DFE32CAH1R0MR0# [MURATA]

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型号：	DFE32CAH1R0MR0#
厂家：	muRata
描述：
文件：	总9页 (文件大小：514K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Only

Spec No. JETE243A-9108A-01

P 1/9

CHIP COIL（CHIP INDUCTORS）DFE32CAH□□□□R0□

Murata Standard Reference Specification【AEC-Q200】

1. Scope

This reference specification applies to DFE32CAH series for automotive electronics based on AEC-Q200.

2. Part Numbering

(ex) DF

R47

Product

special

Type Dimension Applications Category Inductance Tolerance Dimension

Packaging

specification

(L×W)

And

(T)

Characteristics

3. Rating

Operating Temperature Range

(product temperature including self-temperature rise)

Storage Temperature Range.

-55 to +150°C

*3 Rated Current (mA)

Inductance

Murata

ESD

Level

Resistance

(Ω Max.)

Customer

Part Number

*1 Based on

*2 Based on

Part Number

Nominal

value

（HBM）

Tolerance

(%)

Inductance change Temperature rise

(uH)

0.47

0.68

1.0

±20

0.014

0.017

0.022

0.030

0.043

0.067

0.101

DFE32CAHR47MR0L

DFE32CAHR68MR0L

DFE32CAH1R0MR0L

DFE32CAH1R5MR0L

DFE32CAH2R2MR0L

DFE32CAH3R3MR0L

DFE32CAH4R7MR0L

8700

7000

5900

4800

4000

3300

2800

5900

5000

4100

3500

2900

2300

1900

1.5

2.2

3.3

4.7

*1: The saturation allowable DC current value is specified when the decrease of the initial Inductance value at 30%.

*2: When a rated current (based on Temperature rise) is applied, the temperature rise due to self-heating of the product is

40 °C or less.

*3: Keep the product temperature (ambient temperature + self-heating) below 150 °C. The rated current value is the smaller

of the rated current (based on Inductance change) or the rated current (based on Temperature rise).

4. Testing Conditions (Standard atmospheric conditions)

Temperature

Humidity

: Ordinary Temperature (15 to 35°C)

: Ordinary Humidity (25 to 85 %(RH))

: 20 ± 2°C

Humidity

: 60 to 70 %(RH)

: 86 to 106 kPa

Atmospheric Pressure

5. Appearance and Dimensions

■Unit mass (typical value): 0.0913 g

(in mm)

6. Marking

No marking

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9108A-01

P 2/9

7. Electrical Performance

No.

Item.

Specification

Meet item 3.

Test Method

7.1 Inductance

Measuring Equipment: Keysight 4284A or equivalent

Measurement signal level：0.5V

Measuring Frequency: 1MHz

7.2 DC Resistance

Measuring Equipment: Digital multimeter

7.3 Rated Current

(based on

The saturation allowable DC

current value is specified when

the decrease of the initial

Inductance value at 30%.

The rated current specified in Chapter 3 is applied.

Inductance change)

7.4 Rated Current

(based on

The temperature rise due to self- The rated current specified in Chapter 3 is applied.

heating due to rated current

Temperature rise)

application based on

temperature rise is 40 °C or less.

7.5 withstand voltage

Inductance shall meet item 3.

Testing Equipment: Impulse tester

Applied voltage: 60~70V (by item)

8. Q200 Requirement

Performance(based on Table 5 for Magnetics Inductors/Transformer)

AEC-Q200 Rev.D issued June 1. 2010

AEC-Q200

Murata Specification / Deviation

No.

Stress

Test Method

1000 h at 150°C

3 High temperature

exposure

Appearance: No damage

Set for 24 h at room condition, Inductance change rate: within ±10%

then measured.

4 Temperature cycling 1000 cycles

-55°C to +150°C

Appearance: No damage

Inductance change rate: within ±10%

Set for 24 h at room condition,

then measured.

7 Biased humidity

1000 h at 85°C, 85% (RH).

Unpowered.

Appearance: No damage

Inductance change rate: within ±10%

Set for 24 h at room condition,

then measured.

8 Operational life

9 External visual

Apply 110°C 1000 h

Set for 24 h at room condition, Inductance change rate: within ±10%

then measured.

Appearance: No damage

Visual inspection

No abnormalities

10 Physical dimension

13 Mechanical shock

Meet chapter 5, "Appearance

and Dimensions".

