GCM1885C1H361JA16_技术文档

CHIP MONOLITHIC CERAMIC CAPACITOR FOR AUTOMOTIVE

GCM1885C1H470JA16_ (0603, C0G, 47pF, 50Vdc)

_: packaging code

Reference Sheet

1.Scope

This product specification is applied to Chip Monolithic Ceramic Capacitor used for Automotive Electronic equipment.

ꢀꢀ

2.MURATA Part NO. System

(Ex.)

GCM

18

8

5C

1H

470

J

A16

D

(8)Packaging

Code

(2)T

Dimensions

(3)Temperature

Characteristics

(4)DC Rated

Voltage

(5)Nominal (6)Capacitance

(7)Murata’s

Control Code

(1)L/W

Dimensions

Tolerance

Capacitance

3. Type & Dimensions

L

W

T

e

g

e

(Unit:mm)

(1)-1 L

(1)-2 W

0.8±0.1

(2) T

0.8±0.1

e

g

1.6±0.1

0.2 to 0.5

0.5 min.

4.Rated value

(3) Temperature Characteristics

(Public STD Code):C0G(EIA)

Specifications and Test

Methods

(4)

DC Rated

Voltage

(6)

(5) Nominal

Capacitance

Tolerance

(Operationg

Temp. Range)

Temp. coeff

orꢀCap. Change

Temp. Range

(Ref.Temp.)

25 to 125 °C

(25 °C)

50 Vdc

47 pF

±5 %

0±30 ppm/°C

-55 to 125 °C

5.Package

mark

(8) Packaging

Packaging Unit

f180mm Reel

PAPER W8P4

f330mm Reel

PAPER W8P4

D

4000 pcs./Reel

10000 pcs./Reel

J

Product specifications in this catalog are as of Jan.25,2013,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

GCM1885C1H470JA16-01

1

■AEC-Q200 Murata Standard Specification and Test Methods

Specification.

No

AEC-Q200 Test Item

AEC-Q200 Test Method

High Dielectric Type

Temperature

Compensating Type

Pre-and Post-Stress

Electrical Test

1

2

-

High Temperature

Exposure (Storage)

The measured and observed characteristics should satisfy the

specifications in the following table.

Set the capacitor for 1000±12 hours at 150±3℃. Set for

24±2 hours at room temperature, then measure.

Appearance No marking defects

Capacitance Within ±2.5% or ±0.25pF

R7/L8/R9: Within ±10.0%

Change

Q/D.F.

(Whichever is larger)

30pFmin. : Q≧1000

R7/L8 W.V.: 25Vmin.: 0.03 max.

W.V.: 16V/10V : 0.05 max.

R9 : 0.075max.

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF)

I.R.

More than 10,000MΩ or 500Ω ・F

(Whichever is smaller)

R9 : More than 150Ω ・F

3

Temperature Cycling

The measured and observed characteristics should satisfy the

specifications in the following table.

Fix the capacitor to the supporting jig in the same manner and under

the same conditions as (19). Perform cycle test according to the four

heat treatments listed in the following table. Set for 24±2 hours at

room temperature, then measure

Appearance No marking defects

Capacitance Within ±2.5% or ±0.25pF

R7/L8/R9: Within ±10.0%

Change

Q/D.F.

(Whichever is larger)

Cycles

30pFmin. : Q≧1000

R7/L8 W.V.: 25Vmin.: 0.03 max.

W.V.: 16V/10V : 0.05 max.

R9 : 0.05max.

Step

Time(min)

1000(for ΔC/R7)

-55℃+0/-3

Room

300(for 5G/L8/R9)

-55℃+0/-3

Room

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF)

1

2

3

4

15±3

1

15±3

1

125℃+3/-0

Room

150℃+3/-0

Room

I.R.

More than 10,000MΩ or 500Ω ・F

(Whichever is smaller)

・ Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10 ℃for one hour and then set

for 24±2 hours at room temperature.

Perform the initial measurement.

4

5

Destructive

No defects or abnormalities

Per EIA-469.

Phisical Analysis

Apply the 24-hour heat (25 to 65℃) and humidity (80 to 98%)

treatment shown below, 10 consecutive times.

Moisture Resistance

The measured and observed characteristics should satisfy the

specifications in the following table.

Set for 24±2 hours at room temperature, then measure.

Appearance No marking defects

Capacitance Within ±3.0% or ±0.30pF

Humidity

80～98%

Humidity

80～98%

R7/L8/R9: Within ±12.5%

Temperature

Humidity

90～98%

Humidity

90～98%

Humidity

90～98%

(℃)

Change

Q/D.F.

(Whichever is larger)

70

65

60

55

50

45

40

35

30

25

20

15

10

5

30pFmin. : Q≧350

R7/L8 : W.V.: 25Vmin.: 0.03 max.

W.V.: 16V/10V : 0.05 max.

R9 : 0.075max.

10pF and over, 30pF and below:

Q≧275+5C/2

10pFmax.: Q ≧200+10C

C: Nominal Capacitance(pF)

I.R.

More than 10,000MΩ or 500Ω ・F

(Whichever is smaller)

+10

2 ℃

-

R9 : More than 150Ω ・F

Initial measuremt

0

-5

-10

One cycle 24hours

0

1

2

3

4

5

6

7

8

9

10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Hours

Apply the rated voltage and 1.3+0.2/-0vdc (add 6.8kΩ resister)

at 85±3℃and 80 to 85% humidity for 1000±12 hours.

Remove and set for 24±2 hours at room temprature, then measure.

The charge/discharge current is less than 50mA.

6

The measured and observed characteristics should satisfy the

specifications in the following table.

