GRM40X7R331J50PB [MURATA]

Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.00033uF, Surface Mount, 0805, CHIP;


型号：	GRM40X7R331J50PB
厂家：	muRata
描述：	Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.00033uF, Surface Mount, 0805, CHIP
文件：	总16页 (文件大小：239K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

MONOLITHIC CERAMIC CAPACITOR

Series for General Electronic Equipment

GRM

!FEATURES

1. Terminations are made of metal highly resistant to

migration.

2. The GRM series is a complete line of chip ceramic

capacitors in 6.3V, 10V, 16V, 25V, 50V, 100V, 200V and

500V ratings. These capacitors have temperature

characteristics ranging from C0∆ to Y5V.

3. A wide selection of sizes is available, from the miniature

GRM36 (LZWZT : 1.0Z0.5Z0.5mm) to the larger sized

GRM44-1 (LZWZT : 5.7Z5.0Z2.0mm).

GRM39, GRM40 and GRM42-6 types are suited to flow

and reflow soldering.

GRM36, GRM42-2 and larger types are suited to reflow

soldering.

wTEMPERATURE CHARACTERISTICS

# Temperature Compensating Type

Code

4. Stringent dimensional tolerances allow highly reliable,

high speed automatic chip placements on PCBs.

5. The GRM series is available in both paper and plastic

embossed tape and reel packaging for automatic

placement. Bulk case packaging is also available.

(GRM 36, GRM39, GRM40 (T : 0.6, 1.25))

C0G

C0H

P2H

R2H

S2H

T2H

U2J

Temp. range Y55 to W125D

Y55 to W85D

Temp. coeff.

(ppm/D)

W350 to

0T30 0T60 Y150T60 Y220T60 Y330T60 Y470T60Y750T120

1000

# High Dielectric Constant Type

Code

X5R

X7R

Z5U

Y5V

Temp. range Y55 to W85D Y55 to W125D

W10 to W85D Y30 to W85D

!APPLICATION

General electronic equipment.

Cap. change

W22

Y56

W22

Y82

T15

(% )

!PART NUMBERING

(*Please specify the part number when ordering)

eCAPACITANCE (Ex.)

Code

0R5

R75

010

Capacitance (pF)

Code

Capacitance (pF)

0.57

0.75

1.57

100

101

103

100

(Ex.)

GRM40 X7R 102

10,000

qType

tRated Voltage

yMurata's Control No.

uPackaging

wTemperature Characteristics

eCapacitance

rCAPACITANCE TOLERANCE

Tol.

T0.25pF

T0.50pF

T5%0

Code

Capacitance range

rCapacitance Tolerance

10pF and below

qTYPE AND DIMENSIONS

T10%

More than 10pF

T20%

W80, Y20%

tRATED VOLTAGE

Code

11116.3

DC Rated voltage (V)

(in mm)

1 116.3

Type (EIA Code)

g min.

GRM36 (0402)

GRM39^*(0603)

1.0T0.05 0.5T0.05

0.5T0.05 0.15 to 0.3

0.8T0.10 0.2 to 0.5

0.6T0.10

0.4

0.5

1.6T0.1

0.8T0.10

100

200

500

100

200

500

GRM40 (0805)

0.7

1.5

2.0T0.1 1.25T0.1 0.85T0.10 0.2 to 0.7

1.25T0.10

0.85T0.10

3.2T0.15 1.6T0.15

GRM42-6 (1206)

uPACKAGING CODE

1.15T0.10 0.3 to 0.8

3.2T0.2

1.6T0.20

0.85T0.10

1.15T0.10

1.35T0.15

1.8T0.20

2.5T0.20

2.0 max.

1.6T0.2

Code

Packaging

Bulk packaging in a bag

Tape carrier packaging

Bulk case packaging

GRM42-2 (1210)

3.2T0.3

2.5T0.20

0.3 min.

1.0

GRM43-2 (1812)

GRM44-1 (2220)

4.5T0.4

5.7T0.4

3.2T0.30

5.0T0.40

0.3 min.

2.0

2.0 max.

*Bulk case packaging is L=1.6T0.07, W,T=0.8T0.07

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

FOR FLOW AND REFLOW SOLDERING

High Dielectric Constant Type 50V

25V

GRM40 (0805)

X7R

16V

10V

6.3V Char. X7R/X5R

Type (EIA Code)

GRM36 (0402)

GRM39 (0603)

X7R

GRM42-6 (1206)

Char.

X7R X5R

X5R

X7R

X5R

Volt.

