BLM18BD252SZ1D [MURATA]

Chip Ferrite Bead BLM18xxxxxxZ1D Murata Standard Reference Specification [AEC-Q200];


型号：	BLM18BD252SZ1D
厂家：	muRata
描述：	Chip Ferrite Bead BLM18xxxxxxZ1D Murata Standard Reference Specification [AEC-Q200]
文件：	总11页 (文件大小：285K)
中文：	中文翻译
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Reference Only

Spec. No. JENF243A-9122P-01

P.1/11

Chip Ferrite Bead BLM18□□□□□□Z1D

Murata Standard Reference Specification [AEC-Q200]

1.Scope

This reference specification applies to Chip Ferrite Bead BLM18_□Z Series for Automotive Electronics based on

AEC-Q200 except for Power train and Safety.

2.Part Numbering

(ex.)

(3)

(4)

121

(5)

(6)

(9)

(1)

(2)

(7) (8)

(1)Product ID

(2)Type

(3)Dimension (L×Ｗ) (6)Performance

(4)Characteristics

(5)Typical Impedance at 100MHz (8)Numbers of Circuit

(9)Packaging (D:Taping)

(7)Category(for Automotive Electronics)

3.Rating

DC Resistance

Impedance ()

( max.) (*1)

(refer to below

comment)

Rated

Current

(mA)

(at 100MHz)(*1)

(refer to below

comment)

ESD Rank

2:2kV

Customer

Part Number

MURATA

Part Number

Remark

Initial

Values

After

85℃

125℃

Testing

Typical

20 min.

33±25%

40 min.

BLM18PG300SZ1D

BLM18PG330SZ1D

BLM18PG600SZ1D

BLM18PG121SZ1D

BLM18PG181SZ1D

BLM18PG221SZ1D

BLM18PG331SZ1D

BLM18PG471SZ1D

BLM18SP300SZ1D

BLM18SP101SZ1D

BLM18SP221SZ1D

BLM18SP601SZ1D

BLM18SP102SZ1D

BLM18KG221SZ1D

BLM18KG331SZ1D

BLM18KG471SZ1D

1000

0.05

0.025

0.1

0.10

0.050

0.2

1000^*2

3000^*2

2000^*2

1000

120±25%

180±25%

220±25%

330±25%

470±25%

1000^*2

120

180

220

330

470

0.05

0.10

1500^*21000^*2

0.09

0.18

1000^*2

1400^*2

1200^*2

0.10

0.14

0.15

0.20

1000

0.20

0.26

30±10

6000^*14000^*1

3700^*12500^*1

2800^*11900^*1

1500^*11000^*1

1200^*1800^*1

2200^*21500^*2

0.008

0.022

0.040

0.140

0.185

0.050

0.080

0.130

0.010

0.026

0.048

0.168

0.222

0.060

0.095

0.145

For DC

power line

100±25%

220±25%

600±25%

1000±25%

220±25%

330±25%

100

220

600

1000

220

330

470

1200^*2

1000^*2

1700^*2

1500^*2

470±25%

600±25%

1000±25％

1300^*21000^*2

1000^*2800^*2

BLM18KG601SZ1D

BLM18KG102SZ1D

BLM18AG121SZ1D

BLM18AG151SZ1D

BLM18AG221SZ1D

BLM18AG331SZ1D

BLM18AG471SZ1D

600

1000

120

150

220

330

470

0.150

0.200

0.18

0.25

0.30

0.35

0.165

0.230

0.28

0.35

0.40

0.45

120±25%

150±25%

220±25%

330±25%

800

700

600

550

For

general use

470±25%

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

P.2/11

DC Resistance

Impedance ()

(at 100MHz)(*1)

(refer to below

comment)

( max.) (*1)

(refer to below

comment)

Rated

Current

(mA)

