DLW32MH101XK2L [MURATA]
Data Line Filter,;
| 型号： | DLW32MH101XK2L |
| 厂家： | 
muRata |
| 描述： | Data Line Filter, LTE |
| 文件： | 总9页 (文件大小：278K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Spec. No. JEFL243C-9124A-01
P1/9
Wire Wound Chip Common Mode Choke Coil
DLW32MH□□□XK2□ Reference Specification 【AEC-Q200】
1.Scope
This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW32MH_XK Series
for Automotive Electronics based on AEC-Q200.
2.Part Numbering
(ex)
DL
(1)
W
(2)
32
(3)
M
(4)
H
(5)
101
(6)
X
(7)
K
(8)
2
(9)
L
(10)
(1) Product ID
(2) Structure
(6) Inductance(Typ. at 0.1MHz)
(7) Circuit
(3) Dimension Type(LxW)
(4) Type
(8) Features
(9) Number of line
(5) Category
(10) Packing code L : Taping(φ180mm), *B:Bulk
*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3.Rating
Rated Withstanding Rated
DC
Insulation
Common Mode
Inductance
(at 0.1MHz)
Customer
Part Number
Murata
Part Number
ESD
Rank
Voltage
Voltage
Current Resistance Resistance
(MΩmin.)
V(DC)
V(DC)
(mA)
(Ω.)
5B
DLW32MH101XK2L 100μH(-30%/+50%) 50
DLW32MH201XK2L 200μH (-20%/+50%) 50
125
125
100
70
2.8±20%
4.0±20%
10
10
(12kV(AD) < 16kV(AD)
5B
(12kV(AD) < 16kV(AD)
・Operating Temperature Range. –40°C to +125°C
・Storage Temperature Range. –40°C to +125°C
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity: Ordinary Humidity / 25%(RH) to 85 %(RH)
Temperature : 20°C ± 2°C
Humidity
: 60%(RH) to 70 %(RH)
Atmospheric Pressure : 86kPa to 106 kPa
5. Appearance and Dimensions
■ Equivalent Circuits
(2)
(3)
(1)
(4)
No polarity
■ Unit Mass (Typical value)
0.072g
6. Marking
No Marking.
MURATA MFG.CO., LTD
Reference Only
Spec. No. JEFL243C-9124A-01
P2/9
7. Electrical Performance
No.
Item
Specification
Test Method
7.1
Common Mode
Inductance (Lc)
Insulation
Resistance (I.R.)
Withstanding
Voltage
Meet item 3.
Measuring Equipment : KEYSIGHT 4294A or the equivalent
Measuring Frequency:0.1MHz
Measuring voltage : Rated Voltage
Measuring time : 1 min max.
(ref.item 9.1)
7.2
7.3
(ref.item 9.3)
Products shall not be damaged. Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 s
Charge Current : 1 mA max.
(ref.item 9.2)
7.4
DC Resistance
(Rdc)
Meet item 3.
Measuring current : 10mA max.
(In case of doubt in the above mentioned standard condition,
measure by 4 terminal method.) (ref.item 9.4)
8. Q200 Requirement
8-1. Performance
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
Meet Table A after testing.
Stress
Test Method
1000h at 125 deg C
No.
3
High Temperature
Exposure
Set for 24h at room temperature, Table A
then measured.
Appearance
Common Mode
Inductance Change
(at 0.1MHz)
No damaged
Within ±20%
4
Temperature Cycling
1000cycles
Meet Table A after testing.
-40 deg C to +125 deg C
Set for 24h at room temperature,
then measured.
5
7
8
Destructive
Physical Analysis
Per EIA469
No electrical tests
Not Applicable
Biased Humidity
Operational Life
1000h at 85 deg C, 85%RH
Apply rated current
Meet Table A after testing.
Meet Table A after testing.
(ref.item 9.5)
(ref.item 9.6)
1000h at 125 deg C
Apply rated current
Set for 24h at room temperature,
then measured
Visual inspection
9
External Visual
No abnormalities
No defects
10 Physical Dimension
Meet ITEM 4
（Style and Dimensions）
12 Resistance to Solvents
13 Mechanical Shock
Per MIL-STD-202 Method 215
Not Applicable
Per MIL-STD-202 Method 213
Conditon F:
Meet Table A after testing.