Biased Humidity

Appearance No marking defects

Capacitance Within ±3.0% or ±0.30pF

R7/L8/R9: Within ±12.5%

Change

(Whichever is larger)

Q/D.F.

I.R.

30pF and over: Q≧200

R7/L8 W.V.: 25Vmin.: 0.035 max.

W.V.: 16V/10V : 0.05 max.

R9 : 0.075max.

30pF and below: Q≧100+10C/3

C: Nominal Capacitance(pF)

More than 1,000MΩ or 50Ω ・F

(Whichever is smaller)

JEMCGS-0363S

2

■AEC-Q200 Murata Standard Specification and Test Methods

Specification.

High Dielectric Type

No

7

AEC-Q200 Test Item

Operational Life

AEC-Q200 Test Method

Temperature

Compensating Type

The measured and observed characteristics should satisfy the

specifications in the following table.

Apply 200% of the rated voltage for 1000±12 hours at 125±3℃(for

Δ C/R7), 150±3℃(for 5G/L8/R9).

Appearance

Capacitance

Change

No marking defects

Set for 24±2 hours at room temperature, then measure.

The charge/discharge current is less than 50mA.

Within ±3.0% or ±0.30pF

(Whichever is larger)

R7/L8/R9: Within ±12.5%

Q/D.F.

30pFmin. : Q≧350

R7/L8 : W.V.: 25Vmin.: 0.035 max.

(GCM155R71H 562-223: 0.05max)

・ Initial measurement for high dielectric constant type.

Apply 200% of the rated DC voltage for one hour at the maximun

operating temperature ±3℃. Remove and set for 24±2 hours at

room temperature. Perform initial measurement.

10pF and over, 30pF and below:

Q≧275+5C/2

W.V.: 16V/10V : 0.05 max.

R9 : 0.075max.

10pFmax.: Q ≧200+10C

C: Nominal Capacitance(pF)

More than 1,000MΩ or 50Ω ・F

(Whichever is smaller)

I.R.

8

9

External Visual

No defects or abnormalities

Visual inspection

Using calipers

Phisical Dimension

Within the specified dimensions

10 Resistance to Appearance

No marking defects

Per MIL-STD-202 Method 215

Solvents

Capacitance

Within the specified tolerance

Solvent 1 : 1 part (by volume) of isopropyl alcohol

3 parts (by volume) of mineral spirits

Change

Q/D.F.

30pFmin. : Q≧1000

R7/L8 : W.V.: 25Vmin.: 0.025 max.

W.V.: 16V/10V : 0.035 max.

R9 : 0.05max.

Solvent 2 : Terpene defluxer

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF)

Solvent 3 : 42 parts (by volume) of water

1part (by volume) of propylene glycol monomethylether

1 part (by volume) of monoethanolomine

I.R.

More than 10,000MΩ or 500Ω ・F

(Whichever is smaller)

11 Mechanical

Shock

Appearance

Capacitance

Change

No marking defects

Three shocks in each direction should be applied along 3 mutually

perpendicular axes of the test specimen (18 shocks).

Within the specified tolerance

The specified test pulse should be Half-sine and should have a

duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.

Q/D.F.

30pFmin. : Q≧1000

R7/L8 : W.V.: 25Vmin.: 0.025 max.

W.V.: 16V/10V : 0.035 max.

R9 : 0.05max.

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF)

I.R.

More than 10,000MΩ or 500Ω ・F

(Whichever is smaller)

12 Vibration

Appearance

Capacitance

Change

No defects or abnormalities

Within the specified tolerance

Solder the capacitor to the test jig (glass epoxy board) in the same

manner and under the same conditions as (19). The capacitor

should be subjected to a simple harmonic motion having a total

amplitude of 1.5mm, the frequency being varied uniformly between

the approximate limits of 10 and 2000Hz. The frequency range, from

10 to 2000Hz and return to 10Hz, should be traversed in

Q/D.F.

30pFmin. : Q≧1000

R7/L8 : W.V.: 25Vmin.: 0.025 max.

W.V.: 16V/10V : 0.035 max.

R9 : 0.05max.

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF)

approximately 20 minutes. This motion should be applied for 12

items in each 3 mutually perpendicular directions (total of 36 times).

I.R.

More than 10,000MΩ or 500Ω ・F

(Whichever is smaller)

The measured and observed characteristics should satisfy the

specifications in the following table.

No marking defects

13 Resistance to

Soldering Heat

Immerse the capacitor in a eutectic solder solution at 260±5℃ for

10±1 seconds. Set at room temperature for 24±2 hours, then

measure.

Appearance

Capacitance

Change

Within the specified tolerance

・ Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10 ℃ for one hour and then set

for 24±2 hours at room temperature.

Q/D.F.

30pFmin. : Q≧1000

R7/L8 : W.V.: 25Vmin.: 0.025 max.

W.V.: 16V/10V : 0.035 max.

R9 : 0.05max.

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF)

Perform the initial measurement.

I.R.

More than 10,000MΩ or 500Ω ・F

(Whichever is smaller)

JEMCGS-0363S

3

■AEC-Q200 Murata Standard Specification and Test Methods

Specification.

No

AEC-Q200 Test Item

AEC-Q200 Test Method

Temperature

Compensating Type

High Dielectric Type

14 Thermal Shock

The measured and observed characteristics should satisfy the

specifications in the following table.

Fix the capacitor to the supporting jig in the same manner and under

the same conditions as (19). Perform the 300 cycles according to

the two heat treatments listed in the following table(Maximum

transfer time is 20 seconds). Set for 24±2 hours at room

temperature, then measure

Appearance

No marking defects

Capacitance

Change

Within ±2.5% or ±0.25pF

(Whichever is larger)

R7/L8/R9: Within ±10.0%

Q/D.F.

