ERB32Q5C2H1R5BDX1L_技术文档

A ꢀ ꢀ ꢁ ꢂ ꢃ Aꢄ ꢂ ꢅ ꢆ S ꢀ E ꢃ ꢂ F ꢂ ꢃ ꢃ A ꢀAꢃ ꢂ ꢄꢅ R S

High Frequency Ceramic Capacitors

ERB Product Summary

ERB Series: Exhibiting a

capacitance range of 0.5 to 1,000pF,

the ERB series of capacitors comes

with higher Q and lower ESR which

is better than the standard products

of equivalent packages. For high

performance, medium power RF

designs, this series offers low ESR in

the 1MHz to 1GHz frequency range.

The temperature stability of the

C0G dielectrics ensures low power

dissipation. The ERB series is designed

with precious metal inner electrodes.

These surface mount capacitors are

available in voltages up to 500VDC in a

1210 EIA size.

Features:



Size: 0603, 0805, and 1210

Voltage: 50, 100, 250, 300, 500VDC

Cap Range: 0.5 to 1000pF

Internal Electrode: Pd/Ag

Termination: Pd/Ag + Ni/Sn plating

ESR: Low

Power: Medium Power (5-15W)

Frequency Range: 1MHz –1GHz

Tolerance: Tight Tolerance Available ([W]=+/-0.05pF for <=5pF, [ [B]=+/-0.1pF for

5 - 9.1pF, [C]=+/-0.25pF for 5 - 9.1pF, [F]=+/-1% for 10 - 20pF)



Temp. Characteristics: C0G (-55ºC to 125ºC with 0 30ppm/ºC)

Applications: General purpose

high frequency circuits, wireless

equipment, high frequency radios,

broadcast satellites, terminals,

RF and base station power

ampliﬁers

44 – Innovator in Electronics

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C-29-C

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High Frequency Ceramic Capacitors

ERB Data Sheet

Chip Structure

Chip Dimensions

T

W

Plating

(Sn)

Dielectric

(Ceramic)

e

L

Barrier

(Ni)

Unit: mm

Chip Dimensions

Series EIA size

Termination

(Ag/Pd)

L

W

T

max.

e

max. g min.

Inner Electrode

(Pd)

ERB18

ERB21

ERB32

0603

0805

1210

1.6+/-0.1

2.0+/-0.3

0.8+/-0.1

0.9

0.2

0.5

0.7

1.0

1.25+/-0.3 1.35 0.25

3.2+0.5/-0.4 2.5+0.5/-0.4 1.7

0.3

Flow Soldering

Land Pattern Dimensions

Series

a

b

c

Land

Chip Capacitor

Solder

Resist

c

ERB18 0.6 ~ 1.0

ERB21 1.0 ~ 1.2

0.8 ~ 0.9

0.9 ~ 1.0

0.6 ~ 0.8

0.8 ~ 1.1

Re-Flow Soldering

b

a

Series

a

b

c

ERB18 0.6 ~ 0.8

ERB21 1.0 ~ 1.2

ERB31 2.0 ~ 2.4

0.6 ~ 0.7

1.0 ~ 1.2

0.6 ~ 0.8

0.8 ~ 1.1

1.8 ~ 2.3

Capacitance Range

10pF 100pF

Series

TC

WV

1000pF

1pF

pF

ERB18

C0G

250V

100V

50V

0.5 to 100 pF

110 to 130 pF

150 to 160 pF

0.5 to 120 pF

130 to 150 pF

160 to 220 pF

240 to 470 pF

510 to 1000 pF

ERB21

ERB32

C0G

500V

300V

250V

100V

50V

Global Part Numbering

ER B 18 8 5C 2D 100 J DX5 B

ꢁ ꢀ

ꢂ

Code

TC

Cap.Change

Operating Temp. Range

5C

C0G

0+/-30ppm/C

25 to 125C

ꢁ

ꢀ

ꢂ

Innovator in Electronics – 45

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High Frequency Ceramic Capacitors