Per MIL-STD-202

Method 213

No defects

Appearance: No damage

Inductance change rate: within ±10%

Condition C:

100 g's/6 ms/half sine

14 Vibration

5 g's for 20 min, 12 cycles each Appearance: No damage

of 3 orientations

Inductance change rate: within ±10%

Test from 10 Hz to 2000 Hz

15 Resistance

Appearance: No damage

Inductance change rate: within ±10%

Pre-heating：150 to 180°C /

90±30sec

to Soldering Heat

Reflow soldering method

above 220°C, 60±30 sec

Temperature condition

above 255°C, above 30sec

Peak：above 260°C

The specimen shall be subjected

to the reflow process under the

above condition 3times. Test

board shall be 1.6 mm thick.

Base material shall be glass

epoxy resin.

The specimen shall be stored at

standard atmospheric conditions

for 1 h in prior to the

measurement.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9108A-01

AEC-Q200

P 3/9

Murata Specification / Deviation

No.

Stress

Test Method

17 ESD

Per AEC-Q200-002

ESD Rank: Refer to chapter 3, "Part Number and Rating".

Appearance: No damage

18 Solderability

Per J-STD-002

90% or more of the outer electrode shall be covered

with new solder seamlessly.

Deviation for AEC-Q200

Method b: Not applicable

Pre-heating: 150°C/60s

No defects

19 Electrical

Characterization

20 Flammability

Measured: inductance

Per UL-94

Not applicable

21 Board Flex

Epoxy-PCB (1.6 mm)

Appearance:No damage

Deflection 2 mm (min.)

60 s minimum holding time

Inductance change rate: within ±10%

22 Terminal Strength

Per AEC-Q200-006

Appearance: No damage

A force of 17.7 N for 60 s

9. Specification of Packaging

9.1 Appearance and dimensions of tape (8 mm width/plastic tape)

(2.8)

(3.5)

(2.1)

(0.25)

(in mm)

Dimensions A and B are at the bottom of the cavity. The A, B, t, t ' dimensions are reference values.

9.2 Taping specification

Packing quantity

2000 pcs/reel

(Standard quantity)

Packing method

The products are placed in cavities of a carrier tape and sealed by a cover tape.

Feed hole position

The feed holes on the carrier tape are on the right side when the cover tape is pulled

toward the user.

Joint

The carrier tape and cover tape are seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is

greater, and are not continuous. The specified quantity per reel is kept.

9.3 Break down force of tape

Cover tape

10N min.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9108A-01

P 4/9

9.4 Peeling off force of cover tape

165 to 180 degree

300mm/min

Speed of Peeling off

Cover tape

0.1 to 0.7N

(The lower limit is for typical value.)

Peeling off force

Plastic tape

9.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The

leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram

below.)

φ180+0/-3

9±0.3

11.4±1

φ60+1/-0

φ13±0.2

φ21±0.8

2.0±0.5

（in mm）

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(*1), RoHS marking(*2), Quantity etc ･･･

*1 Expression of inspection No.:

(1) Factory code

□□ ○○○○

(1) (2)



(2) Date

First digit: year/last digit of year

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3)

(3) Serial No.

*2 Expression of RoHS marking:

(1) RoHS regulation conformity

(2) Murata classification number

ROHS-

()

(1)

(2)

9.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity,

etc.

9.8 Specification of Outer box

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

185

195

*Above Outer Case size is typical. It depends on a quantity of

an order.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9108A-01

P 5/9

10.

Caution

10.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body

or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(6) Transportation equipment (trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster/crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and/or reliability requirements

to the applications listed in the above

10.2 Precautions on rating

Do not use over the rated temperature range or rated current.

If used beyond the rating, serious defects such as wire breakage and burnout may occur.

10.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is

applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious

fault.

10.4 Circuit voltage

There is a possibility available for DCDC converters with a maximum voltage of 40V or less.

Be sure to evaluate the actual machine in advance to check the quality of this product.

10.5 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that

may be caused by the abnormal function or the failure of our product.

10.6 Corrosive gas

Do not use this product when exposed to corrosive gases (Sulfur gases [Hydrogen sulfide, sulfur dioxide,

etc.], chlorine, ammonia, etc.) or in contact with oil (Cutting oil, silicone oil, etc.) exposed to corrosive

gases. This may cause deterioration or degradation of the product electrode, resulting in opening. our

company assumes no responsibility for use in this environment.