30pFmin. : Q≧1000

R7/L8 : W.V.: 25Vmin.: 0.025 max.*

*0.05max:GCM188R71E/1H563 to 104

W.V.: 16V/10V : 0.035 max.

R9 : 0.05max

Step

1

2

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF)

125+3/-0(forΔC/R7)

150+3/-0（for 5G/L8/R9）

Temp.(℃）

-55+0/-3

Time

(min.）

15±3

I.R.

More than 10,000MΩ or 500Ω・F

(Whichever is smaller)

・ Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10 ℃ꢀfor one hour and then set

for 24±2 hours at room temperature.

Perform the initial measurement.

15 ESD

Appearance

Capacitance

Change

No marking defects

Per AEC-Q200-002

Within the specified tolerance

Q/D.F.

30pFmin. : Q≧1000

R7/L8 : W.V.: 25Vmin.: 0.025 max.

W.V.: 16V/10V :0.035 max.

R9 : 0.05max.

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF)

I.R.

More than 10,000MΩ or 500Ω・F

(Whichever is smaller)

95% of the terminations is to be soldered evenly and continuously.

16 Solderability

(a) Preheat at 155℃ for 4 hours. After preheating, immerse the

ꢀꢀcapacitor in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-

ꢀꢀ5902) (25% rosin in weight propotion). Immerse in

ꢀeutectic solder solution for 5+0/-0.5 seconds at 235±5℃.

(b) should be placed into steam aging for 8 hours±15 minutes.

ꢀꢀAfter preheating, immerse the capacitor in a solution of

ꢀꢀethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight

ꢀꢀpropotion). Immerse in eutectic solder solution for 5+0/-0.5

ꢀꢀseconds at 235±5℃.

(c) should be placed into steam aging for 8 hours±15 minutes.

ꢀꢀAfter preheating, immerse the capacitor in a solution of

ꢀꢀethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight

ꢀꢀpropotion). Immerse in eutectic solder solution for 120±5

seconds at 260±5℃.

17 Electrical Appearance

Chatacteri- Capacitance

No defects or abnormalities

Within the specified tolerance

Visual inspection.

The capacitance/Q/D.F. should be measured at 25℃ at the

frequency and voltage shown in the table.

zation

Change

Q/D.F.

30pFmin. : Q≧1000

R7/L8 : W.V.: 25Vmin.: 0.025 max.

W.V.: 16V/10V : 0.035 max.

R9 : 0.05max.

Char.

ΔC,5G

(more than 1000pF)

R7,R9,L8(C≦10μF)

ΔC,5G

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF)

(1000 pF and below)

Item

Frequency

Voltage

1±0.1MHz

1±0.1kHz

0.5 to 5Vrms

1±0.2Vrms

The insulation resistance should be measured with a DC voltage not

exceeding the rated voltage at 25℃ and 125℃(for Δ C/R7)/ 150℃

（for 5G/L8/R9）within 2 minutes of charging.

I.R.ꢀ25℃

More than 100,000MΩ or 1000Ω・F More than 10,000MΩ or 500Ω・F

(Whichever is smaller)

I.R.ꢀ125℃

I.R.ꢀ150℃

More than 10,000MΩ or 100Ω・F

More than 1,000MΩ or 10Ω・F

(Whichever is smaller)

More than 10,000MΩ or 100Ω・F

More than 1,000MΩ or 1Ω・F

(Whichever is smaller)

No failure should be observed when 250% of the rated voltage is

applied between the terminations for 1 to 5 seconds, provided the

charge/ discharge current is less than 50mA.

Dielectric

Strength

No failure

JEMCGS-0363S

4

■AEC-Q200 Murata Standard Specification and Test Methods

Specification.

No

AEC-Q200 Test Item

AEC-Q200 Test Method

Temperature

Compensating Type

High Dielectric Type

18 Board Flex

Appearance

No marking defects

Solder the capacitor on the test jig (glass epoxy board) shown in

Fig1 using a eutectic solder. Then apply a force in the direction

shown in Fig 2 for 5±1sec. The soldering should be done by the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

Capacitance

Change

Within ±5.0% or ±0.5pF

(Whichever is larger)

30pFmin. : Q≧1000

R7/L8/R9: Within ±10.0%

Type

GCM03

GCM15

GCM18

GCM21

GCM31

GCM32

a

b

c

Q/D.F.

R7/L8 : W.V.: 25Vmin.: 0.025 max.

W.V.: 16V/10V : 0.035max.

0.3

0.5

0.6

0.8

2.0

0.9

1.5

2.2

3.0

4.4

0.3

0.6

0.9

1.3

1.7

2.6

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF) R9 : 0.05max.

I.R.

More than 10,000MΩ or 500Ω ・F

(in mm)

(Whichever is smaller)

b

114

f4.5

20

Pressurizing

speed:1.0mm/s

Pressurize

R4

a

100

Flexure：≦2

Capacitance meter

45 45

(High Dielectric Type)

Flexure：≦3

(Temperature

Fig.1

t : 1.6mm

(GCM03/15:0.8mm

Compensating Type)

Fig.2

19 Terminal

Strength

Appearance

No marking defects

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig.3 using a eutectic solder. Then apply *18N force in parallel with

the test jig for 60sec.

Capacitance

Change

Within specified tolerance

The soldering should be done either with an iron or using the reflow

Q/D.F.

