BNX029-01K [MURATA]

This reference specification applies to SMD Block Type EMIFIL.;


型号：	BNX029-01K
厂家：	muRata
描述：	This reference specification applies to SMD Block Type EMIFIL.
文件：	总14页 (文件大小：445K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec.No. JENF243H-0008M-01

P 1/ 14

Reference Only

BNX02□-01□ Reference Specification

SMD Block Type EMIFIL

1.Scope

This reference specification applies to SMD Block Type EMIFIL.

2.Part Numbering

Product ID

Type

022

Serial No. Features Packaging Code

(L :Taping(φ178mm reel) / K :Taping(φ330mm reel) / B :Bulk)

-01

3.Rating

Rated

Current

∗

Customer’s

Part Number

Rated Withstanding

Insulation

Voltage

Drop

Part Number

Capacitance

1.0µF±15%

Insertion Loss

Voltage

Resistance Resistance

BNX022-01L

BNX022-01K

BNX022-01B

BNX023-01L

BNX023-01K

BNX023-01B

BNX028-01L

BNX028-01K

BNX028-01B

BNX029-01L

BNX029-01K

BNX029-01B

35dB min.

(1MHz to

1GHz)

50V

(DC)

125V

(DC)

20A

(DC)

0.43mΩ

±0.20mΩ

500MΩ

min.

30 mV

max.

35dB min.

(1MHz to

1GHz)

100V

(DC)

250V

(DC)

20A

0.43mΩ

500MΩ

min.

45mV

max.

1.0µF±15%

(DC) ±0.20mΩ

35dB min.

（30KHz～

1GHz）

16V

40V

20A

0.43mΩ

1.1MΩ

min.

45mV

max.

47μF±

(DC)

(DC) ±0.20mΩ

35dB min.

（15KHz～

1GHz）

6.3V

(DC)

15.8V

(DC)

20A

0.43mΩ

0.5MΩ

min.

45mV

max.

100μF±

(DC) ±0.20mΩ

∗ Rated current is derated according to operating temperature.

BNX022-01

BNX023-01

BNX029-01

BNX028-01

125

105

125

Operating Temperature (°C)

• Operating Temperature : - 40 °C to + 125 °C (BNX022-01/ BNX023-01/ BNX029-01)

- 40 °C to + 105 °C (BNX028-01）

• Storage Temperature : - 55 °C to + 125 °C

4.Standard Testing Condition

Temperature : 20 °C ± 2 °C

Temperature : Ordinary Temp. 15 °C to 35 ºC

Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH)

Humidity : 60 %(RH) to 70 %(RH)

Atmospheric pressure : 86kPa to 106kPa

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 2/ 14

Reference Only

5.Style and Dimensions

※Coplanarity 0.10mm max

■Equivalent Circuit

Ｌ１

Ｌ３

Ｃ２

①B

：Bias

①

②

④

②CB ：Circuit + Bias

③PSG ：Power Supply Ground

④CG ：Circuit Ground

Ｃ１

Ｌ２

③

■ Unit Mass (Typical value)

0.80g

6.Marking

Filter shall be marked as follows.

(1) Murata Mark :

(2) Part Number : BNX022-01：（ BNX022 ）

BNX023-01：（ BNX023 ）

BNX028-01：（ BNX028 ）

BNX029-01：（ BNX029 ）

(3) Polarity Marking : ○

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 3/ 14

Reference Only

7.Electrical Performance

No.

7.1

Item

Insertion

Loss

Specification

Test Method

Meet item 3.

10dB

Attenuator

10dB

Attenuator

Balun (1)

(2)

Specimen

(3)

(4)

～

∗

Insertion Loss = -20 log E₁/E₀

^{Method of measurement based on}(^Md^IB^L-S)^TD-220

E₀: Level without FILTER (short)

E₁: Level with FILTER

7.2

Capacitance

Measured by the following condition between

Terminal ①② and ③④. (see item 5.)