50 25 16 10 16 10 50 25 16 10

10 6.3

16 10 16

6.3

Cap. (pF)

220

270

THICKNESS AND PACKAGING TYPES/QUANTITY

Taping

330

390

Bulk

Bulk Case

(pcs./φ178mm

Type

Thickness : T (mm)

470

(pcs./bag)

(pcs./case)

reel) ^*2

560

680

: 0.5T0.05

: 0.8T0.1^*3

: 0.6T0.1

GRM36

GRM39

1,000

10,000

4,000

3,000

4,000

3,000

2,000

50,000

15,000

10,000

820

1,000

1,200

1,500

: 0.85T0.1

: 1.25T0.1

: 0.85T0.1

: 1.15T0.1

: 1.6T0.2

GRM40

1,800

2,200

5,000

2,700

3,300

GRM42-6

3,900

4,700

5,600

*2 φ330mm reel is available on request.

*3 Bulk case packaging is T=0.8T0.07

6,800

8,200

10,000

12,000

15,000

18,000

22,000

27,000

33,000

39,000

47,000

56,000

68,000

82,000

100,000

120,000

150,000

180,000

220,000

270,000

330,000

390,000

470,000

560,000

680,000

820,000

1,000,000

1,500,000

2,200,000

3,300,000

3,900,000

4,700,000

5,600,000

6,800,000

8,200,000

10,000,000

*4 GRM36 series is suited to only reflow soldering.

*5 Only for taping

*6 Type : GRM40-034 (L : 2T0.15, W : 1.25T0.15, T : 1.25T0.15)

*7 L : 3.2T0.2, W : 1.6T0.2, T : 1.15T0.15

Y0.2

*8 Type : GRM42-631 (L : 3.2T0.2, W : 1.6T0.2, T : 1.3

)

!CAPACITANCE TOLERANCE

X7R/X5R Characteristics

K : T10% (E12 Series)

M: T20% (E6 Series)

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

# Capacitance- DC Voltage Characteristics

!CHARACTERISTICS (REFERENCE DATA)

# SELECTION OF CERAMIC CAPACITORS

When selecting capacitors, consider the voltage

characteristics (AC & DC) and aging characteristics.

Measuring condition Z5U

X7R, Y5V : 1kHz, 1Vr.m.s.

C0G : 1MHz, 1Vr.m.s.

: 1kHz, 0.5Vr.m.s.

+40

+20

C0G 50V

# Capacitance-Temperature Characteristics

-20

-40

-60

-80

-100

Measuring condition : 1MHz, 1Vr.m.s.

X7R 50V

Z5U 50V

Y5V 50V

C0G

P2H

DC Voltage (Vdc)

R2H

S2H

T2H

U2J

-5

# Capacitance- AC Voltage Characteristics

Measuring condition C0G

: 1MHz

X7R, Z5U, Y5V :1kHz

-10

-60

-40

-20

100

120

Temperature (D)

+80

+60

+40

+20

Measuring condition Z5U

: 1kHz, 0.5Vr.m.s.

X7R, Y5V : 1kHz, 1Vr.m.s.

Z5U 50V

Y5V 50V

X7R 50V

-20

X7R

C0G 50V

-20

-40

AC Voltage (Vr.m.s.)

Z5U

Y5V

-60

# Impedance- Frequency Characteristics

-80

C0G (GRM40)

100

-100

-60

-40

-20

100

120

1 [pF]

Temperature (D)

10 [pF]

100 [pF]

1000 [pF]

# Capacitance Change- Aging

+10

100m

10m

C0G

X7R

-10

-20

-30

-40

Y5V, Z5U

10M

100M

Frequency (Hz)

X7R, Y5V (GRM40)

50 100

1000

10000

100

Time (Hr)

1000 [pF]

0.01 [µF]

0.1 [µF]

100m

10m

100k

10M

100M

Frequency (Hz)

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

NOTICE

!NOTICE

Process

1. Storage of

Chips

Cautions

Control Points

Reference Data

Data 1

# Chip monolithic ceramic capacitors

(chips) can experience degradation

of termination solderability when

subjected to high temperature or

humidity, or if exposed to sulfur or

chlorine gases.

# Storage environment must be at an ambient temperature of 5-40D and an

ambient humidity of 20-70% RH.

Solderability

Use chips within 6 months. If 6 months or more have elapsed, check

solderability before use.

# For GR series and GR500 series, do not unpack the minimum package until

immediately before use. After unpacking, re-seal promptly or store with a

desiccant.

# Avoid mechanical shock (ex. falling) to the capacitor to prevent mechanical

cracking inside of the ceramic dielectric due to its own weight.

2. Circuit

Design

3. PCB

Design

# These capacitors on this catalog are

not safety recognized products.

# Unlike leaded components, chip

components are susceptible to

flexing stresses since they are

mounted directly on the substrate.

They are also more sensitive to

mechanical and thermal stresses

than leaded components.

Data 2

# When designing substrates, take land patterns and dimensions into consideration

Board bending

strength for

solder filletheight

to eliminate the possibility of excess solder fillet height.

# [Pattern Forms]

Incorrect

Correct

Data 3

Lead wire

Temperature

cycling for solder

fillet height

Solder resist

Excess solder fillet height can

multiply these stresses and cause

chip cracking.