ERB Product Offering

ERB18 Series

Size

TC

WV

Cap

Cap Tol

Murata Global P/N

0603

C0G 250V

0.5pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

ERB1885C2ER50BDX1D

ERB1885C2ER50CDX1D

ERB1885C2ER75BDX1D

ERB1885C2ER75CDX1D

ERB1885C2E1R0BDX1D

ERB1885C2E1R0CDX1D

ERB1885C2E1R1BDX1D

ERB1885C2E1R2BDX1D

ERB1885C2E1R3BDX1D

ERB1885C2E1R5BDX1D

ERB1885C2E1R5CDX1D

ERB1885C2E1R6BDX1D

ERB1885C2E1R8BDX1D

ERB1885C2E2R0BDX1D

ERB1885C2E2R0CDX1D

ERB1885C2E2R2BDX1D

ERB1885C2E2R4BDX1D

ERB1885C2E2R7BDX1D

ERB1885C2E3R0BDX1D

ERB1885C2E3R0CDX1D

ERB1885C2E3R3BDX1D

ERB1885C2E3R6BDX1D

ERB1885C2E3R9BDX1D

ERB1885C2E4R0BDX1D

ERB1885C2E4R0CDX1D

ERB1885C2E4R3BDX1D

ERB1885C2E4R7BDX1D

ERB1885C2E5R0BDX1D

ERB1885C2E5R0CDX1D

ERB1885C2E5R1CDX1D

ERB1885C2E5R6CDX1D

ERB1885C2E6R0CDX1D

ERB1885C2E6R0DDX1D

ERB1885C2E6R2CDX1D

ERB1885C2E6R8CDX1D

C0G 250V 0.75pF

C0G 250V 0.75pF +/-0.25pF

C0G 250V

1pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.5pF

+/-0.25pF

1.1pF

1.2pF

1.3pF

1.5pF

1.6pF

1.8pF

2pF

2.2pF

2.4pF

2.7pF

3pF

3.3pF

3.6pF

3.9pF

4pF

4.3pF

4.7pF

5pF

5.1pF

5.6pF

6pF

6.2pF

6.8pF

46 – Innovator in Electronics

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C-29-C

A ꢀ ꢀ ꢁ ꢂ ꢃ Aꢄ ꢂ ꢅ ꢆ S ꢀ E ꢃ ꢂ F ꢂ ꢃ ꢃ A ꢀAꢃ ꢂ ꢄꢅ R S

High Frequency Ceramic Capacitors

ERB Product Offering

ERB18 Series

Size

TC

WV

Cap

Cap Tol

Murata Global P/N

0603

C0G 250V

7pF

+/-0.25pF

+/-0.5pF

+/-0.25pF

+/-0.5pF

+/-0.25pF

+/-0.5pF

+/-0.25pF

+/-2%

ERB1885C2E7R0CDX5D

ERB1885C2E7R0DDX5D

ERB1885C2E7R5CDX5D

ERB1885C2E8R0CDX5D

ERB1885C2E8R0DDX5D

ERB1885C2E8R2CDX5D

ERB1885C2E9R0CDX5D

ERB1885C2E9R0DDX5D

ERB1885C2E9R1CDX5D

ERB1885C2E100GDX5D

ERB1885C2E100JDX5D

ERB1885C2E120GDX5D

ERB1885C2E120JDX5D

ERB1885C2E150GDX5D

ERB1885C2E150JDX5D

ERB1885C2E180GDX5D

ERB1885C2E180JDX5D

ERB1885C2E220GDX5D

ERB1885C2E220JDX5D

ERB1885C2E270GDX5D

ERB1885C2E270JDX5D

ERB1885C2E330GDX5D

ERB1885C2E330JDX5D

ERB1885C2E390GDX5D

ERB1885C2E390JDX5D

ERB1885C2E470GDX5D

ERB1885C2E470JDX5D

ERB1885C2E560GDX5D

ERB1885C2E560JDX5D

ERB1885C2E680GDX5D

ERB1885C2E680JDX5D

ERB1885C2E820GDX5D

ERB1885C2E820JDX5D

ERB1885C2E101GDX5D

ERB1885C2E101JDX5D

7.5pF

8pF

8.2pF

9pF

9.1pF

10pF

12pF

15pF

18pF

22pF

27pF

33pF

39pF

47pF

56pF

68pF

82pF

100pF

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

Innovator in Electronics – 47

C-29-C

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High Frequency Ceramic Capacitors