Frequency : 1 ± 0.1kHz（BNX022/BNX023）

120±24Hz (BNX028/BNX029)

Voltage : 1 V(rms) max. （BNX022/BNX023）

0.5±0.1V(rms). （BNX028/BNX029）

Measuring Equipment : Agilent4278A or the

equivalent（BNX022/BNX023）

Agilent4284A or the equivalent（BNX028/BNX029）

Measured by the way of 4 terminal method between

① and ② and between ③ and ④. (see item 5.)

Measured at DC rated voltage between terminal

①② and ③④. (see item 5.)

7.3

7.4

Resistance

Insulation

Resistance

Time : 60 s max

Charging current : 50 mA max.

Measuring Equipment : R8340A or the equivalent

Withstanding voltage shall be applied between

terminal ①② and ③④. (see item 5.)

Test Voltage : BNX022-01 125V(DC)

BNX023-01 250 V(DC)

Withstanding

Voltage

7.5

Filter shall be no failure.

BNX028-01

BNX029-01

40 V(DC)

15.8 V(DC)

Time : 5 ± 1 s

Charging current : 50 mA max.

After soldering the part on the test substrate,

measure the voltage with passing the rated current

as shown in the schematic below.

7.6

Voltage

Drop

Meet item 3.

(1)

Specimen

(2)

Where the terminals of the part shall be connected

as follows:

Referring to the terminal No. shown in item 5,

connect terminal No. ② and ④ by soldering

copper wire with diameter more than 1mm /

length less than 6mm.

Then connect terminal No. ① as (1) and terminal

No. ③ as (2) the measurement circuit as

mentioned above.

The probe for measuring the voltage shall be

touched on the solder fillet of ①③.

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 4/ 14

Reference Only

8.Mechanical Performance

No.

Item

Specification

Test Method

8.1 Appearance and Meet item 5.

Dimensions

Visual Inspection and measured with Micrometer

caliper and Slide Caliper.

Meet item 5.

8.2 Marking

8.3 Reflow

Visual Inspection

It shall be soldered with the Standard Profile condition as

shown No.13.6(2) Soldering Condition.

･thickness of solder paste : 150 to 200 µm

･Land dimension : see No.13.5.

Appropriate solder fillet is formed.

Solderability

8.4 Resistance to

soldering iron

Meet Table 1.

Table 1

Soldering iron : 100 W max.

Tip Temperature : 450 °C ± 5 °C

Soldering Time : 5 s , 2 Times

Appearance

Cap.Change BNX022 within

±7.5%

BNX028 within

±15%

meet item 3

No damaged

Do not touch the products directly with the tip of the

soldering iron.

BNX023

· Initial values: measured after heat treatment (150±

BNX029

°C,

I.R.

1hour) and exposure in the room condition for 24±2 hours.

·Values After Testing:measured after heat treatment (150±

Dielectric

Strength

No failure

°C, 1hour) and exposure in the room condition for 24±2

hours.

8.5 Bending

Strength

It shall be soldered on the glass-epoxy substrate.

(100mm×40mm×1.6mm)

Pressure jig

R230

Deflection

Product

Deflection : 2 mm

Keeping Time : 30 s

Speed : 0.5 mm/s

· Initial values: measured after heat treatment (150±

°C,

1hour) and exposure in the room condition for 24±2 hours.

·Values After Testing:measured after heat treatment (150±

°C, 1hour) and exposure in the room condition for 24±2

hours.

8.6 Drop

Meet Table 2.

Table 2

It shall be dropped on concrete or steel board.

Method : free fall

Height : 1 m

Appearance

Cap.Change

I.R.

Dielectric

Strength

No damaged

within ±15%

meet item 3

The Number of Time : 10 times

· Initial values: measured after heat treatment (150±

1hour) and exposure in the room condition for 24±2 hours.

°C,

No failure

·Values After Testing:measured after heat treatment (150±

°C, 1hour) and exposure in the room condition for 24±2

hours.

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 5/ 14

Reference Only

No.

Item

Specification

Meet Table 2.

Test Method

8.7 Vibration

It shall be soldered on the glass-epoxy substrate.

Oscillation Frequency : 10 to 2000 to 10Hz for

20 minutes

Total amplitude 3.0 mm or Acceleration amplitude 196 m/s²

whichever is smaller.