1500g’s(14.7N)/0.5ms/Half sine
14 Vibration
5g's(0.049N) for 20 min,
12cycles each of 3 oritentations
Test from 10-2000Hz.
Meet Table A after testing.
15 Resistance
to Soldering Heat
No-heating
Pre-heating:150 to 180C / 90±30s
Meet Table A after testing.
Solder temperature
260C+/-5 deg C
Immersion time 10s
MURATA MFG.CO., LTD
Reference Only
Spec. No. JEFL243C-9124A-01
P3/9
AEC-Q200
Murata Specification / Deviation
No.
Stress
Test Method
17 ESD
Per AEC-Q200-002
Meet Table A after testing.
ESD Rank: Refer to Item 3. Rating.
18 Solderbility
Per J-STD-002
Method b : Not Applicable
90% of the terminations is to be soldered.(except partly-exposed wire)
Flux:Ethanol solution of rosin,25(wt)% includes activator equivalent to 0.06
to 0.10(wt)% chlorine
19 Electrical
Measured :
Common mode Inductance
No defects
Characterization
20 Flammability
21 Board Flex
Per UL-94
Not Applicable
Epoxy-PCB(1.6mm)
Meet Table A after testing.
Deflection 2mm(min)
60 s minimum holding time
22 Terminal Strength
Per AEC-Q200-006
A force of 17.7N for 60s
No defects
30 Electrical Transient
Conduction
Per ISO-7637-2
Not Applicable
9. Terminal to be Tested.
When measuring and supplying the voltage, the following terminal is applied.
No.
Item
Terminal to be Tested
9.1
Common Mode Inductance
(Measurement Terminal)
Terminal
Terminal
9.2
9.3
Withstanding Voltage
(Measurement Terminal)
Insulation Resistance
Terminal
Terminal
(Measurement Terminal)
9.4
DC Resistance
(Measurement Terminal)
Terminal
Terminal
Terminal
Terminal
9.5
9.6
Biased Humidity
(Supply Terminal)
Terminal
Terminal
Operational Life
(Supply Terminal)
10. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 13 except the case of being specified special condition.
MURATA MFG.CO., LTD
Reference Only
Spec. No. JEFL243C-9124A-01
P4/9
11. Specification of Packaging
11.1 Appearance and Dimensions (12mm-wide,Plastic tape)
*Dimension of the Cavity is measured
at the bottom side.
(in mm)
11.2. Specification of Taping
(1) Packing quantity (Standard quantity) φ 180 mm reel : 1500 pcs. / reel
(2) Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
11.3. Pull Strength of Plastic Tape
Plastic Tape
Cover Tape
5 N min.
10 N min.
11.4. Peeling off force of Cover Tape
0.2N to 0.7N (minimum value is typical.)
Speed of Peeling off : 300 mm / min
165 to 180 degree
F
Cover tape
Plastic tape
11.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
« Packaging Code : L (Φ180mm reel) »
Trailer
Leader
2.0±0.5
160 min.
210 min.
Cover tape
190 min.
Empty Tape
Label
13.0±0.2
21.0±0.8
φ
φ
1
60±
φ
0
1
0
13±
Direction of feed
17±1.4
0
3
180±
φ
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec. No. JEFL243C-9124A-01
P5/9
11.6 Marking for reel
Customer part number, MURATA part number, Inspection number( 1), RoHS marking( 2), Quantity, etc
1) « Expression of Inspection No. »
□□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Second digit
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
11.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking ( 2), Quantity, etc
Standard Reel
11.8 Specification of Outer Case
Outer Case Dimensions
(mm)
Quantity in
Outer Case
(Reel)
Reel
W
D
H
Label
186
186
93
4
φ180mm
H
*Above Outer Case size is typical. It depends on a quantity of an order.
D
W
!
12. △Caution
12.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
Ｚ
Ｚ
right direction
wrong direction
12.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability requirements
to the applications listed in the above.
