- 最新上传
TMP401AIDGKR
采用 VSSOP-8 封装、具有 N 因数和串联电阻校正的远程和本地温度传感器 | DGK | 8 | -40 to 125
0
TI
1
NANYA
0
MURATA
0
MURATA
MAX20751EKX+T
Multiphase Master with PMBus Interface and Internal Buck Converter
0
MAXIM
S-1701B3326-M5T1X
HIGH RIPPLE-REJECTION LOW DROPOUT CMOS VOLTAGE REGULATOR WITH RESET FUNCTION
1
ABLIC
SV-16B-D
Plug-in Signal Conditioners M-UNIT
0
MSYSTEM
0
MSYSTEM
S-1701E3326-U5T1X
HIGH RIPPLE-REJECTION LOW DROPOUT CMOS VOLTAGE REGULATOR WITH RESET FUNCTION
1
ABLIC
0
MSYSTEM
M6SPA-DZ-R/Q
Tension-Clamp Ultra-Slim Signal Conditioners M6S Series
0
MSYSTEM
2
LEIDITECH
1
NANYA
0
WALSIN
ZT028LDCM1R30
Recommended hole size is 22.5 mm. Thread front will fit standard 22.5mm hole
1
MSPI
0
MSYSTEM
0
MSYSTEM
0
MSYSTEM
0
MSYSTEM
0
WALSIN
KTG-12-S
Plug-in Signal Conditioners K-UNIT
0
MSYSTEM
HVS-4Z-R
Space-saving Plug-in Signal Conditioners H-UNIT
0
MSYSTEM
XUJ520125X
XU Family of Low Phase Noise Quartz-based PLL Oscillators
0
IDT
1
VINCOTECH
0
SUNTSU
QN9030T
Bluetooth Low Energy 5.0 wireless MCU
1
NXP
S-1701E3025-M5T1X
HIGH RIPPLE-REJECTION LOW DROPOUT CMOS VOLTAGE REGULATOR WITH RESET FUNCTION
1
ABLIC
1
LEOPARD
0
MURATA
0
WALSIN
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KYOCERA AVX
AMPHENOL
SAMTEC
WALSIN
VISHAY
MSYSTEM
GLENAIR
ITT
MICROSEMI
YAGEO
ECLIPTEK
ABRACON
MOLEX
VICOR
KEMET
MTRONPTI
TI
PANASONIC
CTS
SCHURTER
KNOWLES
MURATA
TE
TOREX
SILICON
BOURNS
GOLLEDGE
STMICROELECTRONICS
RCD
BEL
NXP
MICROCHIP
TDK
KOA
INFINEON
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MAXIM
LITTELFUSE
VCC
RENESAS
CDE
IDT
AVAGO
HONEYWELL
ONSEMI
FH
NICHICON
APITECH
ROHM
EPCOS
AGILENT
GRAYHILL
ADI
Carling Technologies
RICOH