ERB Product Offering

ERB21 Series

Size

TC

WV

Cap

Cap Tol

Murata Global P/N

0805

C0G 250V

0.5pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

ERB21B5C2ER50BDX1L

ERB21B5C2ER50CDX1L

ERB21B5C2ER75BDX1L

ERB21B5C2ER75CDX1L

ERB21B5C2E1R0BDX1L

ERB21B5C2E1R0CDX1L

ERB21B5C2E1R1BDX1L

ERB21B5C2E1R2BDX1L

ERB21B5C2E1R3BDX1L

ERB21B5C2E1R5BDX1L

ERB21B5C2E1R5CDX1L

ERB21B5C2E1R6BDX1L

ERB21B5C2E1R8BDX1L

ERB21B5C2E2R0BDX1L

ERB21B5C2E2R0CDX1L

ERB21B5C2E2R2BDX1L

ERB21B5C2E2R4BDX1L

ERB21B5C2E2R7BDX1L

ERB21B5C2E3R0BDX1L

ERB21B5C2E3R0CDX1L

ERB21B5C2E3R3BDX1L

ERB21B5C2E3R6BDX1L

ERB21B5C2E3R9BDX1L

ERB21B5C2E4R0BDX1L

ERB21B5C2E4R0CDX1L

ERB21B5C2E4R3BDX1L

ERB21B5C2E4R7BDX1L

ERB21B5C2E5R0BDX1L

ERB21B5C2E5R0CDX1L

ERB21B5C2E5R1CDX1L

ERB21B5C2E5R6CDX1L

ERB21B5C2E6R0CDX1L

ERB21B5C2E6R0DDX1L

ERB21B5C2E6R2CDX1L

ERB21B5C2E6R8CDX1L

ERB21B5C2E7R0CDX1L

ERB21B5C2E7R0DDX1L

ERB21B5C2E7R5CDX1L

C0G 250V 0.75pF

C0G 250V 0.75pF +/-0.25pF

C0G 250V

1pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.1pF

+/-0.25pF

+/-0.5pF

+/-0.25pF

+/-0.5pF

+/-0.25pF

1.1pF

1.2pF

1.3pF

1.5pF

1.6pF

1.8pF

2pF

2.2pF

2.4pF

2.7pF

3pF

3.3pF

3.6pF

3.9pF

4pF

4.3pF

4.7pF

5pF

5.1pF

5.6pF

6pF

6.2pF

6.8pF

7pF

7.5pF

48 – Innovator in Electronics

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C-29-C

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High Frequency Ceramic Capacitors

ERB Product Offering

ERB21 Series

Size

TC

WV

Cap

Cap Tol

Murata Global P/N

0805

C0G 250V

C0G 100V

C0G 50V

8pF

+/-0.25pF

+/-0.5pF

+/-0.25pF

+/-0.5pF

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

+/-2%

+/-5%

ERB21B5C2E8R0CDX1L

ERB21B5C2E8R0DDX1L

ERB21B5C2E8R2CDX1L

ERB21B5C2E9R0CDX1L

ERB21B5C2E9R0DDX1L

ERB21B5C2E100GDX1L

ERB21B5C2E100JDX1L

ERB21B5C2E120GDX1L

ERB21B5C2E120JDX1L

ERB21B5C2E150GDX1L

ERB21B5C2E150JDX1L

ERB21B5C2E180GDX1L

ERB21B5C2E180JDX1L

ERB21B5C2E220GDX1L

ERB21B5C2E220JDX1L

ERB21B5C2E270GDX1L

ERB21B5C2E270JDX1L

ERB21B5C2E330GDX1L

ERB21B5C2E330JDX1L

ERB21B5C2E390GDX1L

ERB21B5C2E390JDX1L

ERB21B5C2E470GDX1L

ERB21B5C2E470JDX1L

ERB21B5C2E560GDX1L

ERB21B5C2E560JDX1L

ERB21B5C2E680GDX1L

ERB21B5C2E680JDX1L

ERB21B5C2E820GDX1L

ERB21B5C2E820JDX1L

ERB21B5C2E101GDX1L

ERB21B5C2E101JDX1L

ERB21B5C2A121GDX1L

ERB21B5C2A121JDX1L

ERB21B5C1H151GDX1L

ERB21B5C1H151JDX1L

8.2pF

9pF

10pF

12pF

15pF

18pF

22pF

27pF

33pF

39pF

47pF

56pF

68pF

82pF

100pF

120pF

150pF

Innovator in Electronics – 49

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High Frequency Ceramic Capacitors

