DFE2HCAHR33MJ0# [MURATA]

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型号：	DFE2HCAHR33MJ0#
厂家：	muRata
描述：
文件：	总9页 (文件大小：432K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Only

Spec No. JETE243A-9105E-01

P 1/9

Chip Coil (Chip Inductors) DFE2HCAH□□□□J0L REFERENCE SPECIFICATION

Murata Standard Specification【AEC-Q200】

1.Scope

This reference specification applies to DFE2HCAH□□□□J0L, Chip Coil (Chip Inductors) for Automotive Electronic

based on AEC-Q200.

2.Part Numbering

(ex)

Product

1R0

Structure Dimension Applications

Category

Inductance Tolerance Dimension Other Packaging

(T)

(L×W)

and

Characteristics

3.Rating

Operating Temperature Range

(Ambient temperature; Self-temperture rise is not included)

(Product temperature; Self- temperature rise is included)

Storage Temperature Range.

-40 to +110°C

-40 to +150°C

-40 to +110°C

It can be considered for use with DCDC converters with a maximum voltage of 40 V or less.

*3 Rated Current

Resistance

(A)

Inductance

Tolerance

ESD

Level

(HBM)

Customer

Part Number

Murata

Part Number

∗1 Based on

∗2 Based on

Inductance change Temperature rise

(µH)

Max. (Ω)

(%)

DFE2HCAHR33MJ0L

DFE2HCAHR47MJ0L

DFE2HCAHR68MJ0L

DFE2HCAH1R0MJ0L

DFE2HCAH1R5MJ0L

DFE2HCAH2R2MJ0L

0.33

0.47

0.68

1.0

0.021

0.025

0.031

0.050

0.074

0.101

5.8

5.1

4.4

3.4

2.9

2.5

4.9

4.5

3.6

3.0

2.3

1.9

±20

1kV

1.5

2.2

*1: The saturation allowable DC current value is specified when the decrease of the initial Inductance value at 30%.

*2: Rated current (Based on Temperature rise) is the current value at which the product temperature rises to 40°C when

direct current is applied to the inductor with the product mounted on our designated board.

*3: Value defined when DC current flows and Rated Current (Based on Inductance change) or when DC current flows

and Rated Current (Based on Temperature rise) whichever is smaller.

4. Testing Conditions (Standard atmospheric conditions)

Temperature

Humidity

Temperature : Ordinary Temperature (15 to 35°C)

: 20 ± 2°C

: 65±5% (RH)

Humidity

: Ordinary Humidity (25 to 85% (RH))

Atmospheric Pressure : 86 to 106 kPa

5.Appearance and Dimensions

0.6±0.3

■Unit Mass (Typical value)

※no marking

0.0324g

2.5±0.2

1.2max.

(in mm)

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9105E-01

P 2/9

6. Electrical Performance

No.

Item

Specification

Measuring Equipment:

KEYSIGHT 4284A or equivalent (0.5V)

Measuring Frequency: 1MHz

6.1 Inductance

Meet item 3

6.2 DC Resistance

Measuring Equipment: Resistance Hitester 3541(HIOKI) or

equivalent

6.3 Withstand

voltage

machine: impulse testing machine

applied voltage: 60-70V

Inductance：Meet item 3

7. Q200 Requirement

AEC-Q200 Rev.D issued June 1. 2010

AEC-Q200

Murata Specification / Deviation

Stress

Test Method

No.

High

Temperature

Exposure

Meet Table A after testing.

Table A

1000±12h at 150±2 deg C

Set for 24±2hours

at room temperature,

then measured.

Appearance

Inductance

No damage

Change from

an initial value

within ± 10%

Temperature Cycling 1000cycles

-40 deg C for 30 min and 150 deg C for

30 min with the transit period of

2min or less

Measured within 24±2hours

at room temperature.

Biased Humidity

Operational Life

1000±12h at 85±2 deg C, 85%RH

Measured within 24±2hours

at room temperature.

Apply 110±2 deg C 1000±12h

Measured within 24±2h

at room temperature.

10 Physical Dimension

Measures using digital slide calipers and

an optical microscope.

According to specification

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9105E-01

P 3/9

Murata Specification / Deviation

Meet Table A after testing.

AEC-Q200

Stress

13 Mechanical Shock

Test Method

No.

Peak acceleration:

981 m/s2 （≒100G）

Duration of pulse: 6 ms

3 times in each of 6(±X, ±Y, ±Z) axes

Three successive shock shall be applied in

the perpendicular direction of each surface

of the specimen.

14 Vibration

5G for 20 min,

for 4 hours in each of 3(X, Y, Z) axes

Test from 10-2000Hz

15 Resistance

to Soldering Heat

Pre-heating：150 to 180 deg C / 90±30sec

Reflow soldering method

above 220 deg C, 60±30 sec

Temperature condition

above 255 deg C, above 30sec

Peak：above 260deg C

The specimen shall be subjected to the

reflow process under the above condition 3

times. Test board shall be 1.6 mm thick.