ESD Rank

2:2kV

Customer

Part Number

MURATA

Part Number

Remark

Initial

Values

After

85℃

125℃

Testing

Typical

BLM18AG601SZ1D

BLM18AG102SZ1D

BLM18BB050SZ1D

BLM18BA050SZ1D

BLM18BB100SZ1D

600±25%

1000±25%

5±25%

10±25%

600

1000

500

450

800

500

700

0.38

0.50

0.05

0.2

0.48

0.60

0.10

0.3

For

general use

0.10

0.20

BLM18BA100SZ1D

BLM18BB220SZ1D

BLM18BA220SZ1D

BLM18BB470SZ1D

10±25%

22±25%

500

700

500

600

0.25

0.20

0.35

0.25

0.35

0.30

0.45

0.35

47±25%

47±25％

47±25%

60±25%

75±25%

BLM18BD470SZ1D

BLM18BA470SZ1D

BLM18BB600SZ1D

BLM18BA750SZ1D

BLM18BB750SZ1D

BLM18BB121SZ1D

BLM18BD121SZ1D

BLM18BA121SZ1D

BLM18BB141SZ1D

BLM18BB151SZ1D

BLM18BD151SZ1D

BLM18BB221SZ1D

BLM18BD221SZ1D

BLM18BB331SZ1D

BLM18BD331SZ1D

BLM18BD421SZ1D

BLM18BB471SZ1D

BLM18BD471SZ1D

BLM18BD601SZ1D

BLM18BD102SZ1D

BLM18BD152SZ1D

BLM18BD182SZ1D

BLM18BD222SZ1D

BLM18BD252SZ1D

500

300

600

300

600

550

300

200

500

450

300

450

250

400

250

300

250

200

150

0.3

0.55

0.25

0.70

0.30

0.4

0.65

0.35

0.80

0.40

0.5

75±25%

120±25%

140±25%

150±25%

220±25%

330±25%

420±25%

470±25%

600±25%

1000±25%

1500±25%

1800±25%

2200±25%

2500±25%

120

140

150

220

330

420

470

600

1000

1500

1800

2200

2500

0.9

1.0

For

high speed

signal line

0.35

0.37

0.4

0.45

0.47

0.5

0.45

0.58

0.5

0.55

0.85

0.55

0.65

0.85

1.2

0.55

0.68

0.6

0.65

0.95

0.65

0.75

0.95

1.3

1.5

1.6

6000^*21000^*2

4000^*21000^*2

3000^*21000^*2

2500^*21000^*2

1500^*21000^*2

8000^*25000^*2

6000^*24000^*2

5000^*23300^*2

3500^*22200^*2

3000^*21900^*2

BLM18SG260TZ1D

BLM18SG700TZ1D

BLM18SG121TZ1D

BLM18SG221TZ1D

BLM18SG331TZ1D

BLM18SN220TZ1D

BLM18KG260TZ1D

BLM18KG300TZ1D

BLM18KG700TZ1D

BLM18KG101TZ1D

BLM18KG121TZ1D

26±25%

70±25%

120±25%

220±25%

330±25%

22±7%

0.007

0.020

0.025

0.040

0.070

0.004

0.007

0.010

0.022

0.030

0.012

0.030

0.035

0.055

0.085

120

220

330

For DC

0.005 power line

(Thin type)

0.012

26±25%

30±25%

70±25%

100±25%

120±25%

0.015

0.032

0.040

100

120



 Operating Temperature : -55°C to +125°C

 Storage Temperature : -55°C to +125°C

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

P.3/11

(*1)

Standard Testing Conditions

 Unless otherwise specified 

 In case of doubt 

Temperature : Ordinary Temp. (15 °C to 35 °C )

Temperature : 20°C±2 °C

Humidity : Ordinary Humidity (25%(RH) to 85%(RH))

Humidity : 60%(RH) to 70%(RH)

Atmospheric pressure : 86kPa to 106kPa

Rated current

at 85°C

(*2)In case of Rated current is more than 1A,

Rated Current is derated as right figure

depending on the operating temperature.