ERB Product Offering

ERB32 Series

Size

TC

WV

Cap

Cap Tol

Murata Global P/N

1210

C0G 500V

0.5pF

+/-0.1pF

+/-0.25pF

ERB32Q5C2HR50BDX1L

ERB32Q5C2HR75BDX1L

ERB32Q5C2H1R0BDX1L

ERB32Q5C2H1R1BDX1L

ERB32Q5C2H1R2BDX1L

ERB32Q5C2H1R3BDX1L

ERB32Q5C2H1R5BDX1L

ERB32Q5C2H1R6BDX1L

ERB32Q5C2H1R8BDX1L

ERB32Q5C2H2R0BDX1L

ERB32Q5C2H2R2BDX1L

ERB32Q5C2H2R4BDX1L

ERB32Q5C2H2R7BDX1L

ERB32Q5C2H3R0BDX1L

ERB32Q5C2H3R3BDX1L

ERB32Q5C2H3R6BDX1L

ERB32Q5C2H3R9BDX1L

ERB32Q5C2H4R0BDX1L

ERB32Q5C2H4R3BDX1L

ERB32Q5C2H4R7BDX1L

ERB32Q5C2H5R0BDX1L

ERB32Q5C2H5R1CDX1L

ERB32Q5C2H5R6CDX1L

ERB32Q5C2H6R0CDX1L

ERB32Q5C2H6R2CDX1L

ERB32Q5C2H6R8CDX1L

ERB32Q5C2H7R0CDX1L

ERB32Q5C2H7R5CDX1L

ERB32Q5C2H8R0CDX1L

C0G 500V 0.75pF

C0G 500V

1pF

1.1pF

1.2pF

1.3pF

1.5pF

1.6pF

1.8pF

2pF

2.2pF

2.4pF

2.7pF

3pF

3.3pF

3.6pF

3.9pF

4pF

4.3pF

4.7pF

5pF

5.1pF

5.6pF

6pF

6.2pF

6.8pF

7pF

7.5pF

8pF

50 – Innovator in Electronics

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C-29-C

A ꢀ ꢀ ꢁ ꢂ ꢃ Aꢄ ꢂ ꢅ ꢆ S ꢀ E ꢃ ꢂ F ꢂ ꢃ ꢃ A ꢀAꢃ ꢂ ꢄꢅ R S

High Frequency Ceramic Capacitors

ERB Product Offering

ERB32 Series

Size

TC

WV

Cap

Cap Tol

Murata Global P/N

1210

C0G 500V

C0G 300V

C0G 250V

C0G 100V

C0G 50V

8.2pF

9pF

+/-0.25pF

+/-5%

ERB32Q5C2H8R2CDX1L

ERB32Q5C2H9R0CDX1L

ERB32Q5C2H9R1CDX1L

ERB32Q5C2H100JDX1L

ERB32Q5C2H120JDX1L

ERB32Q5C2H150JDX1L

ERB32Q5C2H180JDX1L

ERB32Q5C2H200JDX1L

ERB32Q5C2H220JDX1L

ERB32Q5C2H270JDX1L

ERB32Q5C2H330JDX1L

ERB32Q5C2H390JDX1L

ERB32Q5C2H470JDX1L

ERB32Q5C2H560JDX1L

ERB32Q5C2H680JDX1L

ERB32Q5C2H820JDX1L

ERB32Q5C2H101JDX1L

ERB32Q5C2H121JDX1L

ERB32Q5CYD151JDX1L

ERB32Q5C2E181JDX1L

ERB32Q5C2E221JDX1L

ERB32Q5C2A271JDX1L

ERB32Q5C2A331JDX1L

ERB32Q5C2A391JDX1L

ERB32Q5C2A471JDX1L

ERB32Q5C1H561JDX1L

ERB32Q5C1H681JDX1L

ERB32Q5C1H821JDX1L

ERB32Q5C1H102JDX1L

9.1pF

10pF

12pF

15pF

18pF

20pF

22pF

27pF

33pF

39pF

47pF

56pF

68pF

82pF

100pF

120pF

150pF

180pF

220pF

270pF

330pF

390pF

470pF

560pF

680pF

820pF

1000pF

Innovator in Electronics – 51

C-29-C

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High Frequency Ceramic Capacitors

ERB Specifications andTest Methods

Item

Specifications

᧩55°C to 125°C

Test Method

Reference Temperature: 25ഒ

Operating Temperature

Appearance

Dimension

No defects or abnormalities.

Visual inspection.

Using calipers.

Within the specified dimensions.

300%* of the rated voltage

*250V/300V: 250%, 500V: 200%

Dielectric Strength

No defects or abnormalities.

1,000,000Mȍmin.(Cู470pF)

100,000 Mȍmin. (C᧺470pF)

C: Nominal capacitance (pF)

DC voltage not exceeding the rated voltage at 25°C

and 75%RH max. and within 2 minutes of charging.

Insulation Resistance

Cู220pF: Qฺ10,000

Frequency 1±0.1MHz

Voltage 1±0.2Vrms

220pF᧸Cู470pF: Qฺ5,000

470pF᧸Cู1000pF: Qฺ3,000

C: Nominal capacitance (pF)

Q

The temperature coefficient is determined using the

capacitance measured in step 3 as a reference.

When cycling the temperature sequentially from

step 1 through 5 the capacitance should be within

the specified tolerance for the temperature coefficient

and capacitance change as in Table A-1. The

capacitance drift is calculated by dividing the

differences between the maximum and minimum

measured values in steps 1, 3 and 5 by the cap.

value in step 3.

Capacitance

Temperature

Characteristics

Capacitance Change:

Within the specified tolerance. (Table A-1)

Temperature Coefficent:

Within the specified tolerance. (Table A-1)

Capacitance Drift: Within ±±.ꢀ2 or

±±.5pꢁ (Whichever is larger)

Step

Temperature (°C)

25±2

1

2

3

4

5

-55±3

25±2

125±3

25±2

Solder the capacitor to the test jig (glass epoxy

board) then apply 10N force in parallel with the test

jig for 10±1sec.

Adhesive Strength of

Termination

No removal of the terminations or other

defect should occur.

Appearance: No defects or abnormalities.

Capacitance: Within the specified tolerance.

Cู220pF: Qฺ10,000

220pF᧸Cู470pF: Qฺ5,000

470pF᧸Cู1000pF: Qฺ3,000

C: Nominal capacitance (pF)

Frequency range, from 10 to 55Hz and return to

10Hz, should be traversed in approximately 1 minute.

This motion should be applied for a period of 2 hours

in each of 3 mutually perpendicular directions total of

6 hours).

Vibration Resistance

Deflection

No crack or marked defect should occur.

Flexure: 1mm

Immerse in eutectic solder solution for 5±0.5 seconds

at 245±5°C or Sn-3.0Ag-0.5Cu solder solution for

5±0.5 seconds at 245±5°C.

95% of the terminations are to be soldered

evenly and continuously.