30pFmin. : Q≧1000

R7/L8 : W.V.: 25Vmin.: 0.025 max. method and should be conducted with care so that the soldering is

W.V.: 16V/10V : 0.035max. uniform and gree of defects such as heat shock

*2N(GCM03/15)

30pFmax.: Q ≧400+20C

C: Nominal Capacitance(pF) R9 : 0.05max.

Type

GCM03

GCM15

GCM18

GCM21

GCM31

GCM32

a

b

c

I.R.

More than 10,000MΩ or 500Ω ・F

0.3

0.4

1.0

1.2

2.2

0.9

1.5

3.0

4.0

5.0

0.3

0.5

1.2

1.65

2.0

2.9

(Whichever is smaller)

（in mm）

c

t: 1.6mm

(GCM03/15: 0.8mm)

Solder resist

Baked electrode or

Copper foil

Fig.3

20 Beam Load Test

Destruction value should be exceed following one.

< Chip L dimension : 2.5mm max. >

Place the capacitor in the beam load fixture as Fig 4.

Apply a force.

< Chip Length : 2.5mm max. >

Chip thickness > 0.5mm rank : 20N

Chip thickness ≦0.5mm rank : 8N

< Chip L dimension : 3.2mm max. >

Iron Board

Chip thickness < 1.25mm rank : 15N

Chip thickness ≧1.25mm rank : 54.5N

< Chip Length : 3.2mm min. >

L

0.6L

Fig.4

Speed supplied the Stress Load : *0.5mm / sec.

*GCM03: 0.1mm/sec.

JEMCGS-0363S

5

■AEC-Q200 Murata Standard Specification and Test Methods

Specification.

No

AEC-Q200 Test Item

AEC-Q200 Test Method

Temperature

Compensating Type

High Dielectric Type

21 Capacitance

Temperature

Capacitance

Change

Within the specified tolerance.

(Table A)

R7 : Within ±15%

(-55℃ to +125℃)

L8 : Within ±15%

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Characteristics

(1)Temperature Compensating Type

(-55℃ to +125℃)

ꢀꢀꢀWithin +15/-40%

(+125℃ to +150℃)

R9 : Within ±15%

(-55℃ to +150℃)

The temperature coefficient is determind using the capacitance

measured in step 3 as a reference. When cycling the temperature

sequentially from step1 through 5 (Δ C: +25℃ to +125℃,

5G:+25℃ to +150℃ other temp. coeffs.:+25℃ to +85℃) the

capacitance should be within the specified tolerance for the

temperature coefficient and capacitance change as Table A-1. The

capacitance drift is caluculated by dividing the differences

betweeen the maximum and minimum measured values in the step

1,3 and 5 by the cap value in step 3.

Temperature

Coefficent

Within the specified tolerance.

(Table A)

Step

1

Temperature.(C)

25±2

2

3

4

5

-55±3(for ΔC to R7)

25±2

125±3（for ΔC/R7）, 150±3（for 5G/R9/L8）,85±3（for other TC）

Within ±0.2% or ±0.05 pF

Capacitance

Drift

25±2

(Whichever is larger.)

(2) High Dielectric Constant Type

The ranges of capacitance change compared with the above 25℃

value over the temperature ranges shown in the table should be

within the specified ranges.

Initial measurement for high dielectric constant type.

Perform a heat treatment at 150+0/-10℃ for one hour

and then set for 24±2 hours at room temperature.

Perform the initial measurement.

Table A

Char.

Capacitance Change from 25C (%)

-30

Nominal Values

(ppm/C)

-55

-10

Max.

0.58

Min.

-0.24

Max.

0.40

Min.

-0.17

Max.

0.25

Min.

-0.11

5C/5G

0± 30

Note1: Nominalvaluesdenotethetemperaturecoefficientwithinarangeof 25Cto125C(forC)/ 150C(for5G)/85C(forotherTC).

JEMCGS-0363S

6

Package

GC□ Type

1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K)

1.1 Minimum Quantity(pcs./reel)

φ180mm reel

Paper Tape

Code:D/E Code:W

15000(W8P2) 30000(W8P1)

φ330mm reel

Paper Tape Plastic Tape

Type

GC□03

GC□15

GC□18

Plastic Tape

Code:L

Code:J/ F

50000(W8P2)

10000

Code:K

10000(W8P2) 20000(W8P1)

4000

6

10000

GC□21 9

B

6

3000

10000

4000

10000

9

GC□31

M

3000

2000

10000

6000

C

9

4000

10000

M

GC□32

N

3000

2000

1000

500

10000

8000

4000

5000

4000

2000

5000

4000

R/D/E

M

GC□43 N/R

E

M

GC□55

N/R

1000

1.2 Dimensions of Tape

(1)GC□03/15(W8P2 CODE:D/E/J/F)

(in:mm)

*1,2：2.0±0.05

4.0±0.1

*1 *2

+0.1

-0

φ1.5

Ａ

0.05 max.

t

Code

A *3

B *3

ｔ

GC□03

0.37

0.67

GC□15

0.65

1.15

0.8 max.

*3 Nominal value

0.5 max.

ꢀ(2)GC□03/15(W8P1 CODE:W)

(in:mm)

4.0±0.1

1.0±0.05

+0.1

-0

φ1.5

Ａ

1.0±0.05

t

Code

A *

B *

ｔ

GC□03

0.37

0.67

GC□15

0.65

1.15

0.8 max.

* Nominal value

0.5 max.

JEMCGP-01894A

7

Package

GC□ Type

ꢀ(3)GC□18/21/31/32

(in:mm)

T:0.85 rank max.