Rated current

at 125°C

125

Operating Temperature (°C)

4.Style and Dimensions

1.6±0.15

0.8±0.15

■ Equivalent Circuit

0.4±0.2

Resistance element becomes

dominant at high frequencies.

(

)

: Electrode

(in mm)

■ Unit Mass (Typical value)

0.5±0.15

0.6±0.15

0.8±0.15

BLM18SG***TZ1D

BLM18*****TZ1D

0.004g

BLM18KG***TZ1D

BLM18SN***TZ1D

BLM18*****SZ1D

0.005g

5.Marking

No marking.

6.Specifications

6-1.Electrical Performance

No. Item

Specification

Meet item 3.

Test Method

6-1-1 Impedance

Measuring Frequency : 100MHz±1MHz

Measuring Equipment : KEYSIGHT 4991A or the equivalent

Test Fixture : KEYSIGHT 16192A or the equivalent

Measuring Equipment : Digital multi meter

6-1-2 DC Resistance

Meet item 3.

For BLM18SN

Measuring Equipment : YOKOGAWA 755611 or the equivalent

Test Fixture : KEYSIGHT 16044A or the equivalent

＊Except resistance of the Substrate and Wire

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

P.4/11

6-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)

AEC-Q200 Rev.D issued June. 1 2010

AEC-Q200

Murata Specification / Deviation

Meet Table A after testing.

No.

Stress

Test Method

High

1000hours at 125 deg C

Set for 24hours at room

temperature, then measured.

Temperature

Exposure

Table A

Appearance

No damage

Impedance

Change

Within ±30%

（for BLM18SN

Within ±50%）

(at 100MHz)

Resistance

Meet item 3.

Temperature Cycling 1000cycles

-55 deg C to +125 deg C

Meet Table B after testing.

TableB

Set for 24hours at room

temperature, then measured.

Appearance

Impedance

Change

No damage

Within ±30%

（for BLM18SN

Within ±50%）

(at 100MHz)

(for BLM18KG

Within-10%to+50%)

DC Resistance Meet item 3.

Destructive

Physical Analysis

Biased Humidity

Per EIA469

No electrical tests

1000hours at 85 deg C, 85%RH

Apply max rated current.

No defects

Meet Table C after testing.

TableC

Appearance

Impedance

No damage

Within ±30%

（for BLM18KG/SN

Within ±50%）

Change

(at 100MHz)

Meet item 3.

Resistance

Meet Table C after testing.

If the rated current of parts exceed 1A,

the operating temperature should be 85 deg C.

Operational Life

Apply 125 deg C 1000hours

Set for 24hours at room

temperature, then measured

External Visual

Visual inspection

No abnormalities

Physical Dimension

Meet ITEM 4

No defects

（Style and Dimensions）

Resistance to Solvents Per MIL-STD-202

Method 215

Not Applicable

Mechanical Shock

Per MIL-STD-202 Method 213

Meet Table D after testing.

Table D

Condition F

1500g's (14.7N)/0.5ms/

Half sine

Appearance

Impedance

Change

(at 100MHz)

DC Resistance

No damage

Within ±30%

Meet item 3.

Vibration

5g's(0.049N) for 20 minutes,

12cycles each of 3 orientations

Test from 10-2000Hz.

Meet Table D after testing.

Resistance

to Soldering Heat

Solder temperature

260C+/-5 deg C

Pre-heating:150C +/-10 deg,60s to 90s

Meet Table C after testing.

Immersion time 10s

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

P.5/11

Murata Specification / Deviation

Meet Table D after testing.

AEC-Q200

No.

Stress

Test Method

Per AEC-Q200-002

ESD

ESD Rank: Meet Item 3. (Rating)

Solderability

Per J-STD-002

Measured : Impedance

Per UL-94

Method b : Not Applicable

95% of the terminations is to be soldered.

