DLW21SN181XQ2L [MURATA]

Data Line Filter,;


型号：	DLW21SN181XQ2L
厂家：	muRata
描述：	Data Line Filter, LTE
文件：	总9页 (文件大小：271K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Only

Spec No. JEFL243C-0028C-01

P1/9

Chip Common Mode Choke Coil

DLW21SN□□□XQ2□

Reference Specification

1. Scope

This reference specification applies to Chip Common Mode Choke Coil DLW21SN_XQ Series.

2. Part Numbering

(ex.)

(1)

261

(6) (7) (8) (9) (10)

(6) Impedance (Typ. at 100MHz)

(2) (3) (4) (5)

(1) Chip Common Mode Choke Coil

(2) Structure (W : Winding Type)

(3) Dimension (L×W)

(4) Type

(7) Circuit

(8) Features

(9) Number of Line

(5) Category

(10) Packaging Code L : Taping / B : Bulk

3. Rating

Common Mode Impedance Rated Withstanding Rated

Insulation

Customer

Part Number

Murata

Part Number

(at 100MHz,Under Standard Voltage

Voltage

V(DC)

Current Resistance Resistance

Testing Condition)

V(DC)

(mA)

(Ω max.) (MΩ min.)

(Ω )

DLW21SN181XQ2L

DLW21SN181XQ2B

DLW21SN261XQ2L

DLW21SN261XQ2B

DLW21SN491XQ2L

DLW21SN491XQ2B

180 ± 25%

260 ± 25%

490 ± 25%

240

220

190

0.39

0.59

0.77

Operating Temperature : -40 to +85°C

Storage Temperature : -40 to +85°C

4. Standard Testing Condition

Temperature : 20 ± 2°C

Humidity : 60 to 70%(RH)

Temperature : Ordinary Temperature 15 to 35°C

Humidity : Ordinary Humidity 25 to 85%(RH)

Atmospheric Pressure : 86 to106kPa

5. Style and Dimensions

■ Equivalent Circuits

(2)

(3)

(1)

1.2±0.2

2.0±0.2

(4)

(0.45)

(1)

(0.45)

(2)

No polarity

Electrode

() : Reference Value

■ Unit Mass (Typical value)

0.011g

(in mm)

(3)

(4)

6. Marking

No Marking.

7. Electrical Performance

No.

7.1

Item

Common Mode

Impedance (Zc)

Specification

Meet item 3.

Test Method

Measuring Equipment : KEYSIGHT 4291A or the

equivalent

Measuring Frequency : 100±1MHz(ref.item 10,11)

Test Voltage : 2.5 times for Rated Voltage

Time : 5 s

7.2

7.3

Withstanding

Voltage

Products shall not be damaged.

Meet item 3.

Charge Current : 1 mA max. (ref.item 10)

DC Resistance

(Rdc)

Measuring current : 10mA max. (ref.item 10)

(In case of doubt in the above mentioned standard

condition, measure by 4 terminal method.)

Measuring voltage : Rated Voltage

Measuring time : 1 min max. (ref.item 10)

7.4

Insulation

Resistance (I.R.)

MURATA MFG.CO.,LTD

Reference Only

Spec No. JEFL243C-0028C-01

P2/9

8. Mechanical Performance

No.

Item

Specification

Test Method

8.1 Appearance and Meet item 5.

Dimensions

Visual Inspection and measured with

Slide Calipers.

8.2 Bonding Strength No evidence of coming off

substrate.

It shall be soldered on the substrate.

Applying Force(F) : 5N

Products shall not be

mechanical damaged.

Applying Time : 5±1s

Pressure

Substrate

Product

Test board fixture

8.3

Meet Table 1.

Table 1

It shall be soldered on the Glass-epoxy substrate.

Bending Strength

Deflection : 2mm

Keeping time : 5 s

(t=1.0mm)

Speed of Applying Force : 0.5mm/s

No damaged

Appearance

Common Mode

Impedance

Change

Pressure jig

R230

within ±20%

Deflection

10MΩ min.