Solderability of Termination

Appearance: No marking defects

Capacitance Change: Within ±2.5% or

±0.25 pF (Whichever is larger)

Cู220pF: Qฺ10,000

220pF᧸Cู470pF: Qฺ5,000

470pF᧸Cู1000pF: Qฺ3,000

C: Nominal capacitance (pF)

Immerse the capacitor in a eutectic solder solution or

Sn-3.0Ag-0.5Cu solder solution at 270±5°C for

10±0.5 seconds. Let sit at room temperature for

24±2 hours.

Resistance to Soldering Heat

Appearance: No marking defects

Capacitance Change: Within ±5% or

±0.5 pF (Whichever is larger)

Cู220pF: Qฺ10,000

Temperature Cycle

᧩55ഒ to 125ഒ Five cycles

220pF᧸Cู470pF: Qฺ5,000

470pF᧸Cู1000pF: Qฺ3,000

C: Nominal capacitance (pF)

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High Frequency Ceramic Capacitors

ERB Specifications andTest Methods

Item

Specification

Test Method

Appearance: No marking defects

Capacitance Change: Within ±5% or

±0.5 pF (Whichever is larger)

Apply the 24-hour heat (-10 to +65°C) and humidity

(80 to 100%) treatment, 10 consecutive times.

Humidity Steady State

Cꢀ30pF: Q >350, 10pFꢀCꢁ30pF:

Q>275+5°C/2Cꢁ10pF:Q > 200+10C

C: Nominal Capacitance (puff)

Appearance: No marking defects

Capacitance Change Within ±3% or

±0.3pF (Whichever is larger)

Cꢀ30pFmin.>: Q350

Apply 200% (500V only 150%) of the rated voltage

for 1000±12 hours at the maximum operating

temperature ±3°C.

High Temperature Load

> 275+5C/2C

10pFꢀCꢁ30pF: Q

ꢁ10pF: Q >200+10C

ꢀꢀ

C: Nominal Capacitance (pF)

Table A-1

Capacitance Change from 25°C（%）

Nominal Values

Char.

– 55C

－30C

—10C

(ppm/°C) Note

Max .

0.58

Min.

Max.

0.4C

Min.

Max.

0.25

Min.

5C

0 ± 30

-0.24

-0.17

-0.11

Note: Nominal values denote the temperature coefficient within a range of 25°C to 125°C.

Innovator in Electronics – 53

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High Frequency Ceramic Capacitors

ERBTechnical Data (Typical)

Capacitance -Temperature Characteristics

C0G Characteristics (ERB)

2.0

1.5

1.0

0.5

Spec. (upper)

0.0

-0.5

-1.0

-1.5

-2.0

Spec. (lower)

-75

-50

-25

0

25

50

75

100

125

150

TEMPERATURE (°C)

Resonant Frequency Characteristics

ERB Series

Measurement

Equipment

HP8753D

10G

1G

100M

1

10

100

CAPACITANCE (pF)

54 – Innovator in Electronics

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High Frequency Ceramic Capacitors

ERBTechnical Data (Typical)

ESR - Frequency Characteristics

ERB18 Series

Measurement

Equipment

1 0

Boontoon Resonant

Coaxial Line 34A

1 p F

1 0 p F

1 0 0 p F

1

0 .1

0 .0 1

1 0 G

1 0 0 0 0 M

1 0 0 M

1 0 010GM

F R E Q U E N C Y (H z )

ERB21 Series

1 0

1 p F

1 0 p F

1 0 0 p F

1

0 .1

0 .0 1

1 0 G

1 G

1 0 0 0 M

1 0 0 M

1 0 0 0 0 M

F R E Q U E N C Y (H z )

ERB32 Series

1 0

3 .3 p F

1 0 p F

1 0 0 p F

1

0 .1

0 .0 1

1 0 0 M

1 G

1 0 0 0 M

1 0 G

1 0 0 0 0 M

F R E Q U E N C Y (H z )

Innovator in Electronics – 55

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High Frequency Ceramic Capacitors

ERBTechnical Data (Typical)

Q - Frequency Characteristics

ERB18 Series

10000

Measurement

Equipment

Boonton Resonant

Coaxial-Line 34A

1pF

10pF

100pF

1000

100

10

1

1G

10G

100M

FREQUENCY (Hz)

ERB21 Series

10000

1000

100

10

1pF

10pF

100pF

1

1G

10G

100M

FREQUENCY (Hz)

ERB32 Series

10000

1000

100

10

3.3pF

10pF

100pF

1

1G

10G

100M

FREQUENCY (Hz)

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High Frequency Ceramic Capacitors

ERBTechnical Data (Typical)

Temperature Rise - Current Characteristics

ERB18 Series (1GHz)

60

50

40

2.4pF

10pF

82pF

30

20

10

0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

CURRENT (Arms)

ERB21 Series (1GHz)

60

50

40

30

20

10

0

2.4pF

10pF

82pF

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

CURRENT (Arms)

Innovator in Electronics – 57

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High Frequency Ceramic Capacitors

ERB Soldering and Mounting

■ !Caution (Soldering and Mounting)

1. Mounting Position

Choose a mounting position that minimizes the stress

Component Direction

imposed on the chip during flexing or bending of the

Locate chip

horizontal to the

direction in

which stress

acts

board.

