV= -1, measured in false summing junction circuit.  
2 Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only.  
Industrial grade and "E" suffix devices shall be tested to subgroups 1 and 4 unless otherwise specified.  
Military grade devices ("B" suffix) shall be 100% tested to subgroups 1,2,3 and 4.  
Subgroups 5 and 6 testing available upon request.  
3
4
5
6
TA=TC=+25°C  
TA=TC=+125°C  
TA=TC=-55°C  
Subgroup 1,4  
Subgroup 2  
Subgroup 3  
Measurement taken 0.5 seconds after application of power using automatic test equipment.  
7
Rev. A 4/02  
2
APPLICATION NOTES  
HEAT SINKING  
The value of the short circuit current limit resistors (±RSC) can  
be calculated as follows.  
To determine if a heat sink is necessary for your application and  
if so, what type, refer to the thermal model and governing equation  
below.  
+RSC=VCC-0.7/+ISC  
-RSC=VCC+0.7/-ISC  
Thermal Model:  
Short circuit current limit should be set at least 2X above the  
highest normal operating output current to keep the value of RSC low  
enough to ensure that the voltage dropped accross the short circuit  
current limit resistor doesn't adversely affect normal operation.  
INTERNAL FEEDBACK RESISTOR  
The MSK 739 is equipped with an internal 1.5Kfeedback resis-  
tor. Bandwidth and slew rate can be optimized by connecting the  
MSK 739 as shown in Figure 2. Placing the feedback resistor inside  
the hybrid reduces printed circuit board trace length and its'  
asscociated capacitance which acts as a capacitive load to the op-  
amp output. Reducing the capacitive load allows the output to slew  
faster and greater bandwidths will be realized. Refer to Table 1 for  
recommended RIN values for various gains.  
Governing Equation:  
TJ=PD x (RθJC + RθCS + RθJC) + TA  
Where  
TJ=Junction Temperature  
PD=Total Power Dissipation  
RθJC=Junction to Case Thermal Resistance  
RθCS=Case to Heat Sink Thermal Resistance  
RθSA=Heat Sink to Ambient Thermal Resistance  
TC=Case Temperature  
TA=Ambient Temperature  
TS=Sink Temperature  
Example:  
This example demonstrates a worst case analysis for the op-amp  
output stage. This occurs when the output voltage is 1/2 the power  
supply voltage. Under this condition, maximum power transfer oc-  
curs and the output is under maximum stress.  
RIN  
VALUE  
APPROXIMATE  
DESIRED GAIN  
Conditions:  
1.5KΩ  
750Ω  
150Ω  
-1  
-2  
-10  
VCC=±16VDC  
VO=±8Vp Sine Wave, Freq.=1KHz  
RL=100Ω  
TABLE 1  
Whenever the internal resistor is not being used it is good practice  
to short pin 4 and 5 to avoid inadvertently picking up spurious sig-  
nals.  
For a worst case analysis we will treat the +8Vp sine wave  
as an 8VDC output voltage.  
Recommended External Component Selection  
Guide Using External Rf  
TABLE 2  
1.) Find Driver Power Dissapation  
PD=(VCC-VO) (VO/RL)  
=(16V-8V) (8V/100)  
=0.64W  
APPROXIMATE  
DESIRED GAIN  
2.) For conservative design, set TJ=+125°C  
3.) For this example, worst case TA=+90°C  
4.) RθJC=45°C/W from MSK 739B Data Sheet  
5.) RθCS=0.15°C/W for most thermal greases  
6.) Rearrange governing equation to solve for RθSA  
RI(+)  
RI(-)  
Rf(Ext)  
Cf  
1
1
1
-1  
-2  
-5  
249Ω  
160Ω  
169Ω  
499Ω  
249Ω  
200Ω  
499Ω  
499Ω  
1KΩ  
2
2
2
1
1
1
-8  
-10  
100Ω  
90.9Ω  
100Ω  
124Ω  
100Ω  
100Ω  
1KΩ  
1KΩ  
2KΩ  
2
2
2
RθSA=((TJ-TA)/PD) - (RθJC) - (RθCS)  
=((125°C -90°C)/0.64W) - 45°C/W - 0.15°C/W  
=54.7 - 46.15  
-20  
=9.5°C/W  
OUTPUT SHORT CIRCUIT PROTECTION  
The output section of the MSK 739 can be protected from direct  
shorts to ground by placing current limit resistors between pins 1  
and 12 and pins 9 and 10 as shown in Figure 1.  
1
2
The positive input resistor is selected to minimize any bias current induced offset  
voltage.  
The feedback capacitor will help compensate for stray input capacitance. The value of  
this capacitor can be dependent on individual applications. A 0.5 to 5pF capacitor is  
usually optimum for most applications.  
3
Effective load is RL in parallel with Rf.  