4.0±0.1

2.0±0.1

+0.1

-0

φ1.5

Ａ

1.1 max.

Code

A

B

GC□18

1.05±0.1

1.85±0.1

GC□21

1.55±0.15

2.3±0.15

GC□31

2.0±0.2

3.6±0.2

GC□32

2.8±0.2

3.6±0.2

ꢀ(4)GC□21/31/32

ꢀT:1.15 rank min.

(in:mm)

4.0±0.1

2.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

+0.1

φ1.5

-0

Ａ

＊

1.7 max.(T≦1.25mm)

2.5 max. (T:1.35/1.6mm)

3.0 max. (T:1.8/2.0mm)

3.7 max. (T≧2.5mm)

＊

Code

A

B

GC□21

1.45±0.2

2.25±0.2

GC□31

1.9±0.2

3.5±0.2

GC□32

2.8±0.2

3.5±0.2

ꢀ(5)GC□43/55

(in:mm)

8.0±0.1

4.0±0.1

*

+0.1

-0

0.3±0.1

φ1.5

*：2.0±0.1

Ａ

+0.2

-0

φ1.5

*1

2.5 max.(T≦1.8mm)

*1

Code

A *2

GC□43

3.6

GC□55

5.2

*2 Nominal value

B *2

4.9

6.1

JEMCGP-01894A

8

Package

GC□ Type

Fig.1 Package Chips

(in:mm)

Chip

Fig.2 Dimensions of Reel

2.0±0.5

φ21±0.8

ｗ1

W

w₁

10±1.5

14±1.5

Fig.3 Taping Diagram

GC□32 max.

GC□43/55

16.5 max.

20.5 max.

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

Base Tape : As specified in 1.2.

JEMCGP-01894A

9

Package

GC□ Type

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.

(The sprocket holes are to the right as the tape is pulled toward the user.)

1.4 Part of the leader and part of the vacant section are attached as follows.

(in:mm)

Tail vacant Section

Chip-mounting Unit Leader vacant Section

Leader Unit

(Top Tape only)

Direction

of Feed

160 min.

190 min.

210 min.

1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm

1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.

1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

1.8 There are no jointing for top tape and bottom tape.

1.9 There are no fuzz in the cavity.

1.10 Break down force of top tape : 5N min.

Break down force of bottom tape : 5N min. (Only a bottom tape existence )

1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2. There are possibly

to change the material and dimension due to some impairment.

1.12 Peeling off force : 0.1N to 0.6N^*in the direction as shown below.

* GC□03:0.05N～0.5N

Top tape

165～180°

1.13 Label that show the customer parts number, our parts number, our company name, inspection

number and quantity, will be put in outside of reel.

JEMCGP-01894A

10

Caution

!

■ Limitation of use

Please contact our sales representatives or product engineers before using our products for the applications

listed below which require of our products for other applications than specified in this product.

ꢀꢀꢀ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment

ꢀꢀꢀ⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment

ꢀꢀꢀ⑧Disaster prevention / crime prevention equipment

⑨Data-processing equipment

ꢀꢀꢀ⑩Application of similar complexity and/or requirements to the applications listed in the above

■ Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may

be caused by the abnormal function or the failure of our product.

■Storage and Operation condition

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store capacitors in the following conditions: Temperature of +5℃to +40℃and a Relative Humidity

of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity

conditions during storage may affect the solderability and the packaging performance.

Please use product within six months of receipt.

(2) Please confirm solderability before using after six months.

Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,

hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and

electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity

conditions

JEMCGC-2702N

11

Caution

!

■Rating

1.Temperature Dependent Characteristics

1. The electrical characteristics of the capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature

changes. The following actions are recommended in order to insure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature.

When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance.

Example: a time constant circuit., please carefully consider the characteristics of these capacitors,

such as their aging, voltage, and temperature characteristics.

And check capacitors using your actual appliances at the intended environment and operating conditions.

□Typical temperature characteristics Char.R6 (X5R) □Typical temperature characteristics Char.R7 (X7R)

20

15

10

5

0

-5

-10

-15

-20

-75

-50

-25

0

25

50

75

100

Temperature (℃)

□Typical temperature characteristics Char.F5 (Y5V)

40

20

0

-20

-40

-60

-80

-100

-50

-25

0

25

50

75

100

Temperature (℃)

2.Measurement of Capacitance

1. Measure capacitance with the voltage and the frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease when capacitance is high occasionally.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage

applied. Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

JEMCGC-2702N

12

Caution

!

3.Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated

DC voltage. When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed

the rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC

voltage.

Typical voltage applied to the DC capacitor

DC voltage

DC voltage+AC

AC voltage

Pulse voltage

0

E

0

（E：Maximum possible applied voltage.）

1-2. Influence of overvoltage

Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the

breakdown of the internal dielectric layers .

The time duration until breakdown depends on the applied voltage and the ambient temperature.

4. Applied Voltage and Self-heating Temperature

1. When the capacitor is used in a high-frequency voltage, pulse voltage, application, be sure to take into account

self-heating may be caused by resistant factors of the capacitor.

1-1. The load should be contained to the level such that when measuring at atomospheric temperature of 25℃,

the product's self-heating remains below 20℃ and surface temperature of the capacitor in the actual circuit

remains wiyhin the maximum operating temperature.

JEMCGC-2702N

13

Caution

!

5. DC Voltage and AC Voltage Characteristic

1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied.

Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)

Please confirm the following in order to secure the capacitance.

(1) Whether the capacitance change caused by the

applied voltage is within the range allowed or not.

□DC voltage characteristics

(2) In the DC voltage characteristics, the rate of capacitance

20

change becomes larger as voltage increases.

