R3-ND3-K3 [MSYSTEM]

Remote I/O R3 Series DeviceNet INTERFACE MODULE;


型号：	R3-ND3-K3
厂家：	M-SYSTEM
描述：	Remote I/O R3 Series DeviceNet INTERFACE MODULE
文件：	总7页 (文件大小：173K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MODEL: R3-ND3

Remote I/O R3 Series

SPECIFICATIONS OF OPTION: Q (multiple selections)

COATING (For the detail, refer to M-System's web site.)

/C01: Silicone coating

DeviceNet INTERFACE MODULE

(for 64-point analog signals)

/C02: Polyurethane coating

/C03: Rubber coating

27.5 [1.08]

EX-FACTORY SETTING

/SET: Preset according to the Ordering Information Sheet

(No. ESU-8353)

130

[5.12]

RELATED PRODUCTS

• EDS file

(downloadable at M-System’s web site.)

109

[4.29]

mm [inch]

GENERAL SPECIFICATIONS

Connection

DeviceNet: Euro type connector terminal

MODEL: R3-ND3-[1][2]

(applicable wire size: 0.2 to 2.5 mm , stripped length 7 mm)

Internal bus: Via the Installation Base

(model: R3-BSx)

ORDERING INFORMATION

• Code number: R3-ND3-[1][2]

Specify a code from below for each of [1] and [2].

(e.g. R3-ND3-R/CE/Q)

Internal power: Via the Installation Base (model: R3-BSx)

Power input, RUN contact output: M3 separable screw

terminal (torque 0.5 N·m)

• Specify the specification for option code /Q

(e.g. /C01/SET)

Screw terminal: Nickel-plated steel

Isolation: DeviceNet to internal bus or internal power to

power input to RUN contact output to FG

Input error data setting: Input value setting at input module

error with side DIP SW

[1] POWER INPUT

N: No power supply

Dual communication setting: Set with the side DIP switch

Data allocation setting: Set with the side DIP switch

■ RUN CONTACT OUTPUT

AC Power

K3: 100 – 120 V AC

(Operational voltage range 85 - 132 V, 47 - 66 Hz) *

(CE not available)

RUN contact: Turns ON when both MS and NS LEDs are

green (DeviceNet in normal communication).

Rated load: 250 V AC @ 0.5 A (cos ø = 1)

30 V DC @ 0.5 A (resistive load)

L3: 200 – 240 V AC

(Operational voltage range 170 - 264 V, 47 - 66 Hz) *

(CE not available)

(Less than 50 V AC to conform with EU Directive)

Maximum switching voltage: 250 V AC or 30 V DC

Maximum switching power: 250 VA or 150 W

Minimum load: 1 V DC @ 1 mA

DC Power

R: 24 V DC

(Operational voltage range 24 V ±10 %, ripple 10 %p-p max.) *

* Not selectable for use with independent power modules or

network modules with the internal power input options.

Mechanical life: 2 × 10 cycles (300 cycles/min.)

When driving an inductive load, external contact protection

and noise quenching recommended.

[2] OPTIONS (multiple selections)

Standards & Approvals

blank: Without CE

/CE: CE marking

Other Options

blank: none

/Q: Option other than the above (specify the specification)

R3-ND3 SPECIFICATIONS

ES-8382 Rev.17 Page 1/7

https://www.m-system.co.jp/

MODEL: R3-ND3

DeviceNet COMMUNICATION

Transmission cable: Approved for DeviceNet

Node address setting: DIP switch; 00 – 63

Baud rate: 125 kbps, 250 kbps, 500 kbps DIP switch

NS (Network Status) indicator: Bi-color (green/red) LED

indicates status of the communication link.

MS (Module Status) indicator: Bi-color (green/red) LED

indicates device status.

Data allocation: 64 words for input data 67 words for output

data

INSTALLATION

Power consumption

•AC: Approx. 20 VA

•DC: Approx. 12 W

Current consumption (no power supply): 80 mA

Output current (power supply): 270 mA continuous at 20 V

DC; 420 mA for 10 minutes

Supply voltage to network: 11 – 25 V DC supplied through

the network terminal block

Supply current to network: 50 mA max.

Operating temperature: -10 to +55°C (14 to 131°F)

Operating humidity: 30 to 90 %RH (non-condensing)

Atmosphere: No corrosive gas or heavy dust

Mounting: Installation Base (model: R3-BSx)

Weight: 200 g (0.44 lb)

PERFORMANCE

Insulation resistance: ≥ 100 MΩ with 500 V DC

Dielectric strength: 1500 V AC @ 1 minute

(DeviceNet to internal bus or internal power to power input

to RUN contact output to FG)

STANDARDS & APPROVALS

EU conformity:

EMC Directive

EMI EN 61000-6-4

EMS EN 61000-6-2

RoHS Directive

R3-ND3 SPECIFICATIONS

ES-8382 Rev.17 Page 2/7

https://www.m-system.co.jp/

MODEL: R3-ND3

EXTERNAL VIEW

■ FRONT VIEW

■ SIDE VIEW

Node Address & Baud Rate

DR1

DR0

NA5

NA4

MS Indicator LED

Baud Rate

Setting

NA3

NA2

NA1

NA0

Node

Address

Setting

NS Indicator LED

Configuration Jack

DIP SW

SW3

SW2

SW1

Euro Type

Connector Terminal

R3-ND3 SPECIFICATIONS

ES-8382 Rev.17 Page 3/7

https://www.m-system.co.jp/

MODEL: R3-ND3

TRANSMISSION DATA DESCRIPTIONS

The DIP SW located at the side of the module specifies each I/O module's data allocation (occupied data area).