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
12.3 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
12.4 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1 Flux and Solder
Flux
Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of the solder paste should be 150µm.
MURATA MFG.CO., LTD
Reference Only
Spec. No. JEFL243C-9124A-01
P6/9
13.2 Assembling
<Exclusive use of Reflow soldering>
Flow soldering may cause deterioration in insulation resistance.
So, reflow soldering shall be applied for this product.
13.3 Cleaning Conditions
Do not clean after soldering. Some cleaning agents may degrade bonding strength,and
characteristics of products by detaching. If cleaning,please contact us.
13.4 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,
please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
13.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
a
Products shall be location the sideways
b
Direction (Length : a<b) to the mechanical
Stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as
possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
>
>
D *1
B
C
C
Perforation
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
B
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore
A > D is invalid.
D
A
Slit
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
MURATA MFG.CO., LTD
Reference Only
Portion of
Spec. No. JEFL243C-9124A-01
P7/9
Perforation
13.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
×
P.C.B.
○
P.C.B. shall be designed so that products are
far from the portion of perforation.
○
Product
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Portion of
Perforation
×
○
×
P.C.B.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
Product
Hole
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Pick-up nozzle
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
Product
P.C.B.
< P.C.B. Separation >
Support pin
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
13.7 Standard Land Dimensions (Reflow)
*1
*2
∗1 If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be
occurred due to the spread of soldering paste or mount placing accuracy.
∗2 If the pattern is made with wider, the strength of bending will be reduced.
Moreover, if the pattern is made with less than 2mm , in the worst case short circuit may be occurred.
∗3 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
13.8 Standard Soldering Condition
1.Reflow Soldering
(1) Standard printing pattern of solder paste
• Standard thickness of the solder paste should be 150 µm.
• Use the solder paste printing pattern of the right pattern.
• For the resist and copper foil pattern, use standard
land dimensions.
• Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
• Spread of soldering paste between lines may cause short circuit of lines.
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec. No. JEFL243C-9124A-01
P8/9
(2) Soldering Temperature
Temperature difference between soldering and surface of components must be within 150°C,
in preheating. When components are immersed in liquid after soldering, temperature difference
should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration
in insulation resistance.
(3) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
eterioration of product quality.
Soldering Profile for Lead Free solder (Sn-3.0Ag-0.5Cu solder )
Temp.
( )
260
240
245±3
220
Limit Profile
180
150
Standard Profile
30～60s
30s max.
90s±30s
Time(s)
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
Limit Profile
Pre-heating
Heating
above 240°C、30s max.
260°C、10s
Peak temperature
Cycle of reflow
2 times
2 times
2. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
· Pre-heating: 150°C, 1 min
· Soldering iron output: 30W max.
· Tip temperature: 350°C max.
· Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes : Do not touch the products directly with the soldering iron.
3. Solder Volume
Solder shall be used not to be exceeded the upper limits.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
In case if the solder volume is much, we recommend to make the size of the solder paste
with less than the land pattern.
4.Solder fillet
Solder fillet in lateral direction is not formed in some case because of product's structure,
but it is not something that affects product's performance and reliability.
MURATA MFG.CO., LTD
Reference Only
Spec. No. JEFL243C-9124A-01
P9/9
tweezer
13.9 Caution for use
･When you hold products with a tweezer, please hold
like a figure of the right side, and sharp material,
such as a pair of tweezers, shall not be touched to
the winding portion to prevent the breaking of wire.
･Mechanical shock should not be applied to the products
mounted on the board to prevent the breaking
of the core.
13.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
13.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
13.12 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.13 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·Products should be stored in the warehouse on the following conditions.
Temperature ： -10 ~ +40°C
Humidity
： 15 to 85% relative humidity No rapid change on temperature and humidity.
· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderability due to the oxidized electrode.
· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
14. △Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
相关型号：
DLW43MH201XK2L
Data Line Filter, 2 Function(s), 20V, 0.11A, EIA STD PACKAGE SIZE 1812, SMD, 4 PIN
MURATA
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