0

Even if the applied voltage is below the rated voltage.

When a high dielectric constant type capacitorꢀis in a

circuit that needs a tight (narrow) capacitance tolerance.

-20

-40

Example: a time constant circuit., please carefully

-60

consider the characteristics of these capacitors, such as

-80

their aging, voltage, and temperature characteristics.

-100

And check capacitors using your actual appliances at the

0

2

4

6

8

intended environment and operating conditions.

DC Voltage (VDC)

2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

□AC voltage characteristics

30

20

10

0

-10

-20

-30

-40

-50

-60

0.0

0.5

1.0

1.5

2.0

2.5

AC Voltage (Vr.ms.)

6. Capacitance Aging

1. The high dielectric constant type capacitors have the characteristic in which the capacitance value decreases

with the passage of time.

When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance. Example: a time constant circuit., please carefully consider the characteristics of these capacitors,

such as their aging, voltage, and temperature characteristics.

And check capacitors using your actual appliances at the intended environment and operating conditions.

JEMCGC-2702N

14

Caution

!

7.Vibration and Shock

1. The capacitors mechanical actress (vibration and shock) shall be specified for the use environment.

Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the

terminals.

2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor.

Do not use a fallen capacitor because the quality and reliability may be deteriorated.

Crack

Floor

3. When printed circuit boards are piled up or handled, the corners of another printed circuit board

should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor.

Mounting printed circuit board

Crack

■Soldering and Mounting

1.Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor

during flexing or bending the printed circuit board.

1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending

of the board.

ꢀ[Component Direction]

Locate chip horizontal to the

direction in which stress acts

ꢀ[Chip Mounting Close to Board Separation Point]

C

Chip arrangement

Perforation

B

Worst A-C-(B~D) Best

D

A

Slit

ꢀ

JEMCGC-2702N

15

Caution

!

2.Information before mounting

1. Do Not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the Solderability for the capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in

advance.

3.Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept

to a minimum to prevent them from any bending damage or cracking. Please take into account the

following precautions and recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

ꢀ[Incorrect]

Suction Nozzle

Deflection

Board

Board Guide

ꢀ[Correct]

Support Pin

2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent

the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,

causing cracked chips. Also the locating claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,

checked and replaced periodically.

JEMCGC-2702N

16

!

Caution

4-1.Reflow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

[Standard Conditions for Reflow Soldering]

Infrared Reflow

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB board.

Preheating conditions are shown in table 1. It is required to

keep the temperature differential between the solder and

the components surface (ΔT) as small as possible.

Temperature(℃)

Soldering

Peak Temperature

Gradual

200℃

Cooling

170℃

150℃

130℃

Preheating

2. Solderability of Tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of

Tin is used. Please confirm the Solderability of Tin plated

termination chips before use.

Time

30-60 seconds

60-120 seconds

Vapor Reflow

Temperature(℃)

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT)

between the component and the solvent within the range

shown in the table 1.

Soldering

Gradual

Peak Temperature

Cooling

170℃

150℃

130℃

Preheating

Table 1

Part Number

Temperature Differential

Time

60-120 seconds

20 seconds

ΔT≦190℃

GC□03/15/18/21/31

[Allowable Soldering Temperature and Time]

280

270

ΔT≦130℃

GC□32

260

250

240

230

220

Recommended Conditions

0

30

90

Soldering Time(sec.)

60

120

Pb-Sn Solder

Lead Free Solder

Infrared Reflow

Vapor Reflow

230～240℃

Air

Peak Temperature

Atmosphere

230～250℃

240～260℃

Air

Air or N2

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

4. Optimum Solder Amount for Reflow Soldering

0.2mm* min.

4-1. Overly thick application of solder paste results in

a excessive solder fillet height.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause

the chips to crack.

* GC□03: 1/3 of Chip Thickness min.

in section

4-2. Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in

chips breaking loose from the PCB.

4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm* min.

Inverting the PCB

JEMCGC-2702N

Make sure not to impose any abnormal mechanical shocks to the PCB.

17

Caution

!

4-2.Flow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

[Standard Conditions for Flow Soldering]

Temperature(℃)

deformation inside the components. In order to prevent

mechanical damage in the components, preheating should

be required for both of the components and the PCB board.

Preheating conditions are shown in table 2. It is required to

keep temperature differential between the solder and

the components surface (ΔT) as small as possible.

Soldering

Soldering Peak

Temperature

Gradual

Cooling

△Ｔ

Preheating Peak

Preheating

2. Excessively long soldering time or high soldering

Time

5 seconds max.

30-90 seconds

temperature can result in leaching of the outer electrodes,

causing poor adhesion or a reduction in capacitance value

due to loss of contact between electrodes and end termination.

[Allowable Soldering Temperature and Time]

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT)

between the component and solvent within the range

shown in the table 2.

280

270

260

250

4. Do not apply flow soldering to chips not listed in Table 2.

240

230

220

Table 2

0

30

60

90

120

Part Number

Temperature Differential

Soldering Time(sec.)

GC□18/21/31

ΔT≦150℃

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Recommended Conditions

Lead Free Solder

100～120℃

250～260℃

N₂

Pb-Sn Solder

90～110℃

240～250℃

Air

Preheating Peak Temperature

Soldering Peak Temperature

Atmosphere

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

5. Optimum Solder Amount for Flow Soldering

Up to Chip Thickness

5-1. The top of the solder fillet should be lower than the

thickness of components. If the solder amount is

excessive, the risk of cracking is higher during

board bending or any other stressful condition.