Chip Mounting Close to Board Separation Point

C

Chip arrangement

Worst A-C-(B~D) Best

Perforation

B

D

A

Slit

2. Chip Placing

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. So adjust the suction nozzle's

bottom dead point by correcting warp in the board.

Normally, the suction nozzle's bottom dead point must be

set on the upper surface of the board. Nozzle pressure

for chip mounting must be a 1 to 3N static load.

Dirt particles and dust accumulated between the suction

nozzle and the cylinder inner wall prevent the nozzle from

moving smoothly. This imposes great force on the chip

during mounting, causing cracked chips. And the locating

claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction

nozzle and the locating claw must be maintained,

checked and replaced periodically.

Incorrect

Correct

Suction Nozzle

Deflection

Board

Board Guide

Support Pin

Continued on the following page.

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High Frequency Ceramic Capacitors

ERB Soldering and Mounting

3. Reflow Soldering

When sudden heat is applied to the components, the

mechanical strength of the components should go down

Standard Conditions for Reflow Soldering

Infrared Reflow

because remarkable temperature change causes

deformity inside components. In order to prevent

mechanical damage in the components, preheating should

be required for both of the components and the PCB board.

Preheating conditions are shown in Table 1. It is required to

keep temperature differential between the soldering and

the components surface ($T) as small as possible.

Solderability of Tin plating termination chip might be

deteriorated when low temperature soldering profile where

peak solder temperature is below the Tin melting point is

used. Please confirm the solderability of Tin plating

termination chip before use.

Temperature (%)

Peak Temperature

200oC

Soldering

Gradual

Cooling

$T

170oC

150oC

130oC

Preheating

Time

60-120 seconds 30-60 seconds

Vapor Reflow

When components are immersed in solvent after mounting,

be sure to maintain the temperature difference ($T)

between the component and solvent within the range

shown in theTable 1.

Temperature (%)

Soldering

Peak Temperature

Gradual

Cooling

$T

170oC

150oC

130oC

Table 1

Part Number

GRM02/03/15/18/21/31

GJM03/15

Temperature Differential

Preheating

ERB18/21

LLL15/18/21/31

$T-190%

Time

20 seconds max.

60-120 seconds

ERB18/21

GQM18/21

GRM32/43/55

LLA18/21/31

LLME2R1/B3312

GNM

Allowable Soldering Temperature and Time

280

270

260

250

240

$T-130%

ERB32

Recommended Conditions

230

220

Pb-Sn Solder

Infrared Reflow Vapor Reflow

Lead Free Solder

0

30

60

90

120

Soldering Time (sec.)

Peak Temperature

Atmosphere

230-250oC

230-240oC

240-260oC

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Air

Air or N2

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

4. Optimum Solder Amount for Reflow Soldering

Overly thick application of solder paste results in

excessive fillet height solder.

Optimum Solder Amount for Reflow Soldering

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause

cracked chips.

0.2mm min.

Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in

chips breaking loose from the PCB.

Make sure the solder has been applied smoothly to the

end surface to a height of 0.2mm min.

Inverting the PCB

Make sure not to impose an abnormal mechanical shock on

the PCB.

Continued on the following page.

Innovator in Electronics – 59

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High Frequency Ceramic Capacitors

ERB Soldering and Mounting

5. Flow Soldering

When sudden heat is applied to the components, the

mechanical strength of the components should go down

because remarkable temperature change causes

deformity inside components. And an excessively long

soldering time or high soldering temperature results in

leaching of the outer electrodes, causing poor adhesion

or a reduction in capacitance value due to loss of contact

between electrodes and end termination.

Standard Conditions for Flow Soldering

Temperature (%)

Soldering

Peak Temperature

Gradual

Cooling

$T

170oC

150oC

130oC

Preheating

In order to prevent mechanical damage in the

components, preheating shoud be required for the both

components and the PCB board. Preheating conditions

are shown inTable 2. It is required to keep temperature

differential between the soldering and the components

surface ($T) as small as possible.

When components are immersed in solvent after

mounting, be sure to maintain the temperature difference

between the component and solvent within the range

shown in Table 2.

Time

5 seconds max.

60-120 seconds

Allowable Soldering Temperature and Time

280

270

260

250

240

Do not apply flow soldering to chips not listed in Table 2.

230

220

Table 2

0

10

20

30

40

Soldering Time (sec.)

Part Number

GRM18/21/31

LLL21/31

Temperature Differential

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

$T-150%

ERB18/21

GQM18/21

Recommended Conditions

Pb-Sn Solder

240-250oC

Air

Lead Free Solder

250-260oC

N2

Peak Temperature

Atmosphere

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Optimum Solder Amount for Flow Soldering

The top of the solder fillet should be lower than the

thickness of components. If the solder amount is

excessively big, the risk of cracking is higher during

board bending or under any other stressful conditions.