Data 4

Chassis

Board bending

strength for

board material

Solder (Ground)

Solder

resist

Electrode pattern

Soldering iron

Lead wire

Solder resist

[Land Dimensions]

Land

Chip Capacitor

Solder Resist

Table 1 Flow soldering method

(in mm)

GRM390

GRM420

GRM400

GRM425

GRM42-6

GRM430-

LL0508

LL0612

GRH706

GRH708

GRH110

Dimen-

1.6

0.8

2.00

1.25

3.2

1.6

1.25

2.00

1.6

3.2

1.25

1.00

2.00

1.25

1.4

sions

0.6

0.8

0.6

1.0

0.9

0.8

1.0

0.9

0.8

1.2

1.0

1.1

2.2

1.0

2.6

1.1

1.4

0.4

0.5

1.4

0.7

1.8

0.6-1.0

0.4

0.6

0.8

0.6

0.8

1.0

0.9

0.8

1.2

1.0

0.5-0.8

0.8

2.6

0.9

0.8

-0.9

-2.8

1.0

-1.2

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

NOTICE

Process

3. PCB

Cautions

Control Points

Reference Data

Table 2 Reflow soldering method

(in mm)

Design

GRM390 GRM400 GRM42-6 GRM42-2

GRM420 GRM425 GRM430- GRM235

GRM220 GRM225 GRM230- GRM435-

GRM36

GRM33

GRM43-2

GRM240

GRM44-1 LL0306

LL0508

LL0612 GRH706

GRM615

Dimen-

0.6

0.3

1.0

0.5

1.6

0.8

2.01

1.25

3.2

1.6

3.2

2.5

4.5

3.2

5.7

5.0

0.8

1.6

1.25

2.01

1.6

3.2

1.25

1.00

sions

0.2

0.30 0.30

0.50 0.6

0.8

1.0

1.2

2.2

2.4

2.0

2.4

3.0-

1.2-

2.3-

3.5

1.4

3.0

4.0

4.6

0.2

0.4

0.3

1.4

-0.6

-0.5

-1.8

0.6

0.8

0.4

0.6

0.2

0.35 0.35

0.40 0.40

0.45 0.6

0.60 0.6

0.7

0.8

0.6

0.8

0.7

1.1

0.8

1.0

0.9

1.4

1.0

1.8

1.2

2.3

1.4

3.5

1.6

4.8

0.3

1.0

0.4

1.4

0.6

2.6

0.7

2.8

0.6

0.8

1.0

GRH708 GRH710 GRH110 GRH111 GR530

GR535

GR540

GR545

GR550

GR555

GR580

Dimen-

2.01

1.25

3.2

2.5

1.4

2.8

4.5

3.8

5.6

5.0

10.6

15.0

10.6

10.0

11.8

10.6

16.0

05.0

28.1

13.2

sions

1.0

1.2

2.2

2.5

0.4

0.8

1.8

2.1

3.2

3.4

4.2

0.9

4.0

-4.5

-1.2

-5.0

8.5-

1.3-

4.0-

9.0 8.5

09.0 9.0

9.50 13.0

13.5 25.0

25.5

0.6

0.8

1.0

0.8

1.9

1.0

2.3

0.6

1.0

0.8

1.2

0.7

2.2

0.9

2.6

0.9

3.0

1.2

3.8

1.5 1.3

5.0 8.0

01.5 1.8

10.0 8.0

2.00 01.8

10.0 04.0

02.0 02.2

05.0 10.0

02.4

13.0

Table 3 GNM Series for reflow soldering method

Dimensions (mm)

Type

Chip Capacitor

GNM30-401

3.2

1.6

0.8-1.0 0.7-0.9 0.3-0.4 0.4-0.5

Land

# Choose a mounting position that minimizes the stress imposed on the chip during

flexing or bending of the board.

[Component Direction]

Locate chip horizontal

to the direction in

which stress acts

[Chip Mounting Close to Board Separation point]

Chip arrangement

Perforation

Worst A-C-(B D) Best

---

Slit

4. Solder

Paste

# Overly thick application of solder

paste results in excessive fillet height

solder.

# Make sure the solder has been applied smoothly to the end surface to a height of

0.2mm min.

Printing

This makes the chip more

[Optimum Solder Amount for Reflow Soldering]

susceptible to mechanical and

thermal stress on the board and may

cause cracked chips.

0.2mm min.

# Too little solder paste results in a

lack of adhesive strength on the

outer electrode, which may result in

chips breaking loose from the PCB.

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

NOTICE

Process

5. Chip

Cautions

Control Points

# Adjust the suction nozzle's bottom dead point by correcting warps in the board.

Reference Data

# An excessively low bottom dead

point of the suction nozzle imposes

great force on the chip during

mounting, causing cracked chips.