Base material shall be glass epoxy resin.

The specimen shall be stored at standard

atmospheric conditions for 1 h in prior to the

measurement.

17 ESD

Per AEC-Q200-002

Meet Table A after testing.

1 time in each of terminals

ESD level: Meet Item 3 (Rating)

18 Solderability

Per J-STD-002 Condition SMD)C Method D New solder shall cover 90% minimum of

Electrode shall be immersed in flux at

room temperature and then shall be

immersed in solder bath after preheat.

Soldering 245±5 deg C, 5sec

the surface immersed.

19 Electrical

Measured: inductance

No defects

characterization

21 Board Flex

Board : 40 × 100mm

Meet Table A after testing.

Thickness 1.6mm

Apply pressure gradually in the direction of

the arrow at a rate of about 0.5mm/s until

bent depth reaches 2mm and hold

for 60 sec.

22 Terminal Strength

A static load using a R0.5 pressing tool shall

be applied to the body of the specimen in the

direction of the arrow and shall be hold for

60s. Measure afte r removing pressure.

Pressure 18N

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9105E-01

P 4/9

8. Specification of Packaging

8.1 Appearance and Dimensions of plastic tape

Unreeling direction

(in mm)

8.2 Specification of Taping

(1) Packing quantity (standard quantity)

3,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

8.3 Pull Strength

Embossed carrier tape

9.8N min.

10N min.

Cover tape

8.4 Peeling off force of cover tape

Speed of Peeling off

300mm/min

165 to 180 degree

Cover tape

Plastic tape

0.1 to 0.7N

(minimum value is typical)

Peeling off force

8.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows.

(in mm)

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9105E-01

8.6 Marking for reel

P 5/9

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･

∗1) <Expression of Inspection No.>

LLOOOO ×××

(1)

(2)

(3)

(1) Factory Code

(2) Date

First digit

Second digit

: Year / Last digit of year

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

8.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking

(∗2) ,Quantity, etc ･･･

8.8 Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

200

185

Above Outer Case size is typical. It depends on a quantity of an order.

Caution

9.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life,

body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(6) Transportation equipment ( trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

9.2 Caution(Rating)

Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product

and short/open circuit of the product or falling off the product may be occurred.

9.3 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage

that may be caused by the abnormal function or the failure of our product.

9.4 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the

previously stated corrosive gas environment will result in deterioration of product quality or an open from

deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these

environments.

10. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

This product employs a core with low insulation resistance, Pay strict attention when use it.

a) Do not make any through holes and copper pattern under the coil except a copper pattern to the electrode.

b) Design/mount any components not to contact this product.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9105E-01

P 6/9

10.1 Land pattern designing (Reflow Soldering)

Recommended land pattern for reflow soldering is as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

UNIT : mm

10.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 100μm to 150μm

Solder

Other flux (except （above) Please contact us for details, then use.

10.3 soldering conditions (Reflow)

・Pre-heating should be in such a way that the temperature difference between solder and product surface is

limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature

difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile profile is as follows.

Standard Profile

Pre-heating

Heating

150℃～180℃ 、90s±30s

above 230℃ 、20s～40s

Peak

temperature

250+5/-0°C

2 times

Cycle of reflow

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9105E-01

10.4 Solder Volume

P 7/9

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable

1/3T≦t≦T

T： thickness of electrode

10.5 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D ∗1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

Perforation

∗1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Slit

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

10.6 Resin coating

The inductance value may change and/or it may affect on the product's performance due to high cure-stress

of resin to be used for coating/molding products. So please pay your careful attention when you select resin.

In prior to use, please make the reliability evaluation with the product mounted in your application set.

10.7 Temperature rating of the circuit board and components located around

Temperature may rise up to max. 40 ℃ when applying the rated current to the Products.

Be careful of the temperature rating of the circuit board and components located around.

10.8 Caution for use

There is possibility that the Impedance value change due to magnetism. Don‘t use a magnet or a pair of tweezers

with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.)

10.9 Magnetic Saturation

When the excessive current over rated current is applied, the Impedance value may change due to magnetism.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9105E-01

10.10 Handling of a substrate

P 8/9

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting

to the substrate when cropping the substrate, inserting and removing a connector from the substrate or

tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

10.11 Storage and Handing Requirements

(1) Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C to 40°C

Humidity

： 15% to 85% relative humidity No rapid change on temperature and humidity

Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of

electrode, resulting in poor solderability.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

・Avoid storing the product by itself bare (i.e.exposed directly to air).

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical

shock.

10.12 Derating

Max. current (DC, AC) as function of product temperature (derating curve)

I_OP

I_R

Loaded Current

Rated Current

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9105E-01

P 9/9

11． Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO., LTD

DFE2HCAHR33MJ0# [MURATA]

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