Time : A period of 3 hours in each of 3 mutually

perpendicular directions. (Total 9 hours)

· Initial values: measured after heat treatment (150±

°C,

1hour) and exposure in the room condition for 24±2 hours.

·Values After Testing:measured after heat treatment (150±

°C, 1hour) and exposure in the room condition for 24±2

hours.

8.8 Shock

It shall be soldered on the glass-epoxy substrate.

Acceleration : 14700 m/s²

Normal duration: 0.5 ms

Waveform : Half-sine wave

Direction : 6 direction

Testing Time : 3 times for each direction

· Initial values: measured after heat treatment (150±

°C,

1hour) and exposure in the room condition for 24±2 hours.

·Values After Testing:measured after heat treatment (150±

°C, 1hour) and exposure in the room condition for 24±2

hours.

9.Environmental Performance (It shall be soldeared on the substrate.)

No.

Item

Specification

Test Method

9.1 Heat

Shock

BNX022/BNX023:Meet Table 1.

BNX028/BNX029:Meet Table 3.

1 Cycle

1 step : -55°C(+0°C,-3°C) / 30 min. (+3,-0) min.

2 step : Room Temperature / within 0.5 min.

3 step : 125(+3°C,-0°C) / 30 min. (+3,-0) min.

(for BNX028: 105(+3°C,-0°C) / 30 min. (+3,-0) min.)

4 step : Room Temperature / within 0.5 min.

Total cycles

BNX022

1000cycles

100cycles

BNX023

BNX028

BNX029

Then measure values after exposure in the room

condition for 48 ± 4 hours.

· Initial values: measured after heat treatment (150±

°C,

1hour) and exposure in the room condition for 24±2 hours.

·Values After Testing:measured after heat treatment (150±

°C, 1hour) and exposure in the room condition for 24±2

hours.

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 6/ 14

Reference Only

No.

Item

Specification

Test Method

9.2 Humidity Meet Table 3.

Temperature : 60 ± 2 °C

Humidity : 90 ∼ 95 %(RH)

Voltage : Rated Voltage

Time : 1000 h (+ 48h , - 0h)

Then measure values after exposure in the room condition

for 48 ± 4 hours.

Life

①

Table 3

Appearance

Cap.Change

No damaged

BNX022

BNX023

BNX028

BNX029

BNX022

BNX023

within

±12.5%

within

±15%

· Initial values: measured after heat treatment (150±

1hour) and exposure in the room condition for 24±2 hours.

I.R.

25MΩ

min.

°C,

BNX028 0.11M Ω

·Values After Testing:measured after heat treatment (150±

min.

BNX029 0.05MΩ

min.

°C, 1hour) and exposure in the room condition for 24±2

hours.

Humidity

Life

②

Temperature : 85 ± 2 °C

Humidity : 80 ∼ 85 %(RH)

Voltage : Rated Voltage

Time : 1000 h (+ 48h , - 0h)

Then measure values after exposure in the room condition

for 48 ± 4 hours.

· Initial values: measured after heat treatment (150±

°C,

1hour) and exposure in the room condition for 24±2 hours.

·Values After Testing:measured after heat treatment (150±

°C, 1hour) and exposure in the room condition for 24±2

hours.

9.3 Heat Life

Meet Table 4.

Table 4

Appearance

Cap.Change

Temperature : 125 ± 2 °C

Voltage : Rated Voltage × 2

Time : 1000 h (+ 48h , - 0h)

Then measure values after exposure in the room condition

for 48 ± 4 hours.

No damaged

BNX022

BNX023

BNX028

BNX029

BNX022

BNX023

within

±12.5%

within

±15%

· Initial values: measured after heat treatment (150±

I.R.

50MΩ

min.

°C,

1hour) and exposure in the room condition for 24±2 hours.

·Values After Testing:measured after heat treatment (150±

BNX028 0.11M Ω

°C, 1hour) and exposure in the room condition for 24±2

min.

BNX029 0.05MΩ

min.

hours.

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 7/ 14

Reference Only

10.Insertion Loss Characteristics (I.L.) (Typ.)