# Dirt particles and dust accumulated

between the suction nozzle and the

cylinder inner wall prevent the nozzle

from moving smoothly. This imposes

great force on the chip during

mounting, causing cracked chips.

# The locating claw, when worn out,

imposes uneven forces on the chip

when positioning, causing cracked

chips.

Data 5

Placing

Break Strength

Correct

Incorrect

suction nozzle

Deflection

Board

Board guide

Support pin

# Normally, the suction nozzle's bottom dead point must be set on the upper

surface of the board.

# Nozzle pressure for chip mounting must be a 1 to 3N static load.

# The suction nozzle and the locating claw must be maintained, checked and

replaced periodically.

6. Reflow

Soldering

# Sudden heating of the chip results in # When preheating, keep temperature differential, ∆T, within the range shown in

distortion due to excessive

expansion and construction forces

within the chip causing cracked

chips.

Table 4. The smaller the ∆T, the less stress on the chip.

Table 4

Chip Size

GRM33/36/39/40/42-6

GRM420/425/430/615

GRM220/225/230

Temperature Differential

∆TV190D

∆TV130D

LL0306/0508/0612

GRH706/708/110

GRM42-2/43-2/44-1/240/435

GRH710/111

GRM235/GNM30-401

GR530/535/540/545/550/555/580

# When components are immersed in solvent after mounting, be sure to maintain

the temperature difference (∆T) between the component and solvent within the

range shown in the above table.

[Standard Conditions for Reflow Soldering]

# Infrared reflow

# Vapor reflow

Soldering

Gradual

cooling

(in the air)

200D

Gradual

cooling

(in the air)

Preheating

Time

20-40 seconds

GR500 Series

20 seconds max.

60 seconds min.

20 seconds max.

120 seconds max.

[Allowable Soldering Temperature and Time]

GRM /LL /GNM Series

GRH Series

GR500 Series

270

260

250

240

230

Soldering time (sec.)

# In case of repeated soldering, the accumulated soldering time must be within the

range shown above.

Inverting

the PCB

# Make sure not to impose an abnormal mechanical shock on the PCB.

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

NOTICE

Process

7. Adhesive

Application

Cautions

Control Points

Reference Data

# Thin or insufficient adhesive causes

chips to loosen or become

# The amount of adhesive must be more than dimension C shown in the drawing

below to obtain enough bonding strength.

disconnected when flow soldered.

# Low viscosity adhesive causes chips

to slip after mounting.

The chip's electrode thickness and land thickness must be taken into

consideration.

# Adhesive must have a viscosity of 500ps (at 25D) min.

GR500 Series

Chip capacitor

a : 20 to 70 µm

b : 30 to 35 µm

c : 50 to 105 µm

a : 40 to 70 µm

b : 30 to 35 µm

c : 70 to 105 µm

Adhesive

Land

Board

8. Adhesive

Curing

# Insufficient curing of the adhesive

causes chips to disconnect during

flow soldering and causes

# Control curing temperature and time in order to prevent insufficient hardening.

deteriorated insulation resistance

between outer electrodes due to

moisture absorption.

Inverting

the board

9. Leaded

Component

Insertion

# Make sure not to impose an abnormal mechanical shock on the PCB..

# If the PCB is flexed when leaded

components (such as transformers

and ICs) are being mounted, chips

may crack and solder joints may

break.

# Before mounting leaded components, support the PCB using backup pins or

special jigs to prevent warping.

10. Flux

# An excessive amount of flux

generates a large quantity of flux

gas, causing deteriorated

solderability.

# Apply flux thinly and evenly throughout. (A foaming system is generally used for

flow soldering).

Application

# Use flux with a halide content of 0.2wt% max. But do not use strongly acidix flux.

# Wash thoroughly because water soluble flux causes deteriorated insulation

resistance between outer electrodes unless sufficiently cleaned.

# Flux containing too high a

percentage of halide may cause

corrosion of the outer electrodes

unless sufficiently cleaned.

11. Flow

# Sudden heating of the chip results in # When preheating, keep the temperature differential between solder temperature

Data 6

and chip surface temperature, ∆T, within the range shown in Table 5. The smaller Thermal shock

the ∆T, the less stress on the chip.

Soldering

thermal distortion causing cracked

chips.

# An excessively long soldering time or # When components are immersed in solvent after mounting, be sure to maintain

Data 7

high soldering temperature results in

leaching of the outer electrodes,

the temperature difference between the component and solvent within the range

shown in Table 5.

Solder heat

resistance

causing poor adhesion or a reduction # Do not apply flow soldering to chips not listed in Table 5.

in capacitance value due to loss of

contact between electrodes and end

termination.

Table 5

Chip Size

GRM39/40/42-6

GRM420/425/430

LL0508/0612

Temperature Differential

∆TV150D

GRH706/708/110

[Standard Conditions for Flow Soldering]

Soldering

Gradual

cooling

(in the air)

Preheating

Time

5 seconds max.