I.R.

Product

Withstanding

Voltage

No damaged

8.4

Drop

It shall be dropped on concrete or steel board.

Method : free fall

Height : 1 m

The Number of Times : 3 times

8.5 Vibration

It shall be soldered on the substrate.

Oscillation Frequency : 10 to 55 to 10Hz for 1 min

Total Amplitude : 1.5mm

Testing Time : A period of 2 hours in each of 3

mutually perpendicular directions. (Total 6 hours)

Flux:Ethanol solution of rosin,25(wt)% includes

activator equivalent to 0.06 to 0.10(wt)% chlorine

Pre-Heating : 80 to 120°C 1min

Solder : Sn-3.0Ag-0.5Cu

8.6 Solderability

The electrodes shall be at least

90% covered with new solder

coating.

Solder Temperature : 245±3°C

Immersion Time : 4±1 s

Immersion and emersion rates : 25mm/s

Stainless tweezers

Please hold product

except these part.

Flux : Ethanol solution of rosin,25(wt)%

includes activator equipment to 0.06 to

0.10(wt)% chlorine

8.7 Resistance to

Soldering Heat

Meet Table 1.

Pre-Heating : 80 to 120°C, 1min

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 260±5°C

Immersion Time : 5±0.5 s

Immersion and emersion rates : 25mm/s

Then measured after exposure in the room

condition for 4 to 48 hours.

MURATA MFG.CO.,LTD

Reference Only

Spec No. JEFL243C-0028C-01

P3/9

9. Environmental Performance(Products shall be soldered on the substrate.)

No.

9.1

Item

Temperature

Cycle

Specification

Meet Table 1.

Test Method

1 Cycle

Step 1 -40°C(+0°C,-3°C) / 30±3 min

Step 2 Ordinary Temp. / 10 to 15 min

Step 3 +85°C(+3°C,-0°C) / 30±3 min

Step 4 Ordinary Temp. / 10 to 15 min

Total of 100 cycles

Then measured after exposure in the

room condition for 4 to 48 hours

9.2

9.3

9.4

Humidity

Temperature : 40±2°C

Humidity : 90~95%(RH)

Time : 1000(+48 hours,-0 hours)

Then measured after exposure in the

room condition for 4 to 48 hours.

Heat life

Temperature : 85±2°C

Applying Voltage : 2times for Rated Voltage

Time : 1000(+48 hours,-0 hours)

Then measured after exposure in the

room condition for 4 to 48 hours.

Temperature : -40± 2°C

Time : 1000(+48 hours,-0 hours)

Then measured after exposure in the

room condition for 4 to 48 hours.

(ref.item 10)

Cold Resistance

10. Terminal to be Tested.

When measuring and suppling the voltage, the following terminal is applied.

No.

Item

Terminal to be Tested

10.1

Common Mode Impedance

(Measurement Terminal)

Terminal

10.2

10.3

Withstanding Voltage

(Measurement Terminal)

Terminal

DC Resistance

(Measurement Terminal)

Terminal

10.4

10.5

Insulation Resistance

(Measurement Terminal)

Terminal

Heat Life(Supply Terminal)

11. Measuring method for common mode impedance.

Measured common mode impedance may be included measurement error due to stray capacitance,

residual inductance of test fixture.

To correct this error, the common mode impedance should be calculate as follows;

(1) Measure admittance of the fixture(opened), Go Bo.

(2) Measure impedance of the fixture(shorted), Rs Xs.

(3) Measure admittance of the specimen, Gm Bm.

(4) Calculate corrected impedance Z using the formula below.

Z = (Rx²+Xx²) ^1/2

Where

Gm-Go

Rx =

- Rs

- Xs

(Gm-Go)^２+ (Bm-Bo)^２

-(Bm- Bo)

Xx =

(Gm-Go)^２+ (Bm-Bo)^２

MURATA MFG.CO.,LTD

Reference Only

Spec No. JEFL243C-0028C-01

P4/9

12. P.C.B., Flux, Solder and Soldering condition

Test shall be done using P.C.B., Flux, Solder and Soldering condition which are

specified in item 16 except the case of being specified special condition.