Adhesive

in section

JEMCGC-2702N

18

Caution

!

4-3.Correction with a Soldering Iron

1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of

the components will decrease because the extreme temperature change can cause deformations inside the

components. In order to prevent mechanical damage to the components, preheating is required for both

the components and the PCB board. Preheating conditions, (The "Temperature of the Soldering Iron tip",

"Preheating Temperature", "Temperature Differential" between the iron tip and the components and the

PCB), should be within the conditions of table 3. It is required to keep the temperature differential

between the soldering Iron and the component surfaces (ΔT) as small as possible.

2. After soldering, do not allow the component/PCB to rapidly cool down.

3. The operating time for the re-working should be as short as possible. When re-working time is too long,

it may cause solder leaching, and that will cause a reduction in the adhesive strength of the terminations.

Table 3

Temperature

of Soldering

Iron tip

Temperature

Differential

(ΔT)

Preheating

Temperature

Part Number

Atmosphere

GC□03/15/18/21/31

GC□32

350℃max.

280℃max.

150℃min.

ΔT≦190℃

ΔT≦130℃

Air

*Applicable for both Pb-Sn and Lead Free Solder Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

4. Optimum Solder amount when re-working with a Soldering lron

4-1. In case of sizes smaller than 0603, (GC□03/15/18),

the top of the solder fillet should be lower than 2/3's

of the thickness of the component or 0.5mm whichever

is smaller. In case of 0805 and larger sizes, (GC□21/

31/32), the top of the solder fillet should be lower

Solder Amount

in section

than 2/3's of the thickness of the component. If the

solder amount is excessive, the risk of cracking is higher

during board bending or under any other stressful condition.

4-2. A Soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep the soldering

iron from touching the components during the re-work.

4-3. Solder wire with ø0.5mm or smaller is required for soldering.

4-4.Leaded Component Insertion

1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted,

chips may crack and solder joints may break.

Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping.

JEMCGC-2702N

19

Caution

!

5.Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked

chips or broken solder joints. Take note not to vibrate PCBs.

6.Electrical Test on Printed Circuit Board

1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of

a capacitor after mounting on the printed circuit board.

1-1. Avoid bending printed circuit board by the pressure of a test pin, etc.

The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints.

Provide support pins on the back side of the PCB to prevent warping or flexing.

1-2. Avoid vibration of the board by shock when a test pin contacts a printed circuit board.

□Not recommended

□Recommended

←Support pin

←Peeling

←Test-pin

JEMCGC-2702N

20

Caution

!

7.Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is

caused by bending or twisting the board.

1-1. In cropping the board, the stress as shown right may cause the capacitor to crack.

Try not to apply this type of stress to a capacitor.

Bending

Twisting

2. Check of the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus to prevent the

mechanical stress which can occur to the board.

(1) Example of a suitable jig

Recommended example: the board should be pushed as close to the near the cropping jig as possible

and from the back side of board in order to minimize the compressive stress applied to capacitor.

Not recommended example* when the board is pushed at a point far from the cropping jig and from

the front side of board as below, the capacitor may form a crack caused by the tensile stress applied

to capacitor.

Recommended

Not recommended

Direction of

load

Outline of jig

Direction of

load

Printed circuit

board

Load point

V-groove

Components

Printed circuit

board

Printed circuit

board

Load point

Components

Board cropping jig

(2) Example of a suitable machine

An outline of a printed circuit board cropping machine is shown as follows. Along the lines with the

V-grooves on printed circuit board, the top and bottom blades are aligned to one another when

cropping the board.

The misalignment of the position between top and bottom blades may cause the capacitor to crack.

Outline of machine

Top blade

Principle of operation

Top blade

Cross-section diagram

Printed circuit board

Bottom blade

Printed circuit board

V-groove

Not recommended

Top-bottom misalignment Left-right misalignment Front-rear misalignment

Recommended

Top blade

Bottom blade

JEMCGC-2702N

21

^!Caution

■Others

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of

a electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).

Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operation is under the specified conditions.

Do not use the equipment under the following environment.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to Ozone, ultraviolet rays or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Others

2-1. In an Emergency

(1) If the equipment should generate smoke, fire or smell, immediately turn off or unplug the equipment.

If the equipment is not turned off or unplugged, the hazards may be worsened by supplying

continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be

caused by the capacitors high temperature.

2-2. Disposal of waste

When capacitors are disposed, they must be burned or buried by the industrial waste vender with

the appropriate licenses.

2-3. Circuit Design

GC□ Series capacitors in this specification are not safety recognized products.

2-4. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.

The above notices are for standard applications and conditions. Contact us when the products are used in

special mounting conditions.

Select optimum conditions for operation as they determine the reliability of the product after assembly.

The data herein are given in typical values, not guaranteed ratings.

JEMCGC-2702N

22

Notice

■Rating

1.Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1.Do not apply temperatures exceeding the upper operating temperature.

It is necessary to select a capacitor with a suitable rated temperature which will cover the operating

temperature range.

Also it is necessary to consider the temperature distribution in equipment and the seasonal temperature

variable factor.

1-2.Consider the self-heating of the capacitor

The surface temperature of the capacitor shall be the upper operating temperature or less when

including the self-heating factors.

2.Atmosphere surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. The capacitor, when used in the above, unsuitable, operating environments may deteriorate

ꢀdue to the corrosion of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are

subject to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of

ꢀꢀterminal electrodes may result in breakdown when the capacitor is exposed to corrosive or

volatile gases or solvents for long periods of time.

3.Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates

at specific frequencies and noise may be generated.

Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.