Electrical

Characterization

Flammability

No defects

Not Applicable

Board Flex

Epoxy-PCB(1.6mm)

Deflection 2mm(min)

60s minimum holding tim

Per AEC-Q200-006

Meet Table C after testing.

Terminal Strength

No defects

Electrical

Transient

Conduction

Per ISO-7637-2

Not Applicable

7.Specification of Packaging

7-1.Appearance and Dimensions (8mm-wide paper tape)

Part Number

Type

Appearance and Dimensions

2.0±0.05

4.0±0.1

+0.1

4.0±0.1



1.5

-0

BLM18PG***SZ1D

BLM18SP***SZ1D

BLM18AG***SZ1D

BLM18B****SZ1D

BLM18SN***TZ1D

BLM18KG****Z1D

8mm-

wide Paper tape

4mm-pitch

1.05±0.1

Direction of feed

Item

Dimension “a”

1.1 max.

BLM18*****SZ1D

BLM18KG***TZ1D

0.85 max.

BLM18SN***TZ1D

2.0±0.05

2.0±0.05 4.0±0.1

2.0±0.1

+0.1

-0

1.5



8mm-

wide Paper tape

2mm-pitch

BLM18SG***TZ1D

0.9max.

1.05±0.1

Direction of Feed

(in mm)

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

(1) Taping

P.6/11

Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously

and sealed by top tape and bottom tape.

(2) The sprocket holes are to the right as the tape is pulled toward the user.

(3) Spliced point:The base tape and top tape have no spliced point

(4) Cavity:There shall not be burr in the cavity.

(5) Missing components number

Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,

and are not continuous. The specified quantity per reel is kept.

7-2.Tape Strength

(1)Pull Strength

Top tape

Bottom tape

165 to 180 degree

5N min.

(2)Peeling off force of Top tape

Bottom tape

Base tape

0.1N to 0.6N (Minimum value is typical.)

*Speed of Peeling off:300mm/min

7-3.Taping Condition

(1)Standard quantity per reel

Type

Quantity per 180mm reel

4000 pcs. / reel

BLM18(except BLM18SG)

BLM18SG

10000 pcs. / reel

(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.

(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape

for more than 5 pitch.

(4)Marking for reel

The following items shall be marked on a label and the label is stuck on the reel.

(Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2) , Quantity, etc)

1) « Expression of Inspection No. »

□□ OOOO 

(1)

(2)

(3)

(1) Factory Code

(2) Date

First digit

: Year/ Last digit of year

Second digit

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

Third, Fourth digit : Day

(3) Serial No.

2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

(5)Outside package

These reels shall be packed in the corrugated cardboard package and the following items shall be marked

on a label and the label is stuck on the box.

(Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS discrimination(2) ,Quantity, etc)

(6)Dimensions of reel and taping(leader-tape, trailer-tape)

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

P.7/11

7-4. Specification of Outer Case

Outer Case Dimensions

Label

Standard Reel Quantity in Outer Case

(Reel)

(mm)

186

Above Outer Case size is typical. It depends on a quantity of an order.

Caution

8-1.Rating

Do not use products beyond the Operating Temperature Range and Rated Current.

8-2.Surge current

Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a

critical failure, such as an open circuit, burnout caused by excessive temperature rise.

Please contact us in advance in case of applying the surge current.

8-3.Fail Safe

Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage

that may be caused by the abnormal function or the failure of our products.

8-4.Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1)Aircraft equipment

(6)Disaster prevention / crime prevention equipment

(7)Traffic signal equipment

(8)Transportation equipment (trains,ships,etc.)