BNX022-01／BNX023-01

BNX028-01

BNX029-01

11. Specification of Packaging

11.1 Appearance and Dimensions (24mm-wide plastic tape)

(1) plastic tape

4.0×10pich=40.0±0.2

Cavity

0.5

2.0±0.1

Sprocket Hole

4.0±0.1

0.1

0.3±0.1

1.5±

3.3±0.1

9.4±0.1

12.0±0.1

^Ｔ：3.5±0(^.1in^（:m^BNm^X)^{022/BNX023）}

Direction of feed

3.6±0.1（BNX028/BNX029）

(in:mm)

*Dimension of the Cavity is measured at the bottom side.

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

(2)Direction of the product

P 8/ 14

Reference Only

MURATA logo mark

11.2 Specification of Taping

(1) Packing quantity (standard quantity)

φ178mm reel : 400 pcs. / reel

φ330mm reel : 1500 pcs. / reel

(2) Packing Method

Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.

(3) Spliced point

The cover tape have no spliced point.

(4) Sprocket Hole

The sprocket holes are to the right as the tape is pulled toward the user.

(5) Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,

and are not continuous. The specified quantity per reel is kept.

11.3 Pull Strength of Plastic Tape and Cover Tape

Plastic tape

10N min.

165 to 180 degree

Cover tape

Plastic tape

Cover tape

11.4 Peeling off force of Cover tape

0.2N to 0.7N (minimum value is typical)

∗ Speed of Peeling off : 300 mm / min

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 9/ 14

Reference Only

11.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.

[ Packaging Code:L (φ178mm reel) ]

Trailer

160 min.

Leader

210 min

190 min

2.0±0.5

Label

Empty tape Cover tape

13.0±0.2

62±

0.5

21.0±0.8

Direction of feed

2.2±0.1

24.8 26.5

178±0.5

(in:mm)

Leader

～

[ Packaging Code:K (φ330mm reel) ]

Trailer

160 min.

210 min

190 min

2.0±0.5

Label

Empty tape Cover tape

13.0±0.2

21.0±0.8

100±

1.0

Direction of feed

2±0.2

330±2.0

(in:mm)

25.5±0.5

11.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking (∗2), Quantity, etc

∗1) « Expression of Inspection No. »

□□ OOOO ×××

(1)

(2)

(3)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

Third, Fourth digit : Day

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D

(3) Serial No.

∗2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 10/ 14

Reference Only

11.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,

RoHS discrimination(∗2) , Quantity , etc

11.8 Specification of Outer Case

Outer Case Dimensions

Label

Standard Reel Quantity

in Outer Case (Reel)

Reel

(mm)

186

340

186

φ178mm

φ330mm

340

∗ Above Outer Case size is typical. It depends on a quantity of an order.

12.

! Caution

12.1.Direction of mounting

Please make sure of the direction of mounting and connect to the circuit properly.

As shown in the equivalent circuit shown in item 5, this product has a directionality.

Wrong connection to the circuit may cause open/short circuit of the part, burnout and serious accidents.

12.2.Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property.

(1)Aircraft equipment

(2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment

(5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment

(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment

(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above

12.3.ESD

ESD to this product, exceeding condition of IEC61000-4-2 with 30kV, may cause short circuit and fuming or firing.

13.Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

13.1. Flux and Solder

Use rosin-based flux, Do not use highly acidic flux (with chlorine content

exceeding 0.2(wt)%).

Flux

Do not use water soluble flux.

Solder

Use Sn-3.0Ag-0.5Cu solder

Other flux (except above) Please contact us for details, then use.

13.2. Note for Assembling

When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs.

Products can only be soldered with reflow.

The use in flow soldering be reserved.

< Thermal Shock >

Pre-heating should be in such a way that the temperature difference between solder and products

surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way

that the temperature difference is limited to 100 °C max.

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 11/ 14

Reference Only

13.3. Attention Regarding P.C.B. Bending

The following shall be considered when designing P.C.B.'s and laying out products.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

〔Products direction〕

Products shall be locatedin the sideways

^{direction (Length:a}<b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2) Products location on P.C.B. near seam for separation.