3
Rev. A 4/02  
APPLICATION NOTES CON'T  
STABILITY AND LAYOUT CONSIDERATIONS  
OPTIMIZING SLEW RATE  
As with all wideband devices, proper decoupling of the power  
lines is extremely important. The power supplies should be by-passed  
as near to pins 9 and 1 as possible with a parallel grouping of a  
0.01µf ceramic disc and a 4.7µf tantalum capacitor. Wideband de-  
vices are also sensitive to printed cicuit board layout. Be sure to  
keep all runs as short as possible, especially those associated with  
the summing junction and power lines. Circuit traces should be sur-  
rounded by ground planes whenever possible to reduce unwanted  
resistance and inductance. The curve below shows the relationship  
between resonant frequency and capacitor value for 3 trace lengths.  
When measuring the slew rate of the MSK 739, many external  
factors must be taken into consideration to achieve best results. The  
closed loop gain of the test fixture should be -1.5V/V or less with  
the external feedback resistor being 499Lead length on this resis-  
tor must be as short as possible and the resistor should be small. No  
short circuit current limit resistors should be used. (Short pin 1 to  
pin 12 and pin 9 to pin 10). Pins 2,3,7 and 8 should all be shorted  
directly to ground for optimum response. Since the internal feedback  
resistor isn't being used, pin 4 should be shorted to pin 5. SMA  
connectors are recomended for the input and output connectors to  
keep external capacitances to a minimum. To compensate for input  
capacitance, a small 0.5 to 5pF high frequency variable capacitor  
should be connected in parallel with the feedback resistor. This ca-  
pacitor will be adjusted to trim overshoot to a minimum. A 5500V/  
µS slew rate limit from -10V to +10V translates to a transition time  
of 2.9 nanoseconds. In order to obtain a transition time of that mag-  
nitude at the output of the test fixture, the transition time of the  
input must be much smaller. A rise time at the input of 500 picosec-  
onds or less is sufficient. If the transition time of the input is greater  
than 500 picoseconds, the following formula should be used, since  
the input transition time is now affecting the measured system tran-  
sition time.  
TA=TB²+TC²  
WHERE:  
TA=Transition time measured at output jack on MSK 739 test card.  
TB=Transition time measured at input jack on MSK 739 test card.  
TC=Actual output transition time of MSK 739(note that this quantity  
will be calculated, not measured directly with the oscilloscope).  
FEEDBACK CAPACITANCE  
THE MSK 739 IS INVERTING, THEREFORE WHEN MEASURING RIS-  
ING EDGE SLEW RATE:  
Feedback capacitance is commonly used to compensate for the  
"input capacitance" effects of amplifiers. Overshoot and ringing,  
especially with capacitive loads, can be reduced or eliminated with  
the proper value of feedback capacitance.  
All capacitors have a self-resonant frequency. As capacitance in-  
creases, self-resonant frequency decreases (assuming all other fac-  
tors remain the same). Longer lead lengths and PC traces are other  
factors that tend to decrease the self-resonant frequency. When a  
feedback capacitor's self-resonant frequency falls within the fre-  
quency band for which the amplifier under consideration has gain,  
oscillation occurs. These influences place a practical upper limit on  
the value of feedback capacitance that can be used. This value is  
typically 0.5 to 5pF for the MSK 739(B).  
TA=Rise time measured at output  
TB=Fall time measured at input  
TC=Actual rise time of output  
WHEN MEASURING FALLING EDGE SLEW RATE:  
TA=Fall time measured at output  
TB=Rise time measured at input  
TC=Actual fall time of output  
LOAD CONSIDERATIONS  
When determining the load an amplifier will see, the capacitive  
portion must be taken into consideration. For an amplifier that slews  
at 1000V/µS, each pF will require 1mA of output current.  
To minimize ringing with highly capacitive loads, reduce the load  
time constant by adding shunt resistance.  
I=C(dV/dT)  
CASE CONNECTION  
The MSK 739(B) has pin 3 internally connected to the case. The  
case is not electrically connected to the internal circuit. Pin 3 should  
be tied to a ground plane for sheilding. For special applications,  
consult factory.  
4
Rev. A 4/02  
TYPICAL PERFORMANCE CURVES  
5
Rev. A 4/02  
MECHANICAL SPECIFICATIONS  
NOTE:Standard cover height:  
MSK 739 0.200 Max.  
Alternate lid heights available  
NOTE: ALL DIMENSIONS ARE ±0.010 INCHES UNLESS OTHERWISE LABELED.  
ORDERING INFORMATION  
MSK739 B  
SCREENING  
BLANK=INDUSTRIAL; B=MIL-PRF-38534 CLASS H  
E=EXTENDED RELIABILITY  
GENERAL PART NUMBER  
M.S. Kennedy Corp.  
4707 Dey Road, Liverpool, New York 13088  
Phone (315) 701-6751  
FAX (315) 701-6752  
www.mskennedy.com  
The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make  
changes to its products or specifications without notice, however, and assumes no liability for the use of its products.  
Please visit our website for the most recent revision of this datasheet.  
Rev. A 4/02  
6

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