60 -120 seconds

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

NOTICE

Process

11. Flow

Cautions

Control Points

Reference Data

[Allowable Soldering Temperature and Time]

Soldering

270

260

250

240

230

Soldering time (sec.)

In case of repeated soldering, the accumulated soldering time must be within the

range shown above.

[Optimum Solder Amount for Flow Soldering]

Up to chip thickness

Adhesive

# Set temperature and time to ensure that leaching of the outer electrode does not

exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D

shown below) and 25% of the length A-B shown below as mounted on substrate.

As a single chip

Outer electrode

As mounted on substrate

12. Correction

with a

<For chip type capacitors except

GRM200 series>

# When preheating, keep temperature differential, ∆T, within the range shown in

Table 6. The smaller the∆T, the less stress on the chip.

Data 8

Thermal shock

when making a

correction with a

soldering iron

Soldering

iron

# Sudden heating of the chip results in

distortion due to a high internal

temperature differential, causing

cracked chips.

Table 6

Chip Size

GRM36/39/40/42-6

GRM420/425/430/615

LL0306/0508/0612

GRH706/708/110

Temperature Differential

∆TV190D

GRM42-2/43-2/44-1/435

GNM30-401

∆TV130D

GRH710/111

GR530/535/540/545/550/555/580

[Standard Conditions for Soldering lron Temperature]

Soldering

Gradual

cooling

(in the air)

Preheating

Time

120 seconds

20 seconds max.

GR500 Series

5 seconds max.

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

NOTICE

Process

12. Correction

with a

Cautions

Control Points

Reference Data

[Allowable Time and Temperature for Making Corrections with a Soldering lron]

Data 8

Thermal shock

when making a

correction with a

soldering iron

Soldering

iron

The accumulated soldering time/temperature including reflow/flow soldering must

be within the range shown below :

270

260

250

240

230

Soldering time (sec.)

[Optimum Solder Amount when Corrections Are Made Using a Soldering lron]

Up to chip thickness

# When correcting chips with a soldering iron, no preheating is required if the chip

is listed in Table 7 and the following conditions (Table 7) are met.

Preheating should be performed on chips not listed in Table 7.

Table 7

Item

Conditions

GRM36/39/40

GRM42-6

GRM430

LL0612

GRM420/425/615

LL0306/0508

Chip Size

GRH706/708/110

GNM30-401

Temperature of

iron tip

300D max.

270D max.

Soldering iron

wattage

20W max.

Diameter of iron tip

Restriction

φ 3mm max.

Do not allow the iron tip to directly touch the ceramic element.

# When solder GRM200 series chip capacitor, keep the following conditions.

Item

Chip type

Conditions

GRM220

no pre-heating is possible

300D max.

GRM225/230/235/240

Pre-heating

∆V130D

Temperature of iron tip

Soldering iron wattage

Diameter of iron tip

Soldering time

Solder amount

Restriction

20W max.

φ 3mm max.

5 sec. max.

VChip thickness

V1/2 of chip thickness

Do not allow the iron tip to directly touch the ceramic element.

# Solder 1mm away from the ribbon terminal base, being careful that the solder tip

does not directly contact the capacitor. Preheating is unnecessary.

# Complete soldering within 3 seconds with a soldering tip less than 270D in

temperature.

13. Washing

# Excessive output of ultrasonic

oscillation during cleaning causes

PCBs to resonate, resulting in

cracked chips or broken solder.

# Take note not to vibrate PCBs.

14. Inspection

# Thrusting force of the test probe can # Provide support pins on the back side of the PCB to prevent warping or flexing.

flex the PCB, resulting in cracked

chips or open solder joints.

15. Resin

Coating

# When selecting resin materials, select those with low contraction.

16. Board

Separation

(or Depane-

lization)

# Board flexing at the time of

separation causes cracked chips or

broken solder.

# Severity of stresses imposed on the chip at the time of board break is in the order

of : PushbackFSlitterFV SlotFPerforator.

Board separation must be performed using special jigs, not with hands.

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

MONOLITHIC CERAMIC CAPACITOR

High-capacitance for General Electrical Equipment

Series

GHM1500

!FEATURES

!DIMENSIONS

1. A new monolithic structure for small, high-capacitance

capable of operating at high-voltage levels.

2. Sn-plated external electrodes allow mounting without

silver compound solder.

3. The GHM1525/1530 type for flow and reflow soldering,

and other types for reflow soldering.

g min.

e min.

!APPLICATIONS

1. Ideal use as hot-cold coupling for DC-DC converter.

2. Ideal use on line filter and ringer detector for telephone,

facsimile and modem.

3. Ideal use on diode-snubber circuit for switching power

supply.