Up to Chip Thickness

Adhesive

Continued on the following page.

60 – Innovator in Electronics

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High Frequency Ceramic Capacitors

ERB Soldering and Mounting

6. Correction with a Soldering Iron

(1) For Chip Type Capacitors

Table 3

When sudden heat is applied to the components by

soldering iron, the mechanical strength of the

Temperature

Differential

Peak

Temperature

Part Number

Atmosphere

components should go down because remarkable

temperature change causes deformity inside components.

In order to prevent mechanical damage in the

GRM15/18/21/31

GJM15

300°C max.

3 seconds max.

/ termination

ERB18/21

LLL15/18/21/31

∆TV190D

∆TV130D

Air

components, preheating should be required for both of

the components and the PCB board. Preheating

conditions are shown in Table 3. It is required to keep

temperature differential between the soldering and the

components surface (∆T) as small as possible. After

soldering, it is not allowed to cool it down rapidly.

GQM18/21

ERB18/21

GRM32/43/55

GNM

270°C max.

3 seconds max.

/ termination

ERB32

LLA18/21/31

Air

LLM21/31

ERB32

*Applicable for both Pb-Sn and Lead Free Solder.

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Optimum Solder Amount when Corrections Are Made

Using a Soldering lron

The top of the solder fillet should be lower than the

thickness of components. If the solder amount is

excessively big, the risk of cracking is higher during

board bending or under any other stressful conditions.

Soldering iron ø3mm or smaller should be required. And

it is necessary to keep a distance between the soldering

iron and the components without direct touch. Thread

solder with ø0.5mm or smaller is required for soldering.

Up to Chip Thickness

7. Washing

Excessive output of ultrasonic oscillation during cleaning

causes PCBs to resonate, resulting in cracked chips or

broken solder. Take note not to vibrate PCBs.

FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY

RESULT, WORST CASE, IN A SHORT CIRCUIT AND

FUMING WHEN THE PRODUCT IS USED.

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A p p l i c At i o n S p E c i F i c c A pAc i t o R S

High Frequency Ceramic Capacitors

ERB Design Engineering Kits

CERAMIC CHIP CAPACITORS

ASCAP Hi-Frequency

N Miniature sizes & stable C0G temperature coefficient

N Very high Q at high frequencies

N Miniature sizes & stable C0G temperature coefficient

N Very high Q at high frequencies

N 0603, 0805 and 1210 sizes

N Low Power Consumption for Mobile Telecommunication

N Base Station, Terminal applications, Wireless equipment and

High frequency radio

N Low Power Consumption for Mobile Telecommunication

N Base Station, Terminal applications, Wireless equipment and

High frequency radio

ERB18-HIQ0603KIT-E 0603 - (250 VDC)

ERB21-HIQ0805KIT-E 0805 - (250VDC)

No. Description

Murata Global P/N

Qty.

10

No. Description

Murata Global P/N

Qty.

