DFE18SANR24ME0# [MURATA]

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型号：	DFE18SANR24ME0#
厂家：	muRata
描述：
文件：	总8页 (文件大小：412K)
中文：	中文翻译
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Spec No. JETE243A-0037H-01

P 1/8

CHIP COIL（CHIP INDUCTORS）DFE18SAN□□□□E0□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to DFE18SAN_E0 series, Chip coil (Chip Inductors).

2.Part Numbering

(ex)

1R0

Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Other Packaging

(L×W)

and

(T)

Characteristics

3.Rating

Operating Temperature Range

(Ambient temperature; Self-temperature rise is not included)

(Product temperature; Self- temperature rise is included)

Storage Temperature Range.

-40°C to +85°C

-40°C to +125°C

-40°C to +85°C

20V DC

Absolute maximum voltage

*3 Rated Current

(Max.) (mA)

Inductance

Resistance

Customer

Part Number

Murata

Part Number

∗1 Based on ∗2 Based on

inductance Temperatur

(Ω)

Tolerance

(%)

(µH)

change

4200

3100

2600

2000

e rise

DFE18SANR24ME0L

DFE18SANR47ME0L

DFE18SANR56ME0L

DFE18SAN1R0ME0L

0.24

0.47

0.56

1.0

0.036

0.064

0.070

0.144

3200

2400

2200

1600

±20%

∗1: The saturation allowable DC current value is specified when the decrease of the initial Inductance value at 30%.

*2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited

to 40°C max.

.∗3:Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.

4. Testing Conditions (Standard atmospheric conditions)

Temperature

Temperature : Ordinary Temperature (15°C to 35°C)

: 20°C ± 2°C

Humidity

: Ordinary Humidity (25% to 85 %(RH))

Humidity

Atmospheric Pressure

: 60% to 70 %(RH)

: 86 kPa to 106 kPa

5.Appearance and Dimensions

1.6±0.2

※no marking

(in mm)

■Unit Mass (Typical value)

0.007g

0.8±0.2

0.3±0.2

MURATA MFG.CO., LTD

Spec No. JETE243A-0037H-01

P 2/8

6. Electrical Performance

No.

Item

Specification

Test Method

6.1 Inductance

Inductance shall meet item 3.

Measuring Equipment:

Agilent 4287A or equivalent (0.5V)

Measuring Frequency: 1MHz

6.2 DC Resistance

6.3 Rated Current

Measuring Equipment: Digital multi meter

Self temperature rise shall be

limited to 40°C max.

The rated current is applied.

7.Mechanical Performance

No.

Item

Specification

Test Method

7.1 Bonding

Strength

Chip coil shall not be damaged.

It shall be soldered on the substrate.

Applying Force(F) : 10N

Hold Duration: 5s

7.2 Bending

Strength

Substrate: Glass-epoxy substrate

(100×40×1.0mm)

Speed of Applying Force: 0.5mm / s

Deflection: 2mm

Hold Duration: 20s

(in mm)

7.3 Vibration

It shall be soldered on the substrate.

Oscillation Frequency : 10 to 55 to 10Hz for 1 m

Total amplitude : 1.5 mm or Acceleration amplitude

98m/s²whichever is smaller.

Testing Time: A period of 2h in each of 3 mutually

perpendicular directions. (Total 6h)

7.4 Solderability

The wetting area of the electrode shall Flux:Ethanol solution of rosin,25(wt)%

be at least 90% covered with new Solder : Sn-3.0Ag-0.5Cu

solder coating.

Pre-Heating:150±10°C / 60 to 90s

Solder Temperature:245±5°C

Immersion Time:3 s

7.5 Resistance to Appearance:No damage

Reflow soldering method

Soldering

Heat

Inductance Change : within ±10%

Flux: Ethanol solution of rosin,25(wt)%

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150 to 180°C / 60 to 120s

Solder Temperature: 230°C min. / 20 to 40s

Peak Temperature: 250+5/-0°C

Reflow times: 2 times max

Test board shall be 0.8 mm thick. Base material shall

be glass epoxy resin.

Then measured after exposure Standard atmospheric

conditions for 1~2h.

MURATA MFG.CO., LTD

Spec No. JETE243A-0037H-01

P 3/8

8.Environmental Performance (It shall be soldered on the substrate.)