13. Impedance Frequency Characteristics(Typical)

14. Specification of Packaging

14.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)

Sprocket Hole

1.5± ^0.1

0.25±0.05

4.0±0.1

2.0±0.05

0.3±0.05

*Dimension of the Cavity is measured

at the bottom side.

1.4±0.1

4.0±0.1

Direction of feed

1.45±0.1

Cavity

(in mm)

14.2 Specification of Taping

(1)Packing quantity(Standard quantity) 2000 pcs. / reel

(2)Packing Method

Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.

(3) Spliced point

The cover tape have no spliced point.

(4) Sprocket Hole

The sprocket holes are to the right as the tape is pulled toward the user.

(5)Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not

continuous.The specified quantity per reel is kept.

14.3 Pull Strength of Plastic Tape

Plastic Tape

Cover Tape

5N min.

10N min.

14.4 Peeling off force of Cover Tape

0.2 to 0.7N(Minimum value is Typical)

Speed of Peeling off : 300 mm / min

165 to 180 degree

Cover tape

Plastic tape

MURATA MFG.CO.,LTD

Reference Only

Spec No. JEFL243C-0028C-01

P5/9

14.5 Dimensions of Leader-tape, Trailer and Reel

Trailer

Leader

2.0±0.5

160 min.

190 min.

210 min.

Label

Empty tape Top tape

13.0±0.2

60± ¹

21.0±0.8

Direction of feed

9± ¹₀

13±1.4

180±⁰

14.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS discrimination(∗2), Quantity, etc

∗1) « Expression of Inspection No. »

□□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS discrimination » ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

14.7 Marking for Outside package

Customer name Purchasing Order Number, Customer Part Number, MURATA part number,

RoHS discrimination(∗2), Quantity, etc

14.8 Specification of Outer Case

Outer Case Dimensions

Standard Reel Quantity in Outer Case

Label

(mm)

(Reel)

186

∗ Above Outer Case size is typical. It depends on a quantity of an

order.

15. △Caution

15.1 Mounting Direction

Mount products in right direction.

Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also

flames or other serious trouble.

Ｚ

right direction

wrong direction

15.2 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life, body

or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and / or reliability

requirements to the applications listed in the above.

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

MURATA MFG.CO.,LTD

Reference Only

Spec No. JEFL243C-0028C-01

P6/9

16. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

16.1 Flux and Solder

Flux

Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),

but not highly acidic flux

(with Halogen content exceeding 0.2(wt)% conversion to chlorine).

Do not use water-soluble flux.

Solder

Use Sn-3.0Ag-0.5Cu solder

16.2 Assembling

Flow soldering may cause deterioration in insulation resistance.

So, reflow soldering shall be applied for this product.

16.3 Cleaning Conditions

Do not clean after soldering. Some cleaning agents may degrade bonding strength,and

characteristics of products by detaching. If cleaning,please contact us.

16.4 Resin coating

The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An

open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or

operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by

hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,

please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted

on your board.

16.5 Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［Products direction］

Products shall be location the sideways

Direction (Length : a<b) to the mechanical

Stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as

possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

D *1

(3) Keep the mounting position of the component away from the board separation surface.

Perforation

*1 A > D is valid when stress is added vertically to the perforation as with

Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB,

therefore A > D is invalid.

Slit

MURATA MFG.CO.,LTD

Reference Only

Spec No. JEFL243C-0028C-01

P7/9

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.

Recommended

Screw Hole

Portion of

Perforation

16.6 Attention Regarding P.C.B. Design

< The Arrangement of Products >

P.C.B.

○

P.C.B. shall be designed so that products are

far from the portion of perforation.

○

Product

Portion of

Perforation

The portion of perforation shall be designed

as narrow as possible, and shall be designed

so as not to be applied the stress in the

case of P.C.B. separation.

○

P.C.B.