Dimensions (mm)

Type

(EIA Code)

GHM1525

(0805)

2.0T0.2

1.25T0.2

1.6T0.2

2.5T0.2

3.2T0.3

5.0T0.4

0.7

GHM1530

(1206)

3.2T0.2

3.2T0.3

4.5T0.4

5.7T0.4

See

1.5

GHM1535

(1210)

"STANDARD

LIST"

0.3

GHM1540

(1812)

2.5

3.5

GHM1545

(2220)

!STANDARD LIST

B Characteristic (T10%)

High Dielectric Constant Type

Dimensions (mm)

Nom.Cap.

Cap.

Tol.

DC Rated Volt. Packaging Qty.

Part Number

(pF)

(V)

(pcs./reel)

GHM1525 B 102 K 250

GHM1525 B 152 K 250

GHM1525 B 222 K 250

GHM1525 B 332 K 250

GHM1525 B 472 K 250

GHM1525 B 682 K 250

GHM1525 B 103 K 250

GHM1530 B 153 K 250

GHM1530 B 223 K 250

GHM1530 B 333 K 250

GHM1530 B 473 K 250

GHM1535 B 683 K 250

GHM1535 B 104 K 250

GHM1540 B 154 K 250

GHM1540 B 224 K 250

GHM1545 B 334 K 250

GHM1545 B 474 K 250

GHM1530 B 102 K 630

GHM1530 B 152 K 630

GHM1530 B 222 K 630

GHM1530 B 332 K 630

GHM1530 B 472 K 630

GHM1530 B 682 K 630

GHM1530 B 103 K 630

GHM1535 B 153 K 630

GHM1535 B 223 K 630

GHM1540 B 333 K 630

GHM1540 B 473 K 630

GHM1540 B 683 K 630

GHM1540 B 104 K 630

GHM1545 B 154 K 630

GHM1545 B 224 K 630

1,000

1,500

2,200

W 0

Y0.3

1.0

4,000

2.0T0.2

1.25T0.2

3,300

4,700

6,800

1.25T0.2

10,000

15,000

22,000

33,000

47,000

68,000

100,000

150,000

220,000

330,000

470,000

1,000

3,000

4,000

3,000

2,000

W 0

Y0.3

1.0

250

3.2T0.2

1.6T0.2

W 0

Y0.3

1.25

1.65T0.2

W 0

Y0.3

1.5

3.2T0.3

4.5T0.4

5.7T0.4

2.5T0.2

3.2T0.3

5.0T0.4

W 0

Y0.3

2.0

1,000

500

W 0

Y0.3

2.5

2.0

W 0

Y0.3

T10%

1,000

1,500

2,200

W 0

Y0.3

3.2T0.2

1.6T0.2

1.25

3,300

3,000

4,700

6,800

10,000

15,000

22,000

33,000

47,000

68,000

100,000

150,000

220,000

630

3.2T0.3

4.5T0.4

5.7T0.4

2.5T0.2

3.2T0.3

5.0T0.4

2,000

1,000

W 0

Y0.3

1.5

W 0

Y0.3

W 0

Y0.3

W 0

Y0.3

W 0

Y0.3

2.0

2.6

2.0

2.7

500

1,000

500

100

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

TYPICAL CHARACTERISTICS DATA

•Capacitance-Temp. Char.

GHM3000 Series

GHM1000 Series • GHM2000 Series

X7R Char. Spec. (upper)

Type GC (V681)

Type GB

Type GC (102V)

-5

-10

X7R Char. Spec. (lower)

-20

-30

-15

-20

-60 -40 -20

20 40 60 80 100 120 140

Temperature (D)

-60 -40 -20

20 40 60 80 100 120 140

Temperature (D)

•Impedance-Freq. Char.

GHM1000 Series [ SL Char.]

GHM1000 Series [ R Char.]

100k

10k

100pF

220pF

10pF

22pF

47pF

100

470pF

1000pF

100pF

220pF

100m

10m

100m

10M

100M

Frequency (Hz)

10M

Frequency (Hz)

100M

GHM1500 Series

GHM2000 Series

100

1000pF

10000pF

100000pF

10000pF

100000pF

100m

10m

100m

10m

10M

100M

Frequency (Hz)

10M

Frequency (Hz)

100M

GHM3000 Series (Type GC)

GHM3000 Series (Type GB)

1000

100

4.7nF

10nF

0.68nF

100m

10m

100m

33nF

10m

10M

100M

Frequency (Hz)

10M

Frequency (Hz)

100M

109

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

CAUTION

1. Operating voltage

Be sure to use a capacitor only within its rated operating

voltage range. When DC-rated capacitors are to be used

in AC or ripple voltage circuits, be sure to maintain the

Vp-p value of the applied voltage within the rated voltage

range.

2. Operating temperature and self-generated heat

Keep the surface temperature of a capacitor within the

rated operating temperature range.

Be sure to take into account the heat produced by the

capacitor itself. When a capacitor is used in a high-fre-

quency circuit, pulse voltage circuit or the like, it may

produce heat due to dielectric loss.