11. Precautions for Use

This product is designed to be mounted by soldering. If you want to use other mounting method, for example,

using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the

coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting

part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder

volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in

ambient temperature is assumed.

This product has a lower insulation resistance than conventional ferrite products, so care must be paid to its

use.

a) Do not make any through holes and copper pattern under the coil except a copper pattern to the

electrode.

b) Design/mount any components not to contact this product.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9108A-01

P 6/9

11.1 Land dimensions

The following diagram shows the recommended land dimensions for flow and reflow soldering:

2.8

3.7

1.8

(in mm)

11.2 Flux and solder used

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

Solder

・Standard thickness of solder paste : 100μm to 150μm

Other flux (except above) Please contact us for details, then use.

11.3 Soldering conditions (Reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product

surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the

temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the

product, resulting in the deterioration of product quality.

• Standard soldering profile is as follows.

Standard profile

Pre-heating

Heating

150〜180°C/90 s±30 s

Above 230°C/30 s±10 s

250°C +5/-0°C

Peak temperature

Number of reflow

cycles

2times

11.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

60 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the

product. Such a direction contact may cause cracks in the ceramic

body due to thermal shock.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9108A-01

P 7/9

11.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may

cause the failure of mechanical or electrical performance.

11.6 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping

the board.

［Products direction］

Products shall be located in the sideways

direction to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

A > D^*1

A > B

(1) Turn the mounting direction of the component

parallel to the board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away

from the board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand

separation. If a cutting disc is used, stress will be diagonal to the PCB,

therefore A > D is invalid.

Perforation

Slit

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that

occurs during the tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

Recommended

Screw Hole

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9108A-01

P 8/9

11.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or

twisting to the substrate when cropping the substrate, inserting and removing a connector from the

substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.8 Cleaning

When cleaning this product, observe the following conditions:

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning

temperature shall be 40°C max.

(2) During ultrasonic cleaning, under some cleaning conditions, the resonation of PCB should be caused

by its vibration.

Be sure to do the test cleaning with actual cleaning equipment before production and confirm that

product does not be damaged by cleaning.

(3) Cleaner

Alcohol-based cleaner: IPA

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product

with deionized water adequately and completely dry it so that no cleaner is left.

11.9 Storage and transportation

Storage period

Use the product within 6 months after delivery.

If you do not use the product for more than 6 months, check solderability before

using it.

Storage

conditions

• The products shall be stored in a room not subject to rapid changes in

temperature and humidity. The recommended temperature range is -10°C to

+40°C. The recommended relative humidity range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid

may cause the poor solderability.

• Do not place the products directly on the floor; they should be placed on a

palette so that they are not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or

vibration.

• Do not keep products in bulk packaging. Doing so may cause collision

between the products or between the products and other products, resulting

in chipping or wire breakage.

• Avoid storing the product by itself bare (i.e. exposed directly to air).

Excessive vibration and impact reduce the reliability of the products. Exercise

caution when handling the products.

Transportation

11.10 Resin coating (including moistureproof coating)

Coating/molding the product with resin may change electrical characteristics.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of

resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate

chlorine by hydrolysis under some operating condition may cause corrosion of conductor, leading to

wire breakage.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products

mounted on your board.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-9108A-01

P 9/9

11.11 Mounting Conditions

・Please check the mounting condition before using.

・Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products

may lead to pick up errors, misalignment, or damage to the product.

11.12 Operating Environment

Do not use this product under the following environmental conditions as it may cause deterioration of

product quality.

(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic

gases and etc. (the sea breeze, Cl₂, H₂S, NH₃, SO₂, NO₂,etc)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

11.13 Implementation density

When placing this product near parts with heat generation, take sufficient heat radiation

countermeasures.

If the heat received from other parts is large, the characteristics of this product may deteriorate, causing

circuit operational failure or deterioration of the joints.

Be sure to use this product below the maximum rated operating temperature even when heat received

from other parts is applied.

11.14 Handling of product

Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or

other similar tools when handling the product (instead, use tweezers with resin or ceramic tips).

11.15 Derating

Max. current (DC, AC) as function of product temperature (derating curve)

I_OP

I_R

Loaded Current

Rated Current

12．

Note

(1)Please make sure that your product has been evaluated in view of your specifications with our

product being mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO., LTD

DFE32CAH1R0MR0# [MURATA]

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