10

1

2

3

4

5

6

7

8

9

0603/COG/1.0pF/250V

ERB1885C2E1R0BDX1

ERB1885C2E1R1BDX1

ERB1885C2E1R2BDX1

ERB1885C2E1R3BDX1

ERB1885C2E1R5BDX1

ERB1885C2E1R6BDX1

ERB1885C2E1R8BDX1

ERB1885C2E2R0BDX1

ERB1885C2E2R4BDX1

ERB1885C2E2R7BDX1

ERB1885C2E3R0CDX1

ERB1885C2E3R3CDX1

ERB1885C2E3R6CDX1

ERB1885C2E3R9CDX1

ERB1885C2E4R3CDX1

ERB1885C2E4R7CDX1

ERB1885C2E5R1CDX1

ERB1885C2E5R6CDX1

ERB1885C2E6R2CDX1

ERB1885C2E6R8CDX1

ERB1885C2E7R5CDX5

ERB1885C2E8R2CDX5

ERB1885C2E9R1CDX5

ERB1885C2E100JDX5

ERB1885C2E120JDX5

ERB1885C2E150JDX5

ERB1885C2E180JDX5

ERB1885C2E220JDX5

ERB1885C2E270JDX5

ERB 1885C2E330JDX5

ERB1885C2E390JDX5

ERB1885C2E470JDX5

ERB1885C2E560JDX5

ERB1885C2E680JDX5

ERB1885C2E820JDX5

ERB1885C2E101JDX5

1

2

3

4

5

6

7

8

9

0805/COG/1.2pF/250V

ERB21 B5C2E1R2CDX1

ERB21 B5C2E1R5CDX1

ERB21 B5C2E1R8CDX1

ERB21B5C2E2R2CDX1

ERB21B5C2E2R7CDX1

ERB21B5C2E3R3CDX1

ERB21B5C2E3R9CDX1

ERB21B5C2E4R7CDX1

ERB21B5C2E5R6DDX1

ERB21B5C2E6R8DDX1

0603/COG/1.1pF/250V

0603/COG/1.2pF/250V

0603/COG/1.3pF/250V

0603/COG/1.5pF/250V

0603/COG/1.6pF/250V

0603/COG/1.8pF/250V

0603/COG/2.0pF/250V

0603/COG/2.4pF/250V

0805/COG/1.5pF/250V

0805/COG/1.8pF/250V

0805/COG/2.2pF/250V

0805/COG/2.7pF/250V

0805/COG/3.3pF/250V

0805/COG/3.9pF/250V

0805/COG/4.7pF/250V

0805/COG/5.6pF/250V

10 0603/COG/2.7pF/250V

11 0603/COG/3.0pF/250V

12 0603/COG/3.3pF/250V

13 0603/COG/3.6pF/250V

14 0603/COG/3.9pF/250V

15 0603/COG/4.3pF/250V

16 0603/COG/4.7pF/250V

17 0603/COG/5.1pF/250V

18 0603/COG/5.6pF/250V

19 0603/COG/6.2pF/250V

20 0603/COG/6.8pF/250V

21 0603/COG/7.5pF/250V

22 0603/COG/8.2pF/250V

23 0603/COG/9.1pF/250V

24 0603/COG/10pF/250V

25 0603/COG/12pF/250V

26 0603/COG/15pF/250V

27 0603/COG/18pF/250V

28 0603/COG/22pF/250V

29 0603/COG/27pF/250V

30 0603/COG/33pF/250V

31 0603/COG/39pF/250V

32 0603/COG/47pF/250V

33 0603/COG/56pF/250V

34 0603/COG/68pF/250V

35 0603/COG/82pF/250V

36 0603/COG/100pF/250V

10 0805/COG/6.8pF/250V

11 0805/COG/8.2pF/250V

12 0805/COG/10pF/250V

13 0805/COG/12pF/250V

14 0805/COG/15pF/250V

15 0805/COG/18pF/250V

16 0805/COG/22pF/250V

17 0805/COG/27pF/250V

18 0805/COG/33pF/250V

19 0805/COG/39pF/250V

20 0805/COG/47pF/250V

21 0805/COG/56pF/250V

22 0805/COG/68pF/250V

23 0805/COG/82pF/250V

24 0805/COG/100pF/250V

ERB82185C2E8R2DDX1 10

ERB21B5C2E100JDX1

ERB21B5C2E120JDX1

ERB21B5C2E150JDX1

ERB21B5C2E180JDX1

ERB21B5C2E220JDX1

ERB21B5C2E270JDX1

ERB21B5C2E330JDX1

ERB21B5C2E390JDX1

ERB21B5C2E470JDX1

ERB21B5C2E560JDX1

ERB21B5C2E680JDX1

ERB21B5C2E820JDX1

ERB21B5C2E101JDX1

10

ERB32-HIQ1210KIT-E 1210 - (500VDC)

No. Description

Murata Global P/N

Qty.

10

1

2

3

4

5

6

7

8

9

1210/C0G/3.3pF/500V

ERB32Q5C2H3R3CDX1

ERB32Q5C2H3R9CDX1

ERB32Q5C2H4R7CDX1

ERB32Q5C2H5R6DDX1

ERB32Q5C2H6R8DDX1

ERB32Q5C2H8R2DDX1

ERB32Q5C2H100JDX1

ERB32Q5C2H120JDX1

ERB32Q5C2H150JDX1

ERB32Q5C2H180JDX1

ERB32Q5C2H220JDX1

ERB32Q5C2H270JDX1

ERB32Q5C2H330JDX1

ERB32Q5C2H390JDX1

ERB32Q5C2H470JDX1

ERB32Q5C2H560JDX1

ERB32Q5C2H680JDX1

ERB32Q5C2H820JDX1

ERB32Q5C2H101JDX1

1210/C0G/3.9pF/500V

1210/C0G/4.7pF/500V

1210/C0G/5.6pF/500V

1210/C0G/6.8pF/500V

1210/C0G/8.2pF/500V

1210/C0G/10pF/500V

1210/C0G/12pF/500V

1210/C0G/15pF/500V

10 1210/C0G/18pF/500V

11 1210/C0G/22pF/500V

12 1210/C0G/27pF/500V

13 1210/C0G/33pF/500V

14 1210/C0G/39pF/500V

15 1210/C0G/47pF/500V

16 1210/C0G/56pF/500V

17 1210/C0G/68pF/500V

18 1210/C0G/82pF/500V

19 1210/C0G/100pF/500V

62 – Innovator in Electronics

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C-29-C

A p p l i c At i o n S p E c i F i c c A pAc i t o R S

High Frequency Ceramic Capacitors

ERB Notes

Innovator in Electronics – 63

C-29-C

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型号：	ERB32Q5C2H1R5BDX1L
厂家：	muRata
描述：	Application Spec ifi c Capacitors High Frequency Ceramic Capacitors 应用规格IFI C电容高频陶瓷电容
文件：	总20页 (文件大小：3054K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ERB32Q5C2H1R5BDX1L [MURATA]

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