Keep such self-generated temperature below 20D.

3. Operating and storage environment

Do not use or store capacitors in a corrosive

atmosphere, especially where chloride gas, sulfide gas,

acid, alkali, salt or the like are present and avoid

exposure to moisture.

Before cleaning, bonding or molding this product, verify

that these processes do not affect product quality by

testing the performance of a cleaned, bonded or molded

product in the intended equipment.

Store the capacitors where the temperature and relative

humidity do not exceed 5 to 40D and 20 to 70%.

Use capacitors within 6 months.

4. Vibration and impact

Do not expose a capacitor to excessive shock or

vibration during use.

5. Circuit board material

Please contact our sales representatives or engineers in

case that GHM products (size 4.5Z3.2mm and over) are

to be mounted upon a metal-board or metal-frame.

Soldering heat causes the expansion and shrinkage of a

board or frame, which may result in chip-cracking.

6. Land layout for cropping PC Board

Choose a mounting position that minimizes the stress imposed on the

chip during flexing or bending of the board.

[Chip Mounting Close to Board Separation Point]

[Component direction]

Perforation

Locate chip horizontal to

the direction in which

stress acts.

Chip arrangement

Worst A

C B~D Best

slit

112

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

CAUTION

7. Soldering (Prevention of the thermal shock)

If a chip component is heated or cooled abruptly during

soldering, it may crack due to the thermal shock. To

prevent this, adequate soldering condition should be

taken following our recommendation below.

Carefully perform pre-heating so that temperature difference (∆T)

between the solder and component surface should be in the following

range.

• Infrared reflow soldering conditions

(Example)

• Vapor reflow soldering (VPS)

conditions (Example)

220 to 230D

Within 10 sec.

Chip Size

3.2Z1.6mm

3.2Z2.5mm

and under

and over

Soldering method

215D

Reflow method or

200D

∆T

∆TV190D

∆TV150D

∆TV130D

Soldering iron method

∆T

Flow method or

Dip Soldering method

Pre-heating

When components are immersed in solvent after mounting, pay special

60 sec. min.

Within 20 sec.

attention to maintain the temperature difference within 100D.

60 sec. min.

Within 20 sec.

Within120 sec.

When soldering chips with a soldering iron, it should be performed in

following conditions.

• Dip soldering/Soldering iron

conditions (Example)

• Flow soldering conditions

(Example)

Item

Conditions

V2.0Z1.25mm

300D max.

Chip size

3.2Z1.6mm

270D max.

Temperature of iron-tip

Soldering iron wattage

Diameter of iron-tip

Soldering time

230 to 240D

20W max.

φ 3.0mm max.

∆

∆T

3 sec. max.

Ca ution

Do not allow the iron-tip to directly touch the ceramic element.

Pre-heating

60 to 120 sec. Within 20 sec.

60 to 120 sec. Within 5 sec.

8. Soldering method

GHM products whose sizes are 3.2Z1.6mm and under

for flow and reflow soldering, and other sizes for reflow

soldering.

Be sure to contact our sales representatives or

engineers in case that GHM products (size 3.2Z2.5mm

and over) are to be mounted with flow soldering. It may

crack due to the thermal shock.

Failure to follow the above cautions may result, worst case,

in a short circuit and fuming when the product is used.

113

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

NOTICE

1. MOUNTING OF CHIPS

"Mechanical shock of the chip placer

"Termination thickness of chip capacitor and desirable

thickness of adhesives applied

When the positioning claws and pick up nozzle are worn,

the load is applied to the chip while positioning is

concentrated to one position, thus causing cracks,

breakage, faulty positioning accuracy, etc.

Careful checking and maintenance are necessary to

prevent unexpected trouble.

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. Please set the suction nozzle's

bottom dead point on the upper surface of the board.

a : 20 to 70µm

Chip Capacitor

b : 30 to 35µm

c : 50 to 105µm

Adhesive

Base board

Land

0.3mm min.

100 to 120µm

Adhesive

Land

2. CONSTRUCTION OF BOARD PATTERN

vent this, be extremely careful in determining shape and

dimension before designing the circuit board diagram.

After installing chips, if solder is excessively applied to

the circuit board, mechanical stress will cause

destruction resistance characteristics to lower. To pre-

"Construction and dimensions of pattern (example)

"Flow soldering

(in mm)

Chip capacitor

Slit

LZW

Solder resist

2.0Z1.25

3.2Z1.65

1.0Y1.2

2.2Y2.6

0.9Y1.0

1.0Y1.1

0.8Y1.1

1.0Y1.4

"Reflow soldering

(in mm)

LZW

Land

2.0Z1.25

3.2Z1.65

3.2Z2.55

4.5Z2.05

4.5Z3.25

5.7Z2.85

5.7Z5.05

1.0Y1.2

2.2Y2.4

2.0Y2.4

2.8Y3.4

4.0Y4.6

0.9Y1.0

0.8Y0.9

1.0Y1.2

1.2Y1.4

1.4Y1.6

0.8Y1.1

1.0Y1.4

1.8Y2.3

1.4Y1.8

2.3Y3.0

2.1Y2.6

3.5Y4.8

1.0Y2.0

1.0Y2.8

1.0Y4.0

3.2Y3.7

4.1Y4.6

3.6Y4.1

4.8Y5.3

4.4Y4.9

6.6Y7.1

Preparing slit help flux cleaning

and resin coating on the back of

the capacitor.