(9)Data-processing equipment

(10)Applications of similar complexity and /or reliability requirements

to the applications listed in the above

(2)Aerospace equipment

(3)Undersea equipment

(4)Power plant control equipment

(5)Medical equipment

9. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

9-1.Land pattern designing

Standard land dimensions

< For BLM18 series (except BLM18P/BLM18S/BLM18K type) >

Chip Ferrite Bead

Type

Soldering

Flow

BLM18 (except18P/18S/

BLM18K type)

0.8

0.7

2.5

2.0

0.7

Reflow

Solder Resist

Pattern

(in mm)

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

P.8/11

< For BLM18P/BLM18S/BLM18K type >

Chip Ferrite Bead

Land pad thickness

Rated

and dimension d

18µm 35µm 70µm

Type

Current Soldering

(A)

0.5 to 1.5

1.7 to 2.5

3 to 4

5 to 6

0.7

1.2

2.4

6.4

0.7

1.2

3.3 1.65

6.4

0.7

BLM18P

BLM18S

BLM18K

Flow

0.8

Reflow

Flow

Flow/

Reflow

2.5

Reflow

2.0

0.7

Solder Resist

Pattern

0.7

BLM18SN

3.3

BLM18SP 1.2 to 6.0

The excessive heat by land pads may cause deterioration

at joint of products with substrate.

(in mm)

9-2.Soldering Conditions

Products can be applied to reflow and flow soldering.

(1) Flux,Solder

Flux

Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )

Do not use water-soluble flux.

Solder

Use Sn-3.0Ag-0.5Cu solder

Standard thickness of solder paste : 100 µm to 200 m

(2) Soldering conditions

Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited

to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference

is limited to 100℃ max.

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

(3)soldering profile

□Flow soldering profile

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard Profile

150℃、60s min.

250℃、4～6s

2 times

Limit Profile

Pre-heating

Heating

265℃±3℃、5s max.

Cycle of flow

2 times

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

P.9/11

□Reflow soldering profile

Temp.

(℃)

260℃

245℃±3℃

230℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

Heating

150～180°C 、90s±30s

above 220°C、30s～60s above 230°C、60s max.

Peak temperature

245±3°C

260°C,10s

2 times

Cycle of reflow

2 times

9-3.Reworking with soldering iron

Pre-heating: 150°C, 1 min

Soldering iron output: 80W max.

 Tip diameter:φ3mm max.

 Times : 2times max.

Tip temperature: 350°C max.

Soldering time : 3(+1,-0) seconds.

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the ferrite material due to the thermal shock.

9-4.Solder Volume

Solder shall be used not to be exceeded as shown below.

Upper Limit

Recommendable

1/3T≦t≦T

(T:Chip thickness)

Accordingly increasing the solder volume, the mechanical stress to product is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

9-5.Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

Products shall be located in the sideways

direction (Length:ab) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2)Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the board separation surface.

D *1

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

P.10/11

Perforation

Slit

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.

Recommended

Screw Hole

9-6.Mounting density

Add special attention to radiating heat of products when mounting the inductor near the products with heating.

The excessive heat by other products may cause deterioration at joint of this product with substrate.

9-7. Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the Insulation

Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.

(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases

and etc. (the sea breeze, Cl₂, H₂S, NH₃, SO₂, NO₂,etc)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

9-8. Resin coating

The impedance value may change and/or it may affect on the product's performance due to high cure-stress of

resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to

use, please make the reliability evaluation with the product mounted in your application set.

9-9.Cleaning Conditions

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken

solder joints. Before starting your production process,

test your cleaning equipment / process to insure it does not degrade this product.

9-10. Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG.CO., LTD.

Reference Only

Spec. No. JENF243A-9122P-01

P.11/11

9-11.Storage Conditions

(1)Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2)Storage conditions

Products should be stored in the warehouse on the following conditions.

Temperature : -10°C to 40°C

Humidity

: 15% to 85% relative humidity

No rapid change on temperature and humidity

Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization

of electrode, resulting in poor solderability.

 Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

Avoid storing the product by itself bare (i.e.exposed directly to air).

(3)Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

10.

Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD.

BLM18BD252SZ1D [MURATA]

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