No.

Item

Specification

Test Method

8.1 Heat

Appearance:No damage

Temperature: 125±2°C

Resistance

Inductance Change : within ±10%

Time: 500h (±12h)

Then measured after exposure Standard atmospheric

conditions for 1~2h.

8.2 Cold

Temperature: -40±2°C

Resistance

Time: 500h (±12h)

Then measured after exposure Standard atmospheric

conditions for 1~2h.

8.3 Humidity

Temperature: 40±2°C

Humidity: 90 to 95%(RH)

Time: 500h (±12h)

Then measured after exposure Standard atmospheric

conditions for 1~2h.

8.4 Temperature

Cycle

1 cycle:

1 step: -40±2°C / 30±3m

2 step: Ordinary temp. / 3m max.

3 step: +125±2°C / 30±3m

4 step: Ordinary temp. / 3m max.

Total of 100 cycles

Then measured after exposure Standard atmospheric

conditions for 1~2h.

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

Unreeling direction

(in mm)

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

3,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape

Cover tape

9.8N min.

10N min.

MURATA MFG.CO., LTD

Spec No. JETE243A-0037H-01

P 4/8

9.4 Peeling off force of cover tape

Speed of Peeling off

165 to 180 degree

300mm/min

Cover tape

Plastic tape

0.1 to 0.7N

(minimum value is typical)

Peeling off force

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows.

(in mm)

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･

∗1) <Expression of Inspection No.>

□□OOOO ×××

(1)

(2)

(3)

(1) Factory Code

(2) Date

First digit

Second digit

: Year / Last digit of year

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking

(∗2) ,Quantity, etc ･･･

9.8. Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

186

Above Outer Case size is typical. It depends on a quantity of an order.

MURATA MFG.CO., LTD

Spec No. JETE243A-0037H-01

P 5/8

10.

Caution

10.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life,

body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

10.2 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide,

sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact

with the previously stated corrosive gas environment will result in deterioration of product quality or an open

from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under

these environments.

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

This product employs a core with low insulation resistance, Pay strict attention when use it.

a) Do not make any through holes and copper pattern under the coil except a copper pattern to the electrode.

b) Design/mount any components not to contact this product.

11.1 Land pattern designing (Reflow Soldering)

Recommended land pattern for reflow soldering is as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

(in mm)

11.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 100μm to 150μm

Solder

Other flux (except above) Please contact us for details, then use.

MURATA MFG.CO., LTD

Spec No. JETE243A-0037H-01

11.3 soldering conditions (Reflow)

P 6/8

・Pre-heating should be in such a way that the temperature difference between solder and product surface is

limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature

difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile profile is as follows.

Standard Profile

Pre-heating

Heating

150℃～180℃ 、90s±30s

above 230℃ 、20s～40s

Peak

temperature

250+5/-0°C

2 times

Cycle of reflow

11.4 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable

1/3T≦t≦T

T： thickness of electrode

11.5 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

MURATA MFG.CO., LTD

Spec No. JETE243A-0037H-01

P 7/8

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D ∗1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

Perforation

∗1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Slit

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

11.6 Resin coating

The inductance value may change and/or it may affect on the product's performance due to high cure-stress

of resin to be used for coating/molding products. So please pay your careful attention when you select resin.

In prior to use, please make the reliability evaluation with the product mounted in your application set.

11.7 Temperature rating of the circuit board and components located around

Temperature may rise up to max. 40 ℃ when applying the rated current to the Products.

Be careful of the temperature rating of the circuit board and components located around.

11.8 Caution for use

There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of tweezers

with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.)

11.9 Magnetic Saturation

When the excessive current over rated current is applied, the inductance value may change due to magnetism.

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting

to the substrate when cropping the substrate, inserting and removing a connector from the substrate or

tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG.CO., LTD

Spec No. JETE243A-0037H-01

P 8/8

11.11 Storage and Handing Requirements

(1) Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C to 40°C

Humidity

： 15% to 85% relative humidity No rapid change on temperature and humidity

Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of

electrode, resulting in poor solderability.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

・Products should be stored under the airtight packaged condition.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical

shock.

12． Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO., LTD

DFE18SANR24ME0# [MURATA]

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