Products (A,B,C,D) shall be located carefully

so that products are not subjected to the

mechanical stress due to warping the board.

Because they may be subjecte the mechanical

stress in order of A > C > B ≅ D.

Seam

Slit

Lengh:a<b

Portion of

Perforation

13.4. Attention Regarding P.C.B. Design

< The Arrangement of Products >

P.C.B.

P.C.B. shall be designed so that products are

far from the portion of perforation.

○

Product

Portion of

Perforation

The portion of perforation shall be designed

as narrow as possible, and shall be designed

so as not to be applied the stress in the

case of P.C.B. separation.

○

P.C.B.

Products shall not be arranged on the line

of a series of holes when there are big

holes in P.C.B.

Product

Hole

(Because the stress concentrate on the

line of holes.)

< Products Placing >

Pick up nozzle

Support pins shall be set under P.C.B .

to prevent causing a warp to P.C.B.

during placing the products on the other

side of P.C.B.

P.C.B.

Support pin

< P.C.B. Separation >

P.C.B. shall not be separated with hand.

P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 12/ 14

Reference Only

13.5. Standard Land Dimensions

12.5

10.2

9.9

9.6

7.1

6.2

5.3

Copperfoilpattern

PSG

2.8

2.3

Copperfoilpattern+Resist

Etchedarea

Throughhole

（in ： mm

）

3.8 5.8

10.3 13.213.7

17.5

(1)Design the land pads for this part as shown above on both side printed circuit board ( or a multiple layered

substrate ).

(2) This product is designed to meet large current.

Please design PCB pattern which is connected to this product not to become too hot by applied large current.

(3)Ground area of CG should be connected to ground layer on the other side (or ground layer of multiple layered

substrate) with through holes as shown above.

It is recommended to take the ground area as wide as possible.

(4)It is recommended to use the connection to the ground layer with through holes and the ground layer to be circuit

board wide.

(5)Even in case that it isn't possible to use a both side printed circuit board ( or a multiple layered substrate ), the land

pads for CG should be designed as wide as possible.

13.6. Reflow Soldering

(1) Solder paste printing for reflow soldering

· Standard thickness of solder paste should be 150 to 200 µm.

Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up

the terminal, being possible to lead to not enough connection between terminals and lands on the circuit

board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual

use condition.

· For the solder paste printing pattern, use standard land dimensions.

· For the resist and copper foil pattern, use standard land dimensions.

· Use Sn / Pn = 60 / 40 or Sn-3.0Ag-0.5Cu solder

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

(2) Soldering Conditions

P 13/ 14

Reference Only

Standard soldering profile and the limit soldering profile is as follows.

The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration

of product quality.

Temp.

(°C)

260°C

245°C±3°C

230°C

220°C

Limit Profile

180

150

30s 60s

～

Standard Profile

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

Heating

Peak temperature

Cycle of reflow

150°C ~ 180°C , 90s ± 30s

above 220°C , 30s ~ 60s

245°C ± 3°C

above 230°C , 60s max.

260°C , 10s

2 times

13.7. Reworking with Soldering iron

· The following conditions shall be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

450°C max.

100W max.

Tip temperature

Soldering iron output

Soldering time

Time

2 times

Note : Do not touch the products directly with the tip of the soldering iron.

13.8. Cleaning Conditions

Don't cleaning product due to non-waterproof construction.

13.9. Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the performance,

such as insulation resistance may result from the use.

(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

13.10. Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or

twisting to the substrate when cropping the substrate, inserting and removing a connector from the

substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG.CO.,LTD.

Spec.No. JENF243H-0008M-01

P 14/ 14

Reference Only

13.11 Storage condition

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage environment condition

· Products should be stored in the warehouse on the following conditions.

Temperature

Humidity

- 10 °C to + 40 °C

15 % to 85% relative humidity No rapid change on temperature and humidity

· Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of

electrode, resulting in poor solderability.

· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

· Products should be stored under the airtight packaged condition.

(3) Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or

mechanical shock.

14.

! Notes

(1) Please make sure that your product has been evaluated in view of your specifications with our product

being mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO.,LTD.

BNX029-01K [MURATA]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E