JEMCGC-2702N

23

Notice

■Soldering and Mounting

1.PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted

directly on the substrate.

They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates,

take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet

height.

1-2. It is possible for the chip to crack by the expansion and shrinkage of a metal board.

Please contact us if you want to use our ceramic capacitors on a metal board such as Aluminum.

Pattern Forms

Prohibited

Correct

Chassis

Solder (ground)

Solder Resist

Placing Close to Chassis

Electrode Pattern

Lead Wire

Solder Resist

Placing of Chip

Components

and Leaded Components

Soldering Iron

Lead Wire

Solder Resist

Placing of Leaded

Components

after Chip Component

Solder Resist

Lateral Mounting

JEMCGC-2702N

24

Notice

2. Land Dimensions

Chip Capacitor

Land

2-1. Chip capacitor can be cracked due to the stress of PCB

bending / etc if the land area is larger than needed and has

an excess amount of solder.

C

Please refer to the land dimensions in table 1 for flow

soldering, table 2 for reflow soldering.

a

b

Solder Resist

Please confirm the suitable land dimension by evaluating of the actual SET / PCB.

Table 1 Flow Soldering Method

Dimensions

Chip（L×W）

a

b

c

Part Number

GC□18

1.6×0.8

2.0×1.25

3.2×1.6

0.6～1.0

1.0～1.2

2.2～2.6

0.8～0.9

0.9～1.0

1.0～1.1

0.6～0.8

0.8～1.1

1.0～1.4

GC□21

GC□31

(in mm)

Table 2 Reflow Soldering Method

Dimensions

Chip（L×W）

Part Number

a

b

c

GC□03

GC□15

GC□18

GC□21

GC□31

GC□32

0.6×0.3

1.0×0.5

1.6×0.8

2.0×1.25

3.2×1.6

3.2×2.5

0.2～0.3

0.3～0.5

0.6～0.8

1.0～1.2

2.2～2.4

2.0～2.4

0.2～0.35

0.35～0.45

0.6～0.7

0.8～0.9

1.0～1.2

0.2～0.4

0.4～0.6

0.6～0.8

0.8～1.1

1.0～1.4

1.8～2.3

(in mm)

JEMCGC-2702N

25

Notice

2.Adhesive Application

1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering.

The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain

the correct bonding strength.

The chip's electrode thickness and land thickness must also be taken into consideration.

Chip Capacitor

ꢀꢀꢀꢀa=20～70μm

ꢀꢀꢀꢀb=30～35μm

a

ꢀꢀꢀꢀc=50～105μm

c

Adhesive

b

Board

Land

2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of

5000Pa • s (500ps) min. (at 25℃)

3.Adhesive Coverage

Part Number

GC□18

Adhesive Coverage*

0.05mg min.

GC□21

0.1mg min.

GC□31

0.15mg min.

*Nominal Value

3.Adhesive Curing

1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes

deterioration in the insulation resistance between the outer electrodes due to moisture absorption.

Control curing temperature and time in order to prevent insufficient hardening.

4.Flux Application

1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration

of Solderability.

So apply flux thinly and evenly throughout. (A foaming system is generally used for flow soldering).

2. Flux containing too a high percentage of halide may cause corrosion of the outer electrodes unless

there is sufficient cleaning. Use flux with a halide content of 0.2% max.

3. Do not use strong acidic flux.

［As a Single Chip］

4. Do not use water-soluble flux.

A

B

(*Water-soluble flux can be defined as non roｓin type flux

D

including wash-type flux and non-wash-type flux.)

Outer Electrode

C

5.Flow Soldering

Set temperature and time to ensure that leaching of the

outer electrode does not exceed 25% of the chip end

［As Mounted on Substrate］

B

A

area as a single chip (full length of the edge A-B-C-D

shown right) and 25% of the length A-B shown below as

mounted on substrate.

JEMCGC-2702N

26

Notice

6.Washing

1. Please evaluate a capacitor by actual cleaning equipment and condition surely for confirming the quality

and select the applicable solvent.

2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of

electrical characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the

performance of the capacitors.

7.Coating

1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during

curing process.

The stress is affected by the amount of resin and curing contraction.

Select a resin with small curing contraction.

The difference in the thermal expansion coefficient between a coating resin or a molding resin and

capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and

lead to the deterioration of insulation resistance or dielectric breakdown.

Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.

A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic.

Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation

resistance of a capacitor.

An epoxy resin can be used as a less hygroscopic resin.

■Others

1.Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force

during transportation.

(1) Climatic condition

－low air temperature：－40℃

－change of temperature air/air：－25℃/＋25℃

－low air pressure：30 kPa

－change of air pressure：6 kPa/min

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forces are not directly

passed on to the inner packaging.

1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may

occur in the ceramic body of the capacitor.

(2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the

surface of capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.

The capacitor dropped accidentally during processing may be damaged.

JEMCGC-2702N

27

NOTE

!

1.Please make sure that your product has been evaluated in view of your specifications with our

product being mounted to your product.

2.Your are requested not to use our product deviating from this product specification.

3.We consider it not appropriate to include any terms and conditions with regard to the business

transaction in the product specifications, drawings or other technical documents. Therefore,

if your technical documents as above include such terms and conditions such as warranty clause,

product liability clause, or intellectual property infringement liability clause, they will be deemed to

be invalid.

JEMCGC-2702N

28


型号：	GCM1885C1H361JA16
厂家：	muRata
描述：	CHIP MONOLITHIC CERAMIC CAPACITOR FOR AUTOMOTIVE
文件：	总28页 (文件大小：737K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

GCM1885C1H361JA16 [MURATA]

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