Products shall not be arranged on the line

of a series of holes when there are big

holes in P.C.B.

Product

Hole

(Because the stress concentrate on the

line of holes.)

< Products Placing >

Pick-up nozzle

Support pins shall be set under P.C.B .

to prevent causing a warp to P.C.B.

during placing the products on the other

side of P.C.B.

Product

P.C.B.

< P.C.B. Separation >

Support pin

P.C.B. shall not be separated with hand.

P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.

16.7 Standard Land Dimensions (Reflow)

∗

Resist

Copper foil pattern

0.8

2.6

No pattern

(in mm)

∗1 If the pattern is made with wider than 1.2mm. It will result to let component turn around,

because melting speed is different. In the worst case, short circuit between lines may be occured.

∗2 If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be

occurred deu to the spread of soldering paste or mount placeing accuracy.

∗3 If the pattern is made with wider than 0.8mm, the strength of bending will be reduced.

∗⁴Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.

16.8 Standard Soldering Condition

1.Reflow Soldering

(1)Standard printing pattern of solder paste

• Standard thickness of the solder paste

should be 100 to 150µm.

• Use the solder paste printing pattern of the

right pattern.

• For the resist and copper foil pattern, use

0.8

(in mm)

2.6

MURATA MFG.CO.,LTD

Reference Only

Spec No. JEFL243C-0028C-01

standard land dimensions.

P8/9

• Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.

• Spread of soldering paste between lines may

cause short circuit of lines.

(2) Soldering Temperature

Temperature difference between soldering and surface of components must be within 150°C,

in preheating. When components are immersed in liquid after soldering, temperature difference

should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration

in insulation resistance.

(3) Soldering Condition

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

Temp.

(℃)

260℃/10s

230℃

245±3℃

220℃

Limit Profile

180

150

Standard Profile

30～60s

60s max.

90s±30s

Time（ｓ）

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s

245±3°C

Limit Profile

Pre-heating

Heating

above 230°C、60s max.

260°C、10s

Peak temperature

Cycle of reflow

2 times

2. Reworking with Soldering iron

The following conditions must be strictly followed when using a soldering iron after being

mounted by reflow soldering.

· Pre-heating: 150°C, 1 min

· Tip temperature: 350°C max.

· Soldering time : 3(+1,-0) s.

· Soldering iron output: 30W max.

· Tip diameter:φ3mm max.

· Times : 2times max.

Notes : Do not touch the products directly with the soldering iron.

Do not remove the product from P.C.B.. If the removed product is re-soldered on

P.C.B. ,characteristic impedance may change.

3. Solder Volume

Solder shall be used not to be exceed the upper limits as shown below.

Upper limit

Recommendable

ｔ

1/3T t T (T:Tickness of electrode)

≦≦

Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

MURATA MFG.CO.,LTD

Reference Only

Spec No. JEFL243C-0028C-01

P9/9

16.9 Caution for use

tweezer

･When you hold products with a tweezer, please hold

like a figure of the right side, and sharp material,

such as a pair of tweezers, shall not be touched to

the winding portion to prevent the breaking of wire.

･Mechanical shock should not be applied to the products

mounted on the board to prevent the breaking of the core.

16.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to

the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening

screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

16.11 Brushing of neighborhood of products

When you clean the neighborhood of products such as connector pins, bristles of cleaning brush

shall not be touched to the winding portion to prevent the breaking of wire.

16.12 Operating Environment

Do not use this product under the following environmental conditions, on deterioration

of the performance, such as insulation resistance may result from the use.

(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

16.13 Storage Condition

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage environment conditions

·Products should be stored in the warehouse on the following conditions.

Temperature ： -10 ~ +40°C

Humidity

： 15 to 85% relative humidity No rapid change on temperature and humidity.

· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,

to prevent the following deterioration.

Poor solderability due to the oxidized electrode.

· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.

· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

· Products should not be stored under the air tights packaged condition.

(3) Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

17. ！ Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO.,LTD

DLW21SN181XQ2L [MURATA]

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