For example, when the data areas are assigned as shown below:

Module 1

Module 2

Module 3

Module 4

Module 5

Module 6

Module 7

Then the I/O data are assigned as in the figures below:

■ OUTPUT DATA

■ INPUT DATA

The figure below shows the allocation of the data sent from

the network module to the master.

The figure below shows the allocation of the data sent from

the master to the network module.

Begin

Address +0

Begin

Address +0

Module 1

Module 2

Module 3

Module 1

Module 2

Module 3

+10

+12

+14

+16

+10

+12

+14

+16

Module 4

Module 5

Module 6

Module 7

Module 4

Module 5

Module 6

Module 7

+63

+64

+66

Module Status

Error Status

Data Error Status

Module Status, Error Status and Data Error Status are assigned to +64, +65 and +66 respectively.

Each module can handle either input or output data. Input and output cannot be mixed in one module.

Input data from the master device is transferred to the module's output data area. The master device can read from the output

data area the data it has set.

• Module Status indicates whether individual I/O modules are mounted or not. The bit corresponding to the mounted slot

turns to “1,” and the unmounted slot to “0.”

• Error Status indicates error status for each module as described below. The bit corresponding to such module turns to “1.”

R3-TSx, R3-RSx, R3-US4: Input burnout

R3-DA16A:

R3-YSx:

Power input in error or disconnected

Output current error (e.g. load unconnected)

External power supply in error or disconnected

R3-PC16A:

• Data Error Status indicates overrange (R3-US4: out of -10% to +110%; the other types: out of -15% to +115%) status for each

module. The bit corresponding to such module turns to “1.”

R3-ND3 SPECIFICATIONS

ES-8382 Rev.17 Page 4/7

https://www.m-system.co.jp/

MODEL: R3-ND3

MODULE STATUS, ERROR STATUS, DATA ERROR STATUS

Shows each module's availability and error status.

Module 1

Module 2

Module 3

Module 16

I/O DATA DESCRIPTIONS

The data allocations for typical I/O modules are shown below.

Refer to the manual for each module for detailed data allocations.

■ ANALOG DATA (16-bit data, models: R3-SV4, YV4, DS4, YS4, US4, etc.)

16-bit binary data.

Basically, 0 to 100% of the selected I/O range is converted into 0 to 10000 (binary).

-15 to 0 % is a negative range represented in 2’s complement.

In case of R3-US4, -10 to 0% is a negative range represented in 2's complement.

■ TEMPERATURE DATA (16-bit data, models: R3-RS4, TS4, US4, etc.)

16-bit binary data.

With °C temperature unit, raw data is multiplied by 10. For example, 25.5°C is converted into 255.

With °F temperature unit, the integer section of raw data is directly converted into the data.

For example, 135.4°F is converted into 135.

Minus temperature is converted into negative values, represented in 2’s complements.

■ ANALOG DATA (16-bit data, models: R3-CT4A, CT4B, etc.)

16-bit binary data.

Integer obtained by multiplying unit value (A) by 100.

In case of CLSE-R5, integer obtained by multiplying unit value (A) by 1000.

■ ACCUMULATED COUNT DATA (32-bit data, models: R3-PA2, PA4A, WT1, WT4, etc.)

32-bit binary data is used for accumulated counts and encoder positions.

Lower 16 bits are allocated from the lowest address to higher ones, higher 16 bits in turn.

Lower 16 bits

Higher 16 bits

R3-ND3 SPECIFICATIONS

ES-8382 Rev.17 Page 5/7

https://www.m-system.co.jp/

MODEL: R3-ND3

■ BCD DATA (32-bit data, models: R3-BA32A, BC32A, etc.)

32-bit binary data is used for BCD.

Lower 16 bits are allocated from the lowest address to higher ones, higher 16 bits in turn.

Lower 16 bits

Higher 16 bits

■ 16-POINT DISCRETE DATA (models: R3-DA16, DC16, etc.)

Input 1 (Output 1)

Input 2 (Output 2)

Input 3 (Output 3)

Input 16 (Output 16)

0 : OFF

1 : ON

EXTERNAL DIMENSIONS & TERMINAL ASSIGNMENTS unit: mm [inch]

27.5 [1.08]

109 [4.29]

POSITIONING

GUIDE

6–M3

SCREW

TERMINAL

COVER

R3-ND3 SPECIFICATIONS

ES-8382 Rev.17 Page 6/7

https://www.m-system.co.jp/

MODEL: R3-ND3

SCHEMATIC CIRCUITRY & CONNECTION DIAGRAM

Note: In order to improve EMC performance, bond the FG terminal to ground.

Caution: FG terminal is NOT a protective conductor terminal.

LED

DIP SW

V+

Isolation

CAN_H

Drain

CAN_L

V–

To Other

DeviceNet

Devices

Control

Circuit

Communication

Circuit

INTERNAL BUS

DIP SW

RUN +

INTERNAL POWER

RUN CONTACT OUTPUT

RUN –

U (+)

V (–)

POWER INPUT

JACK

*Not provided with ‘No Power Supply’ type module.

CONFIGURATION JACK

Specifications are subject to change without notice.

R3-ND3 SPECIFICATIONS

ES-8382 Rev.17 Page 7/7

https://www.m-system.co.jp/

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