"Land layout to prevent excessive solder

Mounting close to a chassis

Mounting with leaded components

Mounting leaded Components later

Soldering Iron

Lead Wire of

Component to be

Connected Later.

d¹

Lead Wire Connected

to a Part Provided

with Lead Wires.

Chassis

Solder (Ground solder)

Examples of

arrangements to

be avoided

Adhesive

Base board

Land Pattern

d²

d1<d2

Solder Resist

Examples of

Solder Resist

improvements

by the land divi-

sion

114

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

NOTICE

3. SOLDERING

(Care for minimizing loss of the terminations)

"Limit of losing effective area of the terminations and

conditions needed for soldering.

Depending on the conditions of the soldering temperature and/or

immersion (melting time), effective areas may be lost in some part of the

terminations.

Soldering Allowance Time

Solder : 6Z4 eutectic Solder

270

260

250

240

230

To prevent this, be careful in soldering so that any possible loss of the

effective area on the terminations will securely remain minimum 25% on

all edge length A-B-C-D of part with A, B, C, D, shown in the Figure below.

Reflow Soldering and

Soldering Iron Methods

Flow

Soldering

Dip Soldering

(Static Solder)

Time (sec.)

Termination

In case of repeated soldering, the accumulated soldering time must be

within the range shown above.

(Flux and Solder)

• Use rosin-type flux and do not use a highly acidic flux

(any containing a minimum of 0.2wt% chlorine).

• Please use 6Z4 eutectic solder, or 5Z5 solder. (Do not use

solder with silver.)

Max. Buildup

Min. Buildup

Adhesive

(Solder Buildup)

(i) Flow soldering and iron soldering

Use as little solder as possible (as shown in Fig.1), and

confirm that the solder is securely placed.

(ii)Reflow soldering

Excessive Solder

Buildup

When soldering, confirm that the solder is placed over

0.2mm of the surface of the terminations (as shown in

Fig.2).

Solder buildup by flow method and soldering iron methods.

Fig.1

4. CLEANING

• To perform ultrasonic cleaning, observe the following

conditions.

Rinse bath capacity : Output of 20 watts per liter or less.

Rinsing time : 5 minutes maximum.

Chip Capacitor

0.2mm min.

5. RESIN COATING

• When selecting resin materials, select those with low

contraction and low moisture absorption coefficient

(generally epoxy resin is used).

• Buffer coat can decrease the influence of the resin

shrinking (generally silicone resin).

Solder buildup by reflow method.

Fig.2

115

This is the PDF file of catalog No.C02E-5.

No.C02E5.pdf 99.8.13

Note:

1. Export Control

For customers outside Japan

Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive

weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons.

For customers in Japan

For products which are controlled items subject to the “Foreign Exchange and Foreign Trade Law” of Japan, the export license specified by the law is required

for export.

2. Please contact our sales representatives or product engineers before using our products listed in this catalog for the applications listed below which require

especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property, or when intending to use one of

our products for other applications than specified in this catalog.

q Aircraft equipment

w Aerospace equipment

e Undersea equipment

r Medical equipment

t Transportation equipment (vehicles, trains, ships,etc.)

y Traffic signal equipment

u Disaster prevention / crime prevention equipment

i Data-processing equipment

o Application of similar complexity and/or reliability requirements to the applications listed in the above

3. Product specifications in this catalog are as of July 1999. They are subject to change or our products in it may be discontinued without advance notice. Please

check with our sales representatives or product engineers before your ordering. If there are any questions, please contact our sales representatives or product

engineers.

4. The parts numbers and specifications listed in this catalog are for information only. You are requested to approve our product specification or to transact the

approval sheet for product specification, before your ordering.

5. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect

of our and/or third party's intellectual property rights and other related rights in consideration of your using our products and/or information described or contained

in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned above under

licenses without our consent.

6. None of ozone depleting substances (ODS) under the Montreal Protocol is used in manufacturing process of us.

http://www.murata.co.jp/products/

He a d O ffice

In te rn a tio n a l Divisio n

2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone:81-75-955-6502

3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan

Phone:81-3-5469-6123 Fax:81-3-5469-6155 E-mail:intl@murata.co.jp

GRM40X7R331J50PB [MURATA]

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